TWI771573B - 配線基板、半導體裝置及配線基板的製造方法 - Google Patents

配線基板、半導體裝置及配線基板的製造方法 Download PDF

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TWI771573B
TWI771573B TW108109521A TW108109521A TWI771573B TW I771573 B TWI771573 B TW I771573B TW 108109521 A TW108109521 A TW 108109521A TW 108109521 A TW108109521 A TW 108109521A TW I771573 B TWI771573 B TW I771573B
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wiring board
insulating layer
connection terminal
layer
conductive layer
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TW108109521A
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Chinese (zh)
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TW201944505A (zh
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竹內浩文
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日商新光電氣工業股份有限公司
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW108109521A 2018-04-05 2019-03-20 配線基板、半導體裝置及配線基板的製造方法 TWI771573B (zh)

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JP2018-072937 2018-04-05
JP2018072937A JP7386595B2 (ja) 2018-04-05 2018-04-05 配線基板、半導体装置及び配線基板の製造方法

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TWI771573B true TWI771573B (zh) 2022-07-21

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Publication number Priority date Publication date Assignee Title
US11031342B2 (en) 2017-11-15 2021-06-08 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method
US10950551B2 (en) * 2019-04-29 2021-03-16 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof

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Publication number Priority date Publication date Assignee Title
US20080236662A1 (en) * 2006-12-15 2008-10-02 Shinko Electric Industries Co., Ltd. Dye sensitized solar cell module and manufacturing method thereof
JP2013110151A (ja) * 2011-11-17 2013-06-06 Elpida Memory Inc 半導体チップ及び半導体装置
JP2016208007A (ja) * 2015-04-23 2016-12-08 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板、半導体パッケージ及びその製造方法

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JP3865989B2 (ja) * 2000-01-13 2007-01-10 新光電気工業株式会社 多層配線基板、配線基板、多層配線基板の製造方法、配線基板の製造方法、及び半導体装置
JP5032456B2 (ja) * 2008-08-12 2012-09-26 新光電気工業株式会社 半導体装置、インターポーザ、及びそれらの製造方法
JP5853896B2 (ja) 2012-08-03 2016-02-09 富士通株式会社 半導体チップ、半導体装置、および半導体装置の製造方法
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