CN105593980B - 有芯结构焊料凸点及其制造方法 - Google Patents
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Abstract
本发明提供一种有芯结构焊料凸点及其制造方法。在制造焊料凸点时,预先在凸点的中心部分印刷涂布芯用浆料,并以焊料金属的回流处理温度附近或其以下的温度对芯用浆料进行烧结,由此形成烧结芯,接着以印刷法在该烧结芯周围涂布焊料金属,并对该焊料金属进行回流处理,从而得到在焊料凸点的内部形成有沿垂直方向延伸的烧结芯的有芯结构焊料凸点。
Description
技术领域
本发明涉及一种有芯结构焊料凸点及其制造方法,尤其涉及一种实现了半导体装置用焊料凸点的细距化的有芯结构焊料凸点、及用于在半导体装置的焊盘电极上形成有芯结构焊料凸点的制造方法。
本申请主张基于2013年12月27日于日本申请的专利申请2013-270852号的优先权,并将其内容援用于此。
背景技术
近年来,为了半导体的高密度安装,通常使用焊料凸点来进行接合,但为了实现更进一步的高密度化,要求焊料凸点形成的细距化。
并且,为了响应该要求,关于用于实现细距化的焊料凸点或者其制造法,一直以来提出有几个方案。
例如,专利文献1中提出有通过在半导体基板表面的导体焊盘上依次形成支柱金属(pillar metal)、覆盖支柱金属上表面的凸点下金属层及与导体焊盘的直径几乎相等的焊料金属层,并进行焊料金属的回流处理来形成焊料凸点。并且,在专利文献2中提出有与专利文献1的记载同样地通过依次形成与导体焊盘13的直径几乎相等的焊料金属层(阻挡金属层14)后,减小支柱金属层15的直径,接着,进行焊料金属17的回流处理,并形成如图1所示的焊料凸点,从而实现细距化。
并且,例如在专利文献3中还提出有使半导体芯片上的焊盘电极朝下并与熔融焊料的喷流面接触来在该焊盘电极上形成一次焊料凸点,使形成有该一次焊料凸点的焊盘电极朝上,并在其上通过丝网印刷方法来载置焊膏,使该焊膏朝下,在该朝下且被施加重力的状态下对所述焊膏进行回流来形成二次焊料凸点,由此,制造能够实现焊盘电极的细距化的焊料凸点。
专利文献1:日本特开2013-187258号公报(A)
专利文献2:日本特开2006-332694号公报(A)
专利文献3:日本专利第3961876号公报(B)
如上述现有技术所示,在半导体的高密度安装中要求焊料凸点的细距化,但在确保焊料凸点的粘附性、导电性的基础之上的细距化技术尚未确立。
例如,在专利文献1、2所记载的技术中,在晶片或有机基板的电极上利用电镀法形成小径的支柱,在其之上利用电镀法形成焊料金属,并实施回流处理来形成焊料凸点,且将凸点的高度形成至一定程度。然而,因通过电镀法来形成支柱并形成焊料金属,因此工艺的生产能力较差,并且由于熔融时的焊料金属的自重及表面张力,凸点变得扁平且凸点高度受到限制,因此与焊料凸点直径相比,无法获得太高的纵横比,即使增加焊料金属的载置量,也存在有可能与相邻的其他焊料凸点接触而引起短路的问题。
并且,在专利文献3所记载的技术中,对于一次焊料凸点表面的焊膏,通过使其朝下进行回流,从而形成纵横比较高的凸点,但在装配时等再熔融时,纵横比很自然地受到焊料金属的自重及表面张力的限制,通过与相邻的熔融焊料金属凸点接触,有可能成为电导通不良的原因。
因此,为了实现半导体的高密度安装,期待一种能够实现细距化的高纵横比的焊料凸点及其简单的制造法。
发明内容
为了使焊料凸点的细距化成为可能,本发明人等对焊料凸点的结构及其制造方法进行深入研究的结果,得到以下见解。
即,本发明人等发现在制作焊料凸点时,例如在半导体基板的规定位置(例如,在半导体封装用有机基板上形成的焊盘电极表面或者半导体封装用晶片上形成的UBM(凸点下金属))预先涂布由规定的材料构成的芯用浆料并进行回流处理,从而形成具有规定高度的烧结芯,接着,通过印刷法在该烧结芯的周围涂布焊膏之后,对该焊膏进行回流处理,从而能够形成有芯结构的焊料凸点。
并且发现,该有芯结构的焊料凸点难以产生因凸点的自重而产生的扁平化,因此成为凸点高度较高的高纵横比的焊料凸点,并且,通过适当地选择烧结芯的材质来提高与焊料金属的粘附性,随此,凸点与半导体基板之间的粘附性也得到提高,进而,该高纵横比的有芯结构焊料凸点具备与以往的凸点相比毫不逊色的导电性。
而且,本发明人等发现,所述有芯结构的焊料凸点能够通过普通的丝网印刷法来简单地进行制作。
即发现,首先,作为第1工序,在半导体基板的规定位置(例如,形成于半导体封装用有机基板上的焊盘电极表面或者形成于半导体封装用晶片上的UBM(凸点下金属))上安装掩模,该掩模具有露出少许焊盘电极或者UBM的程度的开口,并在焊盘电极或者UBM的中央部印刷成为烧结芯的芯用浆料,接着,卸下掩模,以与焊膏的回流温度接近或其以下的温度来对涂布于焊盘电极或者UBM的芯用浆料进行烧结,从而在焊盘电极或者UBM的大致中央部制作具有规定高度的烧结芯,接着,作为第2工序,以露出在大致中央部形成有烧结芯的焊盘电极或者UBM的方式,安装具有比焊盘电极或者UBM的直径更大直径的开口的掩模,并以覆盖焊盘电极或者UBM及烧结芯整体的方式涂布焊膏,接着,卸下掩模,并以焊膏的回流温度对以覆盖焊盘电极或者UBM及烧结芯整体的方式涂布印刷的焊膏进行回流处理,从而能够以简单的工序制造有芯结构的焊料凸点。
本申请发明是基于上述见解而完成的,其具有以下所示的方式。
(1)一种形成于半导体基板上的有芯结构焊料凸点,其特征在于,所述焊料凸点由烧结芯和被覆于所述烧结芯的周围的焊料金属的有芯结构构成,所述烧结芯形成于焊料凸点的内部且沿与半导体基板垂直的方向延伸,所述烧结芯由以焊膏的回流处理温度附近或其以下的温度烧结而成的烧结体构成。
(2)根据所述(1)所记载的有芯结构焊料凸点,其特征在于,所述烧结芯由第一群粉末和第二群粉末的粉末烧结体、合金烧结体或它们的混合烧结体构成,所述第一群粉末含有第一A群粉末及第一B群粉末中的至少任一个,所述第一A群粉末由选自Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe和Co中的一种或两种以上的金属粉末构成,并且,所述第一B群粉末由选自液相线温度为450℃以上的钎焊合金粉末及液相线温度为280℃以上的高温焊料合金粉末的一种或两种以上的合金粉末构成。
(3)根据所述(1)所记载的有芯结构焊料凸点,其特征在于,所述烧结芯由第一群粉末和第二群粉末的粉末烧结体、合金烧结体或它们的混合烧结体构成,所述第二群粉末含有第二A群粉末及第二B群粉末中的至少任一个,所述第二A群粉末由选自Sn、In、Bi和Ga中的一种或两种以上的金属粉末构成,并且,所述第二B群粉末由液相线温度为240℃以下的焊料合金的合金粉末构成。
(4)一种形成于半导体基板上的有芯结构焊料凸点的制造方法,其特征在于,对形成于半导体基板上的焊盘电极或者凸点下金属的表面印刷涂布芯用浆料,并以焊膏的回流处理温度附近或其以下的温度对芯用浆料进行烧结,从而在焊盘电极或者凸点下金属的表面的大致中央部形成烧结芯,接着,以覆盖在焊盘电极或者凸点下金属的大致中央部形成的烧结芯整体的方式印刷涂布焊膏,并以焊膏的回流处理温度进行回流处理,从而在焊盘电极表面上或者凸点下金属的表面上形成有芯结构焊料凸点。
根据本申请发明的一方式的有芯结构焊料凸点(以下,称作本申请发明的有芯结构凸点),不易产生由凸点的自重引起的扁平化,且能够形成高纵横比的焊料凸点,并且形成于焊料凸点内部的烧结芯与焊料金属之间的粘附性优异,其结果,焊料凸点牢固地粘附于焊盘电极、半导体基板,并且不会降低导电性,因此,用于实现半导体的高密度安装的细距化成为可能。
并且,根据本申请发明的另一方式的有芯结构焊料凸点的制造方法(以下,称作本申请发明的有芯结构凸点的制造法),以印刷法来涂布芯用浆料32之后以烧结来形成烧结芯,接着,同样地以印刷法来涂布焊膏34并进行回流处理的简单的制造法,从而能够得到有芯结构焊料凸点,因此能够实现焊料凸点的制造工序的简单化和低成本化。
附图说明
图1是现有技术(专利文献2记载的技术)中的焊料凸点的示意图。
图2中示出本申请发明的有芯结构焊料凸点的制造工序的示意图。
图3中示出通过本申请发明的制造法得到的有芯结构焊料凸点的剖面示意图。
图4表示使用由Cu粉及Sn粉的混合粉构成的芯用浆料E并以240℃的烧结温度形成的烧结芯的SEM图像。
具体实施方式
以下,参考附图对本申请发明进行详细说明。
图2中示出本申请发明的有芯结构焊料凸点的制造工序的示意图,图3中示出通过本申请发明的制造法得到的有芯结构焊料凸点的剖面示意图。
如图2所示,本申请发明的有芯结构焊料凸点能够通过(a)~(d)工序(称作第1工序)及(e)~(h)工序(称作第2工序)制作。第1工序如下。
首先,在形成有焊盘电极2的半导体基板1的表面(当然也包括在半导体封装用晶片上设置有UBM的情况,但在以下省略对于UBM的说明。)上安装金属掩模33(参考图2的(a)),所述金属掩模33具有露出焊盘电极2的大致中央部的表面程度的开口,利用橡胶滚轴31在从金属掩模33的开口至焊盘电极2的大致中央部的表面上印刷芯用浆料32(参考图2的(b))。由此,芯用浆料印刷填充于上述的开口(S1)。
接着,卸下金属掩模33(参考图2的(c)),以与芯用浆料32的种类相应的温度(与焊膏34的回流温度接近或其以下的温度)进行烧结(S2),从而在焊盘电极2的大致中央部形成沿与半导体基板1垂直的方向延伸,且高度比最终形成的焊料凸点的高度H更低的烧结芯3。
图4中作为烧结芯3的一例而示出使用芯用浆料E(参考表2)并以240℃的烧结温度形成的9个烧结芯3的SEM图像。
另外,图2中省略了形成于焊盘电极2表面的UBM的图示,但UBM设置于焊盘电极2之上的情况也包含于本申请发明的范围。
在所述第1工序中形成的烧结芯3能够作为第一群粉末和第二群粉末的烧结体而构成。
并且,所述烧结芯3能够作为含有构成所述第一群粉末和所述第二群粉末的构成成分元素的合金烧结体而构成,或者也可以作为所述粉末烧结体和合金烧结体的混合烧结体而构成。
这里,第一群粉末是含有第一A群粉末及第一B群粉末中的至少任一个的粉末,并且,作为第一A群粉末,能够使用选自Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe和Co中的一种或两种以上的金属粉末,并且,作为第一B群粉末,能够使用选自液相线温度为450℃以上的钎焊合金粉末及液相线温度为280℃以上的高温焊料合金粉末的一种或两种以上的合金粉末。
并且,第二群粉末是含有第二A群粉末及第二B群粉末中的至少任一个的的粉末,并且,作为第二A群粉末,能够使用选自Sn、In、Bi和Ga中的一种或两种以上的金属粉末,并且,作为第二B群粉末,能够使用液相线温度为240℃以下的焊料合金的合金粉末。
用于形成烧结芯3的烧结温度应为与对在第2工序中印刷涂布于烧结芯3的周围的焊膏34进行回流的温度接近或其以下的温度。这是由于,即使在进行焊膏回流处理时,也需要烧结芯3不软化、不熔融,并且维持着作为烧结芯3的形状来使焊料金属4附着于烧结芯3的周围。由此,形成高纵横比的焊料凸点5,并且烧结芯3与焊料金属4具有较大的接触面积,从而能够防止焊料凸点因自重而扁平化。而且,焊料金属4与烧结芯3的粘附性得到提高,进而发挥提高凸点与焊盘电极2、半导体基板1之间的粘附性的作用。
在此,若构成烧结芯3的第一群粉末的含量小于10质量%,则在回流时熔融的第二群粉末过多,导致芯崩坏,无法成为芯柱状的烧结芯3。并且,导致在第2次回流时,在构成芯柱状的烧结芯3的第一群粉末和第二群粉末中发生由第二群粉末引起的再熔融。
另一方面,若第一群粉末的含量超过90质量%,则在回流时熔融的第二群粉末过少而无法进行烧结,导致在作为第2工序的焊料金属浆料的印刷时形状崩坏,因此在本申请发明中,优选将混合粉末中的第一群粉末的含量设为10~90质量%,更优选设为30~80质量%。
并且,根据焊料金属4的种类和构成烧结芯3的材质的组合的不同而在焊料金属4和烧结芯3的界面产生扩散反应,焊料金属4和烧结芯3的粘附性提高,形成粘附性更加优异的高纵横比的焊料凸点。
作为本申请发明的有芯结构凸点的烧结芯3,若从烧结芯3的形成难易度的观点,即能够以焊膏34的回流处理温度附近或其以下的比较低的温度进行烧结的烧结性的观点考虑,进而从与焊料金属4的润湿性、粘附性优异的观点考虑,则作为构成烧结芯3的第一A群的金属粉末,优选使用选自Cu、Ag和Au中的一种或两种以上的金属粉末,并且,作为第二A群的金属粉末,优选使用选自Sn、In和Bi中的一种或两种以上的金属粉末。
为了形成所述烧结芯3而使用的芯用浆料32例如能够以如下顺序制备。
作为芯用浆料用原料粉末,准备含有第一A群粉末及第一B群粉末中的至少任一个的第一群粉末、及含有第二A群粉末及第二B群粉末中的至少任一个的第二群粉末。
对于这些粉末,以将芯用浆料用粉末的总重量设为100质量%时第一群粉末为10~90质量%,并且剩余部分为第二群粉末的方式进行配合来制作混合粉末。
将该混合粉末在V型混合机等通常使用的粉末混合机中进行混合。
接着,将芯用浆料32的总重量设为100质量%时,优选以助焊剂为5~40质量%,且剩余为所述混合粉末的方式进行配合,并且将该芯用浆料32在机械捏合机等通常使用的捏合机中进行混合,从而制作出为了形成本申请发明的有芯结构凸点的烧结芯3而使用的芯用浆料32。
作为芯用浆料32的助焊剂,能够使用通常所使用的一般的助焊剂,并没有特别的限制,但从浆料的润湿性的观点等来看,优选RA或RMA助焊剂。并且,在该助焊剂中,含有通常所使用的松香、活性剂、溶剂及触变剂等也无妨。
并且,若芯用浆料32中的助焊剂含量小于5质量%,则不会成为浆料状。另一方面,若助焊剂含量超过40质量%,则芯用浆料32的粘度过低,在印刷时会产生塌边(ダレ),在回流时导致芯崩坏而无法确保作为芯柱状的烧结芯3的充分的高度。从以上理由来看,优选将芯用浆料32中的助焊剂含量设为5~40质量%,更优选将助焊剂含量设为6~15质量%。
在所述第1工序中,通过对芯用浆料32进行烧结来形成烧结芯3,但用于形成烧结芯3的烧结温度需要为与在第2工序中使用的焊膏34的回流处理温度(这依赖于焊料金属4的种类)接近或者更低的温度。
因此,需要根据所使用的焊料金属4的种类来决定芯用浆料32中所含有的混合粉末的种类、配合比例。
例如,作为焊料金属4而使用Pb-Sn系合金(回流处理温度约为210℃)时,需要使用以该回流温度进行烧结的芯用浆料,在形成烧结芯3之后,印刷Pb-Sn系合金浆料,并以该回流温度形成凸点。并且,使用Sn、SnAg系合金、SnCu合金、SnAgCu系合金(回流处理温度约为240℃)时,需要使用以该回流温度进行烧结的芯用浆料,在形成烧结芯3之后,印刷Sn、SnAg系合金、SnCu合金、SnAgCu系合金浆料,并以该回流温度形成凸点。
如上所述,本申请发明中使用的芯用浆料32需要确定第一群粉末和第二群粉末的种类、配合比例,以便在它们的回流处理温度下进行烧结。通常,烧结是通过第二群粉末熔融而与第一群粉末发生反应来进行。
另外,对于烧结芯3(或者芯用浆料32的混合粉末)和焊料金属4,使用相同成分系的材料来形成焊料凸点时,与烧结芯3的界面上的焊料金属4的整合性较高,因此能够形成粘附性更高的焊料凸点。
在所述第1工序(图2的(a)~(d))中,在焊盘电极2的大致中央部形成沿与半导体基板1垂直的方向延伸,且高度低于最终形成的焊料凸点的高度H的烧结芯3之后,在第2工序中,印刷涂布焊膏34,从而制作有芯结构的焊料凸点。
即,安装金属掩模35,该金属掩模35具有比烧结芯3形成于大致中央部的焊盘电极2的直径更大的开口,且具有烧结芯3的高度以上的厚度(参考图2的(e)),并从金属掩模35的开口起,以覆盖焊盘电极2的露出部分及烧结芯3整体的方式利用橡胶滚轴36来印刷涂布焊膏34(参考图2的(f))。由此,焊膏34印刷填充于上述开口(S3)。
接着,卸下金属掩模35(参考图2的(g)),以与焊膏34的种类相应的回流处理温度进行回流处理(S4),并在焊盘电极2的表面上且以将烧结芯3封入于其内部的方式形成焊料凸点(参考图2的(h))。
通过所述第1工序(图2的(a)~(d))及第2工序(图2的(e)~(h)),形成本申请发明的有芯结构焊料凸点。
图3中示出本申请发明的有芯结构焊料凸点的纵剖面放大示意图。
如图3所示,本申请发明的有芯结构焊料凸点为烧结芯3包含于凸点内部,且焊料金属4被覆于该烧结芯3的周围的所谓卵型形状,并以此来构成有芯结构的焊料凸点。
以往的焊料凸点中,在凸点内部未形成有烧结芯3,因此由于焊料凸点本身的自重,凸点扁平化,无法提高凸点高度,但根据本申请发明,通过使焊料金属4粘附于构成有芯结构的焊料凸点内部的烧结芯3,由此不会导致导电性的下降,且焊料凸点与烧结芯3、乃至焊料凸点与焊盘电极2、半导体基板1之间的粘附力提高。
而且,烧结芯3沿与半导体基板1垂直的方向延伸,且在该周围附着有焊料金属4而构成焊料凸点,因此能够提高焊料凸点的高度H。
其结果,与将现有技术中的焊料凸点的高度设为h,并且将焊料凸点直径设为d时的以往的焊料凸点的纵横比h/d相比,本申请发明的有芯结构的焊料凸点的高度H和焊料凸点的直径D之比H/D的值(即,本申请发明的焊料凸点的纵横比)成为较大的值(即,H/D>h/d),形成高纵横比的焊料凸点,因此能够实现焊料凸点的细距化。
另外,图3中也省略了形成于焊盘电极2表面的UBM的图示,但UBM设置于焊盘电极2之上的情况当然也包含于本申请发明的范围。
以下,关于本申请发明所涉及的有芯结构焊料凸点及其制造方法,利用实施例进行说明。
[实施例1]
表1中,作为在本实施例1中为了形成焊料凸点而使用的焊料金属,示出5种合金粉末的成分组成。
另外,该焊料金属用合金粉末的粒径为2~12μm,平均粒径为7μm。
并且,表2中示出在本实施例1中为了形成烧结芯而使用的芯用浆料A~M中所含有的粉末的种类、组合、配合比例、以及助焊剂的种类及其含有比例。
另外,关于芯用浆料中所含有的粉末,其粒径为1~5μm,平均粒径为2.5μm。
首先,作为第1工序,如图2的(a)~(d)所示,在形成有焊盘电极(直径:85μm)2的半导体基板1的表面上载置设置有直径小于焊盘电极的直径的开口(开口直径:43μm,开口间距:150μm)且厚度为20μm的金属掩模33,通过橡胶滚轴31来将表2所示的芯用浆料32(芯用浆料的类别记号:A~M)印刷涂布于焊盘电极表面(印刷填充(S1)),卸下金属掩模33之后,将印刷涂布的芯用浆料32在氮气气氛的带式炉中以表3所示的温度进行烧结(S2),从而在焊盘电极2的中央部形成具有与金属掩模33的厚度大致相当的高度的烧结芯3。
接着,作为第2工序,如图2的(e)~(h)所示,载置金属掩模35,该金属掩模35具有比烧结芯3形成于大致中央部的焊盘电极2的直径更大的开口且具有烧结芯的高度以上的厚度(开口直径:110μm,开口间距:150μm,厚度:30μm),并从金属掩模35的开口起,以覆盖焊盘电极2的露出部分及烧结芯整体的方式利用橡胶滚轴36来印刷涂布含有表1所示的焊料金属用粉末的焊膏34(印刷填充(S3)),卸下金属掩模35之后,在氮气气氛的带式炉中根据焊膏34的种类,以表3所示的温度进行回流处理(S4)。
通过所述的第1工序及第2工序,在焊盘电极2的表面上制作将烧结芯封入于其内部的表3所示的有芯结构焊料凸点1~17(以下,称作“本发明凸点1~17”)。
图4中,作为烧结芯的一例,示出使用由Cu粉及Sn粉的混合物构成的芯用浆料E并以240℃的烧结温度形成的9个烧结芯的SEM图像。在表3所示的本发明凸点5的内部封入该烧结芯而构成有芯结构的凸点。(是与删除了图4中的图像下的文字后的图像相对应的修正)
对于上述制作出的本发明凸点1~17,为了评价凸点高度而进行了凸点的高度测定。
测定使用NEXIV VMR-3030(Nikon Corporation制),并通过光学图像分析来测定从凸点的顶点部至基板为止的高度,以此来进行,并且对于200个凸点的测定值进行平均,将其设为凸点高度。另外,本实施例中,焊盘电极的直径及金属掩模的开口直径恒定,因此凸点高度越高则纵横比越高。
表3中示出对于本发明凸点1~17求出的凸点高度。
[比较例]
为进行比较,在形成有焊盘电极(直径:85μm)的半导体基板的表面上载置与在实施例1的第2工序中使用的金属掩模相同尺寸的金属掩模(开口直径:110μm,开口间距:150μm,厚度:30μm),并从金属掩模的开口起,利用橡胶滚轴来印刷涂布表1所示的焊膏,卸下金属掩模之后,在氮气气氛的带式炉中根据焊膏的种类,以表4所示的温度进行回流处理,从而在焊盘电极的表面上制作表4所示的比较例的焊料凸点1~5(以下,称作“比较例凸点1~5”)。
即,比较例凸点1~5不进行使用了芯用浆料的烧结芯的形成,这一点与本发明凸点1~17相比,焊料凸点的结构及制造法大不相同。
对于比较例凸点1~5,与本发明凸点1~17同样地求出凸点高度。另外,在本比较例中,焊盘电极的直径及金属掩模的开口直径恒定,因此凸点高度越高则纵横比越高。
表4中示出对于比较例凸点1~5求出的凸点高度。
[表1]
[表2]
(注)第1群成分是指选自Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe和Co中的一种或两种以上的粉末。第2群成分是指选自Sn、In、Bi和Ga中的一种或两种以上的粉末。
[表3]
[表4]
[实施例2]
作为实施例2,使用将第一群粉末或第二群粉末中的至少任一方设为合金粉末的表5所示的本发明芯用浆料N~R,与实施例1同样地制作表6所示的有芯结构焊料凸点18~22(以下,称作“本发明凸点18~22”)。
另外,该焊料金属用合金粉末的粒径为2~12μm,平均粒径为7μm,关于芯用浆料中所含有的金属粉末、合金粉末,其粒径为1~5μm,平均粒径为2.5μm。
表6中示出对于本发明凸点18~22求出的凸点高度。
[表5]
[表6]
从表3、表4、表6所示的结果可知,比较例凸点1~5因自重而产生扁平化,其结果,不仅凸点高度为30μm左右而较低,且易引起因与其他凸点接触而导致的短路,相对于此,本申请发明的有芯结构焊料凸点1~22的凸点高度为40μm以上而较高,具有高纵横比,并且由于在凸点内部形成有烧结芯,因此烧结芯与焊料金属的粘附性、以及焊料凸点与焊盘电极的粘附性优异,并且,不会降低导电性,因此用于实现半导体的高密度安装的细距化成为可能。
产业上的可利用性
通过本申请发明所带来的有芯结构焊料凸点及其制造方法,能够以更低的成本来高效地实现半导体的高密度安装化。
符号说明
1、11-半导体基板,2-焊盘电极,3、17-烧结芯,4-焊料金属,5-高纵横比凸点,12-介质层,13-导体焊盘,14-阻挡金属层,15-支柱金属,16-凸点下金属层,31、36-橡胶滚轴,32-芯用浆料,33、35-金属掩模,34-焊膏,D-凸点直径,H-凸点高度,S1-印刷填充,S2-烧结,S3-印刷填充,S4-回流。
Claims (4)
1.一种有芯结构焊料凸点,其形成于半导体基板上,所述有芯结构焊料凸点的特征在于,
所述焊料凸点由烧结芯及被覆于所述烧结芯周围的焊料金属的有芯结构构成,所述烧结芯形成于焊料凸点的内部且沿与半导体基板垂直的方向延伸,所述烧结芯由以焊膏的回流处理温度附近或其以下的温度烧结而成的烧结体构成,
所述烧结芯的高度低于所述凸点的高度,
所述烧结芯由第一群粉末和第二群粉末的粉末烧结体、合金烧结体或它们的混合烧结体构成,所述第一群粉末含有第一A群粉末及第一B群粉末中的至少任一个,所述第一A群粉末由选自Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe和Co中的一种或两种以上的金属粉末构成,并且所述第一B群粉末由选自液相线温度为450℃以上的钎焊合金粉末及液相线温度为280℃以上的高温焊料合金粉末中的一种或两种以上的合金粉末构成。
2.一种有芯结构焊料凸点,其形成于半导体基板上,所述有芯结构焊料凸点的特征在于,
所述焊料凸点由烧结芯及被覆于所述烧结芯周围的焊料金属的有芯结构构成,所述烧结芯形成于焊料凸点的内部且沿与半导体基板垂直的方向延伸,所述烧结芯由以焊膏的回流处理温度附近或其以下的温度烧结而成的烧结体构成,
所述烧结芯的高度低于所述凸点的高度,
所述烧结芯由第一群粉末和第二群粉末的粉末烧结体、合金烧结体或它们的混合烧结体构成,所述第二群粉末含有第二A群粉末及第二B群粉末中的至少任一个,所述第二A群粉末由选自Sn、In、Bi和Ga中的一种或两种以上的金属粉末构成,并且,所述第二B群粉末由液相线温度为240℃以下的焊料合金的合金粉末构成。
3.一种有芯结构焊料凸点的制造方法,所述有芯结构焊料凸点形成于半导体基板上,所述制造方法的特征在于,
对形成于半导体基板上的焊盘电极或者凸点下金属的表面印刷涂布芯用浆料,并以焊膏的回流处理温度附近或其以下的温度对芯用浆料进行烧结,从而在焊盘电极或者凸点下金属的表面的大致中央部形成沿与所述半导体基板垂直的方向延伸的烧结芯,接着,以覆盖在焊盘电极或者凸点下金属的大致中央部形成的烧结芯整体的方式印刷涂布焊膏,并以焊膏的回流处理温度进行回流处理,从而在焊盘电极表面上或者凸点下金属的表面上形成有芯结构焊料凸点,所述烧结芯的高度低于所述凸点的高度,
所述烧结芯由第一群粉末和第二群粉末的粉末烧结体、合金烧结体或它们的混合烧结体构成,所述第一群粉末含有第一A群粉末及第一B群粉末中的至少任一个,所述第一A群粉末由选自Cu、Ag、Au、Pt、Pd、Ti、Ni、Fe和Co中的一种或两种以上的金属粉末构成,并且所述第一B群粉末由选自液相线温度为450℃以上的钎焊合金粉末及液相线温度为280℃以上的高温焊料合金粉末中的一种或两种以上的合金粉末构成。
4.一种有芯结构焊料凸点的制造方法,所述有芯结构焊料凸点形成于半导体基板上,所述制造方法的特征在于,
对形成于半导体基板上的焊盘电极或者凸点下金属的表面印刷涂布芯用浆料,并以焊膏的回流处理温度附近或其以下的温度对芯用浆料进行烧结,从而在焊盘电极或者凸点下金属的表面的大致中央部形成沿与所述半导体基板垂直的方向延伸的烧结芯,接着,以覆盖在焊盘电极或者凸点下金属的大致中央部形成的烧结芯整体的方式印刷涂布焊膏,并以焊膏的回流处理温度进行回流处理,从而在焊盘电极表面上或者凸点下金属的表面上形成有芯结构焊料凸点,所述烧结芯的高度低于所述凸点的高度,
所述烧结芯由第一群粉末和第二群粉末的粉末烧结体、合金烧结体或它们的混合烧结体构成,所述第二群粉末含有第二A群粉末及第二B群粉末中的至少任一个,所述第二A群粉末由选自Sn、In、Bi和Ga中的一种或两种以上的金属粉末构成,并且,所述第二B群粉末由液相线温度为240℃以下的焊料合金的合金粉末构成。
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