TWI681481B - 整列裝置及整列方法 - Google Patents

整列裝置及整列方法 Download PDF

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Publication number
TWI681481B
TWI681481B TW104133033A TW104133033A TWI681481B TW I681481 B TWI681481 B TW I681481B TW 104133033 A TW104133033 A TW 104133033A TW 104133033 A TW104133033 A TW 104133033A TW I681481 B TWI681481 B TW I681481B
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TW
Taiwan
Prior art keywords
sheet
wafer
bodies
support surface
supporting
Prior art date
Application number
TW104133033A
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English (en)
Chinese (zh)
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TW201626488A (zh
Inventor
毛受利彰
岡本直也
Original Assignee
日商琳得科股份有限公司
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Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201626488A publication Critical patent/TW201626488A/zh
Application granted granted Critical
Publication of TWI681481B publication Critical patent/TWI681481B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW104133033A 2014-11-19 2015-10-07 整列裝置及整列方法 TWI681481B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014234891A JP6393596B2 (ja) 2014-11-19 2014-11-19 整列装置および整列方法
JP2014-234891 2014-11-19

Publications (2)

Publication Number Publication Date
TW201626488A TW201626488A (zh) 2016-07-16
TWI681481B true TWI681481B (zh) 2020-01-01

Family

ID=55989262

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104133033A TWI681481B (zh) 2014-11-19 2015-10-07 整列裝置及整列方法
TW108122671A TW201939644A (zh) 2014-11-19 2015-10-07 整列裝置及整列方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108122671A TW201939644A (zh) 2014-11-19 2015-10-07 整列裝置及整列方法

Country Status (4)

Country Link
JP (1) JP6393596B2 (ja)
KR (1) KR102419700B1 (ja)
CN (1) CN105609447B (ja)
TW (2) TWI681481B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10211363B2 (en) 2017-02-21 2019-02-19 Shenzhen China Star Optoelectronics Technology Co., Ltd Transfer printing template and transfer printing device of micro light-emitting diode
CN106903978B (zh) * 2017-02-21 2019-01-11 深圳市华星光电技术有限公司 转印模板及微发光二极管的转印装置
JP6880431B2 (ja) * 2017-04-11 2021-06-02 リンテック株式会社 離間装置および離間方法
JP7155587B2 (ja) * 2018-04-10 2022-10-19 富士電機株式会社 物品の姿勢矯正構造、搬送装置および搬送方法
CN111554604B (zh) * 2020-04-30 2023-11-21 苏州均华精密机械有限公司 提高精度与速度的接合装置
CN112992720B (zh) * 2020-07-22 2022-04-29 重庆康佳光电技术研究院有限公司 微发光二极管芯片巨量转移方法及系统
CN117515166A (zh) * 2022-07-28 2024-02-06 华为技术有限公司 阀门、互连设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200707667A (en) * 2005-07-28 2007-02-16 Sanyo Electric Co Semiconductor device and method for manufacture thereof
TW200826221A (en) * 2006-06-30 2008-06-16 World Platech Co Ltd Chip scale package tray
JP2011096961A (ja) * 2009-11-02 2011-05-12 Citizen Electronics Co Ltd Ｌｅｄ素子の製造方法
JP2012156288A (ja) * 2011-01-26 2012-08-16 Showa Denko Kk 半導体チップの製造方法および半導体チップの実装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4821418B1 (ja) * 1969-01-27 1973-06-28
JPS6461033A (en) * 1987-09-01 1989-03-08 Sumitomo Electric Industries Device for mounting chip
JP4592894B2 (ja) * 2000-08-25 2010-12-08 Ｎｅｃエンジニアリング株式会社 位置決め装置および位置決め方法
JP4272402B2 (ja) * 2002-10-11 2009-06-03 株式会社日立メディアエレクトロニクス パッケージとリッドの組み合わせ装置ならびにその組み合わせ方法
JP2009175581A (ja) * 2008-01-28 2009-08-06 Kyocera Mita Corp 画像形成装置の転写ベルト装置
JP5607965B2 (ja) * 2010-03-23 2014-10-15 日東電工株式会社 半導体ウエハマウント方法および半導体ウエハマウント装置
JP6007008B2 (ja) * 2012-07-06 2016-10-12 リンテック株式会社 シート貼付装置
JP6047439B2 (ja) * 2013-03-26 2016-12-21 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置および剥離方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200707667A (en) * 2005-07-28 2007-02-16 Sanyo Electric Co Semiconductor device and method for manufacture thereof
TW200826221A (en) * 2006-06-30 2008-06-16 World Platech Co Ltd Chip scale package tray
JP2011096961A (ja) * 2009-11-02 2011-05-12 Citizen Electronics Co Ltd Ｌｅｄ素子の製造方法
JP2012156288A (ja) * 2011-01-26 2012-08-16 Showa Denko Kk 半導体チップの製造方法および半導体チップの実装方法

Also Published As

Publication number Publication date
TW201626488A (zh) 2016-07-16
TW201939644A (zh) 2019-10-01
KR102419700B1 (ko) 2022-07-11
JP6393596B2 (ja) 2018-09-19
CN105609447A (zh) 2016-05-25
KR20160059967A (ko) 2016-05-27
CN105609447B (zh) 2020-06-02
JP2016100413A (ja) 2016-05-30

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