TWI691001B - 用於3d共形處理的原子層製程腔室 - Google Patents
用於3d共形處理的原子層製程腔室 Download PDFInfo
- Publication number
- TWI691001B TWI691001B TW105107923A TW105107923A TWI691001B TW I691001 B TWI691001 B TW I691001B TW 105107923 A TW105107923 A TW 105107923A TW 105107923 A TW105107923 A TW 105107923A TW I691001 B TWI691001 B TW I691001B
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- H10P50/242—
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/483—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using coherent light, UV to IR, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- H10P14/6339—
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- H10P14/6518—
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- H10P14/6526—
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- H10P14/6532—
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- H10P14/6905—
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- H10P32/20—
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- H10P72/0434—
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- H10P72/0436—
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- H10P72/0602—
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- H10P72/7621—
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma & Fusion (AREA)
- Formation Of Insulating Films (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562135836P | 2015-03-20 | 2015-03-20 | |
| US62/135,836 | 2015-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201705293A TW201705293A (zh) | 2017-02-01 |
| TWI691001B true TWI691001B (zh) | 2020-04-11 |
Family
ID=56925242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105107923A TWI691001B (zh) | 2015-03-20 | 2016-03-15 | 用於3d共形處理的原子層製程腔室 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20160276162A1 (enExample) |
| JP (1) | JP6807860B2 (enExample) |
| KR (1) | KR102494614B1 (enExample) |
| CN (2) | CN113981414B (enExample) |
| TW (1) | TWI691001B (enExample) |
| WO (1) | WO2016153716A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10573532B2 (en) | 2018-06-15 | 2020-02-25 | Mattson Technology, Inc. | Method for processing a workpiece using a multi-cycle thermal treatment process |
| JP7065728B2 (ja) * | 2018-08-17 | 2022-05-12 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
| JP7018849B2 (ja) * | 2018-08-17 | 2022-02-14 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201635383A (zh) * | 2015-01-06 | 2016-10-01 | 蘭姆研究公司 | 使用一氧化氮活化之矽氧化物的同向性原子層蝕刻 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5024724A (en) * | 1987-03-27 | 1991-06-18 | Sanyo Electric Co., Ltd. | Dry-etching method |
| JPH01103840A (ja) * | 1987-10-16 | 1989-04-20 | Sanyo Electric Co Ltd | ドライエツチング方法 |
| JPH01289121A (ja) * | 1988-05-16 | 1989-11-21 | Nec Corp | 3‐5族化合物半導体のデジタルエッチング方法 |
| JP3184988B2 (ja) * | 1991-12-10 | 2001-07-09 | 科学技術振興事業団 | 結晶面異方性ドライエッチング方法 |
| US6143082A (en) * | 1998-10-08 | 2000-11-07 | Novellus Systems, Inc. | Isolation of incompatible processes in a multi-station processing chamber |
| US6450116B1 (en) * | 1999-04-22 | 2002-09-17 | Applied Materials, Inc. | Apparatus for exposing a substrate to plasma radicals |
| US6303518B1 (en) * | 1999-09-30 | 2001-10-16 | Novellus Systems, Inc. | Methods to improve chemical vapor deposited fluorosilicate glass (FSG) film adhesion to metal barrier or etch stop/diffusion barrier layers |
| US6686298B1 (en) * | 2000-06-22 | 2004-02-03 | Micron Technology, Inc. | Methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates |
| KR20020083767A (ko) * | 2001-04-30 | 2002-11-04 | 주식회사 하이닉스반도체 | 선택적 에피택셜 성장 공정에서의 기판 세정 방법 |
| US7172792B2 (en) * | 2002-12-20 | 2007-02-06 | Applied Materials, Inc. | Method for forming a high quality low temperature silicon nitride film |
| US7056773B2 (en) * | 2004-04-28 | 2006-06-06 | International Business Machines Corporation | Backgated FinFET having different oxide thicknesses |
| US7629267B2 (en) * | 2005-03-07 | 2009-12-08 | Asm International N.V. | High stress nitride film and method for formation thereof |
| US20070281082A1 (en) * | 2006-06-02 | 2007-12-06 | Nima Mokhlesi | Flash Heating in Atomic Layer Deposition |
| US7416989B1 (en) * | 2006-06-30 | 2008-08-26 | Novellus Systems, Inc. | Adsorption based material removal process |
| US7837790B2 (en) * | 2006-12-01 | 2010-11-23 | Applied Materials, Inc. | Formation and treatment of epitaxial layer containing silicon and carbon |
| US7629275B2 (en) * | 2007-01-25 | 2009-12-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple-time flash anneal process |
| JP5209237B2 (ja) * | 2007-06-19 | 2013-06-12 | 大日本スクリーン製造株式会社 | 熱処理装置 |
| KR20100114037A (ko) * | 2007-12-20 | 2010-10-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 향상된 가스 유동 분포를 가진 열 반응기 |
| EP2342739A4 (en) * | 2008-09-17 | 2013-05-22 | Applied Materials Inc | MANAGEMENT OF THE HEAT BUDGET ON LIGHTING OF SUBSTRATES |
| JP5564311B2 (ja) * | 2009-05-19 | 2014-07-30 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置及び基板の製造方法 |
| US8748259B2 (en) * | 2010-03-02 | 2014-06-10 | Applied Materials, Inc. | Method and apparatus for single step selective nitridation |
| US20130196078A1 (en) * | 2012-01-31 | 2013-08-01 | Joseph Yudovsky | Multi-Chamber Substrate Processing System |
| US20130344688A1 (en) * | 2012-06-20 | 2013-12-26 | Zhiyuan Ye | Atomic Layer Deposition with Rapid Thermal Treatment |
| SG11201506367TA (en) * | 2013-03-15 | 2015-09-29 | Applied Materials Inc | Apparatus and methods for pulsed photo-excited deposition and etch |
| JP6368773B2 (ja) * | 2013-04-30 | 2018-08-01 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 空間的に分散されたガス流路を有する流量制御ライナー |
| US9929014B2 (en) * | 2013-11-27 | 2018-03-27 | Entegris, Inc. | Dopant precursors for mono-layer doping |
| US9401273B2 (en) * | 2013-12-11 | 2016-07-26 | Asm Ip Holding B.V. | Atomic layer deposition of silicon carbon nitride based materials |
-
2016
- 2016-02-25 CN CN202111142728.4A patent/CN113981414B/zh active Active
- 2016-02-25 WO PCT/US2016/019619 patent/WO2016153716A1/en not_active Ceased
- 2016-02-25 CN CN201680016568.XA patent/CN107431033B/zh active Active
- 2016-02-25 KR KR1020177030338A patent/KR102494614B1/ko active Active
- 2016-02-25 JP JP2017549291A patent/JP6807860B2/ja active Active
- 2016-03-15 TW TW105107923A patent/TWI691001B/zh active
- 2016-03-16 US US15/071,479 patent/US20160276162A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201635383A (zh) * | 2015-01-06 | 2016-10-01 | 蘭姆研究公司 | 使用一氧化氮活化之矽氧化物的同向性原子層蝕刻 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170129912A (ko) | 2017-11-27 |
| US20160276162A1 (en) | 2016-09-22 |
| JP6807860B2 (ja) | 2021-01-06 |
| KR102494614B1 (ko) | 2023-02-02 |
| WO2016153716A1 (en) | 2016-09-29 |
| CN107431033A (zh) | 2017-12-01 |
| CN113981414B (zh) | 2024-11-08 |
| TW201705293A (zh) | 2017-02-01 |
| CN113981414A (zh) | 2022-01-28 |
| CN107431033B (zh) | 2021-10-22 |
| JP2018514943A (ja) | 2018-06-07 |
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