TWI735651B - 銅箔以及具有該銅箔的覆銅層積板 - Google Patents

銅箔以及具有該銅箔的覆銅層積板 Download PDF

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Publication number
TWI735651B
TWI735651B TW106131202A TW106131202A TWI735651B TW I735651 B TWI735651 B TW I735651B TW 106131202 A TW106131202 A TW 106131202A TW 106131202 A TW106131202 A TW 106131202A TW I735651 B TWI735651 B TW I735651B
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TW
Taiwan
Prior art keywords
copper foil
treatment layer
copper
resin
layer
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TW106131202A
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English (en)
Chinese (zh)
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TW201825717A (zh
Inventor
佐藤章
宇野岳夫
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日商古河電氣工業股份有限公司
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Publication of TW201825717A publication Critical patent/TW201825717A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW106131202A 2016-09-12 2017-09-12 銅箔以及具有該銅箔的覆銅層積板 TWI735651B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016177256 2016-09-12
JP2016-177256 2016-09-12

Publications (2)

Publication Number Publication Date
TW201825717A TW201825717A (zh) 2018-07-16
TWI735651B true TWI735651B (zh) 2021-08-11

Family

ID=61562549

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106131202A TWI735651B (zh) 2016-09-12 2017-09-12 銅箔以及具有該銅箔的覆銅層積板

Country Status (5)

Country Link
JP (1) JP6479254B2 (ja)
KR (1) KR102274906B1 (ja)
CN (1) CN109642338B (ja)
TW (1) TWI735651B (ja)
WO (1) WO2018047933A1 (ja)

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JP7251927B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP7087760B2 (ja) * 2018-07-18 2022-06-21 住友金属鉱山株式会社 銅張積層板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP7325000B2 (ja) * 2019-02-04 2023-08-14 パナソニックＩｐマネジメント株式会社 表面処理銅箔、並びに、それを用いた銅張積層板、樹脂付銅箔および回路基板
TWI731330B (zh) * 2019-04-30 2021-06-21 南亞塑膠工業股份有限公司 電解銅箔、其製造方法、及鋰離子二次電池
CN113795615B (zh) * 2019-06-07 2024-08-02 古河电气工业株式会社 表面处理铜箔、覆铜层叠板以及印刷电路板
CN112921371A (zh) * 2021-01-21 2021-06-08 江苏铭丰电子材料科技有限公司 高频覆铜板用rtf铜箔的表面粗化固化处理方法
TWI756155B (zh) 2021-07-19 2022-02-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板
CN116083972B (zh) * 2022-12-09 2023-08-18 浙江花园新能源股份有限公司 一种具有低粗糙度、高剥离强度的反转铜箔的生产工艺及其产品和应用

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Also Published As

Publication number Publication date
TW201825717A (zh) 2018-07-16
KR102274906B1 (ko) 2021-07-09
CN109642338A (zh) 2019-04-16
JP6479254B2 (ja) 2019-03-06
KR20190049818A (ko) 2019-05-09
JPWO2018047933A1 (ja) 2018-09-06
WO2018047933A1 (ja) 2018-03-15
CN109642338B (zh) 2021-02-09

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