TWI686361B - 附膜玻璃板之製造方法 - Google Patents

附膜玻璃板之製造方法 Download PDF

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Publication number
TWI686361B
TWI686361B TW105129814A TW105129814A TWI686361B TW I686361 B TWI686361 B TW I686361B TW 105129814 A TW105129814 A TW 105129814A TW 105129814 A TW105129814 A TW 105129814A TW I686361 B TWI686361 B TW I686361B
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TW
Taiwan
Prior art keywords
film
glass plate
inorganic
laminated
forming
Prior art date
Application number
TW105129814A
Other languages
English (en)
Chinese (zh)
Other versions
TW201722880A (zh
Inventor
內田宏之
吉野正洋
曽根倫成
福田加代子
中島徳子
Original Assignee
日商日本電氣硝子股份有限公司
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Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW201722880A publication Critical patent/TW201722880A/zh
Application granted granted Critical
Publication of TWI686361B publication Critical patent/TWI686361B/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
    • C23C18/1817—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
TW105129814A 2015-10-28 2016-09-13 附膜玻璃板之製造方法 TWI686361B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015211906A JP6652740B2 (ja) 2015-10-28 2015-10-28 膜付きガラス板の製造方法
JP2015-211906 2015-10-28

Publications (2)

Publication Number Publication Date
TW201722880A TW201722880A (zh) 2017-07-01
TWI686361B true TWI686361B (zh) 2020-03-01

Family

ID=58630315

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105129814A TWI686361B (zh) 2015-10-28 2016-09-13 附膜玻璃板之製造方法

Country Status (5)

Country Link
JP (1) JP6652740B2 (ko)
KR (1) KR20180074619A (ko)
CN (1) CN107709262A (ko)
TW (1) TWI686361B (ko)
WO (1) WO2017073147A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7183582B2 (ja) 2018-06-19 2022-12-06 凸版印刷株式会社 ガラス配線基板
KR102638153B1 (ko) 2021-06-24 2024-02-16 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 도금 피막 및 도금 피막의 제조 방법
CN116615575B (zh) * 2021-06-24 2024-04-30 奥野制药工业株式会社 镀敷皮膜和镀敷皮膜的制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61261237A (ja) * 1985-05-16 1986-11-19 Asahi Glass Co Ltd 導電性セラミツクカラ−プリントガラス
JPH0575238A (ja) * 1991-03-06 1993-03-26 Nau Chem:Yugen 回路基板とその製造方法
JPH08144061A (ja) * 1994-11-24 1996-06-04 Japan Energy Corp 絶縁体のメタライズ方法
JPH08333685A (ja) * 1995-06-07 1996-12-17 Kondo Mekki Kogyo Kk 鍍金方法
TW475914B (en) * 1998-08-28 2002-02-11 Nissha Printing Light transmittable electromagnetic wave-shielding member and method of manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56158424A (en) * 1980-05-13 1981-12-07 Asahi Chem Ind Co Ltd Electrolytic copper plating for compound semiconductor
JPS575856A (en) * 1980-06-13 1982-01-12 Hitachi Ltd Plating method
JP2568837B2 (ja) * 1987-03-30 1997-01-08 伊勢電子工業株式会社 耐熱性黒色電極およびその製造方法
JP4977885B2 (ja) * 2007-07-18 2012-07-18 奥野製薬工業株式会社 電気銅めっき方法
KR20140054735A (ko) * 2012-10-29 2014-05-09 삼성전기주식회사 터치패널 및 이의 제조방법
CN103342471B (zh) * 2013-07-05 2015-10-21 西北师范大学 一种光电纳米复合膜材料及其制备方法和应用
JP6532794B2 (ja) * 2014-10-03 2019-06-19 日本電気硝子株式会社 膜付きガラス板、タッチセンサ、膜及び膜付きガラス板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61261237A (ja) * 1985-05-16 1986-11-19 Asahi Glass Co Ltd 導電性セラミツクカラ−プリントガラス
JPH0575238A (ja) * 1991-03-06 1993-03-26 Nau Chem:Yugen 回路基板とその製造方法
JPH08144061A (ja) * 1994-11-24 1996-06-04 Japan Energy Corp 絶縁体のメタライズ方法
JPH08333685A (ja) * 1995-06-07 1996-12-17 Kondo Mekki Kogyo Kk 鍍金方法
TW475914B (en) * 1998-08-28 2002-02-11 Nissha Printing Light transmittable electromagnetic wave-shielding member and method of manufacturing the same

Also Published As

Publication number Publication date
JP2017081781A (ja) 2017-05-18
CN107709262A (zh) 2018-02-16
TW201722880A (zh) 2017-07-01
WO2017073147A1 (ja) 2017-05-04
KR20180074619A (ko) 2018-07-03
JP6652740B2 (ja) 2020-02-26

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