TWI703048B - 肥粒鐵層合體及雜訊抑制薄片 - Google Patents
肥粒鐵層合體及雜訊抑制薄片 Download PDFInfo
- Publication number
- TWI703048B TWI703048B TW105122080A TW105122080A TWI703048B TW I703048 B TWI703048 B TW I703048B TW 105122080 A TW105122080 A TW 105122080A TW 105122080 A TW105122080 A TW 105122080A TW I703048 B TWI703048 B TW I703048B
- Authority
- TW
- Taiwan
- Prior art keywords
- laminate
- iron
- present
- noise suppression
- layer
- Prior art date
Links
- 230000001629 suppression Effects 0.000 title claims abstract description 41
- 229910000859 α-Fe Inorganic materials 0.000 title claims abstract description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 126
- 229910052742 iron Inorganic materials 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011231 conductive filler Substances 0.000 claims abstract description 14
- 230000035699 permeability Effects 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 68
- 230000005540 biological transmission Effects 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 24
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims 1
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- 239000000843 powder Substances 0.000 description 15
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- 239000002904 solvent Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
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- 238000000465 moulding Methods 0.000 description 6
- -1 polypropylene Polymers 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
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- 239000002002 slurry Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910000676 Si alloy Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- 239000006185 dispersion Substances 0.000 description 3
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- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910007565 Zn—Cu Inorganic materials 0.000 description 2
- NJFMNPFATSYWHB-UHFFFAOYSA-N ac1l9hgr Chemical compound [Fe].[Fe] NJFMNPFATSYWHB-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
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- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
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- 238000001125 extrusion Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
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- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
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- 239000000523 sample Substances 0.000 description 2
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- WKYYYUWKFPFVEY-UHFFFAOYSA-N 2-ethylcyclohexan-1-one Chemical compound CCC1CCCCC1=O WKYYYUWKFPFVEY-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
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- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000004794 expanded polystyrene Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 229910052595 hematite Inorganic materials 0.000 description 1
- 239000011019 hematite Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
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- 150000003891 oxalate salts Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
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- 239000002244 precipitate Substances 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/18—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being compounds
- H01F10/20—Ferrites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
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- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
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Abstract
本發明係提供一種雜訊抑制薄片,其可吸收10MHz至1GHz之廣範圍頻率的雜訊。
該雜訊抑制薄片,係層合導電性填料與樹脂所構成之導電性層、與肥粒鐵所構成之磁性層所得之肥粒鐵層合體,前述導電層之表面電阻為100~5000Ω/□,前述肥粒鐵係分割成小片狀,肥粒鐵於10MHz下之磁導率之實數部分為130~480,磁導率之虛數部分為30~440。
Description
本發明係關於一種導電性填料與樹脂所構成之導電性層、與燒結肥粒鐵所構成之磁性層所構成的肥粒鐵層合體、以及該肥粒鐵層合體所構成的雜訊抑制薄片。
近年來之數位電子機器的進步驚人,特別於以智慧型手機、行動電話、數位相機或筆記型電腦為代表的可攜式電子機器,隨著動作訊號高頻化的同時,亦小型化及輕量化,因此,電子零件或配線基板的高密度構裝,成為了最大的技術課題。
由於電子機器內之電子零件或配線基板的高密度構裝、與動作訊號之高頻化持續進展,使所產生之非必要輻射對周圍零件產生了不良影響。因此,為了抑制由電子機器之微處理機、LSI或液晶面板等所發射之非必要輻射,而於電子電路或配線基板進行雜訊抑制薄片的貼附。
專利文獻1:日本特開平7-212079號公報
專利文獻2:日本特開2009-290075號公報
專利文獻3:日本特開2013-229541號公報
於專利文獻1,揭示一種雜訊抑制薄片,其含有作為軟磁性粉末之平均粒徑10μm之扁平狀Fe-Al-Si合金粉末,其於數百MHz~數GHz具有雜訊抑制效果。
於專利文獻2,揭示一種Ni-Zn肥粒鐵燒結體所構成之雜訊抑制薄片。該文獻,藉由控制Ni-Zn肥粒鐵之複磁導率與體積電阻率,而提供一種於10MHz至1GHz下電磁波之反射少的雜訊抑制薄片,但於10MHz之吸收量成為數%之低者。
於專利文獻3揭示一種雜訊抑制薄片,其係於導電性填料與樹脂所構成之導電層,層合軟磁性粉末與樹脂所構成之磁性層,而於數百MHz~數GHz下顯示雜訊抑制效果。
如上述提出各種於數百MHz~數GHz下具有雜訊抑制效果之雜訊抑制薄片,但對於數十MHz中亦產生雜訊的電子零件,並未提出具有充分抑制效果的雜訊抑制薄片。
因此,本發明之技術課題在於提供一種於10MHz及1GHz中亦可充分發揮雜訊抑制效果之肥粒鐵層合體、雜訊抑制薄片。
前述之技術課題,可藉由如下所述之本發明而達成。
亦即,本發明係一種肥粒鐵層合體,其係由導電性填料與樹脂所構成之導電性層、與燒結肥粒鐵所構成之磁性層所構成(本發明1)。
又,本發明係如本發明1所記載之肥粒鐵層合體,其中,該層合體之以微帶線測定所得之透過衰減量於1GHz下為3.6~8dB,以環形天線測定所得之透過衰減量於10MHz下為12~30dB(本發明2)。
又,本發明係如本發明1或2所記載之肥粒鐵層合體,其中,前述磁性層之10MHz下之磁導率之實數部分為130~480,磁導率之虛數部分為30~440(本發明3)。
又,本發明係如本發明1至3中任一項所記載之肥粒鐵層合體,其中,前述導電層之表面電阻為100~5000Ω/□(本發明4)。
又,本發明係如本發明1至4中任一項所記載之肥粒鐵層合體,其中,導電層與磁性層係透過黏著層而層合(本發明5)。
又,本發明係如本發明1至5中任一項所記載之肥粒鐵層合體,其中,於該層合體之至少一表面進一步設置黏著層或保護層(本發明6)。
又,本發明係如本發明1至6中任一項所記載之肥粒鐵層合體,其中,於該層合體之一表面進一步設置黏著層,於相反側之表面進一步設置保護層(本發明7)。
又,本發明係如本發明1至7中任一項所記載之肥粒鐵層合體,其中,燒結肥粒鐵之組成為由以氧化物換算
47~50mol%之Fe2O3、8~16mol%之NiO、24~35mol%之ZnO、7~12.5mol%之CuO所構成,合計為100mol%(本發明8)。
又,本發明亦係一種雜訊抑制薄片,其由本發明1至8中任一項所記載之肥粒鐵層合體所構成(本發明9)。
本發明之肥粒鐵層合體,不僅於高頻區之1GHz、低頻區之10MHz下亦可吸收雜訊,故適於作為可攜式電子機器等之雜訊抑制薄片。
關於本發明構成之更詳細說明係如以下所述。
本發明之肥粒鐵層合體,其層合由導電性填料與樹脂所構成之導電性層、與燒結肥粒鐵所構成之磁性層所構成。導電性層及/或磁性層亦可層合複數層。
本發明中之燒結肥粒鐵之組成為由以氧化物換算47~50mol%之Fe2O3、8~16mol%之NiO、24~35mol%之ZnO、7~12.5mol%之CuO所構成,合計為100mol%。然而,亦可含有由原料或製造步驟中不可避免地混入之微量雜質。
當本發明中之肥粒鐵中之Fe2O3之組成未滿47mol%時,μ’會變小。當超過50mol%時,會無法燒結。更佳之Fe2O3之組成為47.5~49.5mol%。
當本發明中之肥粒鐵中之NiO之組成未滿8mol%時,μ”會變大。當超過16mol%時,μ’會變小。更佳之NiO之組成為8.5~15.5mol%。
當本發明中之肥粒鐵中之ZnO之組成未滿24mol%時,μ’會變小。當超過35mol%時,μ”會變大。更佳之ZnO之組成為24.5~34.5mol%。
當本發明中之肥粒鐵中之CuO之組成未滿7mol%時,會無法燒結。當超過12.5mol%時,μ’會變小。更佳之CuO之組成為7.5~12.0mol%。
本發明中之肥粒鐵板之密度,以4.8~5.3g/cm3為佳。當密度未滿4.8g/cm3時,肥粒鐵之燒結不足而變得容易破裂,於製造步驟中的作業變得困難。本發明可得密度之最大值為5.3g/cm3。
本發明中之肥粒鐵之厚度,以20~110μm為佳。厚度未滿20μm之肥粒鐵於工業上難以生產。若超過110μm,則不符合薄膜化的要求,又,由於重量變重亦不符合輕量化的要求。更佳之厚度為25~105μm。
本發明中之肥粒鐵於10MHz中之磁導率之實數部分μ’較佳為130~480。當實數部分μ’未滿130時,磁導率之虛數部分μ”會變小,使雜訊抑制效果降低。於本發明無法得到超過480之μ’。更佳之實數部分μ’為150~460。
本發明中之肥粒鐵於10MHz中之磁導率之虛數部分μ”較佳為30~440。當虛數部分μ”未滿30時,雜訊抑制效果降低。於本發明無法得到超過440之μ”。更佳之需數
部分μ”為35~420。
本發明中之磁性層,係由如上述之特定的燒結肥粒鐵所構成,不含樹脂等之成分。因此,與專利文獻1、3不同,本發明之肥粒鐵層合體,於10MHz及1GHz亦可發揮充分的雜訊抑制效果。
本發明中之導電層,係於樹脂中分散導電性填料,成形為薄片狀者。導電性填料,可舉例如導電性碳。導電性碳,較佳為導電性碳黑、將碳纖維加工之纖維狀碳、碳奈米管,導電性碳黑,較佳為粒徑20~60nm、BET比表面積30~1300m2/g,更佳為,粒徑30~40nm、BET比表面積700~1300m2/g之具有中空殼構造之高導電性碳黑。將碳纖維加工之纖維狀碳,較佳為,纖維長30~150μm之磨碎纖維、或纖維長3~24mm之切斷纖維。碳奈米管,以纖維徑40~160μm、BET比表面積16~34m2/g、純度99%以上者為佳。
於本發明之導電層,較佳為含有導電性填料5~25wt%。當導電性填料之含量未滿5wt%時,表面電阻增高,而無法得到所欲之雜訊抑制效果。當導電性填料之含量超過25wt%時,於微帶線測定中之反射量增大,使訊號難以傳導。較佳之含量為7~24wt%。
於本發明之導電層,較佳為含有樹脂10~30wt%。當樹脂之含量未滿10wt%時,難以保持薄片形狀。當樹脂之含量超過30wt%時,無法得到所欲之雜訊抑制效果。
本發明中,導電層所使用之樹脂,較佳為丙烯酸樹
脂、或酚樹脂,亦可混合丙烯酸樹脂與酚樹脂使用。丙烯酸樹脂與酚樹脂可使用周知者。
本發明之導電層,亦可含有難燃劑。難燃劑可使用周知者,可例示如氫氧化鋁、氫氧化鎂等。導電層中之難燃劑含量以0~30wt%為佳、更佳之含量為13~26wt%。
於本發明之導電層,亦可含有平均粒徑0.05~5μm之粉末作為導電性填料之分散助劑,特別是,當導電性填料為纖維狀時,於原料之混合步驟中,其之分散效果高。分散助劑並不特別限定,可舉例如赤鐵礦或磁鐵礦等氧化鐵粉末、肥粒鐵粉末、氧化矽粉末、氧化鋁粉末等之各種氧化物粉末。又,亦可為金屬粉末。當含有磁鐵礦或肥粒鐵粉末等具有磁性之分散助劑時,較佳為,不損及以微帶線測定所得之透過衰減量之範圍的含量。分散助劑之含量以30~70wt%為佳。當於該範圍外時,作為分散助劑的功能降低。
本發明中之導電層的厚度以15~90μm為佳。當厚度未滿15μm時,以微帶線測定所得之透過衰減量減小,故無法得到所欲之雜訊抑制效果。當厚度超過90μm時,以微帶線測定所得之反射量變大,難以傳遞訊號。較佳之厚度為20~85μm。
本發明中之導電層之表面電阻以100~5000Ω/□為佳。當表面電阻未滿100Ω/□時,以微帶線測定所得之透過衰減量減小,故無法得到所欲之雜訊抑制效果。當表面電阻超過5000Ω/□時,以微帶線測定所得之反射量變
大,難以傳遞訊號。較佳之表面電阻為110~4900Ω/□。
本發明之肥粒鐵層合體之以微帶線測定所得之透過衰減量,於1GHz下以3.6~8dB為佳。當透過衰減量未滿3.6dB時,無法得到所欲之雜訊抑制效果。當透過衰減量超過8.0dB時,以微帶線測定所得之反射量變大,難以傳遞訊號。更佳之透過衰減量為3.8~7.5dB。
本發明之肥粒鐵層合體之以環形天線測定所得之透過衰減量,於10MHz下以12~30dB為佳。當透過衰減量未滿12dB時,無法得到所欲之雜訊抑制效果。於本發明中,無法得到超過30dB之透過衰減量。較佳之透過衰減量為13~29dB。
構成本發明之肥粒鐵層合體之磁性層中之肥粒鐵與導電層之厚度比(肥粒鐵/導電層),以0.3~4.0為佳。
本發明之肥粒鐵層合體之整體厚度以35~200μm為佳。
本發明之肥粒鐵層合體,亦可透過黏著層而層合導電層與磁性層。
本發明中之黏著層,可舉例如雙面膠。雙面膠,並無特別限制,可使用以PET膜或聚醯亞胺膜作為基材、或不含基材之周知之雙面膠。又,亦可為將該等層合者。根據薄膜化的要求,黏著層的厚度以3~30μm為佳。
本發明之肥粒鐵層合體,亦可於層合體之至少一表面設置黏著層或保護層。
本發明中之保護層,藉由設置其,可提高對於分割肥
粒鐵時之落粉的可靠性及耐久性。該保護層,只要是雜訊抑制薄片彎曲時可不會斷裂地伸長之樹脂即可,並無特別限制,可例示如PET膜、聚醯亞胺膜、含有樹脂之塗料等。又,保護層,亦可為於肥粒鐵之單面依序層合黏著劑、PET膜或聚醯亞胺膜等具彎曲性及伸縮性之薄膜者。再者,設置二層以上之保護層,當於雜訊抑制薄片之製造步驟及加工步驟中保護層產生傷痕、髒污、破損時,藉由依序除去該保護層,最終可得最上層無傷痕、髒污、破損等之潔淨的保護層。根據薄膜化的要求,保護層的厚度以3~30μm為佳。
本發明之肥粒鐵層合體,為了能密合地貼附於彎曲的部分,以及防止於使用時破裂,較佳為,事先將構成磁性層之肥粒鐵分割成小片狀。其之方法,例如可為下述方法:以肥粒鐵之至少一表面之事先所設置之1溝槽為起點,將肥粒鐵分割;或者將未形成有溝槽之肥粒鐵燒結板分割成小片狀之方法的任一者。前述之溝槽可為連續、亦可斷續地形成,又,亦可形成多數之微小的凹部作為溝槽的代用者。溝槽的斷面並無特別限定,但以U字型或V字型為佳。
肥粒鐵,較佳為,依據溝槽分割成任意大小的三角形、四邊形、多角形或該等之組合。例如,三角形、四邊形、多角形之一邊的長度,通常為1~12mm,當被附著物之接著面為曲面時,較佳為1mm以上而其之曲率半徑為1/3以下,更佳為1mm以上而為1/4以下。再者,肥粒
鐵,可不根據溝槽來分割、亦可分割為不定形。
形成於肥粒鐵之溝之開口部的寬度,通常以250μm以下為佳、更佳為1~150μm。當開口部之寬度超過250μm時,雜訊抑制薄片之磁導率的降低增大故不佳。又,溝槽的深度,較佳為肥粒鐵之厚度的1/20~1/4、更佳為1/20~1/6。
接著,敘述本發明之肥粒鐵層合體之製造方法。
本發明之肥粒鐵層合體,可將事先分別製作之磁性層與導電層而層合而得。
肥粒鐵所構成之磁性層,例如,可如下述方式製造。
首先,肥粒鐵粉末,可藉由下述方式製得,將構成肥粒鐵之各元素的氧化物、碳酸鹽、氫氧化物、草酸鹽等之原料以既定之組成比例混合而得的原料混合物、或使各元素於水溶液中沉澱所得之沉澱物,於大氣中以700~900℃之溫度範圍進行暫時燒成1~20小時後,進行粉碎而得。
將所得之肥粒鐵粉末與黏結樹脂混合之後,藉粉末壓縮成形法、射出成形法、壓延法、擠製法等成形為含有肥粒鐵之樹脂板,視需要進行脫脂處理後,進行燒結處理可製造成肥粒鐵板。又,將肥粒鐵粉末、黏結樹脂與溶劑混合之後,以刮刀等塗布於薄膜或薄片上以得印刷電路基板,視需要進行脫脂處理之後,將所得之印刷電路基板進行燒結處理,藉此可製造肥粒鐵板。又,亦可將所得之印刷電路基板層合複數片之後進行燒結。
當視需要於肥粒鐵板形成溝槽時,可於肥粒鐵板之成
形中、成形後或燒結處理後形成溝槽。例如,當以粉末壓縮成形法或射出成形法進行成形時,以於成形中形成溝槽為佳,當以壓延法或擠製法進行成形時,以於成形後、燒結前形成為佳,當經由印刷電路基板製造肥粒鐵板時,以形成於印刷電路基板為佳。
脫脂處理,通常係以150~500℃之溫度進行。燒結溫度,通常為850~970℃、較佳為870~960℃。燒結時間,通常為30~180分鐘、較佳為30~120分鐘。當燒結溫度未滿850℃時,粒子之燒結難以進行,所得之肥粒鐵板之強度不足,μ’亦低。又,若燒結溫度為970℃則粒子的燒結可充分進行,故不需要超過970℃。當燒結時間未滿30分鐘時,粒子之燒結難以進行,所得之肥粒鐵板之強度不足,μ’亦低。又,當燒結時間為180分鐘時,粒子的燒結可充分進行,故不需要長於180分鐘。
接著,於所得之肥粒鐵板之一表面設置黏著層、例如雙面膠,並對另一表面設置黏著層或保護層之後,以滾輪等進行分割處理,藉此可得於肥粒鐵貼附有保護層及/或黏著層的磁性層。所得之磁性層,係具有於燒結肥粒鐵板所構成之肥粒鐵板之至少一表面形成有黏著層或保護層的層合構造者,而不同於樹脂等之黏結劑成分與肥粒鐵為混合狀態的複合體。
本發明中之導電層之製作方法,可使用周知之方法,例如,將導電性填料或樹脂添加於溶劑、並攪拌所得之分散液,使用棒塗器、刮刀塗布器、模口塗布器等以任意厚
度塗布於剝離性薄膜上之後,藉加熱等進行乾燥以除去溶劑,而可製得導電層。
前述溶劑,可舉例如甲乙酮、甲基異丁基酮、環己酮、異佛酮等酮溶劑、乙酸乙酯、乙酸丁酯等酯溶劑、甲苯、二甲苯等芳香族溶劑、乙酸賽璐蘇、乙酸甲賽璐蘇等賽璐蘇溶劑、四氫呋喃、二乙二醇二甲醚等醚溶劑、異丙醇、正丁醇等醇類、二甲基甲醯胺等非質子性極性溶劑。樹脂溶液中之溶劑之含量,可根據對溶劑所要求之黏度等加以適當決定。
前述剝離性薄膜,可舉例如聚丙烯膜、氟樹脂系膜、聚乙烯薄膜、聚對苯乙二醇酯(PET)薄膜、紙及對該等以矽酮樹脂施以剝離處理者等。厚度以10~200μm為佳。
透過於上述肥粒鐵貼附保護層與黏著層之燒結肥粒鐵板所構成之磁性層之一表面所設置之黏著層,層合上述導電層,藉此可得本發明之肥粒鐵層合體。於導電層之另一表面,視需要亦可設置黏著層或保護層。
本發明之肥粒鐵層合體,可作為雜訊抑制薄片使用。雜訊抑制薄片,藉由貼附於對象物,可發揮雜訊抑制效果。
本發明之雜訊抑制薄片,設置於對象物之方法並無特別限定,而較佳為,對欲抑制雜訊的面,以使磁性層相接的方式來設置。
本發明之最重要的點在於,本發明之雜訊抑制薄片,由於導電層之表面電阻為適當之範圍,故於1GHz下具有充分的雜訊抑制效果,再者,肥粒鐵之10MHz下之μ”大,故於10MHz下具有充分的雜訊抑制效果。
本發明之代表之實施形態係如以下所述。
肥粒鐵之組成為由係使用螢光X射線分析裝置3530(理學電機工業(股)製)進行測定。
本發明之厚度,係以測微計測定。
肥粒鐵之密度,係由游標尺與測微計所測得之外部尺寸與電子天秤所測得之重量計算求得。
磁性層之肥粒鐵之磁導率的實數部分μ’與虛數部分μ”,係將設置有黏著層或保護層之肥粒鐵進行分割處理之後,沖孔為外徑20mm、內徑10mm之環,使用阻抗分析儀E4991A(Agilent Technologies(股)製),於10MHz之頻率下測進行測定。
導電層之表面電阻,係使用電阻計Loresta-GP(三菱化學(股)製)測定。於製作成縱向35mm橫向45mm大小之導電層的中央部,以四點探針probe MCP-T600壓接以進行測定。
藉由以微帶線測定所得之透過衰減量,係如以下之方法進行測定。
於長度75mm、寬度2.3mm、厚度35μm及經阻抗調
整為50Ω之微帶線進行施工之基板,將製作成縱向35mm橫向45mm大小之層合體,使微帶線之長度方向對準層合體之橫向,使各中心為一致的方式裝設。將縱向35mm、橫向45mm及厚度10mm之發泡倍率約25倍的發泡聚苯乙烯所構成之板,疊合於層合體,以於其之上承載560g之荷重的狀態下,使用連接於微帶線之網路分析儀N5230A(Agilent Technologies(股)製)測定S參數。所得之S參數之中,將S21之大小(單位:dB)作為以微帶線測定所得之透過衰減量。又,透過衰減量,其值愈大表示雜訊抑制效果欲高之意。
藉由以環形天線測定所得之透過衰減量,係如以下之方法進行測定。
將一對直徑4mm之環形天線以0.5mm之間隔、環形面為平行、該等中心為一致的方式設置,將製作成縱向35mm橫向45mm大小之層合體,以使其之中心與環形天線之中心為一致的方式配置。使用連接於環形天線之網路分析儀N5230A(Agilent Technologies(股)製),以未配置層合體時之S21為基準,測定配置有層合體時之S21之大小(單位:dB)。將其作為以環形天線測定所得之透過衰減量。又,透過衰減量,其值愈大表示雜訊抑制效果欲高之意。
肥粒鐵之組成為由係以成為既定之組成的方式秤量各
氧化物原料,使用球磨機進行濕式混合20小時後,將混合漿料過濾、乾燥而得原料混合粉末。將該原料混合粉末以730℃燒成2小時所得之暫時燒成物以球磨機粉碎,而得Ni-Zn-Cu肥粒鐵粉末。
對所得之Ni-Zn-Cu肥粒鐵粉末100重量份,加入黏合材料之聚乙烯丁醛8重量份、可塑劑之苯二甲酸苄基-正丁酯3重量份、溶劑之3甲基-3甲氧基-1丁醇50重量份後,充分混合得漿料。將該漿料以刮刀式塗布器塗布於PET膜上以形成塗膜後,藉由乾燥而得厚度31μm之印刷電路基板。於另一表面,使用壓模形成格子狀之溝槽。
將所得之印刷電路基板以400℃脫脂之後,以880℃燒結2小時,藉此製得肥粒鐵板。該肥粒鐵板之組成為由係Fe2O3為49.4mol%、NiO為8.7mol%、ZnO為34.3mol%、CuO為7.6mol%,厚度為26μm,密度為4.83g/cm3。於所得之肥粒鐵板之一表面貼附厚度10μm之PET膜,於另一表面貼附厚度10μm之雙面膠。將所得之肥粒鐵板之層合物以滾輪將肥粒鐵分割成小片狀,而得於肥粒鐵貼附有保護層與黏著層之層合物(磁性層)。所得之肥粒鐵之μ’為170,μ”為128,厚度為46μm。
接著,以下述方法製作導電層。將纖維狀導電性碳(GRANOC middle fiber HC-600-15M(日本石墨纖維製))8wt%、丙烯酸樹脂(TEISANRESIN SG-P3(Nagase ChemteX製))12wt%、酚樹脂(CKM-908(昭和電工製))2wt%、難燃劑之氫氧化鋁14wt%、分散助
劑之粒狀磁鐵礦(MAT-305(戶田工業製))64wt%,加入至甲乙酮並攪拌,得導電性塗料,將所得之導電性塗料塗布於PET膜上,於熱風循環型乾燥機中以150。℃加熱乾燥而得導電層。所得之導電層的厚度為20μm,表面電阻為4860Ω/□。
將上述所得之磁性層之雙面膠的剝離紙剝離使黏著層露出,將上述所得之導電層之PET膜剝離,將導電層而層合於該黏著層之後,於導電層之一表面設置厚度10μm之黏著層(雙面膠),藉此製得層合體。所得之層合體,係依序層合有PET膜、肥粒鐵板、黏著層、導電層及黏著層(雙面膠)者。
所得之層合體之厚度為76μm,磁性層與導電層之厚度比(肥粒鐵/導電層)為1.3。又,以微帶線測定所得之透過衰減量於1GHz下為3.8dB,以環形天線測定所得之透過衰減量於10MHz下為19.9dB。
與實施例1以同樣方法製得層合體。此時之製造條件係示於表1,所得之層合體之諸特性示於表2。
除變更肥粒鐵之組成及燒成溫度之外,與實施例1以同樣方法製得磁性層。此時之製造條件係示於表1,所得之磁性層單層之諸特性示於表2。
於環己酮溶解有20重量%苯乙烯系彈性體之溶液,以使除去溶劑後之體積比成為扁平狀鐵-鋁-矽合金粉末(鐵、鋁、矽之重量比為85:6:9,長寬比為20~30,平均粒徑為40μm)為55vol%、苯乙烯系彈性體為45vol%的方式計量,充分混合而得漿料。此時,為了調整黏度而添加乙基環己酮。將該漿料藉由刮刀式塗布機,塗布於PET膜上並乾燥。將所得之塗膜以溫度130℃、壓力90MPa、加壓時間5分鐘之條件進行成形,製得厚度50μm之含有扁平狀鐵-鋁-矽合金粉末之薄片。所得薄片之10MHz下之磁導率之實數部分μ’為89、虛數部分μ”為22,表面電阻為2×108Ω/□。以微帶線測定所得之透過衰減量於1GHz下為1.2dB,以環形天線測定所得之透過衰減量於10MHz下為10.8dB。
將所得之層合體之透過衰減量示於表2。
將實施例1所得之導電層、與比較例2所得之含有扁平狀鐵-鋁-矽合金粉末之薄片,透過厚度10μm之雙面膠貼合而得層合體。所得層合體之以微帶線測定所得之透過衰減量於1GHz下為3.7dB,以環形天線測定所得之透過衰減量於10MHz下為10.9dB。
將所得之層合體之透過衰減量示於表2。
Claims (7)
- 一種肥粒鐵層合體,其特徵係由:由導電性填料與樹脂所構成之導電性層、與由燒結肥粒鐵所構成之磁性層所構成,其中該層合體之以微帶線測定所得之透過衰減量於1GHz下為3.6~8dB,以環形天線測定所得之透過衰減量於10MHz下為12~30dB,前述磁性層之10MHz下之磁導率之實數部分為130~480,磁導率之虛數部分為30~440。
- 如請求項1之肥粒鐵層合體,其中前述導電層之表面電阻為100~5000Ω/□。
- 如請求項1之肥粒鐵層合體,其中導電層與磁性層係透過黏著層而層合。
- 如請求項1至3中任一項之肥粒鐵層合體,其中於該層合體之至少一表面進一步設置黏著層或保護層。
- 如請求項1至3中任一項之肥粒鐵層合體,其中於該層合體之一表面進一步設置黏著層,於相反側之表面進一步設置保護層。
- 如請求項1至3中任一項之肥粒鐵層合體,其中燒結肥粒鐵之組成為由以氧化物換算47~50mol%之Fe2O3、8~16mol%之NiO、24~35mol%之ZnO、7~12.5mol%之CuO所構成,合計為100mol%。
- 一種雜訊抑制薄片,其特徵係由請求項1至6中任一項之肥粒鐵層合體所構成。
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JP2015117174A (ja) * | 2013-12-20 | 2015-06-25 | Tdk株式会社 | フェライトプレート、アンテナ素子用部材、およびアンテナ素子 |
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2016
- 2016-07-11 CN CN201680041151.9A patent/CN107836140B/zh active Active
- 2016-07-11 WO PCT/JP2016/070393 patent/WO2017010447A1/ja active Application Filing
- 2016-07-11 US US15/743,794 patent/US11096318B2/en active Active
- 2016-07-11 JP JP2017528666A patent/JP6939551B2/ja active Active
- 2016-07-11 KR KR1020187000880A patent/KR102572806B1/ko active IP Right Grant
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JPWO2017010447A1 (ja) | 2018-06-14 |
JP6939551B2 (ja) | 2021-09-22 |
CN107836140B (zh) | 2019-12-06 |
KR102572806B1 (ko) | 2023-08-29 |
CN107836140A (zh) | 2018-03-23 |
TW201716230A (zh) | 2017-05-16 |
US11096318B2 (en) | 2021-08-17 |
KR20180030824A (ko) | 2018-03-26 |
WO2017010447A1 (ja) | 2017-01-19 |
US20180199474A1 (en) | 2018-07-12 |
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