JP6226233B2 - 有芯構造はんだバンプ及びその製造方法 - Google Patents

有芯構造はんだバンプ及びその製造方法 Download PDF

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Publication number
JP6226233B2
JP6226233B2 JP2013270852A JP2013270852A JP6226233B2 JP 6226233 B2 JP6226233 B2 JP 6226233B2 JP 2013270852 A JP2013270852 A JP 2013270852A JP 2013270852 A JP2013270852 A JP 2013270852A JP 6226233 B2 JP6226233 B2 JP 6226233B2
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powder
solder
group
core
bump
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Japanese (ja)
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JP2015126158A (ja
Inventor
将 中川
将 中川
石川　雅之
石川　　雅之
司 八十嶋
司 八十嶋
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2013270852A priority Critical patent/JP6226233B2/ja
Priority to KR1020167004857A priority patent/KR102122631B1/ko
Priority to CN201480053701.XA priority patent/CN105593980B/zh
Priority to PCT/JP2014/082181 priority patent/WO2015098460A1/ja
Priority to TW103144325A priority patent/TWI648835B/zh
Publication of JP2015126158A publication Critical patent/JP2015126158A/ja
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Publication of JP6226233B2 publication Critical patent/JP6226233B2/ja
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    • H01L2224/13169—Platinum [Pt] as principal constituent

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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2013270852A 2013-12-27 2013-12-27 有芯構造はんだバンプ及びその製造方法 Active JP6226233B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013270852A JP6226233B2 (ja) 2013-12-27 2013-12-27 有芯構造はんだバンプ及びその製造方法
KR1020167004857A KR102122631B1 (ko) 2013-12-27 2014-12-04 유심 구조 땜납 범프 및 그 제조 방법
CN201480053701.XA CN105593980B (zh) 2013-12-27 2014-12-04 有芯结构焊料凸点及其制造方法
PCT/JP2014/082181 WO2015098460A1 (ja) 2013-12-27 2014-12-04 有芯構造はんだバンプ及びその製造方法
TW103144325A TWI648835B (zh) 2013-12-27 2014-12-18 有芯構造焊料凸塊及其製造方法

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