TWI700974B - 配線基板的製造方法 - Google Patents

配線基板的製造方法 Download PDF

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Publication number
TWI700974B
TWI700974B TW103120347A TW103120347A TWI700974B TW I700974 B TWI700974 B TW I700974B TW 103120347 A TW103120347 A TW 103120347A TW 103120347 A TW103120347 A TW 103120347A TW I700974 B TWI700974 B TW I700974B
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TW
Taiwan
Prior art keywords
solder mask
exposed
thickness
solder
area
Prior art date
Application number
TW103120347A
Other languages
English (en)
Chinese (zh)
Other versions
TW201513758A (zh
Inventor
豊田裕二
後閑寬彥
川合宣行
中川邦弘
Original Assignee
日商三菱製紙股份有限公司
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Application filed by 日商三菱製紙股份有限公司 filed Critical 日商三菱製紙股份有限公司
Publication of TW201513758A publication Critical patent/TW201513758A/zh
Application granted granted Critical
Publication of TWI700974B publication Critical patent/TWI700974B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW103120347A 2013-06-14 2014-06-12 配線基板的製造方法 TWI700974B (zh)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
JP2013-125179 2013-06-14
JP2013125179 2013-06-14
JP2013-131839 2013-06-24
JP2013131839 2013-06-24
JP2013139706 2013-07-03
JP2013-139706 2013-07-03
JP2013-150824 2013-07-19
JP2013-150825 2013-07-19
JP2013150824 2013-07-19
JP2013150825 2013-07-19
JP2013-151335 2013-07-22
JP2013151335 2013-07-22
JP2014-111574 2014-05-29
JP2014111574 2014-05-29

Publications (2)

Publication Number Publication Date
TW201513758A TW201513758A (zh) 2015-04-01
TWI700974B true TWI700974B (zh) 2020-08-01

Family

ID=52022186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103120347A TWI700974B (zh) 2013-06-14 2014-06-12 配線基板的製造方法

Country Status (5)

Country Link
JP (3) JP6224531B2 (ko)
KR (1) KR102082641B1 (ko)
CN (3) CN107846786B (ko)
TW (1) TWI700974B (ko)
WO (1) WO2014199890A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016012702A (ja) * 2014-06-30 2016-01-21 ファナック株式会社 ソルダコートの濡れ性と耐食性を両立させたプリント基板およびその製造方法
TWI645760B (zh) * 2017-10-27 2018-12-21 南亞電路板股份有限公司 電路板及其製造方法
CN108289388A (zh) * 2017-12-07 2018-07-17 江门崇达电路技术有限公司 一种预防上锡不良的pcb制作方法
JP7142604B2 (ja) 2019-05-15 2022-09-27 日本特殊陶業株式会社 配線基板およびその製造方法
TWI731376B (zh) * 2019-07-22 2021-06-21 頎邦科技股份有限公司 具有粗化防焊層的軟質線路基板及其製造方法
JP7498549B2 (ja) * 2019-09-11 2024-06-12 太陽ホールディングス株式会社 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP7498550B2 (ja) * 2019-09-11 2024-06-12 太陽ホールディングス株式会社 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP2021163851A (ja) * 2020-03-31 2021-10-11 三菱製紙株式会社 ソルダーレジストパターンの形成方法
KR20210129410A (ko) * 2020-04-20 2021-10-28 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
CN113747681B (zh) * 2020-05-27 2023-01-17 庆鼎精密电子（淮安）有限公司 嵌埋元件的软硬结合电路板及其制作方法
US11551939B2 (en) * 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
KR20220039385A (ko) 2020-09-22 2022-03-29 삼성전자주식회사 인터포저 및 이를 포함하는 반도체 패키지
US20220328394A1 (en) * 2021-04-07 2022-10-13 Mediatek Inc. Three-dimensional pad structure and interconnection structure for electronic devices
TWI780783B (zh) * 2021-06-18 2022-10-11 大陸商律勝科技（蘇州）有限公司 印刷電路板之製造方法及具保護層之印刷電路板
CN116801482B (zh) * 2022-03-18 2024-05-10 华为技术有限公司 电路板组件及其加工方法、电子设备
KR102674312B1 (ko) * 2023-01-13 2024-06-12 엘지이노텍 주식회사 반도체 패키지

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11191670A (ja) * 1997-12-25 1999-07-13 Victor Co Of Japan Ltd プリント配線基板及びその製造方法
JP2004140089A (ja) * 2002-10-16 2004-05-13 Dainippon Printing Co Ltd 多層配線基板およびフリップチップ方式の半導体パッケージ
TW200610117A (en) * 2004-09-07 2006-03-16 Siliconware Precision Industries Co Ltd Bump structure of semiconductor package and fabrication method thereof
TW200621113A (en) * 2004-10-18 2006-06-16 Sharp Kk Connection structure for connecting semiconductor element and wiring board, and semiconductor device
JP2011192692A (ja) * 2010-03-12 2011-09-29 Mitsubishi Paper Mills Ltd ソルダーレジストパターンの形成方法
JP3182371U (ja) * 2012-02-10 2013-03-21 三菱製紙株式会社 レジスト層の薄膜化処理装置
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS346263B1 (ko) 1957-01-18 1959-07-18
JPS61256789A (ja) * 1985-05-10 1986-11-14 株式会社日立製作所 プリント配線板製造方法
JP2910261B2 (ja) * 1991-02-13 1999-06-23 松下電器産業株式会社 プリント配線板とその製造方法
JPH05226505A (ja) 1992-02-18 1993-09-03 Ibiden Co Ltd プリント配線板
JP3182371B2 (ja) * 1997-06-05 2001-07-03 三洋電機株式会社 空気調和機
JP2001135919A (ja) * 1999-11-08 2001-05-18 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
JP3912405B2 (ja) * 2003-11-11 2007-05-09 三菱化学株式会社 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置
US7326636B2 (en) * 2005-05-24 2008-02-05 Agilent Technologies, Inc. Method and circuit structure employing a photo-imaged solder mask
CN101945533B (zh) * 2006-05-17 2013-04-03 三菱制纸株式会社 电路基板
JP5255545B2 (ja) 2009-09-29 2013-08-07 三菱製紙株式会社 ソルダーレジストの形成方法
KR101047139B1 (ko) * 2009-11-11 2011-07-07 삼성전기주식회사 단층 보드온칩 패키지 기판 및 그 제조방법
JP5830925B2 (ja) 2011-05-10 2015-12-09 日立化成株式会社 プリント配線板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11191670A (ja) * 1997-12-25 1999-07-13 Victor Co Of Japan Ltd プリント配線基板及びその製造方法
JP2004140089A (ja) * 2002-10-16 2004-05-13 Dainippon Printing Co Ltd 多層配線基板およびフリップチップ方式の半導体パッケージ
TW200610117A (en) * 2004-09-07 2006-03-16 Siliconware Precision Industries Co Ltd Bump structure of semiconductor package and fabrication method thereof
TW200621113A (en) * 2004-10-18 2006-06-16 Sharp Kk Connection structure for connecting semiconductor element and wiring board, and semiconductor device
JP2011192692A (ja) * 2010-03-12 2011-09-29 Mitsubishi Paper Mills Ltd ソルダーレジストパターンの形成方法
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法
JP3182371U (ja) * 2012-02-10 2013-03-21 三菱製紙株式会社 レジスト層の薄膜化処理装置

Also Published As

Publication number Publication date
KR20160020407A (ko) 2016-02-23
JP6514808B2 (ja) 2019-05-15
CN107846786B (zh) 2021-03-05
JP2016006809A (ja) 2016-01-14
JP6224531B2 (ja) 2017-11-01
JP6416324B2 (ja) 2018-10-31
CN107809854A (zh) 2018-03-16
JP2017195380A (ja) 2017-10-26
JP2018139319A (ja) 2018-09-06
CN107846786A (zh) 2018-03-27
KR102082641B1 (ko) 2020-02-28
TW201513758A (zh) 2015-04-01
CN105309053A (zh) 2016-02-03
CN105309053B (zh) 2018-03-09
WO2014199890A1 (ja) 2014-12-18

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