KR102122631B1 - 유심 구조 땜납 범프 및 그 제조 방법 - Google Patents

유심 구조 땜납 범프 및 그 제조 방법 Download PDF

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KR102122631B1
KR102122631B1 KR1020167004857A KR20167004857A KR102122631B1 KR 102122631 B1 KR102122631 B1 KR 102122631B1 KR 1020167004857 A KR1020167004857 A KR 1020167004857A KR 20167004857 A KR20167004857 A KR 20167004857A KR 102122631 B1 KR102122631 B1 KR 102122631B1
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South Korea
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solder
powder
core
group
bump
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KR1020167004857A
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English (en)
Korean (ko)
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KR20160102150A (ko
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쇼 나카가와
마사유키 이시카와
츠카사 야소시마
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미쓰비시 마테리알 가부시키가이샤
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Publication of KR20160102150A publication Critical patent/KR20160102150A/ko
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L2224/13169—Platinum [Pt] as principal constituent

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020167004857A 2013-12-27 2014-12-04 유심 구조 땜납 범프 및 그 제조 방법 KR102122631B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-270852 2013-12-27
JP2013270852A JP6226233B2 (ja) 2013-12-27 2013-12-27 有芯構造はんだバンプ及びその製造方法
PCT/JP2014/082181 WO2015098460A1 (ja) 2013-12-27 2014-12-04 有芯構造はんだバンプ及びその製造方法

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KR20160102150A KR20160102150A (ko) 2016-08-29
KR102122631B1 true KR102122631B1 (ko) 2020-06-12

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JP (1) JP6226233B2 (zh)
KR (1) KR102122631B1 (zh)
CN (1) CN105593980B (zh)
TW (1) TWI648835B (zh)
WO (1) WO2015098460A1 (zh)

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