TWI669041B - 印刷電路板及其製造方法 - Google Patents
印刷電路板及其製造方法 Download PDFInfo
- Publication number
- TWI669041B TWI669041B TW106135163A TW106135163A TWI669041B TW I669041 B TWI669041 B TW I669041B TW 106135163 A TW106135163 A TW 106135163A TW 106135163 A TW106135163 A TW 106135163A TW I669041 B TWI669041 B TW I669041B
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- Taiwan
- Prior art keywords
- layer
- copper
- conductive
- less
- copper surface
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 124
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 230
- 239000010949 copper Substances 0.000 claims abstract description 196
- 229910052802 copper Inorganic materials 0.000 claims abstract description 192
- 229910000679 solder Inorganic materials 0.000 claims abstract description 109
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000012298 atmosphere Substances 0.000 claims abstract description 39
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 37
- 230000003647 oxidation Effects 0.000 claims abstract description 32
- 238000006722 reduction reaction Methods 0.000 claims abstract description 26
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910001882 dioxygen Inorganic materials 0.000 claims abstract description 20
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 19
- 238000011282 treatment Methods 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000000126 substance Substances 0.000 claims abstract description 11
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 239000001569 carbon dioxide Substances 0.000 claims description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 abstract description 23
- 239000010410 layer Substances 0.000 abstract 5
- 239000011247 coating layer Substances 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 30
- 239000000243 solution Substances 0.000 description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 19
- 239000011135 tin Substances 0.000 description 19
- 229910052718 tin Inorganic materials 0.000 description 19
- 238000001764 infiltration Methods 0.000 description 18
- 230000008595 infiltration Effects 0.000 description 18
- 230000008569 process Effects 0.000 description 17
- 239000012080 ambient air Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 13
- 238000004381 surface treatment Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 9
- 238000001465 metallisation Methods 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 230000035515 penetration Effects 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000032798 delamination Effects 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
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- 229920001721 polyimide Polymers 0.000 description 5
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- 230000001747 exhibiting effect Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- -1 hypochlorite Chemical compound 0.000 description 4
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007719 peel strength test Methods 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
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- 230000008901 benefit Effects 0.000 description 3
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- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000001198 high resolution scanning electron microscopy Methods 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910000085 borane Inorganic materials 0.000 description 2
- 229910001919 chlorite Inorganic materials 0.000 description 2
- 229910052619 chlorite group Inorganic materials 0.000 description 2
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 2
- 230000001143 conditioned effect Effects 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
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- 238000000059 patterning Methods 0.000 description 2
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- 229920002120 photoresistant polymer Polymers 0.000 description 2
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- 150000004756 silanes Chemical class 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- UYURMLWWLDQDCD-UHFFFAOYSA-N 1h-pyrrol-2-ylsilicon Chemical compound [Si]C1=CC=CN1 UYURMLWWLDQDCD-UHFFFAOYSA-N 0.000 description 1
- XECIMMKZGQKOIJ-UHFFFAOYSA-N 5-(3-trimethoxysilylpropylsulfanyl)-1,3,4-thiadiazol-2-amine Chemical compound NC=1SC(=NN=1)SCCC[Si](OC)(OC)OC XECIMMKZGQKOIJ-UHFFFAOYSA-N 0.000 description 1
- QSJFIENDVSKMOO-UHFFFAOYSA-N 5-(3-trimethoxysilylpropylsulfanyl)-3h-1,3,4-thiadiazole-2-thione Chemical compound CO[Si](OC)(OC)CCCSC1=NNC(=S)S1 QSJFIENDVSKMOO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical group NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- 208000032544 Cicatrix Diseases 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- RWJASCTWJJZMLN-UHFFFAOYSA-N NC1=NNC(=N1)SCCC[Si](OC)(OC)OC Chemical compound NC1=NNC(=N1)SCCC[Si](OC)(OC)OC RWJASCTWJJZMLN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
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- 150000003851 azoles Chemical class 0.000 description 1
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical class [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012084 conversion product Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
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- 239000003989 dielectric material Substances 0.000 description 1
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- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
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- 238000010884 ion-beam technique Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005385 peroxodisulfate group Chemical group 0.000 description 1
- FHHJDRFHHWUPDG-UHFFFAOYSA-L peroxysulfate(2-) Chemical compound [O-]OS([O-])(=O)=O FHHJDRFHHWUPDG-UHFFFAOYSA-L 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??16193971.5 | 2016-10-14 | ||
| EP16193971.5A EP3310137B1 (en) | 2016-10-14 | 2016-10-14 | Method for manufacturing a printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201831068A TW201831068A (zh) | 2018-08-16 |
| TWI669041B true TWI669041B (zh) | 2019-08-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106135163A TWI669041B (zh) | 2016-10-14 | 2017-10-13 | 印刷電路板及其製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10477700B2 (enExample) |
| EP (1) | EP3310137B1 (enExample) |
| JP (1) | JP7213801B2 (enExample) |
| KR (1) | KR102413015B1 (enExample) |
| CN (1) | CN109845415B (enExample) |
| TW (1) | TWI669041B (enExample) |
| WO (1) | WO2018069421A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11991835B2 (en) | 2019-03-01 | 2024-05-21 | Atotech Deutschland Gmbh | Method for increasing adhesion strength between a metal and an organic material |
| CN110856348A (zh) * | 2019-10-09 | 2020-02-28 | 广东利尔化学有限公司 | 一种用于pcb除胶后处理中和还原剂 |
| CN110798980A (zh) * | 2019-10-12 | 2020-02-14 | 西安金百泽电路科技有限公司 | 一种改善渗油及油墨入孔的方法 |
| JP7474095B2 (ja) * | 2020-03-31 | 2024-04-24 | リンテック株式会社 | 接着シート、及び接着シートの使用方法 |
| JP2021194831A (ja) * | 2020-06-12 | 2021-12-27 | Ckd株式会社 | スクリーンマスク検査方法及びスクリーンマスク検査装置 |
| US11388822B2 (en) | 2020-08-28 | 2022-07-12 | Applied Materials, Inc. | Methods for improved polymer-copper adhesion |
| CN112577982A (zh) * | 2020-12-09 | 2021-03-30 | 广州添利电子科技有限公司 | 一种pcb表面处理金属薄层质量分析方法 |
| WO2022258726A1 (en) | 2021-06-09 | 2022-12-15 | Atotech Deutschland GmbH & Co. KG | A composite and a method for manufacturing a composite of a copper layer and an organic layer |
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| WO2009125845A1 (ja) * | 2008-04-10 | 2009-10-15 | ソニーケミカル＆インフォメーションデバイス株式会社 | フレキシブル配線板の製造方法 |
| US20140261897A1 (en) * | 2010-07-06 | 2014-09-18 | Atotech Deutschland Gmbh | Methods of Treating Metal Surfaces and Devices Formed Thereby |
| TW201438918A (zh) * | 2013-02-08 | 2014-10-16 | Ymt Co Ltd | 具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板 |
| TW201526728A (zh) * | 2013-12-19 | 2015-07-01 | Zhen Ding Technology Co Ltd | 可撓式電路板及其製作方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4316087A1 (de) | 1993-05-13 | 1994-11-17 | Morton Int Inc | Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten |
| JP4219641B2 (ja) * | 2002-08-26 | 2009-02-04 | 新日鐵化学株式会社 | アルカリ現像型感光性樹脂組成物 |
| WO2005101929A1 (en) * | 2004-04-19 | 2005-10-27 | Youngeun Electronics Co., Ltd | Printed circuit board including track gap-filled resin and fabricating method thereof |
| EP2065927B1 (en) * | 2007-11-27 | 2013-10-02 | Imec | Integration and manufacturing method of Cu germanide and Cu silicide as Cu capping layer |
| JP2010166099A (ja) * | 2010-04-30 | 2010-07-29 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
| JP6030401B2 (ja) * | 2012-10-12 | 2016-11-24 | 三井金属鉱業株式会社 | 表面処理銅箔の製造方法 |
| EP2754732B1 (en) * | 2013-01-15 | 2015-03-11 | ATOTECH Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
| US9857687B2 (en) * | 2013-02-28 | 2018-01-02 | Tokai Shinei Electronics Inidustry Co., Ltd | Method of manufacturing substrate and substrate and mask film |
| US9637271B2 (en) | 2013-03-15 | 2017-05-02 | Owens-Brockway Glass Container Inc. | Container with a medal |
| CN103260361B (zh) * | 2013-05-14 | 2016-07-06 | 金悦通电子（翁源）有限公司 | 一种hdi外层线路负片加工方法 |
-
2016
- 2016-10-14 EP EP16193971.5A patent/EP3310137B1/en not_active Not-in-force
-
2017
- 2017-10-12 US US16/340,697 patent/US10477700B2/en active Active
- 2017-10-12 WO PCT/EP2017/076003 patent/WO2018069421A1/en not_active Ceased
- 2017-10-12 CN CN201780062323.5A patent/CN109845415B/zh not_active Expired - Fee Related
- 2017-10-12 JP JP2019520056A patent/JP7213801B2/ja active Active
- 2017-10-12 KR KR1020197012922A patent/KR102413015B1/ko active Active
- 2017-10-13 TW TW106135163A patent/TWI669041B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009125845A1 (ja) * | 2008-04-10 | 2009-10-15 | ソニーケミカル＆インフォメーションデバイス株式会社 | フレキシブル配線板の製造方法 |
| US20140261897A1 (en) * | 2010-07-06 | 2014-09-18 | Atotech Deutschland Gmbh | Methods of Treating Metal Surfaces and Devices Formed Thereby |
| TW201438918A (zh) * | 2013-02-08 | 2014-10-16 | Ymt Co Ltd | 具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板 |
| TW201526728A (zh) * | 2013-12-19 | 2015-07-01 | Zhen Ding Technology Co Ltd | 可撓式電路板及其製作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190066041A (ko) | 2019-06-12 |
| CN109845415A (zh) | 2019-06-04 |
| WO2018069421A1 (en) | 2018-04-19 |
| JP2019530986A (ja) | 2019-10-24 |
| KR102413015B1 (ko) | 2022-06-24 |
| TW201831068A (zh) | 2018-08-16 |
| CN109845415B (zh) | 2020-12-08 |
| EP3310137A1 (en) | 2018-04-18 |
| US10477700B2 (en) | 2019-11-12 |
| JP7213801B2 (ja) | 2023-01-27 |
| EP3310137B1 (en) | 2019-02-27 |
| US20190297732A1 (en) | 2019-09-26 |
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