TWI675020B - 肥粒鐵燒結板及肥粒鐵燒結薄片 - Google Patents

肥粒鐵燒結板及肥粒鐵燒結薄片 Download PDF

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TWI675020B
TWI675020B TW104116267A TW104116267A TWI675020B TW I675020 B TWI675020 B TW I675020B TW 104116267 A TW104116267 A TW 104116267A TW 104116267 A TW104116267 A TW 104116267A TW I675020 B TWI675020 B TW I675020B
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ferrous iron
iron sintered
plate
sheet
ferrous
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TW104116267A
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TW201609602A (zh
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岡野洋司
定井真
本田晋吾
車田光謙
吉田明広
川戶一良
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日商戶田工業股份有限公司
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  • Compounds Of Iron (AREA)

Abstract

本發明，係關於一種肥粒鐵燒結板，其係具有以氧化物換算為47~50mol%之Fe2O3、7.0~26mol%之NiO、13~36mol%之ZnO、7.0~12mol%之CuO、0~1.5mol%之CoO所構成之組成，且體積電阻率為1×108~1×1012Ωcm、厚度為10~60μm，及，關於一種肥粒鐵燒結薄片，其特徵係該肥粒鐵燒結板之表面上設置溝，進而，設置黏著層及/或保護層，500kHz中的磁導率之實數部分為120~800、磁導率之虛數部分為0~30、磁導率之實數部分與肥粒鐵燒結板的厚度之乘積(μm)為5000~48000。本發明之肥粒鐵燒結板及肥粒鐵燒結薄片，係因體積電阻率高、μ'大、μ"小，故適合可作為提昇座標讀取系統之遮蔽板來使用。

Description

肥粒鐵燒結板及肥粒鐵燒結薄片
本發明為提供一種於肥粒鐵燒結板及該肥粒鐵燒結板之表面上設置黏著層及/或保護層之肥粒鐵燒結薄片。進而更詳細而言，為提供一種於行動終端之座標讀取系統之偵測器背面所配置之遮蔽板。
智慧手機、平板電腦、個人電腦等之行動終端中，搭載有藉由觸控筆等之座標指示器偵測出作為數位資訊之液晶螢幕上之位置資訊的座標讀取系統。此系統使用100kHz~1MHz左右之交流磁場，並利用座標指示器與偵測器之間的磁耦合來偵測位置資訊。還有，為了提昇讀取靈敏度和位置精度，偵測器之背面配置有遮蔽板，會抑制由外部造成之不必要磁場的影響。
為了實現讀取靈敏度和位置精度的提昇、輕量化、薄型化的市場需求，作為該遮蔽板揭示使用肥粒鐵板、或將肥粒鐵粒子分散於橡膠或塑膠中之板狀構件之技術(專利文獻1)；使用高導磁合金和非晶質金屬所構成之磁性薄板之技術(專利文獻2)；使用肥粒鐵、肥粒鐵含有 体、羰化鐵壓粉體、高導磁合金壓粉體、鋁矽鐵粉壓粉體之技術(專利文獻3)。
[先前技術文獻] [專利文獻]
[專利文獻1]日本特開平6-149450號公報
[專利文獻2]日本特開平6-309085號公報
[專利文獻3]日本特開平8-221176號公報
為了提昇行動終端之讀取靈敏度和位置精度，必須要增大遮蔽材之電阻率來抑制渦電流的發生，和增大遮蔽板之磁導率之實數部分(μ')。又，為了設定效率高的系統，必須要減少磁導率之虛數部分(μ")，且減少偵測回路的損失。
進而，為了行動終端之輕量化、薄型化，係要求遮蔽材的厚度為數十μm左右。
像這樣遮蔽材之厚度變薄時，必須考慮到μ'與厚度之關係。磁場偵測所使用之環形天線的電感會依存μ'與遮蔽板的厚度，μ'變得越大，或，遮蔽板的厚度變得越厚時，會變大。亦即，μ'與厚度之乘積變得越大，位置資訊之讀取靈敏度和位置精度會提昇。因此，將遮蔽材進行薄膜化之際，不只是μ'與厚度、μ'與厚度之乘積亦必須 設定在適當的範圍。
專利文獻1中雖然揭示了作為偵測器背面所配置之遮蔽板係使用肥粒鐵板之技術，但並未考慮將肥粒鐵變薄之控制。又，亦揭示將肥粒鐵粒子分散於橡膠或塑膠中之板狀構件之技術。雖然肥粒鐵在大塊的狀態時具有高μ'，但將此作為粒子分散於樹脂等中之薄片之μ'，因為粒子間有非磁性的樹脂，其上限為20左右。因此，為了提昇讀取靈敏度和位置精度，進而需要更高的μ'。
專利文獻2中揭示了作為該遮蔽板使用了高導磁合金和非晶質金屬所構成之磁性薄板之技術。若參考此實施例時，該磁性薄板之實效磁導率為頻率變高時會減少之故，所以可知起因於渦電流而磁性損失(μ")會變大。因此，偵測電路全體的損失亦會變大，難以說是效率高的系統。
專利文獻3中雖揭示作為該遮蔽板係使用羰化鐵壓粉體、高導磁合金壓粉體、鋁矽鐵粉壓粉體之技術，但是壓粉體之μ'於磁性粒子間有空隙之故，所以其上限為50左右。因此，為了提昇讀取靈敏度和位置精度，進而需要更高的μ'。
因此，於座標讀取系統中為了實現充分的讀取靈敏度和位置精度，本發明的技術課題為提供一種電阻率高、磁導率中的實數部分μ'高、虛數部分μ"小之肥粒鐵燒結板及肥粒鐵燒結薄片。
前述技術的課題係藉由如其次之本發明可達成。
亦即，本發明為一種肥粒鐵燒結板，其特徵係具有以氧化物換算為47~50mol%之Fe2O3、7.0~26mol%之NiO、13~36mol%之ZnO、7.0~12mol%之CuO、0~1.5mol%之CoO所構成之組成，且體積電阻率為1×108~1×1012Ωcm、厚度為10~60μm(本發明1)。
又，如本發明1之肥粒鐵燒結板，本發明係500kHz中的磁導率之實數部分為160~1200、磁導率之虛數部分為0~90(本發明2)。
又，如本發明1或2之肥粒鐵燒結板，本發明係肥粒鐵燒結板之500kHz中的磁導率之實數部分與肥粒鐵燒結板的厚度之乘積為7500~72000(本發明3)。
又，如本發明1~3中任一項之肥粒鐵燒結板，本發明係於至少一側之表面上形成有至少1個溝(本發明4)。
又，本發明為一種肥粒鐵燒結薄片，於本發明1~4中任一項之肥粒鐵燒結板之至少一側之表面上設置黏著層或保護層(本發明5)。
又，本發明為一種肥粒鐵燒結薄片，於本發明1~4中任一項之肥粒鐵燒結板之一側之表面上設置黏著層，於反對側之表面上設置保護層(本發明6)。
又，本發明為一種肥粒鐵燒結薄片，於本發 明1~4中任一項之肥粒鐵燒結板之雙面上設置黏著層(本發明7)。
又，本發明為一種肥粒鐵燒結薄片，於本發明1~4中任一項之肥粒鐵燒結板之雙面上設置保護層(本發明8)。
又，如本發明5~8中任一項之肥粒鐵燒結薄片，本發明係肥粒鐵燒結板被分割成小片狀(本發明9)。
又，如本發明9之肥粒鐵燒結薄片，本發明係500kHz中的磁導率之實數部分為120~800、磁導率之虛數部分為0~30，500kHz中的磁導率之實數部分與肥粒鐵燒結板的厚度之乘積為5000~48000(本發明10)。
又，本發明為一種肥粒鐵燒結板，其體積電阻率為1×108~1×1012Ωcm、厚度為10~60μm、500kHz中的磁導率之實數部分為160~1200、磁導率之虛數部分為0~90(本發明11)。
又，本發明為一種肥粒鐵燒結薄片，其體積電阻率為1×108~1×1012Ωcm之肥粒鐵燒結板之至少一側之表面上設置黏著層或保護層之肥粒鐵燒結薄片，前述肥粒鐵燒結板被分割成小片狀，該肥粒鐵燒結薄片之500kHz中的磁導率之實數部分為120~800、磁導率之虛數部分為0~30(本發明12)。
又，本發明為一種座標讀取系統，其特徵為偵測器與相鄰於偵測器所配置之遮蔽板所構成之座標讀取系統，其中遮蔽板為本發明1~4、11中任一項之肥粒鐵燒 結板所構成(本發明13)。
又，本發明為一種座標讀取系統，其特徵為偵測器與相鄰於偵測器所配置之遮蔽板所構成之座標讀取系統，其中遮蔽板為本發明5~10、12中任一項之肥粒鐵燒結薄片所構成(本發明14)。
本發明之肥粒鐵燒結板及肥粒鐵燒結薄片，係因電阻率高、μ'大、μ"小，故適合作為提昇座標讀取系統之讀取靈敏度和位置精度之遮蔽板。
[實施發明之形態]
如下係更詳細地說明本發明之構成。
本發明之肥粒鐵燒結板之體積電阻率為1×108~1×1012Ωcm。當體積電阻率未達1×108Ωcm時，會發生渦電流而座標讀取系統之損失會變大。體積電阻率之上限係作為本發明之材料原本特性之1×1012Ωcm。更佳之體積電阻率為2×108~1×1012Ωcm。
本發明之肥粒鐵燒結板之組成為以氧化物換算為47~50mol%之Fe2O3、7~26mol%之NiO、13~36mol%之ZnO、7~12mol%之CuO、0~1.5mol%之CoO，合計為100mol%。惟，亦可含有原料與經由製造步驟所不可避免會混入之微量雜質。
本發明之肥粒鐵燒結板中的Fe2O3之組成為，當未達47mol%時，μ'會變小。當超過50mol%之時，因低溫會不能進行燒結。更佳之Fe2O3之組成為47~49.5mol%。
本發明之肥粒鐵燒結板中的NiO之組成為，當未達7mol%時，μ"會變大。當超過26mol%之時，μ'會變小。更佳之NiO之組成為7.5~26.0mol%。
本發明之肥粒鐵燒結板中的ZnO之組成為，當未達13mol%時，μ'會變小。當超過36mol%之時，μ"會變大。更佳之ZnO之組成為14.0~35.5mol%。
本發明之肥粒鐵燒結板中的CuO之組成為，當未達7mol%之時，會變無法燒結。當超過12mol%之時，μ'會變小，同時體積電阻率未達1×108Ω造成渦電流損失變大之故，位置資訊之讀取靈敏度和位置精度會惡化，偵測電路全體之損失亦變大。更佳之CuO之組成為7.5~11.5mol%。
本發明之肥粒鐵燒結板中的CoO為，當必須將μ"變更小之時使其含有。當該組成超過1.5mol%之時，因μ'的溫度變化會變大故不佳。
本發明之肥粒鐵燒結板的厚度為10~60μm。厚度未達10μm之肥粒鐵燒結板會有工業上生產之困難。超過60μm時不符薄膜化之需求，又，重量會變重，故亦不符輕量化之需求。
本發明之肥粒鐵燒結板之500kHz中的磁導率之實數部分μ'較佳為160~1200。當磁導率之實數部分μ' 未達160之時，讀取靈敏度和位置精度會變低。當磁導率之實數部分μ'超過1200之時，因虛數部分μ"會變大，故座標讀取系統之損失會變大。較佳之磁導率之實數部分μ'為170~1200。藉由視需要進行之肥粒鐵燒結板之分割處理，μ'成為處理前之約5~8成，故肥粒鐵燒結板及未分割處理之肥粒鐵燒結薄片之μ'若設定為160~1200之範圍，可得到μ'為120~800之經分割處理之肥粒鐵燒結薄片。
本發明之肥粒鐵燒結板之500kHz中的磁導率之虛數部分μ"較佳為0~90。作為本發明材料的原本特性，磁導率之虛數部分的下限為0。當磁導率之虛數部分μ"超過90時，座標讀取系統之損失會變大。較佳之磁導率之虛數部分μ"為0~80。藉由視需要進行之肥粒鐵燒結板之分割處理，μ"會比處理前更減少，故肥粒鐵燒結板及未分割處理之肥粒鐵燒結薄片之μ"若設定為0~90之範圍，可得到μ"為0~30之經分割處理之肥粒鐵燒結薄片。
本發明之肥粒鐵燒結板中，磁導率之實數部分μ'與肥粒鐵燒結板的厚度(μm)之乘積(μm)較佳為7500~72000。當前述乘積之值未達7500之時，位置資訊之讀取靈敏度和位置精度會變差。本發明中的磁導率之實數部分與肥粒鐵燒結板的厚度之乘積為由磁導率之實數部分的上限與肥粒鐵燒結板的厚度的上限開始到72000。藉由分割處理，μ'會減少，故肥粒鐵燒結板及未分割處理之肥粒鐵燒結薄片中的磁導率之實數部分與肥粒鐵燒結板的厚度之乘積若設定為7500~72000之範圍，可得到磁導率 之實數部分與肥粒鐵燒結板的厚度之乘積為5000~48000之經分割處理之肥粒鐵燒結薄片。
然後，說明關於本發明之肥粒鐵燒結薄片。
本發明之肥粒鐵燒結薄片係於前述肥粒鐵燒結板之至少一側之表面上設置黏著層或保護層。
作為本發明中的黏著層可列舉雙面黏著膠帶。作為雙面黏著膠帶並沒有特別限制，可用PET薄膜和聚醯亞胺薄膜作為基材，或，可使用不含基材之周知的雙面黏著膠帶。又，作為黏著層，亦可於肥粒鐵燒結板之單面上依序層合黏著劑、PET薄膜和聚醯亞胺薄膜等之彎曲性且伸縮性之薄膜、黏著劑及離型薄膜。由於遮蔽材之薄膜化的需求，黏著層的厚度較佳為3~10μm。
本發明中的保護層，藉由設置此可提高針對分割肥粒鐵燒結板時的粉掉落之信賴性及耐久性。作為該保護層，若是使肥粒鐵燒結薄片彎曲時不會斷裂之伸長性樹脂的話並沒有特別的限制，可舉例PET薄膜、聚醯亞胺薄膜、含有樹脂之塗料等。又，作為保護層，亦可於肥粒鐵燒結板之單面上依序層合黏著劑、PET薄膜和聚醯亞胺薄膜等彎曲性且伸縮性之薄膜。進而，將保護層設置為二層以上，於肥粒鐵燒結薄片之製造步驟及該加工步驟之中，當保護層上發生傷痕、髒污、破裂等時，藉由依序去除該保護層，最終可得到最上層沒有傷痕、髒污、破裂等乾淨的保護層。由於遮蔽材之薄膜化的需求，保護層的厚度較佳為3~10μm。
本發明之未分割處理之肥粒鐵燒結薄片中，500kHz中的磁導率之實數部分μ'、磁導率之虛數部分μ"及磁導率之實數部分μ'與肥粒鐵燒結板的厚度(μm)之乘積(μm)之各數值為，與前述本發明之肥粒鐵燒結板具有同樣程度之特性者。
本發明之肥粒鐵燒結薄片，為了使其緊貼於彎曲之部分，預先，將肥粒鐵燒結板之至少一側之表面上設置至少1個溝作為起點，亦可將肥粒鐵燒結板構成可分割。前述溝亦可為連續、亦可形成斷續，又，藉由形成多數之微小凹部，可作為溝的代替。溝的剖面並沒有特別限定，但是U字型或V字型為較佳。
本發明之肥粒鐵燒結薄片，為了使其緊貼於彎曲之部分與為了防止使用時裂開，預先將肥粒鐵燒結板分割成小片狀為較佳。例如，預先將肥粒鐵燒結板之至少一側之表面上設置至少1個溝作為起點而將肥粒鐵燒結板進行分割，或者是，不形成溝而是將肥粒鐵燒結板分割成小片狀之方法中的任一者皆可。
肥粒鐵燒結板係取決於溝而分割為任意大小之三角形、四邊形、多角形或此等之組合。例如三角形、四邊形、多角形之1邊的長度通常為1~12mm，當被附著物之接著面為曲面時，較佳為1mm以上該曲率半徑之1/3以下，更佳為1mm以上1/4以下。進而，肥粒鐵燒結板亦可不取決於溝而分割，係分割成不固定形狀。
於肥粒鐵燒結板中所形成溝的開口部的寬度 通常較佳為250μm以下，更佳為1~150μm。當開口部的寬度超過250μm之時，肥粒鐵燒結板之磁導率的降低會變大而不佳。又，溝的深度較佳為肥粒鐵燒結板的厚度1/20~1/4、更佳為1/20~1/6。
本發明之經分割處理之肥粒鐵燒結薄片之500kHz中的磁導率之實數部分μ'較佳為120~800。當磁導率之實數部分μ'未達120之時，讀取靈敏度和位置精度會變低。當磁導率之實數部分μ'超過800之時，因虛數部分μ"會變大，故座標讀取系統之損失會變大。更佳之透磁率之實數部分μ'為150~700。
本發明之經分割處理之肥粒鐵燒結薄片之500kHz中的磁導率之虛數部分μ"較佳為0~30。作為本發明材料的原本特性，磁導率之虛數部分μ"的下限為0。當磁導率之虛數部分μ"超過30之時，座標讀取系統之損失會變大。更佳之磁導率之虛數部分μ"為0~25。
本發明之經分割處理之肥粒鐵燒結薄片中，磁導率之實數部分μ'與肥粒鐵燒結板的厚度(μm)之乘積(μm)較佳為5000~48000。當前述乘積之值未達5000之時，位置資訊之讀取靈敏度和位置精度會變差。本發明中的磁導率之實數部分與肥粒鐵燒結板的厚度之乘積為，由磁導率之實數部分的上限與肥粒鐵燒結板的厚度的上限開始到48000。
接著，說明關於本發明之肥粒鐵燒結板及肥粒鐵燒結薄片之製造方法。
首先，肥粒鐵粉末為，可將構成肥粒鐵之各元素的氧化物、碳酸鹽、水氧化物、草酸鹽等原料以規定的組成比例混合而得之原料混合物，或，可將於水溶液中使各元素沉澱而得到之沉澱物，以大氣中700~900℃的溫度範圍進行預先燒成1~20小時之後，再藉由粉碎而得到。
可將得到之肥粒鐵粉末與黏結樹脂混合之後，藉由粉末壓縮成形法、射出成形法、壓延法、擠壓法等將肥粒鐵板進行成形，視需要進行脫脂處理之後，再燒結處理而製造出肥粒鐵燒結板。又，可將肥粒鐵粉末與黏結樹脂與溶劑進行混合之後，於薄膜或薄片上以刮刀等塗布而得到生胚薄片，視需要進行脫脂處理之後，將得到之生胚薄片進行燒結處理而製造出肥粒鐵燒結板。尚，亦可將得到之生胚薄片進行複數片層合之後，再燒結。
視需要，當於肥粒鐵燒結板上形成溝之時，可於肥粒鐵板成形中、成形後或燒結處理後形成溝。例如，當以粉末壓縮成形法或射出成形法成形之時，於成形中形成係較佳；當以壓延法或擠壓法成形之時，於成形後燒結前形成係較佳；當介由生胚薄片來製造燒結肥粒鐵板之時，於生胚薄片形成係較佳。
脫脂處理通常於150~500℃的溫度下進行。燒結溫度通常於850~970℃、較佳於870~960℃。燒結時間通常30~180分鐘、較佳30~120分。當燒結溫度未達850℃之時，粒子的燒結變得困難，得到之肥粒鐵燒結板 的強度並不充分，μ'亦變低。又，若燒結溫度為970℃，因粒子的燒結充分進行之故，並不需要變高超過970℃。當燒結時間未達30分鐘之時，粒子的燒結變得困難，得到之燒結肥粒鐵板的強度並不充分，μ'亦變低。又，若燒結時間為180分鐘，因粒子的燒結充分進行之故，並不需要變長超過180分鐘。
接著，針對得到之肥粒鐵燒結板之表面，黏著層，例如，可藉由設置雙面黏著膠帶而得到肥粒鐵燒結薄片。黏著層可於肥粒鐵燒結板之單面或雙面形成。
又，針對得到之肥粒鐵燒結板之表面，可藉由設置保護層而得到肥粒鐵燒結薄片。保護層可於肥粒鐵燒結板之單面或雙面形成。保護層的形成為，藉由將構成保護層之樹脂的薄膜或薄片，視需要介由接著劑接著於肥粒鐵燒結板之表面來進行，或，藉由將含有構成保護層之樹脂的塗料塗布於肥粒鐵燒結板之表面來進行。可藉由形成保護層來防止肥粒鐵燒結板之粉掉落。
又，於本發明中，可於肥粒鐵燒結板之一側之表面上形成黏著層，於另一側之表面上形成保護層而得到肥粒鐵燒結薄片。
欲得到經分割處理之肥粒鐵燒結薄片，亦可將形成黏著層及/或保護層之肥粒鐵燒結薄片藉由輥等進行分割。
本發明之座標讀取系統，係於偵測器之背面配置本發明之肥粒鐵燒結板或肥粒鐵燒結薄片所構成之遮 蔽板而成。實際上更與座標指示器組合作為座標讀取系統來作用。亦可於偵測器之背面上將遮蔽板接觸來進行配置，或，對於系統小型化無影響之程度，亦可隔著間隔或介由他層來進行配置。
<作用>
本發明中最重要的點，係本發明之肥粒鐵燒結板及肥粒鐵燒結薄片，因體積電阻率高故渦電流損失小，因磁導率之實數部分μ'高、磁性損失之虛數部分μ"小、磁導率之實數部分μ'與肥粒鐵燒成板的厚度之乘積為適當的範圍，故作為座標讀取系統的遮蔽板使用之時，可提昇該讀取靈敏度和位置精度，可使偵測電路全體之損失變小之事實。
[實施例]
本發明代表的實施形態係如下。
肥粒鐵燒結板之組成，係使用螢光X射線分析裝置3530(理學電機工業股份有限公司製)來測量。
肥粒鐵燒結板之密度，係經由以游標卡尺與測微計所測定之外部尺寸與重量來計算求得。
肥粒鐵燒結板及肥粒鐵燒結薄片之厚度，係以測微計測量。
經分割處理之肥粒鐵燒結薄片之μ'與μ"，係使用阻抗分析器4294A(安捷倫科技股份有限公司製)，於 500kHz之頻率中，將衝壓成外徑20mm、內徑10mm之環進行測量。
肥粒鐵燒結板或未經分割處理之肥粒鐵燒結薄片之μ'與μ"，係使用阻抗分析器4294A(安捷倫科技股份有限公司製)，於500kHz之頻率中，藉由超音波加工機將衝壓成外徑20mm、內徑10mm之環進行測量。
肥粒鐵燒結板之體積電阻率，係根據該值來使用高電阻計4339B(安捷倫科技股份有限公司製)，或電阻計3541(日置電機股份有限公司製)進行測量。
實施例1：
肥粒鐵之組成係以規定之組成，秤量各氧化物原料，使用球磨機進行20小時濕式混合之後，將混合漿料過濾分離並乾燥，而得到原料混合粉末。將該原料混合粉末於730℃燒成2小時所得到之初步燒成物，以球磨機進行粉碎，而得到本發明之Ni-Zn-Cu肥粒鐵粉末。
相對於所得之Ni-Zn-Cu肥粒鐵粉末100重量份，添加作為鍵結材料之聚乙烯丁醛8重量份、作為可塑劑之鄰苯二甲酸苄基正丁酯3重量份、作為溶劑之3甲基-3甲氧基-1丁醇50重量份之後，充分混合而得到漿料。藉由刮刀式塗佈機將此漿料塗佈於PET薄膜上而形成塗膜之後，藉由乾燥而得到厚度43μm之生胚薄片。另一側之表面上，使用刃型形成格子狀之溝。
將所得到之生胚薄片以400℃進行脫脂之後， 藉由於960℃燒結2小時，得到肥粒鐵燒結板。該肥粒鐵燒結板之組成，係Fe2O3為47.1mol%、NiO為9.9mol%、ZnO為33.8mol%、CuO為9.2mol%，體積電阻率為3×1011Ωcm、厚度為35μm、密度為5.23g/cm3、μ'為849、μ"為34。又，磁導率之實數部分μ'與肥粒鐵燒結板的厚度之乘積(μm)為29722。
於所得之肥粒鐵燒結板之一側之表面上黏貼厚度5μm之PET薄膜，於另一側之表面上黏貼厚度5μm之雙面膠帶，得到厚度45μm之肥粒鐵燒結薄片。
將所得到之肥粒鐵燒結薄片藉由輥分割成小片狀之後的μ'為535、μ"為7。又，磁導率之實數部分μ'與肥粒鐵燒結板的厚度之乘積(μm)為18725。
實施例2~4：
藉由與實施例1同樣之方法，得到肥粒鐵燒結板及肥粒鐵燒結薄片。表1中顯示此時的製造條件與所得到之肥粒鐵燒結板及肥粒鐵燒結薄片的諸特性。
比較例1：
肥粒鐵之組成係以規定之組成，秤量各氧化物原料，使用球磨機進行20小時濕式混合之後，將混合漿料過濾分離並乾燥，而得到原料混合粉末。將該原料混合粉末於1000℃燒成2小時所得到之初步燒成物，以乾式振動磨進行粉碎，得到Ni-Zn-Cu肥粒鐵粉末。所得到之Ni-Zn-Cu 肥粒鐵粉末之組成，係Fe2O3為49.5mol%、NiO為8.3mol%、ZnO為35.0mol%、CuO為7.2mol%。以Ni-Zn-Cu肥粒鐵粉末成為60vol%之比例，將所得到之Ni-Zn-Cu肥粒鐵粉末與乙烯-乙酸乙烯酯共聚物進行混合，使用Plastomill於80℃之溫度進行混練。使用二軸之熱輥軋於60℃之溫度將所得到之混練物成形為厚度50μm之薄片。所得到之薄片之體積電阻率係7×1010Ωcm、500kHz中的μ'為16、μ"為0。μ'與該薄片的厚度之乘積(μm)為800。
比較例2：
將苯乙烯系彈性體於環己酮溶解20重量%之溶液，去除溶劑後之體積比係扁平狀鐵-鋁-矽合金粉末(鐵、鋁、矽之重量比為85：6：9、縱橫比為20~30、平均粒子徑為40μm)為55vol%、苯乙烯系彈性體為45vol%的方式進行計量，得到充分混合之漿料。此時，為了調整黏度而添加乙烯環己醇。藉由刮刀式塗佈機將此漿料塗佈於PET薄膜上並乾燥。將得到之塗膜以溫度130℃、壓力90MPa、加壓時間5分鐘的條件成形，得到厚度60μm之含有扁平狀鐵-鋁-矽合金粉末之薄片。所得到之薄片之體積電阻率，係3×105Ωcm、500kHz中的μ'為110、μ"為0。μ'與該薄片的厚度之乘積(μm)為6600。
比較例3：
藉由與實施例1同樣之方法，得到肥粒鐵燒結板及肥 粒鐵燒結薄片。表1中顯示此時的製造條件與所得到之肥粒鐵燒結板及肥粒鐵燒結薄片的諸特性。
[產業上之可能利用性]
本發明之肥粒鐵燒結板及肥粒鐵燒結薄片，係因電阻率高、磁導率之實數部分μ'大、虛數部分μ"小，故適合作為提昇座標讀取系統之讀取靈敏度和位置精度之遮蔽板。

Claims (12)

  1. 一種肥粒鐵燒結板，其特徵係具有以氧化物換算為由47~50mol%之Fe2O3、7.0~15.1mol%之NiO、13~36mol%之ZnO、7.0~12mol%之CuO、0~1.5mol%之CoO構成之組成，且體積電阻率為1×108~1×1012Ωcm、厚度為10~60μm，其中500kHz中的磁導率之實數部分為296~1200、磁導率之虛數部分為0~90。
  2. 如請求項1之肥粒鐵燒結板，其中肥粒鐵燒結板之500kHz中的磁導率之實數部分與肥粒鐵燒結板的厚度之乘積(μm)為7500~72000。
  3. 如請求項1或2之肥粒鐵燒結板，其中於至少一側之表面上形成有至少1個溝。
  4. 一種肥粒鐵燒結薄片，其係於如請求項1~3中任一項之肥粒鐵燒結板之至少一側之表面上設置黏著層或保護層。
  5. 一種肥粒鐵燒結薄片，其係於如請求項1~3中任一項之肥粒鐵燒結板之一側之表面上設置黏著層，於反對側之表面上設置保護層。
  6. 一種肥粒鐵燒結薄片，其係於如請求項1~3中任一項之肥粒鐵燒結板之雙面上設置黏著層。
  7. 一種肥粒鐵燒結薄片，其係於如請求項1~3中任一項之肥粒鐵燒結板之雙面上設置保護層。
  8. 如請求項4~7中任一項之肥粒鐵燒結薄片，其中肥粒鐵燒結板被分割成小片狀。
  9. 如請求項8之肥粒鐵燒結薄片，其中500kHz中的磁導率之實數部分為120~800、磁導率之虛數部分為0~30，500kHz中的磁導率之實數部分與肥粒鐵燒結板的厚度之乘積為5000~48000。
  10. 一種肥粒鐵燒結薄片，其係於體積電阻率為1×108~1×1012Ωcm之肥粒鐵燒結板之至少一側之表面上設置黏著層或保護層之肥粒鐵燒結薄片，前述肥粒鐵燒結板被分割成小片狀，該肥粒鐵燒結薄片之500kHz中的磁導率之實數部分為120~800、磁導率之虛數部分為0~30。
  11. 一種座標讀取系統，其特徵係由偵測器與相鄰於偵測器所配置之遮蔽板構成之座標讀取系統，其中遮蔽板為由如請求項1~3中任一項之肥粒鐵燒結板構成。
  12. 一種座標讀取系統，其特徵係由偵測器與相鄰於偵測器所配置之遮蔽板構成之座標讀取系統，其中遮蔽板為由如請求項4~9、10中任一項之肥粒鐵燒結薄片構成。
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