TWI767918B - 電漿蝕刻方法、電漿蝕刻裝置及基板載置台 - Google Patents
電漿蝕刻方法、電漿蝕刻裝置及基板載置台 Download PDFInfo
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- TWI767918B TWI767918B TW106122062A TW106122062A TWI767918B TW I767918 B TWI767918 B TW I767918B TW 106122062 A TW106122062 A TW 106122062A TW 106122062 A TW106122062 A TW 106122062A TW I767918 B TWI767918 B TW I767918B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016140043A JP6854600B2 (ja) | 2016-07-15 | 2016-07-15 | プラズマエッチング方法、プラズマエッチング装置、および基板載置台 |
JP2016-140043 | 2016-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201836005A TW201836005A (zh) | 2018-10-01 |
TWI767918B true TWI767918B (zh) | 2022-06-21 |
Family
ID=60995822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106122062A TWI767918B (zh) | 2016-07-15 | 2017-06-30 | 電漿蝕刻方法、電漿蝕刻裝置及基板載置台 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6854600B2 (ja) |
KR (1) | KR102049146B1 (ja) |
CN (2) | CN107622945B (ja) |
TW (1) | TWI767918B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108417491A (zh) * | 2018-02-02 | 2018-08-17 | 武汉新芯集成电路制造有限公司 | 一种减少铝腐蚀的方法 |
CN108417497B (zh) * | 2018-02-07 | 2019-11-15 | 信利(惠州)智能显示有限公司 | 一种ltps背板布线的刻蚀工艺 |
JP7045883B2 (ja) * | 2018-03-07 | 2022-04-01 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
JP7097758B2 (ja) * | 2018-06-21 | 2022-07-08 | 東京エレクトロン株式会社 | シャワーヘッドおよびプラズマ処理装置 |
KR20210137395A (ko) * | 2020-05-07 | 2021-11-17 | 에이에스엠 아이피 홀딩 비.브이. | 불소계 라디칼을 이용하여 반응 챔버의 인시츄 식각을 수행하기 위한 장치 및 방법 |
CN115672874A (zh) * | 2021-07-30 | 2023-02-03 | 江苏鲁汶仪器股份有限公司 | 一种等离子体处理方法 |
Citations (4)
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US20030040191A1 (en) * | 2001-08-23 | 2003-02-27 | Hiroyuki Kitsunai | Process for producing semiconductor device |
JP2003257951A (ja) * | 2002-03-07 | 2003-09-12 | Seiko Instruments Inc | 半導体製造装置 |
US20080009417A1 (en) * | 2006-07-05 | 2008-01-10 | General Electric Company | Coating composition, article, and associated method |
CN101188207A (zh) * | 2006-08-10 | 2008-05-28 | 东京毅力科创株式会社 | 静电吸附电极、基板处理装置和静电吸附电极的制造方法 |
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JPH05136101A (ja) * | 1991-11-14 | 1993-06-01 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP3594759B2 (ja) * | 1997-03-19 | 2004-12-02 | 株式会社日立製作所 | プラズマ処理方法 |
JP4053112B2 (ja) * | 1997-03-27 | 2008-02-27 | 敏夫 淡路 | 半導体製造工程の排ガス処理方法及び半導体製造工程の排ガス処理装置 |
JP2000012515A (ja) * | 1998-06-22 | 2000-01-14 | Hitachi Ltd | マイクロ波プラズマエッチング装置のプラズマクリーニング方法 |
US6606234B1 (en) * | 2000-09-05 | 2003-08-12 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow |
KR100450564B1 (ko) * | 2001-12-20 | 2004-09-30 | 동부전자 주식회사 | 반도체 소자의 금속 배선 후처리 방법 |
JP2004031410A (ja) * | 2002-06-21 | 2004-01-29 | Sanyo Electric Co Ltd | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
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JP2003347276A (ja) * | 2003-06-30 | 2003-12-05 | Hitachi Ltd | プラズマ処理方法、および半導体装置の製造方法 |
US7220497B2 (en) * | 2003-12-18 | 2007-05-22 | Lam Research Corporation | Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components |
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2016
- 2016-07-15 JP JP2016140043A patent/JP6854600B2/ja active Active
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2017
- 2017-06-30 TW TW106122062A patent/TWI767918B/zh active
- 2017-07-13 KR KR1020170088761A patent/KR102049146B1/ko active IP Right Grant
- 2017-07-14 CN CN201710574737.8A patent/CN107622945B/zh active Active
- 2017-07-14 CN CN202011136319.9A patent/CN112259457B/zh active Active
Patent Citations (5)
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US20030040191A1 (en) * | 2001-08-23 | 2003-02-27 | Hiroyuki Kitsunai | Process for producing semiconductor device |
JP2003068705A (ja) * | 2001-08-23 | 2003-03-07 | Hitachi Ltd | 半導体素子の製造方法 |
JP2003257951A (ja) * | 2002-03-07 | 2003-09-12 | Seiko Instruments Inc | 半導体製造装置 |
US20080009417A1 (en) * | 2006-07-05 | 2008-01-10 | General Electric Company | Coating composition, article, and associated method |
CN101188207A (zh) * | 2006-08-10 | 2008-05-28 | 东京毅力科创株式会社 | 静电吸附电极、基板处理装置和静电吸附电极的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107622945A (zh) | 2018-01-23 |
CN107622945B (zh) | 2021-03-05 |
CN112259457A (zh) | 2021-01-22 |
JP2018011007A (ja) | 2018-01-18 |
KR102049146B1 (ko) | 2019-11-26 |
KR20180008310A (ko) | 2018-01-24 |
CN112259457B (zh) | 2024-04-02 |
TW201836005A (zh) | 2018-10-01 |
JP6854600B2 (ja) | 2021-04-07 |
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