TWI770118B - 基板處理系統 - Google Patents

基板處理系統 Download PDF

Info

Publication number
TWI770118B
TWI770118B TW107104891A TW107104891A TWI770118B TW I770118 B TWI770118 B TW I770118B TW 107104891 A TW107104891 A TW 107104891A TW 107104891 A TW107104891 A TW 107104891A TW I770118 B TWI770118 B TW I770118B
Authority
TW
Taiwan
Prior art keywords
substrate
sound wave
wafer
area
transfer
Prior art date
Application number
TW107104891A
Other languages
English (en)
Chinese (zh)
Other versions
TW201843439A (zh
Inventor
羽島仁志
松岡伸明
中島常長
安武孝洋
船越秀朗
中村泰之
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201843439A publication Critical patent/TW201843439A/zh
Application granted granted Critical
Publication of TWI770118B publication Critical patent/TWI770118B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
TW107104891A 2017-02-24 2018-02-12 基板處理系統 TWI770118B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017032961 2017-02-24
JP2017-032961 2017-02-24
JP2017-251489 2017-12-27
JP2017251489 2017-12-27

Publications (2)

Publication Number Publication Date
TW201843439A TW201843439A (zh) 2018-12-16
TWI770118B true TWI770118B (zh) 2022-07-11

Family

ID=63253175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107104891A TWI770118B (zh) 2017-02-24 2018-02-12 基板處理系統

Country Status (5)

Country Link
JP (1) JP6902601B2 (ja)
KR (1) KR102534203B1 (ja)
CN (1) CN110313060B (ja)
TW (1) TWI770118B (ja)
WO (1) WO2018154993A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7072301B1 (ja) * 2021-09-01 2022-05-20 伸和コントロールズ株式会社 製造プラント及び製造プラントにおける機器の設置方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186864A (ja) * 2007-01-26 2008-08-14 Tokyo Electron Ltd ゲートバルブの洗浄方法及び基板処理システム
TW201433529A (zh) * 2012-12-13 2014-09-01 Tokyo Electron Ltd 搬送基台及搬送系統
JP2016178256A (ja) * 2015-03-23 2016-10-06 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2002041375A1 (ja) * 2000-11-15 2004-03-25 株式会社ニコン 搬送方法及びその装置、露光方法及びその装置、並びにデバイスの製造方法
JP4279008B2 (ja) * 2003-02-27 2009-06-17 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4564742B2 (ja) * 2003-12-03 2010-10-20 キヤノン株式会社 露光装置及びデバイス製造方法
CN100584714C (zh) * 2004-05-13 2010-01-27 东京毅力科创株式会社 基板输送机构及输送装置、颗粒除去法及程序和存储介质
JP4623715B2 (ja) * 2004-05-13 2011-02-02 東京エレクトロン株式会社 基板搬送機構及び該基板搬送機構を備える基板搬送装置
CN100592468C (zh) * 2006-02-02 2010-02-24 株式会社迅动 基板处理装置
JP5395405B2 (ja) * 2008-10-27 2014-01-22 東京エレクトロン株式会社 基板洗浄方法及び装置
JP5123820B2 (ja) * 2008-10-27 2013-01-23 東京エレクトロン株式会社 基板処理装置の真空排気方法及び基板処理装置
JP5557161B2 (ja) 2011-01-24 2014-07-23 住友電気工業株式会社 構造解析方法
TWI523134B (zh) * 2011-09-22 2016-02-21 東京威力科創股份有限公司 基板處理系統、基板搬運方法、及電腦記憶媒體
JP2015126203A (ja) * 2013-12-27 2015-07-06 東京エレクトロン株式会社 基板受け渡し装置及び基板受け渡し方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186864A (ja) * 2007-01-26 2008-08-14 Tokyo Electron Ltd ゲートバルブの洗浄方法及び基板処理システム
TW201433529A (zh) * 2012-12-13 2014-09-01 Tokyo Electron Ltd 搬送基台及搬送系統
JP2016178256A (ja) * 2015-03-23 2016-10-06 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置

Also Published As

Publication number Publication date
CN110313060B (zh) 2023-10-24
KR102534203B1 (ko) 2023-05-19
JP6902601B2 (ja) 2021-07-14
KR20190117685A (ko) 2019-10-16
CN110313060A (zh) 2019-10-08
WO2018154993A1 (ja) 2018-08-30
JPWO2018154993A1 (ja) 2019-11-21
TW201843439A (zh) 2018-12-16

Similar Documents

Publication Publication Date Title
JP3587776B2 (ja) 塗布装置及び塗布方法
JP4410121B2 (ja) 塗布、現像装置及び塗布、現像方法
JP3910827B2 (ja) 液処理装置
JP3910821B2 (ja) 基板の処理装置
JP3445937B2 (ja) 多段スピン型基板処理システム
US20100326353A1 (en) Coating and developing apparatus
JP5002471B2 (ja) 基板洗浄装置、基板洗浄方法、プログラム及びコンピュータ記憶媒体
JPH1079343A (ja) 処理方法及び塗布現像処理システム
JPH09205047A (ja) 処理装置
JP2012146756A (ja) 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2011205004A (ja) 基板処理装置および基板処理方法
TWI770118B (zh) 基板處理系統
JP7363591B2 (ja) 基板処理装置及び基板処理方法
JP2001093827A (ja) 処理システム
JP3441681B2 (ja) 処理装置
JP2006351864A (ja) 処理システム及び処理方法
JPH11274265A (ja) 基板処理装置
JP2016066689A (ja) 容器清掃装置及び容器清掃方法
JP3811359B2 (ja) 液処理装置
JP3521388B2 (ja) 基板搬送装置及び処理システム
JP3305215B2 (ja) ガス処理方法および装置
JP2001023892A (ja) 基板処理装置
JP2004266283A (ja) 基板処理装置
JP3962490B2 (ja) 現像処理装置及び現像処理方法
JP2001110701A (ja) 基板処理装置