JP7386595B2 - 配線基板、半導体装置及び配線基板の製造方法 - Google Patents

配線基板、半導体装置及び配線基板の製造方法 Download PDF

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Publication number
JP7386595B2
JP7386595B2 JP2018072937A JP2018072937A JP7386595B2 JP 7386595 B2 JP7386595 B2 JP 7386595B2 JP 2018072937 A JP2018072937 A JP 2018072937A JP 2018072937 A JP2018072937 A JP 2018072937A JP 7386595 B2 JP7386595 B2 JP 7386595B2
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wiring board
connection terminal
insulating layer
conductive layer
layer
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JP2019186319A (ja
JP2019186319A5 (enExample
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浩文 竹内
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2018072937A priority Critical patent/JP7386595B2/ja
Priority to US16/354,472 priority patent/US10790256B2/en
Priority to TW108109521A priority patent/TWI771573B/zh
Priority to KR1020190034104A priority patent/KR102742049B1/ko
Publication of JP2019186319A publication Critical patent/JP2019186319A/ja
Publication of JP2019186319A5 publication Critical patent/JP2019186319A5/ja
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2018072937A 2018-04-05 2018-04-05 配線基板、半導体装置及び配線基板の製造方法 Active JP7386595B2 (ja)

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JP2018072937A JP7386595B2 (ja) 2018-04-05 2018-04-05 配線基板、半導体装置及び配線基板の製造方法
US16/354,472 US10790256B2 (en) 2018-04-05 2019-03-15 Wiring board and semiconductor device
TW108109521A TWI771573B (zh) 2018-04-05 2019-03-20 配線基板、半導體裝置及配線基板的製造方法
KR1020190034104A KR102742049B1 (ko) 2018-04-05 2019-03-26 배선 기판, 반도체 장치 및 배선 기판의 제조 방법

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JP2019186319A JP2019186319A (ja) 2019-10-24
JP2019186319A5 JP2019186319A5 (enExample) 2021-03-11
JP7386595B2 true JP7386595B2 (ja) 2023-11-27

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Publication number Priority date Publication date Assignee Title
US11031342B2 (en) 2017-11-15 2021-06-08 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method
US10950551B2 (en) * 2019-04-29 2021-03-16 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001196496A (ja) 2000-01-13 2001-07-19 Shinko Electric Ind Co Ltd 多層配線基板、配線基板、多層配線基板の製造方法、配線基板の製造方法、及び半導体装置
US20140293547A1 (en) 2013-03-26 2014-10-02 Via Technologies, Inc. Circuit substrate, semiconductor package and process for fabricating the same
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