TWI667119B - Resin sealing method and resin sealing device - Google Patents

Resin sealing method and resin sealing device Download PDF

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Publication number
TWI667119B
TWI667119B TW104144363A TW104144363A TWI667119B TW I667119 B TWI667119 B TW I667119B TW 104144363 A TW104144363 A TW 104144363A TW 104144363 A TW104144363 A TW 104144363A TW I667119 B TWI667119 B TW I667119B
Authority
TW
Taiwan
Prior art keywords
resin
substrate
mold
lower mold
portions
Prior art date
Application number
TW104144363A
Other languages
English (en)
Chinese (zh)
Other versions
TW201634220A (zh
Inventor
大西洋平
Original Assignee
日商東和股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東和股份有限公司 filed Critical 日商東和股份有限公司
Publication of TW201634220A publication Critical patent/TW201634220A/zh
Application granted granted Critical
Publication of TWI667119B publication Critical patent/TWI667119B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
TW104144363A 2015-01-27 2015-12-30 Resin sealing method and resin sealing device TWI667119B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015013673A JP6560498B2 (ja) 2015-01-27 2015-01-27 樹脂封止方法及び樹脂成形品の製造方法
JPJP2015-013673 2015-01-27

Publications (2)

Publication Number Publication Date
TW201634220A TW201634220A (zh) 2016-10-01
TWI667119B true TWI667119B (zh) 2019-08-01

Family

ID=56559611

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104144363A TWI667119B (zh) 2015-01-27 2015-12-30 Resin sealing method and resin sealing device

Country Status (4)

Country Link
JP (1) JP6560498B2 (ja)
KR (1) KR101764525B1 (ja)
CN (1) CN105826212B (ja)
TW (1) TWI667119B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640770B (zh) * 2017-06-02 2018-11-11 優肯科技股份有限公司 封裝材料之熟化度與比容關係之量測設備
JP6296195B1 (ja) * 2017-07-21 2018-03-20 第一精工株式会社 樹脂封止用金型の調整方法及び樹脂封止用金型
JP6482616B2 (ja) * 2017-08-21 2019-03-13 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
CN108198764B (zh) * 2017-12-18 2019-07-02 重庆市长寿区普爱网络科技有限公司 电子元器件制造方法
JP7160770B2 (ja) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置
JP6837530B1 (ja) * 2019-10-17 2021-03-03 Ｔｏｗａ株式会社 樹脂成形方法及び樹脂成形装置
CN112976666B (zh) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 一种应用于压缩成形的模具上的动平衡缓冲机构
JP7341115B2 (ja) * 2020-11-24 2023-09-08 Ｔｏｗａ株式会社 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法
CN115008703B (zh) * 2022-05-26 2023-09-12 武汉船用机械有限责任公司 一种电气设备用绝缘元件生产装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010008775A1 (en) * 2000-01-19 2001-07-19 Saburo Yamamoto Resin sealing method and resin sealing apparatus
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
JP2007307766A (ja) * 2006-05-17 2007-11-29 Towa Corp 電子部品の樹脂封止成形方法
TW201316559A (zh) * 2011-10-07 2013-04-16 Dai Ichi Seiko Co Ltd 樹脂密封裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3680005B2 (ja) * 1998-07-10 2005-08-10 アピックヤマダ株式会社 半導体装置の製造方法及び樹脂封止装置
JP3017490B1 (ja) * 1999-01-26 2000-03-06 アピックヤマダ株式会社 樹脂モ―ルド装置及びこれに用いるモ―ルド金型
JP4954012B2 (ja) * 2007-10-05 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形用金型
JP5934139B2 (ja) * 2013-04-19 2016-06-15 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010008775A1 (en) * 2000-01-19 2001-07-19 Saburo Yamamoto Resin sealing method and resin sealing apparatus
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
JP2007307766A (ja) * 2006-05-17 2007-11-29 Towa Corp 電子部品の樹脂封止成形方法
TW201316559A (zh) * 2011-10-07 2013-04-16 Dai Ichi Seiko Co Ltd 樹脂密封裝置

Also Published As

Publication number Publication date
JP2016137634A (ja) 2016-08-04
TW201634220A (zh) 2016-10-01
KR20160092498A (ko) 2016-08-04
KR101764525B1 (ko) 2017-08-02
CN105826212B (zh) 2019-03-05
CN105826212A (zh) 2016-08-03
JP6560498B2 (ja) 2019-08-14

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