TWI783085B - 工件加工用片材及加工畢工件之製造方法 - Google Patents

工件加工用片材及加工畢工件之製造方法 Download PDF

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Publication number
TWI783085B
TWI783085B TW107142910A TW107142910A TWI783085B TW I783085 B TWI783085 B TW I783085B TW 107142910 A TW107142910 A TW 107142910A TW 107142910 A TW107142910 A TW 107142910A TW I783085 B TWI783085 B TW I783085B
Authority
TW
Taiwan
Prior art keywords
sheet
workpiece
workpiece processing
adhesive
adhesive layer
Prior art date
Application number
TW107142910A
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English (en)
Chinese (zh)
Other versions
TW201927964A (zh
Inventor
小笠原孝文
坂本美紗季
佐伯尚哉
Original Assignee
日商琳得科股份有限公司
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Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201927964A publication Critical patent/TW201927964A/zh
Application granted granted Critical
Publication of TWI783085B publication Critical patent/TWI783085B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Details Of Cutting Devices (AREA)
TW107142910A 2017-12-07 2018-11-30 工件加工用片材及加工畢工件之製造方法 TWI783085B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017235377 2017-12-07
JP2017-235377 2017-12-07

Publications (2)

Publication Number Publication Date
TW201927964A TW201927964A (zh) 2019-07-16
TWI783085B true TWI783085B (zh) 2022-11-11

Family

ID=66750873

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107142910A TWI783085B (zh) 2017-12-07 2018-11-30 工件加工用片材及加工畢工件之製造方法
TW108101471A TWI809030B (zh) 2017-12-07 2019-01-15 工件加工用片材及加工完成的工件的製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108101471A TWI809030B (zh) 2017-12-07 2019-01-15 工件加工用片材及加工完成的工件的製造方法

Country Status (5)

Country Link
JP (2) JP7162612B2 (fr)
KR (2) KR102515877B1 (fr)
CN (2) CN111149191B (fr)
TW (2) TWI783085B (fr)
WO (2) WO2019111481A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021095449A (ja) * 2019-12-13 2021-06-24 日東電工株式会社 粘着シート剥離方法
JP2021143307A (ja) * 2020-03-13 2021-09-24 日東電工株式会社 再剥離粘着テープ
JP2024010412A (ja) * 2022-07-12 2024-01-24 日東電工株式会社 保護シート

Citations (3)

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Publication number Priority date Publication date Assignee Title
TW201402768A (zh) * 2012-07-06 2014-01-16 Furukawa Electric Co Ltd 半導體晶圓表面保護用黏著帶及使用其之半導體晶圓之製造方法
TW201546225A (zh) * 2014-03-03 2015-12-16 Lintec Corp 半導體關聯構件加工用薄片以及利用該薄片之晶片的製造方法
JP2017069476A (ja) * 2015-10-01 2017-04-06 リンテック株式会社 ダイシングダイボンディングシート

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JPS5019657B2 (fr) 1972-02-08 1975-07-09
JPS5352496Y2 (fr) 1973-06-21 1978-12-15
JPH09213663A (ja) * 1996-02-06 1997-08-15 Mitsui Toatsu Chem Inc 半導体ウエハの加工方法
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP2007069476A (ja) 2005-09-07 2007-03-22 Toppan Printing Co Ltd インク吐出ヘッドのノズル面インク付着低減方法およびインク吐出ヘッド
CN102245379B (zh) * 2008-12-12 2015-06-24 琳得科株式会社 叠层体、其制造方法、电子设备构件和电子设备
KR101886455B1 (ko) 2010-09-07 2018-08-07 린텍 가부시키가이샤 점착 시트 및 전자 디바이스
JP5027321B2 (ja) * 2010-09-24 2012-09-19 古河電気工業株式会社 半導体加工用テープ
JP2011046964A (ja) * 2010-11-19 2011-03-10 Nitto Denko Corp 粘着テープ及び粘着テープ用基材
JP2013067708A (ja) * 2011-09-21 2013-04-18 Nitto Denko Corp 塗膜保護シートおよびその製造方法
JP6343883B2 (ja) * 2013-07-29 2018-06-20 東亞合成株式会社 活性エネルギー線硬化型樹脂組成物
JP6210827B2 (ja) * 2013-10-04 2017-10-11 リンテック株式会社 半導体加工用シート
JP6140066B2 (ja) * 2013-12-10 2017-05-31 リンテック株式会社 半導体加工用シート
JP6019054B2 (ja) * 2014-03-24 2016-11-02 富士フイルム株式会社 ガスバリアフィルムおよびガスバリアフィルムの製造方法
JP6272109B2 (ja) 2014-03-31 2018-01-31 リンテック株式会社 粘着剤組成物、粘着シート、および粘着シートの製造方法
US10518506B2 (en) * 2014-06-12 2019-12-31 Toray Industries, Inc. Layered product and process for producing same
JP6610256B2 (ja) * 2014-07-22 2019-11-27 三菱ケミカル株式会社 活性エネルギー線硬化性粘着剤組成物、これを用いてなる粘着剤、及び粘着シート
JP6547827B2 (ja) 2015-06-12 2019-07-24 東亞合成株式会社 粘着剤組成物及びその製造方法、並びに粘着製品
JP2017069474A (ja) * 2015-10-01 2017-04-06 イビデン株式会社 回路基板及びその製造方法
JP2017132874A (ja) 2016-01-27 2017-08-03 リンテック株式会社 電子部品貼付用アースラベル
JP6959751B2 (ja) * 2017-03-31 2021-11-05 株式会社クレハ フッ化ビニリデン共重合体粒子及びその利用

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201402768A (zh) * 2012-07-06 2014-01-16 Furukawa Electric Co Ltd 半導體晶圓表面保護用黏著帶及使用其之半導體晶圓之製造方法
TW201546225A (zh) * 2014-03-03 2015-12-16 Lintec Corp 半導體關聯構件加工用薄片以及利用該薄片之晶片的製造方法
JP2017069476A (ja) * 2015-10-01 2017-04-06 リンテック株式会社 ダイシングダイボンディングシート

Also Published As

Publication number Publication date
KR102579064B1 (ko) 2023-09-15
CN111149191A (zh) 2020-05-12
JPWO2019111760A1 (ja) 2020-12-17
JPWO2019111481A1 (ja) 2020-12-24
CN111149191B (zh) 2023-08-29
CN111149192B (zh) 2023-09-15
KR20200094728A (ko) 2020-08-07
CN111149192A (zh) 2020-05-12
KR102515877B1 (ko) 2023-03-30
WO2019111760A1 (fr) 2019-06-13
TW202010807A (zh) 2020-03-16
WO2019111481A1 (fr) 2019-06-13
TW201927964A (zh) 2019-07-16
KR20200094727A (ko) 2020-08-07
JP7162614B2 (ja) 2022-10-28
JP7162612B2 (ja) 2022-10-28
TWI809030B (zh) 2023-07-21

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