TWI901607B - 導熱性片及其製造方法 - Google Patents

導熱性片及其製造方法

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Publication number
TWI901607B
TWI901607B TW109137460A TW109137460A TWI901607B TW I901607 B TWI901607 B TW I901607B TW 109137460 A TW109137460 A TW 109137460A TW 109137460 A TW109137460 A TW 109137460A TW I901607 B TWI901607 B TW I901607B
Authority
TW
Taiwan
Prior art keywords
filler
thermally conductive
conductive sheet
flake
along
Prior art date
Application number
TW109137460A
Other languages
English (en)
Chinese (zh)
Other versions
TW202124585A (zh
Inventor
工藤大希
石原実步
Original Assignee
日商積水保力馬科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=75715943&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI901607(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商積水保力馬科技股份有限公司 filed Critical 日商積水保力馬科技股份有限公司
Publication of TW202124585A publication Critical patent/TW202124585A/zh
Application granted granted Critical
Publication of TWI901607B publication Critical patent/TWI901607B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • B29C70/62—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres the filler being oriented during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/44—Number of layers variable across the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/30—Particles characterised by physical dimension
    • B32B2264/303—Average diameter greater than 1µm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/30—Particles characterised by physical dimension
    • B32B2264/308—Aspect ratio of particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2313/00—Elements other than metals
    • B32B2313/02—Boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C08J2483/05—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
  • Ceramic Engineering (AREA)
TW109137460A 2019-11-01 2020-10-28 導熱性片及其製造方法 TWI901607B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2019-200095 2019-11-01
JP2019200095 2019-11-01

Publications (2)

Publication Number Publication Date
TW202124585A TW202124585A (zh) 2021-07-01
TWI901607B true TWI901607B (zh) 2025-10-21

Family

ID=75715943

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109137460A TWI901607B (zh) 2019-11-01 2020-10-28 導熱性片及其製造方法

Country Status (7)

Country Link
US (1) US11618247B2 (https=)
JP (3) JP6892725B1 (https=)
KR (2) KR102452165B1 (https=)
CN (2) CN116355425B (https=)
DE (1) DE112020005404T5 (https=)
TW (1) TWI901607B (https=)
WO (1) WO2021085383A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019244890A1 (ja) 2018-06-22 2019-12-26 積水ポリマテック株式会社 熱伝導性シート
JP7618954B2 (ja) * 2018-09-26 2025-01-22 積水ポリマテック株式会社 熱伝導性シート
JP7542317B2 (ja) * 2020-02-06 2024-08-30 積水化学工業株式会社 熱伝導性樹脂シート
CN117624899A (zh) * 2020-05-15 2024-03-01 迪睿合株式会社 导热性片和导热性片的制造方法
JP6980868B1 (ja) * 2020-08-25 2021-12-15 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP6999003B1 (ja) 2020-09-09 2022-01-18 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP7811376B2 (ja) * 2021-10-08 2026-02-05 株式会社昭和丸筒 電子回路基板及び電子回路基板の製造方法
WO2024018635A1 (ja) * 2022-07-22 2024-01-25 株式会社レゾナック 熱伝導シート、放熱装置及び熱伝導シートの製造方法
US11615999B1 (en) * 2022-07-22 2023-03-28 GuangDong Suqun New Material Co., Ltd Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device
WO2024090364A1 (ja) * 2022-10-28 2024-05-02 帝人株式会社 積層体及びその製造方法
JP7793114B1 (ja) * 2024-03-28 2025-12-26 積水化学工業株式会社 熱伝導性シート
JP7582540B1 (ja) 2024-03-28 2024-11-13 日本ゼオン株式会社 熱伝導シート及びその製造方法
KR102851466B1 (ko) * 2024-08-20 2025-08-29 조인셋 주식회사 이방성 열전부재 및 그 제조방법
WO2026043264A1 (ko) * 2024-08-20 2026-02-26 조인셋 주식회사 열전부재 및 그 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201514289A (zh) * 2013-07-10 2015-04-16 迪睿合股份有限公司 導熱片及使用其之裝置、以及導熱片之製造方法
TW201830615A (zh) * 2016-12-28 2018-08-16 日商日立化成股份有限公司 導熱片、導熱片的製造方法以及散熱裝置
TW201842150A (zh) * 2017-03-31 2018-12-01 日商阪東化學股份有限公司 熱傳導性片
CN109196052A (zh) * 2016-05-31 2019-01-11 积水保力马科技株式会社 导热部件、导热组合物及导热组合物的制造方法
TW201936781A (zh) * 2018-01-26 2019-09-16 日商東麗股份有限公司 纖維強化熱塑性樹脂成形品及纖維強化熱塑性樹脂成形材料

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283955A (ja) 1996-04-10 1997-10-31 Matsushita Electric Works Ltd 放熱シート
JP2001110961A (ja) 1999-10-08 2001-04-20 Fujikura Rubber Ltd 放熱シート
JP2002026202A (ja) 2000-06-29 2002-01-25 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
JP2002121393A (ja) 2000-10-12 2002-04-23 Sekisui Chem Co Ltd 熱伝導性樹脂組成物及び熱伝導性シート
JP2004051852A (ja) 2002-07-22 2004-02-19 Polymatech Co Ltd 熱伝導性高分子成形体及びその製造方法
JP4629475B2 (ja) 2005-03-30 2011-02-09 株式会社カネカ 放熱シート用組成物およびそれを硬化させてなる放熱シート
JP2007012913A (ja) 2005-06-30 2007-01-18 Polymatech Co Ltd 放熱シート及び放熱構造
CN102433105B (zh) 2006-11-01 2014-07-30 日立化成株式会社 导热片、其制造方法以及使用了导热片的散热装置
JP2009004536A (ja) * 2007-06-21 2009-01-08 Mitsubishi Electric Corp 熱伝導性樹脂シート及びこれを用いたパワーモジュール
JP5185582B2 (ja) * 2007-09-11 2013-04-17 日本バルカー工業株式会社 熱伝導性シート
JP2009094110A (ja) 2007-10-03 2009-04-30 Denki Kagaku Kogyo Kk 放熱部材、及びそのシート、およびその製造方法
JP5274007B2 (ja) * 2007-12-27 2013-08-28 三菱電機株式会社 熱伝導性樹脂シートおよびこれを用いたパワーモジュール
JP2010114421A (ja) * 2008-10-08 2010-05-20 Hitachi Chem Co Ltd 熱伝導シート、及びその熱伝導シートの製造方法
CN104086929A (zh) 2008-10-21 2014-10-08 日立化成工业株式会社 导热片材、其制造方法以及使用了该导热片材的散热装置
JP2011184663A (ja) 2010-03-11 2011-09-22 Hitachi Chem Co Ltd 熱伝導シート、その製造方法及びこれを用いた放熱装置
JP5454300B2 (ja) 2010-03-30 2014-03-26 日立化成株式会社 熱伝導シート、その製造方法及びこれを用いた放熱装置
JP2013062379A (ja) * 2011-09-13 2013-04-04 Nitto Denko Corp 熱伝導性シートおよびその製造方法
JP5443657B2 (ja) 2011-12-27 2014-03-19 パナソニック株式会社 シートの異方性熱伝導組成物の成形品
JP2014014809A (ja) 2012-07-11 2014-01-30 Fujifilm Corp 二酸化炭素分離用複合体の製造方法、二酸化炭素分離用複合体、二酸化炭素分離モジュール、二酸化炭素分離装置、及び二酸化炭素分離システム
JP5953160B2 (ja) 2012-07-27 2016-07-20 ポリマテック・ジャパン株式会社 熱伝導性成形体の製造方法
JP6094119B2 (ja) 2012-09-26 2017-03-15 住友ベークライト株式会社 熱伝導シートの製造方法
JP2014150161A (ja) 2013-02-01 2014-08-21 Sumitomo Bakelite Co Ltd 熱伝導シートの製造方法および熱伝導シート
JP6123314B2 (ja) 2013-02-01 2017-05-10 住友ベークライト株式会社 熱伝導シートおよび熱伝導シートの製造方法
JP6219624B2 (ja) * 2013-07-04 2017-10-25 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シートの製造装置、樹脂成型体の切断方法
JP6071935B2 (ja) 2013-09-06 2017-02-01 バンドー化学株式会社 樹脂成形品の製造方法
EP3419399B1 (en) * 2016-04-11 2020-08-26 Sekisui Polymatech Co., Ltd. Heat conductive sheet
JP6750019B2 (ja) * 2016-08-08 2020-09-02 積水化学工業株式会社 熱伝導シート及びその製造方法
JP6876569B2 (ja) * 2017-07-28 2021-05-26 昭和電工株式会社 金属−炭素粒子複合材
JP7087372B2 (ja) 2017-12-19 2022-06-21 日本ゼオン株式会社 熱伝導シート及びその製造方法
JP7467024B2 (ja) 2017-12-25 2024-04-15 日本ゼオン株式会社 熱伝導シート
US11610829B2 (en) 2018-02-14 2023-03-21 Sekisui Polymatech Co., Ltd. Heat-conductive sheet
JP7650071B2 (ja) 2019-09-30 2025-03-24 積水ポリマテック株式会社 熱伝導性シート及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201514289A (zh) * 2013-07-10 2015-04-16 迪睿合股份有限公司 導熱片及使用其之裝置、以及導熱片之製造方法
CN109196052A (zh) * 2016-05-31 2019-01-11 积水保力马科技株式会社 导热部件、导热组合物及导热组合物的制造方法
TW201830615A (zh) * 2016-12-28 2018-08-16 日商日立化成股份有限公司 導熱片、導熱片的製造方法以及散熱裝置
TW201842150A (zh) * 2017-03-31 2018-12-01 日商阪東化學股份有限公司 熱傳導性片
TW201936781A (zh) * 2018-01-26 2019-09-16 日商東麗股份有限公司 纖維強化熱塑性樹脂成形品及纖維強化熱塑性樹脂成形材料

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