WO2016121619A1 - 金属光沢を有する顔料用板状フェライト粒子 - Google Patents
金属光沢を有する顔料用板状フェライト粒子 Download PDFInfo
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- WO2016121619A1 WO2016121619A1 PCT/JP2016/051717 JP2016051717W WO2016121619A1 WO 2016121619 A1 WO2016121619 A1 WO 2016121619A1 JP 2016051717 W JP2016051717 W JP 2016051717W WO 2016121619 A1 WO2016121619 A1 WO 2016121619A1
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- WIPO (PCT)
- Prior art keywords
- plate
- ferrite
- ferrite particles
- resin
- pigment
- Prior art date
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- 229910000859 α-Fe Inorganic materials 0.000 title claims abstract description 127
- 239000002245 particle Substances 0.000 title claims abstract description 91
- 239000000049 pigment Substances 0.000 title claims abstract description 22
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims abstract description 61
- 239000002932 luster Substances 0.000 claims description 20
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 22
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- 238000010298 pulverizing process Methods 0.000 description 6
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
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- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229920006370 Kynar Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
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- 241000282341 Mustela putorius furo Species 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 239000000696 magnetic material Substances 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
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- 238000010309 melting process Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/22—Compounds of iron
- C09C1/24—Oxides of iron
- C09C1/245—Oxides of iron of plate-like shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G49/00—Compounds of iron
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G49/00—Compounds of iron
- C01G49/02—Oxides; Hydroxides
- C01G49/06—Ferric oxide [Fe2O3]
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G53/00—Compounds of nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/22—Compounds of iron
- C09C1/24—Oxides of iron
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/36—Pearl essence, e.g. coatings containing platelet-like pigments for pearl lustre
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/42—Magnetic properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
Definitions
- the present invention relates to a plate-like ferrite particle for pigment having metallic luster, and more specifically, a plate-like ferrite particle for pigment having electromagnetic wave shielding ability and design properties, a resin molded body containing the plate-like ferrite particle for pigment, and the resin
- the present invention relates to an electromagnetic wave shielding housing that houses an electronic circuit using a molded body.
- ferrite materials have been used as electromagnetic wave absorbing materials and electromagnetic shielding materials because of their high magnetic permeability, and electromagnetic wave absorption characteristics are known to be in the electromagnetic wave absorbing region in the frequency region above the natural resonance frequency of ferrite. Yes.
- Patent Document 1 Japanese Patent Laid-Open No. 10-233309 discloses a powder obtained by pulverizing soft magnetic ferrite produced by a casting method, having a length in the longitudinal direction of 1 to 100 ⁇ m and an aspect ratio. A flat ferrite powder of 5-100 is disclosed. And, as its manufacturing method, after melting the raw material of soft magnetic ferrite in a constant atmosphere and casting the molten metal obtained in the melting process into a mold preheated in a constant atmosphere, it is cooled under specific conditions. In addition, it is described that the method includes a casting process for producing a soft magnetic ferrite ingot, and a crushing process for crushing the ingot obtained by the casting process with a crushing means.
- the flat ferrite powder of Patent Document 1 has a high magnetic permeability and is flat, a magnetic field in a high-frequency region of 1000 MHz or higher when incorporated in a sheet-like magnetic field shielding material in a direction along the sheet surface. It is said that it contributes to improving the shielding ability.
- flat ferrite powder in the manufacturing method, flat ferrite powder can be easily manufactured simply by pulverizing a ferrite ingot cast under set conditions without involving a difficult operation of pulverizing spherical powder. It contributes to the simplification of the manufacturing process of the ferrite powder for sheet-like magnetic field shielding material, and its industrial value is said to be great.
- Patent Document 2 Japanese Patent Laid-Open No. 2001-284118
- at least a part of the flat ferrite particles has a maximum major axis d in the range of 1 ⁇ m to 100 ⁇ m, and the ratio of the maximum major axis d to the thickness t
- a ferrite powder containing flat ferrite particles in which d / t) is in the range of 2.5 ⁇ (d / t) is described.
- the production method includes a step of forming a sheet using a ferrite raw material, firing the sheet to make a ferrite, pulverizing the ferrited sheet, and obtaining ferrite particles including flat ferrite particles. Is described.
- Patent Document 2 it is possible to provide a ferrite powder suitable for obtaining a composite magnetic molded article having high magnetic permeability and excellent noise absorption characteristics in a high frequency band and having high reliability with respect to insulation. It is also described that the ferrite powder can be provided easily and stably by the manufacturing method.
- Patent Document 3 Japanese Patent Laid-Open No. 2000-2521173
- the shape is plate-like and the composition is Mg a Cu b Zn c Fe d O 4 (provided that 0.3 ⁇ a ⁇ 0.5, 0 ⁇ b ⁇ 0.2, 0.4 ⁇ c ⁇ 0.6, 1.8 ⁇ d ⁇ 2.2), and a soft magnetic ferrite particle powder and a soft magnetic ferrite particle composite using the same Has been.
- the soft magnetic ferrite particle composite in which the soft magnetic ferrite particle powder of Patent Document 3 is mixed in a matrix has a high real part of relative permeability in a low frequency band, and can absorb electromagnetic waves over a wide band in a high frequency band.
- the soft magnetic ferrite particle powder described in Patent Document 3 is obtained by using plate-like ⁇ -Fe 2 O 3 as a Fe element supply source and firing the ferrite raw material at a temperature of 1200 ° C. or lower. ing.
- Patent Document 4 Japanese Patent Laid-Open No. 2001-15312
- a mixed liquid in which fine ferrite is mixed with a binder is coated on a film to form a ferrite sheet, the ferrite sheet is peeled off from the film, and the ferrite sheet is pulverized.
- a method for producing a magnetic electromagnetic wave absorbing paste is described in which the powder is fired to obtain a ferrite powder, and the ferrite powder is mixed with a paste material to produce a magnetic electromagnetic wave absorbing paste.
- Patent Document 4 a magnetic electromagnetic wave absorbing paste having ferrite particles having an aspect ratio of 10 or more can be produced by this manufacturing method, and a magnetic electromagnetic wave absorbing paste capable of absorbing broadband and high frequency electromagnetic waves with a high absorption rate is manufactured. I can do it.
- Patent Document 4 when the ferrite sheet is peeled off from the film and only the ferrite sheet is taken out, the ferrite sheet is destroyed and it is difficult to obtain ferrite powder in a stable state. Also, in order to prevent the ferrite sheet from being destroyed when it is peeled off from the film, it is necessary to add a large amount of binder component to the mixed liquid to be applied. However, the increase in the binder component is the generation of pores in the ferrite during firing. And hindered grain growth.
- the soft magnetic ferrite particle composite described in Cited Document 3 is a simple one that uses a gray or black ferrite particle powder and pastes the processed powder into a tile shape on the electronic circuit inside the mobile phone case.
- 3 and 4 show a cross-sectional view of a resin molded body using the plate-like ferrite and a cross-sectional view of an electromagnetic wave shielding housing portion that houses an electronic circuit using the resin molded body.
- 1b is a resin molding
- 2b is a ferrite particle layer
- 4 is a protective layer
- 5 is an adhesive layer.
- This resin molding 1b is obtained by laminating a protective layer 4, a ferrite particle layer 2b, and an adhesive layer 5.
- FIG. 3 shows a cross-sectional view of a resin molded body using the plate-like ferrite and a cross-sectional view of an electromagnetic wave shielding housing portion that houses an electronic circuit using the resin molded body.
- 1b is a resin molding
- 2b is a ferrite particle
- 6 is an antenna coil
- 7 is an electronic circuit
- 8 is a metal electromagnetic wave shield
- 9 is a resin casing (case).
- the resin molded body 1 b is bonded to the metal electromagnetic wave shield 8 through the adhesive layer 5, and the resin casing (case) 9 does not have radio wave shielding ability.
- the ferrite particle layer 3 forms a tile-shaped resin molded body 1a together with the protective layer 2 and the adhesive layer 4, and the interior of the resin casing (case) 9 of the mobile phone.
- the electronic circuit 7 was merely pasted.
- an object of the present invention is to provide a plate-like ferrite particle for pigment having both electromagnetic wave shielding ability and designability, a resin molded body containing the plate-like ferrite particle for pigment, and an electronic circuit using the resin molded body.
- an electromagnetic shielding housing for storage is provided.
- the present inventors have found that the plate-like ferrite particles having a metallic luster have an electromagnetic wave shielding ability and a design property and satisfy the above object, and the present invention. It came to.
- the present invention provides plate-like ferrite particles for pigments characterized by having a metallic luster.
- the plate-like ferrite particles for pigment according to the present invention preferably have a length in the minor axis direction of 3 to 100 ⁇ m and a length in the major axis direction of 10 to 2000 ⁇ m.
- the present invention also provides a resin molded body containing the above plate ferrite particles for pigment.
- the present invention also provides an electromagnetic wave shielding housing that houses an electronic circuit using the resin molding.
- the plate-like ferrite particles for pigment according to the present invention have a metallic luster, they have not only electromagnetic wave shielding ability but also design properties. Then, a resin molded body can be prepared using the plate-like ferrite particles as a pigment, and an electromagnetic wave shielding housing for accommodating an electronic circuit can be obtained using the resin molded body.
- this electromagnetic wave shielding casing since the plate-like ferrite particles are not tile-like, the resin molded body molded with resin has flexibility, so that it can be curved and the plate-like ferrite particles having a metallic luster are used. It also has design characteristics. Furthermore, since it is a ferrite which is an oxide, surface oxidation does not occur and it can be used stably over a long period of time.
- FIG. 1 is a cross-sectional view of a resin molded body using a plate-like ferrite according to the present invention.
- FIG. 2 is a cross-sectional view of an electromagnetic wave shielding housing portion that houses an electronic circuit using the resin molded body according to the present invention.
- FIG. 3 is a sectional view of a resin molded body using a conventional plate-like ferrite.
- FIG. 4 is a cross-sectional view of an electromagnetic wave shielding housing portion that houses an electronic circuit using a conventional resin molding.
- the plate-like ferrite particles according to the present invention have a metallic luster, they are used for pigments.
- the ferrite particles mean an aggregate of individual ferrite particles, and the individual ferrite particles are simply referred to as particles.
- the metallic luster here is manifested only when it is so smooth that it reflects in the direction in which light is incident on the ferrite particle surface, and it glows whitish.
- the ferrite powder in the case where the light does not reflect in the incident direction has a blackish color originally possessed by the ferrite composition. The smoothness of the ferrite particle surface will be described later.
- the plate-like ferrite particles according to the present invention preferably have a length in the minor axis direction of 3 to 100 ⁇ m and a length in the major axis direction of 10 to 2000 ⁇ m.
- the length in the minor axis direction is less than 3 ⁇ m, the ferrite particles become too thin, and the strength of the ferrite particles cannot be obtained sufficiently and cracks. Therefore, there is a possibility that sufficient metallic luster cannot be obtained. If it exceeds 100 ⁇ m, when trying to produce a molded body with a curved surface from a resin molded product to which ferrite particles have been added, the ferrite particles will pop out from the curved surface, making it impossible to obtain a resin molded body with a smooth curved surface. There is sex. If the length in the major axis direction is less than 10 ⁇ m, the incident light cannot be sufficiently reflected, so that the metallic luster cannot be obtained. If it exceeds 2000 ⁇ m, the particles are fused to each other during the main firing, and the thickness in the minor axis direction tends to increase, and plate-like particles having a desired thickness cannot be obtained.
- the length (plate diameter) in the long axis direction was taken with a SEM with a magnification of 35 times, and the obtained image was printed out in A4 size for each field of view, and the horizontal ferret diameter of the particles was measured with a ruler.
- the arithmetic average of the particles was defined as the length in the average major axis direction (average plate diameter).
- a measurement sample was prepared by the following method, and the length (thickness) of the minor axis direction was measured.
- the plate-like ferrite particles according to the present invention preferably have a surface roughness (Ra) measured by a laser microscope of 0.01 to 3 ⁇ m. With the surface roughness (Ra) within the above range, plate-like ferrite particles having metallic luster can be obtained.
- the surface roughness (Ra) measured by a laser microscope cannot be less than 0.01 ⁇ m because there is a subtle difference in the growth rate of grains in the main firing. If it exceeds 3 ⁇ m, the surface roughness is large, and incident light is reflected and absorbed in various directions, so that metallic luster cannot be obtained.
- a hydrophilic ink containing a filler is prepared in advance.
- Fillers include metal oxides, metal carbonates, metal hydroxides, and mixtures thereof.
- the obtained calcined product is coarsely pulverized and then finely pulverized, and then a cake-like calcined product having an adjusted water content is obtained.
- a dispersant is added to the cake-like temporarily fired product and dispersed using a homogenizer to obtain a water-based ink, and a binder is further added.
- Coating is performed on the film with a comma coater so as to have a predetermined thickness using the ink described above. After coating, after removing moisture, the entire film is immersed in a solvent such as methyl ethyl ketone to separate only the ink portion, and further the solvent is removed to remove the granulated product for plate-like (ferrite precursor) before firing. obtain.
- a solvent such as methyl ethyl ketone
- plate-shaped ferrite particles having a predetermined shape are obtained by grinding.
- the surface roughness of the hydrophobic substrate is 5 ⁇ m or less in order to impart a metallic luster.
- the solid content of the ink is preferably 50 to 87% by weight, and more preferably 65 to 85% by weight.
- the amount is less than 50% by weight, hydrophilic ink is repelled by the hydrophobic substrate, coating cannot be performed, and a plate-like granulated product cannot be obtained. If it exceeds 87% by weight, the viscosity of the ink becomes high and the ink does not spread, so that coating may not be possible.
- the viscosity of the ink is preferably 500 to 2500 cp.
- 500 cp hydrophilic ink is repelled by the hydrophobic base material, coating cannot be performed, and a plate-like granulated product cannot be obtained. If it exceeds 2500 cp, there is a possibility that coating cannot be performed because the ink does not spread.
- the resin molded body according to the present invention is obtained by heat curing a resin molded product obtained by mixing the ferrite particles and the resin.
- the resin molded product contains the above plate-like ferrite particles in an amount of 50 to 99.5% by weight.
- content of the ferrite particles is less than 50% by weight, the ferrite characteristics cannot be sufficiently exhibited even if the ferrite particles are contained.
- content of a ferrite particle exceeds 99.5 weight%, since resin is hardly contained, there exists a possibility that it cannot shape
- the resin used in the resin composition preferably has flexibility, and the resin molded body can be processed into a curved surface by using the resin having flexibility.
- the resin include, but are not particularly limited to, an epoxy resin, a phenol resin, a melamine resin, a urea resin, and a fluororesin.
- the resin composition contains a curing agent and a curing accelerator, and further contains various additives such as silica particles as necessary.
- FIG. 1 shows a cross-sectional view of a resin molded body according to the present invention.
- a resin molded body 1 a shown in FIG. 1 is composed of plate-like ferrite particles 2 a and a resin 3. As described above, the resin molded body 1a can be processed into a curved surface by using a resin having flexibility.
- FIG. 2 is a cross-sectional view of an electromagnetic wave shielding housing portion that houses an electronic circuit using the resin molded body according to the present invention, and the same reference numerals as those in FIG.
- the resin molded body 1 a is arranged with a curved surface on the outer peripheral surface of the metal electromagnetic wave shield 8, and forms an electromagnetic wave shielding casing (seal).
- Example 1 (Preparation of ink) Fe 2 O 3 : 49 mol, NiO: 15 mol, ZnO: 30 mol, CuO: Weighed iron oxide, nickel oxide, zinc oxide and copper oxide so as to be 6 mol. After pelletizing with a compactor, it was calcined in a rotary kiln with a firing temperature of 1000 ° C. and an air atmosphere.
- the obtained calcined product is coarsely pulverized with a rod mill, then finely pulverized with a wet bead mill, and then a cake-like calcined product whose moisture content is adjusted to 80% by weight is obtained. It was.
- a water-based ink was obtained by adding a dispersant to the cake-like temporarily fired product and dispersing the cake using a homogenizer. Further, a binder (PVA) was added so as to be 2% by weight with respect to the water content of the water-based ink.
- the coating was performed on a commercially available PET film (thickness: 50 ⁇ m) using a comma coater so that the WET thickness was 12 ⁇ m. After coating, after removing moisture, only the ink part was peeled off by immersing the entire PET film in MEK, and further, MEK was removed to obtain a granule for plate-like (ferrite precursor) before firing. .
- the obtained plate-like granulated product (ferrite precursor) before firing was subjected to binder removal treatment in the air at 650 ° C., and then subjected to main firing in an air atmosphere at 1220 ° C. for 4 hours.
- the obtained fired product was plate-shaped, and plate-like ferrite particles having a length of 9 ⁇ m in the minor axis direction and a length of 352 ⁇ m in the major axis direction were obtained by pulverization.
- Example 2 Plate-like ferrite particles were obtained in the same manner as in Example 1 except that the solid content of the ink was 85% by weight.
- Example 3 Plate-like ferrite particles were obtained in the same manner as in Example 1 except that the solid content of the ink was 70% by weight.
- Example 4 Plate-like ferrite particles were obtained in the same manner as in Example 1 except that the firing temperature was 1165 ° C.
- Example 5 Plate-like ferrite particles were obtained in the same manner as in Example 1 except that the coating thickness was 38 ⁇ m.
- Example 6 Plate-like ferrite particles were obtained in the same manner as in Example 1 except that the coating thickness was 8 ⁇ m.
- Table 1 shows.
- Table 2 shows the coating conditions (coating method, film running speed, film surface temperature and peeling liquid), binder removal processing conditions (processing temperature and baking atmosphere) and main baking conditions (baking temperature and baking atmosphere).
- the properties of ferrite particles are shown in Table 3. Show.
- the BET specific surface area was measured using a specific surface area measuring device (model: Macsorb HM model-1208 (manufactured by Mountec)). About 5 to 7 g of the measurement sample was put in a standard sample cell dedicated to a specific surface area measurement device, accurately weighed with a precision balance, the sample (ferrite particles) was set in the measurement port, and measurement was started. The measurement is performed by a one-point method, and the BET specific surface area is automatically calculated when the weight of the sample is input at the end of the measurement.
- the frequency characteristics of the complex permeability were measured as follows. Measurement was performed using an E4991A type RF impedance / material analyzer 16454A magnetic material measuring electrode manufactured by Agilent Technologies.
- complex permeability measurement sample Preparation of a complex permeability frequency characteristic measurement sample (hereinafter simply referred to as “complex permeability measurement sample”) is as follows. That is, 1 g of binder resin (Kynar 301F: polyvinylidene fluoride) is weighed into 9 g of the composite magnetic powder for noise suppression, placed in a 50 cc glass bottle, and stirred and mixed for 30 minutes in a 100 rpm ball mill.
- binder resin Kynar 301F: polyvinylidene fluoride
- the magnetic characteristics were measured using a vibration sample type magnetometer (model: VSM-C7-10A (manufactured by Toei Industry Co., Ltd.)).
- the measurement sample (ferrite particles) was packed in a cell having an inner diameter of 5 mm and a height of 2 mm and set in the above apparatus.
- the measurement was performed by applying an applied magnetic field and sweeping to 5K ⁇ 1000 / 4 ⁇ ⁇ A / m.
- the applied magnetic field was decreased to create a hysteresis curve on the recording paper. From this curve data, the magnetization at an applied magnetic field of 5K ⁇ 1000 / 4 ⁇ ⁇ A / m was read. Also, the residual magnetization and coercive force were calculated in the same manner.
- Examples 1 to 6 were plate-like ferrite particles having a small surface roughness and a metallic luster.
- Comparative Example 1 since the firing temperature was too low and the grains did not grow sufficiently, the surface roughness increased and the metal luster was not sufficiently obtained. Further, in Comparative Example 2, the firing temperature was too high, and the ferrite particles were fused together, so that plate-like ferrite particles were not formed. Further, Comparative Example 1 and Comparative Example 2 had lower magnetic permeability than Examples 1 to 6, and the magnetic shielding effect was inferior.
- Example 7 (Production of resin molding)
- the binder resin (PVA aqueous solution 10 wt%) 60 wt% and the plate-like ferrite particles 40 wt% obtained in Example 1 were mixed and dispersed, and coated on a PET film with an applicator (10 mil). After drying and removing moisture, it was peeled from the PET film to obtain a resin molded body. It was confirmed that this resin molding also had a metallic luster and was excellent in design.
- Example 8 Manufacture of housing using resin molding
- a plurality of resin molded bodies obtained in Example 7 were sandwiched between a plurality of chamfered molds and pressure-molded while heating to produce a casing. This case was confirmed to be curved and have a metallic luster and excellent design.
- the plate-like ferrite particles for pigment of the present invention have a metallic luster, they have not only electromagnetic wave shielding ability but also design properties. For this reason, a resin molded body can be prepared by using the plate-like ferrite particles as a pigment, and an electromagnetic wave shielding housing for storing an electronic circuit can be obtained using the resin molded body.
- the ferrite particles are not tile-shaped, and the resin molded body molded with resin has flexibility, so that it can be formed by curved surface processing and has design properties. Furthermore, since it is a ferrite which is an oxide, surface oxidation does not occur and it can be used stably over a long period of time.
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Abstract
Description
に至った。
本発明に係る板状フェライト粒子は、金属光沢を有するため顔料用として用いられる。ここで、フェライト粒子とは、特記しない限り、個々のフェライト粒子の集合体を意味し、個々のフェライト粒子は単に粒子という。
長軸方向の長さ(板径)は倍率35倍のSEMにて撮影し、得られた画像を1視野ごとにA4サイズでプリントアウトし、定規にて粒子の水平フェレ径を測定し、100粒子の算術平均を平均長軸方向の長さ(平均板径)とした。
粒子の短軸方向の長さ(厚さ)は、下記の方法にて測定用サンプルを作製し、短軸方向の長さ(厚さ)を計測した。
得られたフェライト粒子を9gと粉末樹脂1gを50ccガラス瓶に入れ、ボールミルにて30min混合し、得られた混合物を直径13mmのダイスに入れて30MPaで加圧成型した。成型体の断面が見えるように垂直に立てた状態で樹脂に包埋し、研磨機で研磨することで厚さ測定用サンプルとした。準備した厚さ測定用サンプルを倍率50倍のSEMにて撮影し、得られた粒子の短軸方向の長さ(厚さ)を測定し、100粒子の算術平均を粒子の平均短軸方向の長さ(平均厚さ)とした。
アスペクト比は上記測定方法により算出された平均長軸方向の長さ(平均板径)及び平均短軸方向の長さ(平均厚さ)から、アスペクト比=平均長軸方向の長さ/平均短軸方向の長さとして算出した。
JIS B 0601-2001に準拠して測定した。
本発明の板状フェライト粒子の製造では、予めフィラーを含有する親水性インクを調製する。フィラーとしては、金属酸化物、金属炭酸塩、金属水酸化物、及びそれらの混合物が挙げられる。フェライト原料をヘンシェルミキサー等で混合後、混合物をローラーコンパクターでペレット化したのち、例えば焼成温度1000℃、大気雰囲気のロータリーキルンにて仮焼を行う。
本発明に係る樹脂成型体は、上記フェライト粒子と樹脂を混合して得られた樹脂成型物を加熱硬化することにより得られる。樹脂成型物中に上記板状フェライト粒子を50~99.5重量%含有する。フェライト粒子の含有量が50重量%を下回ると、フェライト粒子を含有していてもフェライトの特性を十分発揮することができない。また、フェライト粒子の含有量が99.5重量%を超える場合は、樹脂をほとんど含有していないため、成型できない可能性がある。
本発明に係る樹脂成型体を用いた電子回路を収納する電磁波シールド筐体部分の断面図を図2に示し、図4と同一の符号のものは同様のものを示す。図2では、樹脂成型体1aは金属製電磁波シールド8の外周面に曲面をもって配されており、電磁波シールド筐体(シール)を形成している。
(インクの作製)
Fe2O3:49モル、NiO:15モル、ZnO:30モル、CuO:6モルとなるように酸化鉄、酸化ニッケル、酸化亜鉛、酸化銅を秤量し、ヘンシェルミキサーで混合後、混合物をローラーコンパクターでペレット化したのち、焼成温度1000℃、大気雰囲気のロータリーキルンにて仮焼を行った。
塗工は市販のPETフィルム(厚さ50μm)にコンマコーターにより上述のインクを用いてWET厚が12μmになるように行った。塗工後、水分を除去したのち、MEKにPETフィルムごと浸漬することでインク部分のみを剥離させ、さらにMEKを除去することで焼成前の板状用造粒物(フェライト前駆体)を得た。
得られた焼成前の板状用造粒物(フェライト前駆体)を650℃の大気中にて脱バインダー処理を行った後、1220℃の大気雰囲気で本焼成を4時間行った。得られた焼成物は板状となっており、粉砕することで短軸方向の長さ9μm、長軸方向の長さ352μmの板状フェライト粒子が得られた。
インクの固形分を85重量%とした以外は、実施例1と同様にして板状フェライト粒子を得た。
インクの固形分を70重量%とした以外は、実施例1と同様にして板状フェライト粒子を得た。
焼成温度を1165℃とした以外は、実施例1と同様にして板状フェライト粒子を得た。
塗工厚を38μmとした以外は、実施例1と同様にして板状フェライト粒子を得た。
塗工厚を8μmとした以外は、実施例1と同様にして板状フェライト粒子を得た。
焼成温度を1050℃とした以外は、実施例1と同様にして板状フェライト粒子を得た。
焼成温度を1310℃とした以外は、実施例1と同様にして板状フェライト粒子を得た。
このBET比表面積の測定は、比表面積測定装置(型式:Macsorb HM model-1208(マウンテック社製))を用いた。測定試料を比表面積測定装置専用の標準サンプルセルに約5~7g入れ、精密天秤で正確に秤量し、測定ポートに試料(フェライト粒子)をセットし、測定を開始した。測定は1点法で行い、測定終了時に試料の重量を入力すると、BET比表面積が自動的に算出される。なお、測定前に前処理として、測定試料を薬包紙に20g程度を取り分けた後、真空乾燥機で-0.1MPaまで脱気し-0.1MPa以下に真空度が到達していることを確認した後、200℃で2時間加熱した。
環境:温度;10~30℃、湿度;相対湿度で20~80% 結露なし
複素透磁率の周波数特性の測定は下記のようにして行った。
アジレントテクノロジー社製E4991A型RFインピーダンス/マテリアル・アナライザ 16454A磁性材料測定電極を用いて測定した。
磁気特性は、振動試料型磁気測定装置(型式:VSM-C7-10A(東英工業社製))を用いて測定した。測定試料(フェライト粒子)は、内径5mm、高さ2mmのセルに詰めて上記装置にセットした。測定は、印加磁場を加え、5K・1000/4π・A/mまで掃引した。次いで、印加磁場を減少させ、記録紙上にヒステリシスカーブを作成した。このカーブのデータより印加磁場が5K・1000/4π・A/mにおける磁化を読み取った。また、残留磁化及び保磁力も同様に算出した。
(樹脂成型体の作製)
バインダー樹脂(PVA水溶液10wt%)60重量%と実施例1で得られた板状フェライト粒子40重量%を混合、分散し、アプリケーター(10mil)でPETフィルム上に塗布した。乾燥させて水分を除去したのちPETフィルムから剥離させて樹脂成型体とした。この樹脂成型体も金属光沢があり、意匠性に優れていることが確認できた。
(樹脂成型体を用いた筐体の作製)
実施例7で得られた樹脂成型体を複数重ねて面取りした金型に挟んで加熱しながら加圧成型し、筐体を作製した。この筐体は、曲面加工されており、金属光沢があり、意匠性に優れていることが確認できた。
Claims (4)
- 金属光沢を有することを特徴とする顔料用板状フェライト粒子。
- 短軸方向の長さが3~100μm、長軸方向の長さが10~2000μmである請求項1に記載の顔料用板状フェライト粒子。
- 請求項1又は2に記載の顔料用板状フェライト粒子を含有した樹脂成型体。
- 請求項3に記載の樹脂成型体を用いた電子回路を収納する電磁波シールド筐体。
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US15/541,408 US20170349449A1 (en) | 2015-01-27 | 2016-01-21 | Plate shaped ferrite particles having metallic luster for pigment |
CN201680004862.9A CN107207277B (zh) | 2015-01-27 | 2016-01-21 | 具有金属光泽的颜料用板状铁氧体粒子 |
KR1020177018677A KR102228647B1 (ko) | 2015-01-27 | 2016-01-21 | 금속 광택을 가지는 안료용 판상 페라이트 입자 |
JP2016571983A JP6736479B2 (ja) | 2015-01-27 | 2016-01-21 | 金属光沢を有する顔料用板状フェライト粒子 |
EP16743223.6A EP3252015B1 (en) | 2015-01-27 | 2016-01-21 | Plate-shaped ferrite particles for pigment which exhibit metallic lustre |
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WO2019159800A1 (ja) * | 2018-02-13 | 2019-08-22 | パウダーテック株式会社 | 複合粒子、粉末、樹脂組成物および成形体 |
JP7371348B2 (ja) | 2019-05-20 | 2023-10-31 | 三菱電機株式会社 | 回路基板用バリア構造 |
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- 2016-01-21 TW TW105101828A patent/TWI716376B/zh active
- 2016-01-21 EP EP16743223.6A patent/EP3252015B1/en active Active
- 2016-01-21 CN CN201680004862.9A patent/CN107207277B/zh active Active
- 2016-01-21 US US15/541,408 patent/US20170349449A1/en not_active Abandoned
- 2016-01-21 KR KR1020177018677A patent/KR102228647B1/ko active IP Right Grant
- 2016-01-21 WO PCT/JP2016/051717 patent/WO2016121619A1/ja active Application Filing
- 2016-01-21 JP JP2016571983A patent/JP6736479B2/ja active Active
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019159800A1 (ja) * | 2018-02-13 | 2019-08-22 | パウダーテック株式会社 | 複合粒子、粉末、樹脂組成物および成形体 |
JPWO2019159800A1 (ja) * | 2018-02-13 | 2021-02-12 | パウダーテック株式会社 | 複合粒子、粉末、樹脂組成物および成形体 |
JP7371348B2 (ja) | 2019-05-20 | 2023-10-31 | 三菱電機株式会社 | 回路基板用バリア構造 |
Also Published As
Publication number | Publication date |
---|---|
CN107207277B (zh) | 2020-09-04 |
TWI716376B (zh) | 2021-01-21 |
CN107207277A (zh) | 2017-09-26 |
JPWO2016121619A1 (ja) | 2017-11-02 |
EP3252015A4 (en) | 2018-09-19 |
EP3252015B1 (en) | 2020-08-12 |
US20170349449A1 (en) | 2017-12-07 |
TW201631053A (zh) | 2016-09-01 |
KR102228647B1 (ko) | 2021-03-15 |
EP3252015A1 (en) | 2017-12-06 |
JP6736479B2 (ja) | 2020-08-05 |
KR20170107986A (ko) | 2017-09-26 |
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