TWI666682B - 半導體處理方法以及於半導體基板上製造半導體裝置的方法 - Google Patents

半導體處理方法以及於半導體基板上製造半導體裝置的方法 Download PDF

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Publication number
TWI666682B
TWI666682B TW104118057A TW104118057A TWI666682B TW I666682 B TWI666682 B TW I666682B TW 104118057 A TW104118057 A TW 104118057A TW 104118057 A TW104118057 A TW 104118057A TW I666682 B TWI666682 B TW I666682B
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TW
Taiwan
Prior art keywords
process chamber
semiconductor substrate
semiconductor
semiconductor processing
processing system
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TW104118057A
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English (en)
Chinese (zh)
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TW201603113A (zh
Inventor
Bert Jongbloed
伯特 宗補羅度
Dieter Pierreux
迪特爾 皮耶賀
Cornelius A. Van Der Jeugd
德 捷 康奈爾斯Ａ 樊
Herbert Terhorst
赫伯特 特后司特
Lucian Jdira
路西安 堤拉
Radko G. Bankras
瑞德寇Ｇ 班克瑞斯
Theodorus G. M. Oosterlaken
式朵拉斯Ｇ Ｍ 亞斯特雷肯
Original Assignee
Asm Ip Holding B. V.
荷蘭商Ａｓｍ Ｉｐ控股公司
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Publication of TW201603113A publication Critical patent/TW201603113A/zh
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    • H10P14/6529—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • H10P14/6306—
    • H10P14/6336—
    • H10P14/69215—

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Formation Of Insulating Films (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Plasma & Fusion (AREA)
TW104118057A 2014-06-05 2015-06-04 半導體處理方法以及於半導體基板上製造半導體裝置的方法 TWI666682B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462008404P 2014-06-05 2014-06-05
US62/008,404 2014-06-05

Publications (2)

Publication Number Publication Date
TW201603113A TW201603113A (zh) 2016-01-16
TWI666682B true TWI666682B (zh) 2019-07-21

Family

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Family Applications (1)

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TW104118057A TWI666682B (zh) 2014-06-05 2015-06-04 半導體處理方法以及於半導體基板上製造半導體裝置的方法

Country Status (4)

Country Link
US (2) US9431238B2 (enExample)
JP (2) JP6381486B2 (enExample)
KR (1) KR102172363B1 (enExample)
TW (1) TWI666682B (enExample)

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US20190035673A1 (en) * 2016-03-31 2019-01-31 Intel Corporation Flowable dielectrics from vapor phase precursors
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JP6752249B2 (ja) * 2018-03-27 2020-09-09 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
TW202107528A (zh) * 2019-04-30 2021-02-16 美商得昇科技股份有限公司 氫氣輔助的大氣自由基氧化
KR102771903B1 (ko) 2019-08-16 2025-02-27 삼성전자주식회사 저유전체 물질 층을 포함하는 반도체 소자 형성 방법
US20240167153A1 (en) * 2021-03-30 2024-05-23 Lam Research Corporation In-situ film annealing in substrate processing

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Also Published As

Publication number Publication date
JP6836551B2 (ja) 2021-03-03
US20150357184A1 (en) 2015-12-10
JP6381486B2 (ja) 2018-08-29
KR102172363B1 (ko) 2020-11-02
US20170011910A1 (en) 2017-01-12
JP2015233137A (ja) 2015-12-24
JP2018198318A (ja) 2018-12-13
TW201603113A (zh) 2016-01-16
KR20150140232A (ko) 2015-12-15
US9431238B2 (en) 2016-08-30

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