CN109845415B - 用于制造印刷电路板的方法 - Google Patents

用于制造印刷电路板的方法 Download PDF

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Publication number
CN109845415B
CN109845415B CN201780062323.5A CN201780062323A CN109845415B CN 109845415 B CN109845415 B CN 109845415B CN 201780062323 A CN201780062323 A CN 201780062323A CN 109845415 B CN109845415 B CN 109845415B
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China
Prior art keywords
copper
layer
conductive
permanent
copper surface
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Expired - Fee Related
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CN201780062323.5A
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English (en)
Chinese (zh)
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CN109845415A (zh
Inventor
曺元珍
马尔库·拉格尔
迪尔克·特夫斯
林钊文
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201780062323.5A 2016-10-14 2017-10-12 用于制造印刷电路板的方法 Expired - Fee Related CN109845415B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16193971.5A EP3310137B1 (en) 2016-10-14 2016-10-14 Method for manufacturing a printed circuit board
EP16193971.5 2016-10-14
PCT/EP2017/076003 WO2018069421A1 (en) 2016-10-14 2017-10-12 Method for manufacturing a printed circuit board

Publications (2)

Publication Number Publication Date
CN109845415A CN109845415A (zh) 2019-06-04
CN109845415B true CN109845415B (zh) 2020-12-08

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CN201780062323.5A Expired - Fee Related CN109845415B (zh) 2016-10-14 2017-10-12 用于制造印刷电路板的方法

Country Status (7)

Country Link
US (1) US10477700B2 (enExample)
EP (1) EP3310137B1 (enExample)
JP (1) JP7213801B2 (enExample)
KR (1) KR102413015B1 (enExample)
CN (1) CN109845415B (enExample)
TW (1) TWI669041B (enExample)
WO (1) WO2018069421A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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WO2020178146A1 (en) * 2019-03-01 2020-09-10 Atotech Deutschland Gmbh Method for increasing adhesion strength between a metal and an organic material
CN110856348A (zh) * 2019-10-09 2020-02-28 广东利尔化学有限公司 一种用于pcb除胶后处理中和还原剂
CN110798980A (zh) * 2019-10-12 2020-02-14 西安金百泽电路科技有限公司 一种改善渗油及油墨入孔的方法
JP7474095B2 (ja) * 2020-03-31 2024-04-24 リンテック株式会社 接着シート、及び接着シートの使用方法
JP2021194831A (ja) * 2020-06-12 2021-12-27 Ckd株式会社 スクリーンマスク検査方法及びスクリーンマスク検査装置
US11388822B2 (en) 2020-08-28 2022-07-12 Applied Materials, Inc. Methods for improved polymer-copper adhesion
CN112577982A (zh) * 2020-12-09 2021-03-30 广州添利电子科技有限公司 一种pcb表面处理金属薄层质量分析方法
KR20240018632A (ko) 2021-06-09 2024-02-13 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 구리층과 유기층의 복합재 및 그 복합재의 제조방법

Citations (6)

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CN1875669A (zh) * 2004-04-19 2006-12-06 株式会社荣恩电子 具有走线间隙填充树脂的印刷电路板及其制造方法
WO2009125845A1 (ja) * 2008-04-10 2009-10-15 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線板の製造方法
CN101515563B (zh) * 2007-11-27 2011-07-27 台湾积体电路制造股份有限公司 覆盖层的制造方法
WO2012005722A1 (en) * 2010-07-06 2012-01-12 Zettacore, Inc. Methods of treating metal surfaces and devices formed thereby
CN103260361A (zh) * 2013-05-14 2013-08-21 金悦通电子（翁源）有限公司 一种工序简单的hdi外层线路负片加工方法
CN104704137A (zh) * 2012-10-12 2015-06-10 三井金属矿业株式会社 表面处理铜箔、表面处理铜箔的制造方法、负极集电体及非水性二次电池的负极材料

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JP4219641B2 (ja) 2002-08-26 2009-02-04 新日鐵化学株式会社 アルカリ現像型感光性樹脂組成物
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KR101422262B1 (ko) * 2013-02-08 2014-07-24 와이엠티 주식회사 동박층이 형성된 기판과 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
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Publication number Priority date Publication date Assignee Title
CN1875669A (zh) * 2004-04-19 2006-12-06 株式会社荣恩电子 具有走线间隙填充树脂的印刷电路板及其制造方法
CN101515563B (zh) * 2007-11-27 2011-07-27 台湾积体电路制造股份有限公司 覆盖层的制造方法
WO2009125845A1 (ja) * 2008-04-10 2009-10-15 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線板の製造方法
WO2012005722A1 (en) * 2010-07-06 2012-01-12 Zettacore, Inc. Methods of treating metal surfaces and devices formed thereby
CN104704137A (zh) * 2012-10-12 2015-06-10 三井金属矿业株式会社 表面处理铜箔、表面处理铜箔的制造方法、负极集电体及非水性二次电池的负极材料
CN103260361A (zh) * 2013-05-14 2013-08-21 金悦通电子（翁源）有限公司 一种工序简单的hdi外层线路负片加工方法

Also Published As

Publication number Publication date
WO2018069421A1 (en) 2018-04-19
CN109845415A (zh) 2019-06-04
EP3310137B1 (en) 2019-02-27
US10477700B2 (en) 2019-11-12
TW201831068A (zh) 2018-08-16
JP2019530986A (ja) 2019-10-24
US20190297732A1 (en) 2019-09-26
JP7213801B2 (ja) 2023-01-27
TWI669041B (zh) 2019-08-11
KR20190066041A (ko) 2019-06-12
KR102413015B1 (ko) 2022-06-24
EP3310137A1 (en) 2018-04-18

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