TWI681514B - 半導體封裝 - Google Patents

半導體封裝 Download PDF

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Publication number
TWI681514B
TWI681514B TW104122944A TW104122944A TWI681514B TW I681514 B TWI681514 B TW I681514B TW 104122944 A TW104122944 A TW 104122944A TW 104122944 A TW104122944 A TW 104122944A TW I681514 B TWI681514 B TW I681514B
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Taiwan
Prior art keywords
semiconductor package
conductive material
semiconductor element
circuit substrate
thermally conductive
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TW104122944A
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English (en)
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TW201605002A (zh
Inventor
渡邉真司
細山田澄和
中村慎吾
出町浩
宮腰武
近井智哉
石堂仁則
松原寬明
中村卓
本多広一
熊谷欣一
作元祥太朗
岩崎俊寬
玉川道昭
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日商吉帝偉士股份有限公司
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Publication of TW201605002A publication Critical patent/TW201605002A/zh
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Abstract

以提供於堆疊型半導體封裝中減輕從下側晶片朝向上側晶片之熱量傳遞之半導體封裝為目的。提供一種堆疊型半導體封裝,包含一第一半導體封裝、一第二半導體封裝及一熱傳導材料。第一半導體封裝包含一第一電路基板及安裝於第一電路基板之一第一半導體元件。第二半導體封裝包含一第二電路基板及安裝於第二電路基板之一第二半導體元件。第二半導體封裝堆疊於第一半導體封裝。熱傳導材料配置於第一半導體元件上及位於第一半導體元件之周邊之第一電路基板上。

Description

半導體封裝
本發明關於半導體封裝(package)之安裝技術。特別是於堆疊型半導體封裝中,關於為了減輕從下側封裝朝向上側封裝之熱量傳遞之構造。
近年來,隨著電子機器的小型化、高密度化及加速半導體元件之存取速度(access speed)等需求,使用著堆疊多個半導體封裝之封裝上封裝(package on package,POP)。舉例而言,於行動電話及智慧型手機等攜帶型終端中,會使用一種半導體封裝,其中包含執行影像處理之邏輯晶片(logic chip)之封裝位於下側,包含記憶晶片(memory chip)之封裝位於上側。
如此之堆疊型半導體封裝中,晶片間的距離接近1毫米(mm)以下的程度,而有由下側的邏輯晶片所發出的熱量傳遞至上側的記憶晶片且導致上側的記憶晶片作動不良的情形。因此,冀求減輕從下側封裝朝向上側封裝之熱量傳遞。
另外,於日本專利公開案H10-12780號公報中,提出一種安裝於配線基板之半導體元件上採取散熱部件之半導體裝置。
本發明之一實施型態,以提供於堆疊型半導體封裝中減輕從下側晶片朝向上側晶片之熱量傳遞之半導體封裝為目的。
關於本發明之一實施型態之半導體封裝,包含一第一半導體封裝、一第二半導體封裝及一熱傳導材料。第一半導體封裝包含一第一電路基板及安裝於第一電路基板之一第一半導體元件。第二半導體封裝包含一第二電路基板及安裝於第二電路基板之一第二半導體元件。第二半導體封裝堆疊於第一半導體封裝。熱傳導材料配置於第一半導體元件上及位於第一半導體元件之周邊之第一電路基板上。
於本發明之一實施型態中,第一半導體封裝亦可包含多個接合用電極端子,配置於第一半導體元件之周邊且與第二半導體封裝接合。熱傳導材料亦可配置於多個接合用電極端子之內側。
於本發明之一實施型態中,第一半導體封裝亦可包含多個接合用電極端子,配置於第一半導體元件之周邊且與第二半導體封裝接合。熱傳導材料亦可設置於第一半導體封裝之大部分整面,且亦可圍繞多個接合用電極端子所設置之區域。
於本發明之一實施型態中,第一電路基板亦可包含一散熱導孔(thermal via),熱傳導材料亦可與散熱導孔連接。
於本發明之一實施型態中,散熱導孔亦可與第一電路基板之一電源電位層或一接地電位層(ground plane)連接。
於本發明之一實施型態中,熱傳導材料之表面方向之熱傳導率亦可大於熱傳導材料之厚度方向之熱傳導率。
於本發明之一實施型態中,熱傳導材料亦可為碳纖維預浸材(prepreg)、碳纖維片(sheet)或碳石墨片(carbon graphite sheet)之其中任一者。
另外,亦可於熱傳導材料上配置熱傳導率低的層。
於本發明之一實施型態中,亦可於熱傳導材料之上表面設置密封樹脂。
於本發明之一實施型態中,熱傳導材料亦可形成為線寬比第一半導體元件之一邊狹窄之十字狀。
關於本發明之一實施型態之半導體封裝,包含一第一半導體封裝、一第二半導體封裝及一第一熱傳導材料。第一半導體封裝包含一第一電路基板及安裝於第一電路基板之一第一半導體元件。第二半導體封裝包含一第二電路基板及安裝於第二電路基板之一第二半導體元件。第二半導體封裝堆疊於第一半導體封裝。第一熱傳導材料配置於第二半導體封裝之朝向第一半導體封裝的表面。
於本發明之一實施型態中,亦可包含一第二熱傳導材料,配置於第一半導體元件上及位於第一半導體元件之周邊之第一電路基板上。
於本發明之一實施型態中,第一熱傳導材料及第二熱傳導材料之表面方向之熱傳導率亦可大於第一熱傳導材料及 第二熱傳導材料之厚度方向之熱傳導率。
10‧‧‧第一半導體封裝
11‧‧‧第一電路基板
12‧‧‧第一半導體元件
12a、15a‧‧‧虛線
13、23‧‧‧密封樹脂
14、24‧‧‧熱傳導材料
14s‧‧‧缺口
15‧‧‧散熱導孔
16‧‧‧低熱傳導層
17‧‧‧接合用電極端子
18‧‧‧配線
19‧‧‧導電部件
20‧‧‧第二半導體封裝
21‧‧‧第二電路基板
22‧‧‧第二半導體元件
31、35‧‧‧焊料球
34‧‧‧連接線
50‧‧‧區域
100‧‧‧堆疊型半導體封裝
第1圖為關於本發明之實施型態一之堆疊型半導體封裝之剖面圖。
第2圖為關於本發明之實施型態一之堆疊型半導體封裝之概略俯視圖。
第3圖為關於本發明之實施型態一之一變形例之堆疊型半導體封裝之概略俯視圖。
第4圖為關於本發明之實施型態一之又一變形例之堆疊型半導體封裝之概略俯視圖。
第5圖為關於本發明之實施型態一之另一變形例之堆疊型半導體封裝之概略俯視圖。
第6圖為關於本發明之實施型態二之堆疊型半導體封裝之剖面圖。
第7圖為關於本發明之實施型態二之堆疊型半導體封裝之概略俯視圖。
第8圖為關於本發明之實施型態三之堆疊型半導體封裝之剖面圖。
第9圖為關於本發明之實施型態四之堆疊型半導體封裝之剖面圖。
第10圖為關於本發明之實施型態五之堆疊型半導體封裝之剖 面圖。
第11圖為關於本發明之實施型態五之堆疊型半導體封裝之概略俯視圖。
第12圖為關於本發明之實施型態五之一變形例之堆疊型半導體封裝之剖面圖。
第13圖為關於本發明之實施型態六之堆疊型半導體封裝之剖面圖。
第14圖為關於本發明之實施型態六之一變形例之堆疊型半導體封裝之剖面圖。
第15圖為關於本發明之實施型態七之堆疊型半導體封裝之剖面圖。
第16圖為關於本發明之實施型態七之一變形例之堆疊型半導體封裝之剖面圖。
以下,將參照圖式說明關於本發明之堆疊型半導體封裝。然而,本發明之堆疊型半導體封裝能夠以多種不同的態樣實施,而並非限定解釋成以下所示之實施型態之記載內容。而且,以本實施型態所參照之圖式中,同一部分或具有同樣功能之部分將附上相同符號,且將省略如此反覆的說明。
<實施型態一>
關於本發明之實施型態一之堆疊型半導體封裝100之概要,將一邊參照第1圖至第3圖一邊詳細地說明。
〔堆疊型半導體封裝之基本構造〕
第1圖繪示關於本發明之實施型態一之堆疊型半導體封裝100之A-A’(參照第2圖)之剖面圖。參照第1圖,可知第一半導體封裝10及第二半導體封裝20之間經由焊料球31以彼此接合,而令第二半導體封裝20堆疊於第一半導體封裝10之上。
第一半導體封裝10具有第一電路基板11,且於第一電路基板11上配置有一第一半導體元件12。第一電路基板11可由一層或多層配線基板構成。第1圖中雖繪示第一電路基板11由四層構成,但並非限定於此。雖可例如將應用處理器(application processor)等配置為第一半導體元件12,但並非限定於此。而且,第1圖中,第一半導體元件12雖繪示一個半導體元件,但亦可於第一電路基板11上配置多個半導體元件做為第一半導體元件12。
於構成第一電路基板11之配線基板配置有配線18,第一電路基板11接近第二半導體封裝20之表面所露出之配線18之一部分成為接合用電極端子17。接合用電極端子17上配置有焊料球31,以與配置於第二半導體封裝20之第二電路基板21下側之電極連接。第一半導體封裝10之第一電路基板11之配線18與第二半導體封裝20之第二電路基板21之配線之間經由焊料球31而彼此電性連接。另外,第一半導體封裝10及第二半導體封裝20之間隔因焊料球31而保持一定的長度。
第二半導體封裝20具有由一層或多層配線基板構成之第二電路基板21,且一第二半導體元件22配置於第二電路基板21上。第二半導體元件22可用由銀或銅等材料製成之連接線(bonding wire)34而與第二電路基板21電性連接。使用者可例如將FLASH及SDRAM等之記憶體配置為第二半導體元件22。亦可將多個相同種類或不同種類之記憶體並排配置於第二電路基板21上,而做為第二半導體元件22。另外,亦可將多個記憶體堆疊配置而做為第二半導體元件22。
為了覆蓋第二電路基板21及第二半導體元件22,而配置密封樹脂23。密封樹脂23能夠保護第二半導體元件22及第二電路基板21之上部避免外部水分或雜質混入,且防止第二電路基板21翹曲。使用者能夠使用環氧樹脂(epoxy resin)、氰酸酯樹脂(cyanate ester resin)、丙烯酸樹脂(acrylic resin)、聚醯亞胺樹脂(polyimide resin)及矽氧樹脂(silicone resin)等做為密封樹脂23。
第一電路基板11之下側配置有電極,而與安裝堆疊型半導體封裝100之外部安裝基板之間經由配置於此電極之焊料球35以彼此連接。
〔為了減輕從下側之半導體元件朝向上側之半導體元件之熱量傳遞的構造〕
關於本發明之實施型態一之堆疊型半導體封裝100,是於第一半導體元件12上及位於第一半導體元件12之周 邊之第一電路基板11之一部分配置熱傳導材料14。而且,於第一電路基板11配置散熱導孔15,且熱傳導材料14與散熱導孔15直接連接或中間經由電極而連接。
第2圖繪示關於本發明之實施型態一之堆疊型半導體封裝100中,從上側觀看第一半導體封裝10之俯視圖。多個接合用電極端子17上下左右各二列地配置於矩形的第一半導體封裝10之外周周圍。而且,熱傳導材料14以被配置於第一半導體封裝10之外周附近之多個接合用電極端子17圍繞之方式,配置於多個接合用電極端子17之內側的區域
於此,以虛線12a圍繞之部分,表示配置第一半導體元件12之位置,矩形的第一半導體元件12配置於第一半導體封裝10之中央。因此,熱傳導材料14完全覆蓋第一半導體元件12所配置之部分,而可知熱傳導材料14之寬度大於第一半導體元件12所配置之部分。第一半導體元件12具有矩形形狀,因圍入了第一半導體元件12而配置成為矩形之熱傳導材料14。配置有熱傳導材料14但未配置第一半導體元件12之區域50,則形成為中空的矩形形狀。
虛線15a所示之圓形,表示散熱導孔15所配置之位置。散熱導孔15雖配置於區域50之各頂點附近及各邊的中央附近之合計8個位置,但散熱導孔15所配置的個數及於區域50內之位置並非限定於此。
接下來,將詳細說明關於熱傳導材料14之材料及形 成方法。
熱傳導材料14可適當使用碳纖維預浸材(prepreg)、碳纖維片(sheet)及碳石墨片(carbon graphite sheet)等材料。其中,熱傳導材料14之熱傳導方向具有各向異性(anisotropic),熱傳導材料14形成於第一半導體元件12及其周邊的第一電路基板11上時,以表面方向(第1圖中的橫向)之熱傳導性高於厚度方向(第1圖中之縱向)之熱傳導性為優選。
使用碳纖維預浸材做為熱傳導材料14的情況下,將碳纖維預浸材載置於第一半導體元件12及其周邊之第一電路基板11上,加壓壓輾(press)成形至指定厚度之後進行加熱處理。壓輾時,為了避免氣泡產生,而以真空壓輾或真空層壓(laminate)為優選。壓輾後進行加熱處理時,碳纖維預浸材沿著第一半導體元件12與第一電路基板11之段差及第一電路基版11上配置有散熱導孔15之部分所形成之凹部變形且與之接合(參照第1圖)。
使用碳纖維片或碳纖維預浸材做為熱傳導材料14的情況下,會先於第一半導體元件12及其周邊之第一電路基板11上形成由接合膜等材料構成之接合層(圖未繪示)。接下來,將以硬化狀態受供給之碳纖維片或碳纖維預浸材載置於形成有接合層之第一半導體元件12及其周邊之第一電路基板11上且與之接合。因於第一半導體元件12及第一電路基板11形成有段差,為了防止碳纖維片或碳纖維預浸材之纖維斷裂,此纖維為不織布會比織布要較為優選。
接下來,將說明關於散熱導孔15的形成方法。
首先,於構成第一電路基板11之各個配線基板之指定位置以蝕刻等方式形成通孔。接下來,於通孔內嵌入藉由鍍覆金屬或蝕刻等方式形成之金屬材料。形成於各個配線基板之指定位置之金屬材料受到堆疊而形成散熱導孔15。
參照第1圖,於散熱導孔15之上側形成配線18,於下側形成導電部件19。配線18及導電部件19可使用金屬材料。於此情況下,熱傳導材料14及散熱導孔15可經由配線18而彼此連接。散熱導孔15之上側若未形成配線18,熱傳導材料14亦可與散熱導孔15直接連接。無論如何,使用碳纖維片或碳纖維預浸材做為熱傳導材料14之情況下,因必須要有接合層,故熱傳導材料14與散熱導孔15之間更經由接合層而彼此連接。
此外,構成第一電路基板11之各個配線層可配置有電源電位層或接地電位層(ground plane),而散熱導孔亦可用連接於電源電位層或接地電位層之方式配置。電源電位層及接地電位層若要不因散熱導孔15及熱傳導材料14而彼此短路,則一些散熱導孔15可與電源電位層連接,另一些散熱導孔15則可與接地電位層連接。
關於本發明之實施型態一之堆疊型半導體封裝100,因於第一半導體元件12上及其周邊之前述第一電路基板11上配置熱傳導材料14,第一半導體元件12之上表面所發出的熱量能夠積極地傳遞至第一電路基板11。因此,能夠減輕從第一半 導體元件12朝向配置於第一半導體封裝10之上側之第二半導體封裝20之第二半導體元件22之熱量傳遞,而能夠抑制第二半導體元件22作動不良。
此外,於使用表面方向之熱傳導性為高的材料做為熱傳導材料14的情況下,因第一半導體元件12之上表面所發出的熱量能夠更積極地沿表面方向傳遞,而更能夠減輕朝向第二半導體元件22之熱量傳遞。
再者,因於第一電路基板11配置散熱導孔15且令熱傳導材料14與散熱導孔15連接,而能夠經由熱傳導材料14及散熱導孔15將第一半導體元件12之上表面所發出的熱量傳遞至第一電路基板11。尤其藉由散熱導孔15之下側配置有導電部件19及焊料球35之構造,而能夠將熱量傳遞至用以載置堆疊型半導體封裝100之其他支撐基板。藉此構造,因更能夠經由熱傳導材料14將熱量逸散至第一電路基板11或堆疊型半導體封裝100之外部,而更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。
另外,於第一電路基板11配置散熱導孔15,於構成第一電路基板11之配線基板配置電源電位層或接地電位層,以及散熱導孔15連接於電源電位層或接地電位層之構造的情況下,能夠藉由電源電位層或接地電位層而將第一半導體元件12之熱量擴散至第一電路基板11之整體。藉此構造,更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。
<實施型態一之變形例一>
關於本發明之實施型態一之堆疊型半導體封裝100之變形例一,將一邊參照第3圖一邊詳細說明。
根據用於熱傳導材料14之素材,因第一半導體元件12之厚度等原因,而可能會於熱傳導材料14產生皺紋,熱傳導材料14與第一半導體元件12或與第一電路基板11之接合狀態可能會發生不良的情形。因此,如第3圖所示,亦可從矩形的熱傳導材料14之各個頂點至第一半導體元件12之頂點形成缺口14s。藉由缺口14s吸收熱傳導材料14伴隨段差等因素而造成之鬆弛等現象,而能夠防止熱傳導材料14之皺紋產生,進而防止熱傳導材料14與第一半導體元件12或與第一電路基板11之接合不良。
其中,缺口14s之寬度、數量及形成的位置等,並非限定於上述。舉例而言,亦可放射狀地形成多個缺口14s。此外,亦可從形成缺口14s之部分露出第一電路基板11或第一半導體元件12,或者亦可於形成缺口14s之部分令熱傳導材料14部分地折疊。而且,對應於缺口14s之形成位置,亦可適當調整散熱導孔15之配置位置。亦可反過來先考慮能夠配置散熱導孔15之位置,再適當調整缺口14s的形成位置。
<實施型態一之變形例二>
關於本發明之實施型態一之堆疊型半導體封裝100之變形例二,將一邊參照第4圖一邊詳細說明。
為了防止上述變形例一中所說明之第一半導體元件12之厚度等原因造成皺紋之發生及連接不良,變形例二為更為簡易的方法。參照第4圖,熱傳導材料14形成為線寬比第一半導體元件12之一邊狹窄之十字狀,但第一半導體元件12之各個頂點則不被熱傳導材料14覆蓋。換言之,藉由從矩形之熱傳導材料14之各個頂點,至比位於第一半導體元件12之頂點更接近中心附近的點,分別切下矩形,而形成變形例二中之熱傳導材料14。
參照第4圖,舉例而言,從熱傳導材料14之中心於第一半導體元件12之上部延伸之部分,因僅與第一半導體元件12及第一電路基板11之段差垂直相交,而令熱傳導材料14易於吸收段差且難以產生皺紋。而且,變形例二中,因將矩形的熱傳導材料14之各個頂點切下矩形,且僅載置於第一半導體元件12及第一電路基板11上,而具有形成方法能夠較為容易之優點。
第4圖中,雖然位於第一半導體元件12之上下左右之第一電路基板11上之熱傳導材料14分別為矩形形狀,但變形例二並非限定於此。舉例而言,熱傳導材料14之形狀,亦可為隨著接近第一半導體封裝10之外周而變寬的梯形。另外,第4圖中,雖然於第一半導體元件12之上下左右各配置一個散熱導孔15,但亦可對應熱傳導材料14之形狀等因素而加以適當配置散熱導孔15。
<實施型態一之變形例三>
關於本發明之實施型態一之堆疊型半導體封裝100 之變形例三,將一邊參照第5圖一邊詳細說明。
上述實施型態一之說明中,雖說明區域50之形狀為中空的矩形,但區域50之形狀並非限定於此。第2圖中,繪示於第一電路基板11之周邊部分配置內側及外側二列之接合用電極端子17之狀態。對此,參照第5圖,採取的是於第2圖中之內側的接合用電極端子17之一部分替換成散熱導孔15之構造。第5圖中,雖然區域50之外側之形狀為凹凸狀,但亦可為波浪狀。
因具有上述構造,而能夠更寬闊地形成熱傳導材料14,進而提升將第一半導體元件12所發出的熱量沿表面方向傳遞熱量之效果。此外,還能夠寬闊地確保用以配置第一半導體元件12之空間。
因具有上述構造,而有能夠縮短第一半導體元件12與散熱導孔15間之距離之場合。此場合能夠更有效果地經由熱傳導材料14及散熱導孔15,將第一半導體元件12所發出的熱量傳遞至第一半導體封裝10之下側。
<實施型態二>
關於本發明之實施型態二之堆疊型半導體封裝100之概要,將一邊參照第6圖及第7圖一邊詳細地說明。
第6圖繪示關於本發明之實施型態二之堆疊型半導體封裝100之剖面圖。第6圖雖與第1圖類似,但於熱傳導材料14上配置一低熱傳導層16,低熱傳導層16之熱傳導率低於熱傳 導材料14之厚度方向之熱傳導率,於此要點與第1圖相異。
低熱傳導層16盡可能以不混入矽膠填充物等提高熱傳導率之物質為優選,例如能夠適用環氧(epoxy)系預浸材等。較佳為均勻混入空氣之材料,例如能夠適當地適用發泡胺基甲酸乙酯(urethane)等隔熱材料。
熱傳導材料14與低熱傳導層16,是以先於第一半導體元件12及第一電路基板11上形成熱傳導材料14之後,在於熱傳導材料14上形成低熱傳導層16為佳。或者,亦可先貼合熱傳導材料14及低熱傳導層16,再將已彼此貼合之熱傳導材料14及低熱傳導層16配置於第一半導體元件12及第一電路基板11上。
第7圖繪示關於本發明之實施型態二之堆疊型半導體封裝100中,從上側觀看第一半導體封裝10之俯視圖。
參照第7圖,可知低熱傳導層16具有矩形形狀,且配置於熱傳導材料14所配置之區域之略為內側。第7圖中,低熱傳導層16雖然配置於熱傳導材料14所配置之區域之內側,低熱傳導層16亦可配置成覆蓋熱傳導材料14所配置之區域。
藉由低熱傳導層16配置於熱傳導材料14上,而能夠積極地促進第一半導體元件12所發出之熱量沿表面方向傳遞熱量,且能夠抑制第一半導體元件12所發出之熱量沿厚度方向傳遞熱量。因此,更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。
此外,藉由低熱傳導層16配置於熱傳導材料14上,因能夠避免熱傳導材料14與第二半導體封裝20之下側直接接觸,而亦具有能夠增加關於第一半導體封裝10與第二半導體封裝20之間隔之設計餘裕之效果。
而且,低熱傳導層16所配置之區域雖與熱傳導材料14所配置之區域具有幾乎相同的面積,但並非必須限定於此,低熱傳導層16所配置之區域亦能夠更加狹窄。但是,從更積極地促進第一半導體元件12所發出之熱量沿表面方向傳遞熱量之觀點來看,低熱傳導層16所配置之區域以較為寬廣為優選。
<實施型態三>
關於本發明之實施型態三之堆疊型半導體封裝100之概要,將一邊參照第8圖一邊詳細地說明。
第8圖繪示關於本發明之實施型態三之堆疊型半導體封裝100之剖面圖。第8圖與第1圖類似。然而,第一電路基板11上,即熱傳導材料14上及構成未配置熱傳導材料14之第一電路基板11之電路基板上,配置有密封樹脂13之要點,使得第8圖與第1圖相異。
密封樹脂13能夠保護第一半導體元件12及第一電路基板11之上部避免外部水分或雜質混入,且防止第一電路基板11翹曲。使用者雖能夠使用環氧樹脂、氰酸酯樹脂、丙烯酸樹脂、聚醯亞胺樹脂及矽氧樹脂等做為密封樹脂13,亦可優選使用熱傳導率低於熱傳導材料14之厚度方向之熱傳導率之材料。 於第一電路基板11之整面形成密封樹脂13之後,為了配置焊料球31而於指定的位置形成通孔。
藉由密封樹脂13配置於第一電路基板11上,而能夠抑制熱量沿熱傳導材料14之厚度方向傳遞,進而減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。此外,因於熱傳導材料14上形成密封樹脂13,而能夠避免熱傳導材料14與第二半導體封裝20之下側直接接觸,亦具有能夠增加關於第一半導體封裝10與第二半導體封裝20之間隔之設計餘裕之效果。
<實施型態四>
關於本發明之實施型態四之堆疊型半導體封裝100之概要,將一邊參照第9圖一邊詳細地說明。
第9圖繪示關於本發明之實施型態四之堆疊型半導體封裝100之剖面圖。第9圖與第6圖類似,但第一電路基板11上配置有密封樹脂13之要點,使得第9圖與第6圖相異。
實施型態四中,於低熱傳導層16上配置密封樹脂13。低熱傳導層16所配置之區域小於熱傳導材料14所配置之區域時,密封樹脂13還配置於熱傳導材料14上。藉由具有如此之構造,能夠更增加抑制熱量沿熱傳導材料14之厚度方向傳遞之效果,而能夠大幅減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。
<實施型態五>
關於本發明之實施型態五之堆疊型半導體封裝100 之概要,將一邊參照第10圖至第12圖一邊詳細地說明。
第10圖繪示關於本發明之實施型態五之堆疊型半導體封裝100之A-A’(參照第11圖)之剖面圖。第10圖雖與第1圖類似,但熱傳導材料14還配置於第一電路基板11之上表面之左右的邊緣部分及剖面圖中左右分別配置二個之接合用電極端子17之間之要點,令第10圖與第1圖相異。
第11圖繪示關於本發明之實施型態五之堆疊型半導體封裝100中,從上側觀看第一半導體封裝10之俯視圖。參照第11圖時,可知第一半導體封裝10之上部之整面皆配置有熱傳導材料14。熱傳導材料14可於整面配置於第一半導體元件12上及第一電路基板11上之後,藉由雷射切除(laser ablation)開設用以露出接合用電極端子17之孔洞,再藉由除膠渣(desmear)處理去除殘渣而形成。
藉由熱傳導材料14配置於第一半導體封裝10之整面,而能夠更積極地將第一半導體元件12所發出之熱量傳遞至第一電路基板11整體並加以擴散。因能防止熱量集中於第一半導體元件12之上部,而更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。
<實施型態五之變形例>
關於本發明之實施型態五之堆疊型半導體封裝100之變形例,將一邊參照第12圖一邊詳細說明。
參照第12圖時,可知於第一半導體封裝10之上部 填充有密封樹脂13,而於熱傳導材料14上形成密封樹脂13。於第一電路基板11之整面形成熱傳導材料14之後,更進一步形成密封樹脂13。之後,藉由蝕刻等方式,於密封樹脂13及熱傳導材料14形成用以露出接合用電極端子17之孔洞。
藉由於第一電路基板11之整面形成熱傳導材料14再更進一步於熱傳導材料14上填充密封樹脂13,而能夠抑制熱量沿熱傳導材料14之厚度方向傳遞。藉此,比起第10圖及第11圖所示之實施型態,更能夠擴散傳遞至第一電路基板11整體之熱量,而更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。而且,因於熱傳導材料14上形成密封樹脂13,而能夠避免熱傳導材料14與第二半導體封裝20之下側直接接觸,亦具有能夠增加關於第一半導體封裝10與第二半導體封裝20之間隔之設計餘裕之效果。
<實施型態六>
關於本發明之實施型態六之堆疊型半導體封裝100之概要,將一邊參照第13圖及第14圖一邊詳細地說明。
第13圖繪示關於本發明之實施型態六之堆疊型半導體封裝100之剖面圖。第13圖雖與第10圖類似,但於熱傳導材料14之上部更配置一低熱傳導層16之要點,令第13圖與第10圖相異。藉由熱傳導材料14整面形成於第一半導體元件12上及第一電路基板11上,更形成低熱傳導層16於熱傳導材料14上,而能夠積極地促進第一半導體元件12所發出之熱量沿表面 方向傳遞熱量。因此第13圖所示之關於本發明之實施型態六之堆疊型半導體封裝100比起實施型態五之第10圖所示之構造,更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。而且,藉由低熱傳導層16配置於熱傳導材料14上,因能夠避免熱傳導材料14與第二半導體封裝20之下側直接接觸,而亦具有能夠增加關於第一半導體封裝10與第二半導體封裝20之間隔之設計餘裕之效果。
<實施型態六之變形例>
第14圖繪示關於本發明之實施型態六之變形例之堆疊型半導體封裝100之剖面圖。參照第14圖時,可知於第一半導體封裝10之上部填充有密封樹脂13,而於堆疊在熱傳導材料14上之低熱傳導層16上形成密封樹脂13。因於熱傳導材料14上形成低熱傳導層16再更進一步形成密封樹脂13,第14圖所示之關於本發明之實施型態六之變形例之堆疊型半導體封裝100比起實施型態六之第13圖所示之構造,更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。
<實施型態七>
關於本發明之實施型態七之堆疊型半導體封裝100之概要,將一邊參照第15圖及第16圖一邊詳細地說明。
第15圖繪示關於本發明之實施型態七之堆疊型半導體封裝100之剖面圖。參照第15圖時,可知於第二半導體封裝20之下側之整面配置有熱傳導材料24。關於熱傳導材料24之 材質與特性與實施型態一至七中說明之熱傳導材料14相同。熱傳導材料24整面地形成於第二電路基板21之朝向第一半導體封裝10之表面之後,形成用以露出與焊料球31連接之電極之孔洞。
藉由於第二半導體封裝20之下側整面形成熱傳導材料24,而令來自第一半導體元件12傳遞至熱傳導材料24之對應於第一半導體元件12上部之部分之熱量沿表面方向擴散。亦即第一半導體元件12所發出之熱量整體擴散至第二半導體封裝20而防止熱量集中於第一半導體元件12之上部。藉此,能夠減輕從第一半導體元件12朝向配置於第一半導體封裝10之上側之第二半導體封裝20之第二半導體元件22之熱量傳遞,而能夠抑制第二半導體元件22作動不良。
再者,第15圖雖繪示熱傳導材料24整體形成於第二半導體封裝20之下側之表面,但並非將熱傳導料24所形成之面積及形狀限定於此。然而,從擴散第一半導體元件12所發出之熱量至第二半導體封裝20整體之觀點來看,以寬廣形成熱傳導材料24為優選。
<實施型態七之變形例>
實施型態七能夠與實施型態一至六之任一構造併用。第16圖繪示關於本發明之實施型態七之變形例之堆疊型半導體封裝100之剖面圖,為組合實施型態一及實施型態七之構造。亦即於第一半導體封裝10之上側之表面,形成熱傳導材料14於第一半導體元件12及其周邊之第一電路基板11上,並於第 二半導體封裝20之下側之表面整體形成熱傳導材料14。
藉由組合實施型態七與實施型態一至六之任一構造,比起實施型態一至六之單獨構造,更能夠減輕從第一半導體元件12朝向第二半導體元件22之熱量傳遞。
以上,同時參照第1圖至第16圖說明本發明之實施型態一至七。其中,本發明並非限定於上述之實施型態,在不脫離要旨的範圍中能夠予以適當變更。
10‧‧‧第一半導體封裝
11‧‧‧第一電路基板
12‧‧‧第一半導體元件
14‧‧‧熱傳導材料
15‧‧‧散熱導孔
17‧‧‧接合用電極端子
18‧‧‧配線
19‧‧‧導電部件
20‧‧‧第二半導體封裝
21‧‧‧第二電路基板
22‧‧‧第二半導體元件
23‧‧‧密封樹脂
31、35‧‧‧焊料球
34‧‧‧連接線
100‧‧‧堆疊型半導體封裝

Claims (13)

  1. 一種堆疊型半導體封裝,包括:一第一半導體封裝,包括一第一電路基板及安裝於該第一電路基板之一第一半導體元件;一第二半導體封裝,包括一第二電路基板及安裝於該第二電路基板之一第二半導體元件,該第二半導體封裝堆疊於該第一半導體封裝;以及一熱傳導材料,配置於該第一半導體元件上及位於該第一半導體元件之周邊之該第一電路基板上;其中該第一電路基板包括一散熱導孔;該熱傳導材料與該散熱導孔連接;該熱傳導材料沿著該第一半導體元件的一上表面、該第一半導體元件與該第一電路基板之一段差、該第一電路基板的一表面形狀,且該熱傳導材料接合於該第一半導體元件的該上表面、該第一半導體元件與該第一電路基板之該段差、該第一電路基板的該表面,該熱傳導材料配置成擴展至該第一半導體封裝的一端部,該第一半導體封裝包括多個接合用電極端子,配置於該第一半導體元件之周邊且與該第二半導體封裝接合,該熱傳導材料配置於該些接合用電極端子之內側及端子之間。
  2. 如請求項1所述之堆疊型半導體封裝,其中該散熱導孔與該第一電路基板之一電源電位層或一接地電位層(ground plane)連接。
  3. 如請求項1所述之堆疊型半導體封裝,其中該熱傳導材料之表面方向之熱傳導率大於該熱傳導材料之厚度方向之熱傳導率。
  4. 如請求項1所述之堆疊型半導體封裝,其中該熱傳導材料為碳纖維預浸材(prepreg)、碳纖維片(sheet)或碳石墨片(carbon graphite sheet)之其中任一者。
  5. 如請求項1所述之堆疊型半導體封裝,更包括一層,該層設置於該熱傳導材料上,且該層之熱傳導率低於該熱傳導材料之厚度方向之熱傳導率。
  6. 如請求項1所述之堆疊型半導體封裝,更包括一密封樹脂,設置於該熱傳導材料之一上表面。
  7. 如請求項1所述之堆疊型半導體封裝,其中該熱傳導材料形成為線寬比該第一半導體元件之一邊狹窄之十字狀。
  8. 如請求項1所述之堆疊型半導體封裝,其中該熱傳導材料於俯視時具有一缺口。
  9. 如請求項1所述之堆疊型半導體封裝,其中該熱傳導材料配置成擴展至該第一半導體封裝之該第一電路基板的一端部。
  10. 一種堆疊型半導體封裝,包括:一第一半導體封裝,包括一第一電路基板及安裝於該第 一電路基板之一第一半導體元件;一第二半導體封裝,包括一第二電路基板及安裝於該第二電路基板之一第二半導體元件,該第二半導體封裝堆疊於該第一半導體封裝;一第一熱傳導材料,於該第一半導體封裝中,配置於該第一半導體元件上及該第一半導體元件周邊之該第一電路基板上;以及一第二熱傳導材料,配置於該第二半導體封裝之朝向該第一半導體封裝的表面;其中,該第一熱傳導材料沿著該第一半導體元件的一上表面、該第一半導體元件與該第一電路基板之一段差、該第一電路基板的一表面形狀,且該第一熱傳導材料接合於該第一半導體元件的該上表面、該第一半導體元件與該第一電路基板之該段差、該第一電路基板的該表面;其中,該第二熱傳導材料接合於該第二電路基板之朝向第一半導體封裝的一表面。
  11. 如請求項10所述之堆疊型半導體封裝,更包括一第二熱傳導材料,配置於該第一半導體元件上及位於該第一半導體元件之周邊之該第一電路基板上。
  12. 如請求項11所述之堆疊型半導體封裝,其中該第一熱傳導材料及該第二熱傳導材料之表面方向之熱傳導率大於該第一熱傳導材料及該第二熱傳導材料之厚度方向之熱傳導率。
  13. 如請求項10所述之堆疊型半導體封裝,其中該第一熱傳導材料配置成擴展至該第一半導體封裝的一端部。
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