TWI648835B - 有芯構造焊料凸塊及其製造方法 - Google Patents

有芯構造焊料凸塊及其製造方法 Download PDF

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TWI648835B
TWI648835B TW103144325A TW103144325A TWI648835B TW I648835 B TWI648835 B TW I648835B TW 103144325 A TW103144325 A TW 103144325A TW 103144325 A TW103144325 A TW 103144325A TW I648835 B TWI648835 B TW I648835B
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core
solder
group
bump
powder
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TW201541594A (zh
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中川�
石川雅之
八十嶋司
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日商三菱綜合材料股份有限公司
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Abstract

提供有芯構造焊料凸塊及其製造方法。獲得於焊料凸塊之製作時，預先於凸塊之中心部分印刷塗佈芯用膏體，以焊料金屬之迴銲處理溫度附近或其以下的溫度就芯用膏體作燒結，從而形成燒結芯，接著，於此燒結芯之周圍以印刷法塗佈焊料金屬，就此焊料金屬作迴銲處理，從而於焊料凸塊之內部，形成延伸於垂直之方向的燒結芯之有芯構造焊料凸塊。

Description

有芯構造焊料凸塊及其製造方法
本發明，係關於有芯構造焊料凸塊及其製造方法，尤其，關於尋求半導體裝置用焊料凸塊之微矩化的有芯構造焊料凸塊及供以於半導體裝置之墊電極上形成有芯構造焊料凸塊用的製造方法。
本案，係基於在2013年12月27日，於日本申請專利之日本發明專利申請案2013-270852號主張優先權，於此援用其內容。
近年來，為了實現半導體之高密度，使得採用了焊料凸塊之接合受到普遍採用，惟要尋求更進一步的高密度化，係要求焊料凸塊形成之微矩化。
然後，為了響應此要求，就供以實現微矩化用的焊料凸塊或其製造法，自歷來已作出幾項提議。
例如，於專利文獻1，係已提議於半導體基板表面之導體墊上，依序形成柱體金屬、覆蓋柱體金屬上表面之凸塊下金屬層及與導體墊幾乎等徑的焊料金屬層而進 行焊料金屬之迴銲處理從而形成焊料凸塊。此外，於專利文獻2，係已提議如同專利文獻1記載者依序形成與導體墊13幾乎等徑之焊料金屬層(阻擋金屬層14)後，使柱體金屬層15之直徑減少，接著，進行焊料金屬17的迴銲處理，形成如圖1所示之焊料凸塊，從而尋求微矩化。
此外，例如，於專利文獻3，係亦已提議使半導體晶片上之墊電極朝向下而予以接觸於熔化焊料的噴流面從而於此墊電極上形成一次焊料凸塊，使形成此一次焊料凸塊之墊電極朝向上，於其藉網印之手法而載置焊膏，使此焊膏朝向下，在此被朝向下、施加重力之狀態下迴銲前述焊膏而形成二次焊料凸塊，使得可達成墊電極之微矩化的焊料凸塊之製造。
[先前技術文獻] [專利文獻]
[專利文獻1]日本發明專利公開2013-187258號公報(A)
[專利文獻2]日本發明專利公開2006-332694號公報(A)
[專利文獻3]日本發明專利第3961876號公報(B)
雖如於上述先前技術所示，正朝向半導體之高密度安裝，而謀求焊料凸塊之微矩化，惟確保焊料凸塊之密著性、導電性之下的微矩化技術，係尚未確立。
例如，於專利文獻1、2記載之技術，係於晶圓或有機基板之電極上，利用電鍍法，而形成小徑的柱體，於其上利用鍍覆法而形成焊料金屬，實施迴銲處理從而形成焊料凸塊，將凸塊之高度形成為高至一定程度。然而，以鍍覆法而作柱體形成、焊料金屬形成，故程序通量差，此外，因熔化時的焊料金屬之自重及表面張力，使得凸塊變扁平而凸塊高度受到限制，故無法獲得相較於焊料凸塊徑，高至其程度之縱橫比者，即便採取增加焊料金屬之載置量，仍有產生接觸於鄰接之其他焊料凸塊而引起短路之虞的問題。
此外，於專利文獻3記載之技術，亦對於一次焊料凸塊表面之焊膏，而作成向下而作迴銲，從而形成相較上縱橫比高的凸塊，惟於裝配時等再熔時，縱橫比係因焊料金屬之自重及表面張力而自然受到制約，與鄰接之熔化焊料金屬凸塊作接觸，使得有成為電性導通不良的原因之虞。
因此，為了實現半導體之高密度安裝，係可微矩化的高縱橫比之焊料凸塊及其簡易的製造法受到期望。
本發明人們，係為了可焊料凸塊之微矩化，就焊料凸塊之構造及其製造方法作銳意檢討的結果，獲得 以下之發現。
亦即，本發明人們，係發現可於焊料凸塊之製作時，例如，於半導體基板之既定位置(例如，於形成於半導體封裝用有機基板上之墊電極表面或半導體封裝用晶圓上所形成的UBM(凸塊下金屬))，預先塗佈由既定之材料所成之芯用膏體，作迴銲處理，從而形成具有既定之高度的燒結芯，接著，於此燒結芯之周圍以印刷法塗佈焊膏後，就此焊膏作迴銲處理從而形成有芯構造之焊料凸塊。
然後，發現此有芯構造之焊料凸塊，係不易發生凸塊之自重所致的扁平化，因而成為凸塊高度高的高縱橫比之焊料凸塊，此外，藉適當選擇燒結芯之材質，使得與焊料金屬之密著性會提升，隨此，凸塊與半導體基板之密著性亦提升，再者，此高縱橫比之有芯構造焊料凸塊，係具備相較於歷來凸塊不遜色之導電性。
再者，本發明人們，係發現前述有芯構造之焊料凸塊，係得以平常的網版印刷法而簡易製作。
亦即，發現首先，在第一程序方面，於半導體基板之既定位置(例如，於形成於半導體封裝用有機基板上之墊電極表面或半導體封裝用晶圓上所形成的UBM(凸塊下金屬))，安裝具有墊電極或UBM稍微露出的程度之開口的遮罩，將成為燒結芯之芯用膏體印刷於墊電極或UBM的中央部分，接著，卸除遮罩，就塗佈於墊電極或UBM之芯用膏體，以焊膏之迴銲溫度附近或其以下作燒 結，而於墊電極或UBM的大致中央部分製作具有既定之高度的燒結芯，接著，在第二程序方面，將具有比墊電極或UBM的徑還大之徑的開口之遮罩，以於大致中央部形成燒結芯之墊電極或UBM露出的方式作安裝，以覆蓋墊電極或UBM及燒結芯全體的方式塗佈焊膏，接著，卸除遮罩，將以覆蓋墊電極或UBM及燒結芯全體的方式而塗佈印刷之焊膏，以焊膏之迴銲溫度作迴銲處理，使得能以簡易之程序而製造有芯構造之焊料凸塊。
本發明，係基於前述發現而創作者，具有示於以下之態樣。
(1)一種有芯構造焊料凸塊，形成於半導體基板上，特徵在於：前述焊料凸塊，係由形成於焊料凸塊之內部且於垂直於半導體基板之方向延伸的燒結芯、及蓋敷於前述燒結芯之周圍的焊料金屬之有芯構造所成，前述燒結芯，係由以焊膏之迴銲處理溫度附近或其以下的溫度而燒結之燒結體所成。
(2)如前述(1)之有芯構造焊料凸塊，其中，前述燒結芯，係由第一群粉末與第二群粉末之粉末燒結體、合金燒結體或此等之混合燒結體所成，前述第一群粉末，係含有第一A群粉末及第一B群粉末之至少任一者，前述第一A群粉末，係由從Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe、Co之中所選之一種或二種以上的金屬粉末所成，此外，前述第一B群粉末，係由從液相溫度為450℃以上的焊合金粉末及液相溫度為280℃以上的高溫焊料合金粉末 之中所選之一種或二種以上的合金粉末所成。
(3)如前述(1)之有芯構造焊料凸塊，其中，前述燒結芯，係由第一群粉末與第二群粉末之粉末燒結體、合金燒結體或此等之混合燒結體所成，前述第二群粉末，係含有第二A群粉末及第二B群粉末之至少任一者，前述第二A群粉末，係由從Sn、In、Bi、Ga之中所選之一種或二種以上的金屬粉末所成，此外，前述第二B群粉末，係由液相溫度為240℃以下的焊料合金之合金粉末所成。
(4)一種有芯構造焊料凸塊之製造方法，其係形成於半導體基板上之有芯構造焊料凸塊的製造方法，特徵在於：於形成於半導體基板上之墊電極或凸塊下金屬之表面印刷塗佈芯用膏體，以焊膏之迴銲處理溫度附近或其以下的溫度就芯用膏體作燒結，而於墊電極或凸塊下金屬之表面之大致中央部分形成燒結芯，接著，以覆蓋形成於墊電極或凸塊下金屬之大致中央部的燒結芯全體之方式印刷塗佈焊膏，以焊膏之迴銲處理溫度作迴銲處理，從而於墊電極表面上或凸塊下金屬之表面上形成有芯構造焊料凸塊。
依作為本發明的一態樣之有芯構造焊料凸塊(以下，稱作本發明的有芯構造凸塊)，即不易發生凸塊之自重所致的扁平化，可形成高縱橫比之焊料凸塊，同時形成於焊料凸塊內部之燒結芯與焊料金屬於密著性方面優 異，其結果，焊料凸塊係相對於墊電極、半導體基板而強固密接，此外，亦無使導電性降低之情形，使得為了實現半導體之高密度安裝的微矩化成為可能。
此外，依作為本發明之其他態樣的有芯構造焊料凸塊之製造方法(以下，稱作本發明的有芯構造凸塊之製造法)，利用藉印刷法而塗佈芯用膏體32後，藉燒結而形成燒結芯，接著，同樣藉印刷法塗佈焊膏34而作迴銲處理之簡易的製造法，從而獲得有芯構造焊料凸塊，故可謀求焊料凸塊之製程的簡易化、低成本化。
1、11‧‧‧半導體基板
2‧‧‧墊電極
3、17‧‧‧燒結芯
4‧‧‧焊料金屬
5‧‧‧高縱橫比凸塊
12‧‧‧介電體層
13‧‧‧導體墊
14‧‧‧阻擋金屬層
15‧‧‧柱體金屬
16‧‧‧凸塊下金屬層
31、36‧‧‧刷塗器
32‧‧‧芯用膏體
33、35‧‧‧金屬遮罩
34‧‧‧焊膏
D‧‧‧凸塊徑
H‧‧‧凸塊高度
S1‧‧‧印刷充填
S2‧‧‧燒結
S3‧‧‧印刷充填
S4‧‧‧迴銲
[圖1]先前技術(專利文獻2記載者)下的焊料凸塊之示意說明圖。
[圖2]本發明的有芯構造焊料凸塊之製程的示意說明圖。
[圖3]就藉本發明的製造法而得之有芯構造焊料凸塊的剖面示意圖作繪示。
[圖4]就利用由Cu粉及Sn粉的混合粉所成之芯用膏體E，而以燒結溫度240℃所形成的燒結芯之SEM影像作繪示。
以下，參照圖式而詳細說明本發明。
於圖2，就本發明的有芯構造焊料凸塊之製程的示意說明圖作繪示，於圖3，就藉本發明的製造法而得之有芯構造焊料凸塊的剖面示意圖作繪示。
如圖2所示，本發明的有芯構造焊料凸塊，係可藉(a)~(d)之程序(稱作第一程序)及(e)~(h)的程序(稱作第二程序)而製作。第一程序，係如下。
首先，於形成了墊電極2之半導體基板1的表面(於半導體封裝用晶圓上設有UBM之情況亦當然包含，惟以下，關於UBM之說明係省略。)，安裝具有墊電極2的大致中央部之表面會露出的程度之開口的金屬遮罩33(參照圖2(a))，從金屬遮罩33之開口於墊電極2的大致中央部之表面利用刷塗器31而印刷芯用膏體32(參照圖2(b))。藉此，於上述之開口印刷充填了芯用膏體(S1)。
接著，將金屬遮罩33卸除(參照圖2(c))，以依芯用膏體32之種類的溫度(焊膏34之迴銲溫度附近或其以下的溫度)燒結(S2)，於墊電極2的大致中央部，形成在垂直於半導體基板1之方向延伸，且比最終所形成的焊料凸塊之高度H還低的高度之燒結芯3。
於圖4，作為燒結芯3之一例，就利用芯用膏體E(參照表2)，而以燒結溫度240℃而形成的9個燒結芯3之SEM影像作繪示。
另外，在圖2，係省略了形成於墊電極2表面之UBM 的圖示，惟於墊電極2上設有UBM之情況，亦含於本發明的範圍。
在前述第一程序所形成之燒結芯3，係得以第一群粉末與第二群粉末之燒結體的形式而構成。
此外，前述燒結芯3，係以含有構成前述第一群粉末與前述第二群粉末之構成成分元素的合金燒結體之形式而構成，或者，以前述粉末燒結體與合金燒結體之混合燒結體的形式而構成亦可。
於此，第一群粉末，係含有第一A群粉末及第一B群粉末之至少任一者的粉末，然後，在第一A群粉末方面，係可使用從Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe、Co之中所選之一種或二種以上的金屬粉末，此外，在第一B群粉末方面，係可使用從液相溫度為450℃以上的焊合金粉末及液相溫度為280℃以上的高溫焊料合金粉末之中所選之一種或二種以上的合金粉末。
此外，第二群粉末，係含有第二A群粉末及第二B群粉末之至少任一者的粉末，然後，在第二A群粉末方面，係可使用從Sn、In、Bi、Ga之中所選之一種或二種以上的金屬粉末，此外，在第二B群粉末方面，係可使用液相溫度為240℃以下的焊料合金之合金粉末。
用於形成燒結芯3之燒結溫度，係必須為將在第二程序印刷塗佈於燒結芯3之周圍的焊膏34迴銲之溫度附近或其以下的溫度。此係原因為於焊膏迴銲處理時，仍需要燒結芯3不會軟化、熔化，維持作為燒結芯3之原本的形 狀，使焊料金屬4附著於燒結芯3之周圍。藉此，形成高縱橫比之焊料凸塊5，此外，燒結芯3具有與焊料金屬4寬廣的接觸面積，使得可防止焊料凸塊因自重而扁平化。 再者，發揮不僅焊料金屬4與燒結芯3之密著性提高，甚至提高凸塊與墊電極2、半導體基板1之密著性的作用。
於此，構成燒結芯3的第一群粉末之含有量不足10質量%時，於迴銲時熔化之第二群粉末會過多，使得芯會崩掉，無法成為芯柱狀之燒結芯3。此外，於第2次之迴銲時，於構成芯柱狀之燒結芯3的第一群粉末與第二群粉末，會發生因第二群粉末而起的再熔。
另一方面，第一群粉末之含有量超過90質量%時，於迴銲時熔化之第二群粉末過少使得燒結不會進展，形狀會於為第二程序之焊料金屬膏體印刷時崩掉，故在本發明，係使混合粉末中的第一群粉末之含有量為10~90質量%為理想，採取30~80質量%更理想。
此外，依焊料金屬4之種類與構成燒結芯3的材質之組合，形成在焊料金屬4與燒結芯3之界面發生擴散反應，焊料金屬4與燒結芯3之密著性會提升，更上一層，於密著性方面優異的高縱橫比之焊料凸塊。
在本發明的有芯構造凸塊之燒結芯3方面，係就燒結芯3之形成容易度的觀點，亦即，就得以焊膏34之迴銲處理溫度附近或其以下的比較的低溫度作燒結之燒結性的觀點，再者，就於與焊料金屬4之潤濕性、密著性方面優異之觀點作考量時，在構成燒結芯3之第一A群的金屬粉 末方面，係使用從Cu、Ag、Au之中所選之一種或二種以上的金屬粉末為理想，此外，在第二A群的金屬粉末方面，係使用從Sn、In、Bi之中所選之一種或二種以上的金屬粉末為理想。
為了形成前述燒結芯3而使用的芯用膏體32，係例如，可依以下的順序而調製。
在芯用膏體用原料粉末方面，準備含有第一A群粉末及第一B群粉末之至少任一者的第一群粉末、含有第二A群粉末及第二B群粉末之至少任一者的第二群粉末。
就此等之粉末，以成為於使芯用膏體用粉末之總重量為100質量%的情況下，第一群粉末為10~90質量%，此外，其餘部分係第二群粉末的方式調配而製作混合粉末。
就此混合粉末，在V型混合機等之平常所用的粉末混合機中作混合。
接著，以成為於使芯用膏體32之總重量為100質量%時，較佳係使銲劑為5~40質量%，其餘係前述混合粉末的方式作調配，就此芯用膏體32，在機械混練機等之平常所用的混練機中作混合，從而製作為了形成本發明的有芯構造凸塊之燒結芯3而使用的芯用膏體32。
在芯用膏體32之銲劑方面，係可採用平常所用的一般之銲劑，雖非特別限制者，惟就膏體之潤濕性的觀點等，使用RA或RMA銲劑為佳。此外，於此銲劑中，係含有平常所用的松脂、活化劑、溶劑及觸變劑等亦無妨。
此外，芯用膏體32之銲劑含有量不足5質量%時，不會成為膏狀。另一方面，銲劑含有量超過40質量%時，芯用膏體32之黏度過低，因而產生印刷時的流掛，或於迴銲時芯崩掉而無法確保作為芯柱狀之燒結芯3的充分之高度。依以上的理由，使芯用膏體32中之銲劑含有量為5~40質量%為理想，使銲劑含有量為6~15質量%更理想。
在前述第一程序，藉就芯用膏體32作燒結從而形成燒結芯3，惟用於形成燒結芯3之燒結溫度，係需要為在第二程序所用的焊膏34之迴銲處理溫度(此係依存於焊料金屬4之種類)附近或其以下的溫度。
因此，不得不依使用的焊料金屬4之種類，而決定含有於芯用膏體32的混合粉末之種類、配比。
例如，在焊料金屬4方面，採用Pb-Sn系合金(迴銲處理溫度，係約210℃)情況下，係變成需要採用以此迴銲溫度作燒結之芯用膏體，使燒結芯3形成後，印刷Pb-Sn系合金膏體，以此迴銲溫度形成凸塊。此外，採用Sn、SnAg系合金、SnCu合金、SnAgCu系合金(迴銲處理溫度，係約240℃)情況下，係變成需要採用以此迴銲溫度作燒結之芯用膏體，使燒結芯3形成後，印刷Sn、SnAg系合金、SnCu合金、SnAgCu系合金膏體，以此迴銲溫度作凸塊形成。
如上述，在本發明所用之芯用膏體32，係為了燒結會以此等之迴銲處理溫度進展而需要決定第一群粉末與第 二群粉末之種類、配比。一般而言，燒結係第二群粉末熔化，使得與第一群粉末反應從而進展。
另外，於就燒結芯3(或芯用膏體32之混合粉末)與焊料金屬4，採用相同的成分系之材料而形成焊料凸塊的情況下，係燒結芯3之界面的與焊料金屬4之順應性高，故可形成更進一步密接性高之焊料凸塊。
在前述第一程序(圖2(a)~(d))，於墊電極2的大致中央部，形成在垂直於半導體基板1之方向延伸，且比最終所形成的焊料凸塊之高度H還低的高度之燒結芯3後，在第二程序，印刷塗佈焊膏34，製作有芯構造之焊料凸塊。
亦即，安裝具有比燒結芯3被形成於大致中央部的墊電極2之徑還大的開口，並具有燒結芯3之高度以上的厚度之金屬遮罩35(參照圖2(e))，以從金屬遮罩35的開口將墊電極2的露出部分及燒結芯3整體作覆蓋之方式使用刷塗器36而印刷塗佈焊膏34(參照圖2(f))。藉此，於上述之開口印刷充填了焊膏34(S3)。
接著，將金屬遮罩36卸除(參照圖2(g))，以依焊膏34之種類的迴銲處理溫度作迴銲處理(S4)，於墊電極2的表面，並且作成將燒結芯3封入其內部的方式而形成焊料凸塊(參照圖2(h))。
藉前述第一程序(圖2(a)~(d))及第二程序(圖2(e)~(h))，形成本發明的有芯構造焊料凸塊。
於圖3，就本發明的有芯構造焊料凸塊之縱剖面放大示意圖作繪示。
如圖3所示，本發明的有芯構造焊料凸塊，係於凸塊內部內包燒結芯3，於此燒結芯3之周圍蓋敷了焊料金屬4，從而構成譬如為卵狀，並且有芯構造之焊料凸塊。
在歷來的焊料凸塊，係未於凸塊內部形成燒結芯3，故因焊料凸塊本身之自重，使得凸塊會扁平化，無法增加凸塊高度，惟依本發明，於構成有芯構造之焊料凸塊內部的燒結芯3密接了焊料金屬4，即使得不會招致導電性之降低，不僅焊料凸塊與燒結芯3，甚至焊料凸塊與墊電極2、半導體基板1之密著力會提升。
再者，燒結芯3在垂直於半導體基板1之方向延伸，於此周圍附著了焊料金屬4而構成焊料凸塊，故可增加焊料凸塊之高度H。
其結果，相較於先前技術的使焊料凸塊之高度為h、此外焊料凸塊徑為d的情況下之歷來的焊料凸塊之縱橫比h/d，本發明的有芯構造之焊料凸塊的高度H與焊料凸塊之徑D的比H/D之值(亦即，本發明的焊料凸塊之縱橫比)係成為大的值(亦即，H/D>h/d)，形成高縱橫比之焊料凸塊，故可實現焊料凸塊之微矩化。
另外，在圖3，亦省略了形成於墊電極2表面之UBM的圖示，惟於墊電極2上設有UBM之情況，亦當然含於本發明的範圍。
以下，就本發明相關之有芯構造焊料凸塊及 其製造方法，使用實施例而說明。
[實施例1]
於表1，作為在本實施例1為了形成焊料凸塊而使用的焊料金屬，示出5種類的合金粉末之成分組成。
另外，此焊料金屬用合金粉末之粒徑，係2~12μm，平均粒徑係7μm。
此外，於表2，示出在本實施例1於為了形成燒結芯而使用的芯用膏體A~M所含有之粉末的種類、組合、配比、再者銲劑之種類與其含有比例。
另外，關於在芯用膏體所含有的粉末，其粒徑係1~5μm，平均粒徑係2.5μm。
首先，在第一程序方面，如圖2(a)~(d)所示，於形成有墊電極(直徑：85μm)2之半導體基板1的表面，載置設有比墊電極徑小徑的開口(開口直徑：43μm、開口間距：150μm)之厚度20μm的金屬遮罩33，將示於表2之芯用膏體32(芯用膏體之分類記號：A~M)藉刷塗器31而印刷塗佈於墊電極表面(印刷充填(S1))，將金屬遮罩33卸除後，將所印刷塗佈之芯用膏體32，以氮環境之帶式爐，以示於表3之溫度作燒結(S2)，而於墊電極2的中央部形成具有相當於大致金屬遮罩33之厚度的高度之燒結芯3。
接著，在第二程序方面，如圖2(e)~(h)所示，載置具有比燒結芯3被形成於大致中央部的墊電極 2之徑還大的開口，並具有燒結芯之高度以上的厚度之金屬遮罩35(開口直徑：110μm、開口間距：150μm、厚度：30μm)、以從金屬遮罩35的開口覆蓋墊電極2的露出部分及燒結芯全體之方式使用刷塗器36，而印刷塗佈含有示於表1之焊料金屬用粉末的焊膏34(印刷充填(S3))，將金屬遮罩35卸除後，以氮環境之帶式爐，依焊膏34之種類而以示於表3的溫度作迴銲處理(S4)。
藉前述之第一程序及第二程序，於墊電極2的表面，製作將燒結芯封入其內部之示於表3的有芯構造焊料凸塊1~17(以下，稱作「本發明凸塊1~17」)。
於圖4，係作為燒結芯之一例，就利用由Cu粉及Sn粉的混合物所成之芯用膏體E，而以燒結溫度240℃所形成的9個燒結芯之SEM影像作繪示。於示於表3的本發明凸塊5之內部，係封入此燒結芯而構成有芯構造之凸塊。(對應於將圖4中之影像下的文字刪除之情形的修正)
為了就在上述所製作之本發明凸塊1~17，評估凸塊高度，進行凸塊之高度測定。
測定，係使用NEXIV VMR-3030(Nikon公司製)，藉光學式影像解析，就從凸塊之頂點部至基板的高度作測定從而進行，將就200凸塊之測定值平均，而作為凸塊高度。另外，在本實施例，係墊電極的直徑及金屬遮罩之開口直徑為固定，故凸塊高度越高則縱橫比變越高。
於表3，示出就本發明凸塊1~17所求之凸塊高度。
[比較例]
為了比較，於形成有墊電極(直徑：85μm)之半導體基板的表面，載置與在實施例1的第二程序所使用相同的尺寸之金屬遮罩(開口直徑：110μm、開口間距：150μm、厚度：30μm)、從金屬遮罩之開口使用刷塗器，而印刷塗佈示於表1之焊膏，將金屬遮罩卸除後，以氮環境之帶式爐，依焊膏之種類而以示於表4之溫度作迴銲處理，於墊電極的表面，製作示於表4之比較例的焊料凸塊1~5(以下，稱作「比較例凸塊1~5」)。
亦即，比較例凸塊1~5，係在未進行使用了芯用膏體的燒結芯之形成方面，與本發明凸塊1~17，係焊料凸塊之構造及製造法差異甚鉅。
就比較例凸塊1~5，作成如本發明凸塊1~17，而求出凸塊高度。另外，在本比較例，係墊電極的直徑及金屬遮罩之開口直徑為固定，故凸塊高度越高則縱橫比變越高。
於表4，示出就比較例凸塊1~5所求之凸塊高度。
[實施例2]
在實施例2方面，使用使第一群粉末或第二群粉末中的至少一方為合金粉末之示於表5的本發明芯用膏體N~R，而作成如同實施例1，而製作示於表6之有芯構造焊料凸塊18~22(以下，稱作「本發明凸塊18~22」)。
另外，此焊料金屬用合金粉末之粒徑係2~12μm，平均粒徑係7μm，關於含有於芯用膏體之金屬粉末、合金粉 末，其粒徑係1~5μm，平均粒徑係2.5μm。
於表6，示出就本發明凸塊18~22所求之凸塊高度。
根據示於表3、表4、表6之結果，知悉相對於比較例凸塊1~5，係發生自重所致的扁平化，其結果，不僅凸塊高度低至30μm前後，容易引起與其他凸塊之接觸所致的短路，依本發明的有芯構造焊料凸塊1~22，係具有凸塊高度高為40μm以上之高縱橫比，此外，於凸塊內部形成有燒結芯，使得燒結芯與焊料金屬之密著 性、焊料凸塊與墊電極之密著性優異，此外，亦無使導電性降低之虞，故為了實現半導體之高密度安裝的微矩化為可能。
[產業上之可利用性]
藉依本發明而帶來的有芯構造焊料凸塊及其製造方法，使得能以更低成本有效實現半導體之高密度安裝化。

Claims (3)

  1. 一種有芯構造焊料凸塊，形成於半導體基板上，特徵在於：前述焊料凸塊係由形成於焊料凸塊之內部且於垂直於半導體基板之方向延伸的燒結芯、及蓋敷於前述燒結芯之周圍的焊料金屬之有芯構造所成，前述燒結芯，係由第一群粉末與第二群粉末之粉末燒結體、合金燒結體或此等之混合燒結體所成，前述第一群粉末，係含有第一A群粉末及第一B群粉末之至少任一者，前述第一A群粉末，係由從Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe、Co之中所選之一種或二種以上的金屬粉末所成，此外，前述第一B群粉末，係由從液相溫度為450℃以上的焊合金粉末及液相溫度為280℃以上的高溫焊料合金粉末之中所選之一種或二種以上的合金粉末所成。
  2. 一種有芯構造焊料凸塊，形成於半導體基板上，特徵在於：前述焊料凸塊係由形成於焊料凸塊之內部且於垂直於半導體基板之方向延伸的燒結芯、及蓋敷於前述燒結芯之周圍的焊料金屬之有芯構造所成，前述燒結芯，係由第一群粉末與第二群粉末之粉末燒結體、合金燒結體或此等之混合燒結體所成，前述第二群粉末，係含有第二A群粉末及第二B群粉末之至少任一者，前述第二A群粉末，係由從Sn、In、Bi、Ga之中所選之一種或二種以上的金屬粉末所成，此外，前述第二B群粉末，係由液相溫度為240℃以下的焊料合金之合金粉末所成。
  3. 一種有芯構造焊料凸塊之製造方法，其係形成於半導體基板上之有芯構造焊料凸塊的製造方法，特徵在於：於形成於半導體基板上之墊電極或凸塊下金屬之表面印刷塗佈芯用膏體，以焊膏之迴銲處理溫度附近或其以下的溫度就芯用膏體作燒結，而於墊電極或凸塊下金屬之表面之大致中央部分形成燒結芯，接著，以覆蓋形成於墊電極或凸塊下金屬之大致中央部的燒結芯全體之方式印刷塗佈焊膏，以焊膏之迴銲處理溫度作迴銲處理，從而於墊電極表面上或凸塊下金屬之表面上形成有芯構造焊料凸塊。
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