TWI796291B - 熱硬化性樹脂組成物 - Google Patents

熱硬化性樹脂組成物 Download PDF

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Publication number
TWI796291B
TWI796291B TW106109571A TW106109571A TWI796291B TW I796291 B TWI796291 B TW I796291B TW 106109571 A TW106109571 A TW 106109571A TW 106109571 A TW106109571 A TW 106109571A TW I796291 B TWI796291 B TW I796291B
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TW
Taiwan
Prior art keywords
layer
resin composition
thermosetting resin
wiring
mass
Prior art date
Application number
TW106109571A
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English (en)
Chinese (zh)
Other versions
TW201805325A (zh
Inventor
中村茂雄
Original Assignee
日商味之素股份有限公司
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Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201805325A publication Critical patent/TW201805325A/zh
Application granted granted Critical
Publication of TWI796291B publication Critical patent/TWI796291B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structure Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW106109571A 2016-03-29 2017-03-22 熱硬化性樹脂組成物 TWI796291B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-066010 2016-03-29
JP2016066010A JP6690356B2 (ja) 2016-03-29 2016-03-29 熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
TW201805325A TW201805325A (zh) 2018-02-16
TWI796291B true TWI796291B (zh) 2023-03-21

Family

ID=60009112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106109571A TWI796291B (zh) 2016-03-29 2017-03-22 熱硬化性樹脂組成物

Country Status (3)

Country Link
JP (1) JP6690356B2 (ko)
KR (1) KR102314255B1 (ko)
TW (1) TWI796291B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019106953A1 (ja) * 2017-11-30 2019-06-06 京セラ株式会社 樹脂シート、半導体装置及び半導体装置の製造方法
WO2019155896A1 (ja) * 2018-02-09 2019-08-15 Dic株式会社 接着テープ、物品及び物品の製造方法
CN111770964B (zh) * 2018-03-30 2022-12-02 日本瑞翁株式会社 树脂组合物和电子部件
KR102160657B1 (ko) * 2018-12-26 2020-09-29 주식회사 심텍 열경화성 절연재를 이용한 초박형 인쇄회로기판 및 그 제조 방법
CN111825947B (zh) * 2019-04-22 2021-08-27 广东生益科技股份有限公司 一种用于金属基板的树脂组合物、包含其的树脂胶液以及金属基覆铜箔层压板
JP2021091793A (ja) * 2019-12-10 2021-06-17 パナソニックＩｐマネジメント株式会社 エポキシ樹脂組成物及び樹脂封止基板
KR20220161547A (ko) * 2020-03-30 2022-12-06 린텍 가부시키가이샤 광 경화성 시트상 접착제
CN115461423B (zh) * 2020-07-30 2024-07-05 古河电气工业株式会社 粘接剂用组合物和膜状粘接剂、以及使用了膜状粘接剂的半导体封装及其制造方法
KR20230093308A (ko) * 2020-11-27 2023-06-27 교세라 가부시키가이샤 배선 기판
TW202323490A (zh) * 2021-09-28 2023-06-16 日商琳得科股份有限公司 片狀硬化性接著劑以及光學構件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04202402A (ja) * 1990-11-30 1992-07-23 Nippon Oil Co Ltd フェノール類付加ブタジエン重合体あるいは共重合体の製造方法および硬化性エポキシ樹脂組成物
JPH10120753A (ja) * 1996-10-17 1998-05-12 Hitachi Chem Co Ltd 封止用成形材料及び電子部品

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179108A (ja) * 1991-12-28 1993-07-20 Kobe Steel Ltd 熱硬化性樹脂組成物
JP3550923B2 (ja) * 1996-12-13 2004-08-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料
JP2001302823A (ja) * 2000-04-24 2001-10-31 Nippon Mitsubishi Oil Corp 繊維強化複合材料用樹脂組成物、プリプレグおよび繊維強化複合材料
JP2002080693A (ja) * 2000-06-28 2002-03-19 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP2003026773A (ja) * 2001-07-17 2003-01-29 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料
JP2003213083A (ja) * 2002-01-24 2003-07-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
JP4592751B2 (ja) * 2005-10-14 2010-12-08 株式会社フジクラ プリント配線基板の製造方法
CN101679612B (zh) * 2007-06-14 2013-07-17 味之素株式会社 多层印刷电路板的层间绝缘用树脂组合物
JP5486891B2 (ja) * 2009-10-08 2014-05-07 三菱レイヨン株式会社 連鎖硬化性樹脂組成物および繊維強化複合材料
JP5544927B2 (ja) * 2010-02-26 2014-07-09 日立化成株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP5913884B2 (ja) * 2011-09-27 2016-04-27 積水化学工業株式会社 絶縁材料及び積層構造体
JP6000749B2 (ja) * 2012-08-23 2016-10-05 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シートの製造方法と熱伝導性樹脂シート、並びに電力用半導体装置
WO2014098099A1 (ja) * 2012-12-18 2014-06-26 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法
JP6427861B2 (ja) * 2013-10-21 2018-11-28 味の素株式会社 回路基板の製造方法
JP2016032022A (ja) * 2014-07-29 2016-03-07 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04202402A (ja) * 1990-11-30 1992-07-23 Nippon Oil Co Ltd フェノール類付加ブタジエン重合体あるいは共重合体の製造方法および硬化性エポキシ樹脂組成物
JPH10120753A (ja) * 1996-10-17 1998-05-12 Hitachi Chem Co Ltd 封止用成形材料及び電子部品

Also Published As

Publication number Publication date
JP2017179055A (ja) 2017-10-05
KR20170113297A (ko) 2017-10-12
KR102314255B1 (ko) 2021-10-20
JP6690356B2 (ja) 2020-04-28
TW201805325A (zh) 2018-02-16

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