TWI645966B - 聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法 - Google Patents
聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法 Download PDFInfo
- Publication number
- TWI645966B TWI645966B TW103142930A TW103142930A TWI645966B TW I645966 B TWI645966 B TW I645966B TW 103142930 A TW103142930 A TW 103142930A TW 103142930 A TW103142930 A TW 103142930A TW I645966 B TWI645966 B TW I645966B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- polyimide
- release film
- resin
- adhesive layer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2461/00—Presence of condensation polymers of aldehydes or ketones
- C09J2461/005—Presence of condensation polymers of aldehydes or ketones in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013254088 | 2013-12-09 | ||
JP2013-254088 | 2013-12-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201532822A TW201532822A (zh) | 2015-09-01 |
TWI645966B true TWI645966B (zh) | 2019-01-01 |
Family
ID=53371186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103142930A TWI645966B (zh) | 2013-12-09 | 2014-12-09 | 聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6561841B2 (ko) |
KR (1) | KR102344267B1 (ko) |
CN (1) | CN106232355A (ko) |
TW (1) | TWI645966B (ko) |
WO (1) | WO2015087884A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6679902B2 (ja) * | 2015-12-04 | 2020-04-15 | 日立化成株式会社 | めっきプロセス用樹脂組成物、めっきプロセス用樹脂付キャリアフィルム及びその製造方法、配線板用積層体並びに配線板の製造方法 |
JP6756162B2 (ja) * | 2016-06-08 | 2020-09-16 | 日立化成株式会社 | コンフォーマルマスク用絶縁層付き離型金属箔、積層板、多層配線板及び多層配線板の製造方法 |
CN106840101B (zh) * | 2017-04-11 | 2019-01-22 | 重庆三峡学院 | 一种新型光学水准器 |
JP6879158B2 (ja) * | 2017-10-03 | 2021-06-02 | 信越化学工業株式会社 | 半導体装置及びその製造方法、並びに積層体 |
JP6997976B2 (ja) * | 2017-10-13 | 2022-01-18 | 東レフィルム加工株式会社 | エポキシ樹脂含有層転写フィルム用離型フィルムおよびエポキシ樹脂含有層転写フィルム |
JP6967432B2 (ja) * | 2017-11-21 | 2021-11-17 | リンテック株式会社 | セラミックグリーンシート製造工程用剥離フィルムおよびその製造方法 |
JP6934141B2 (ja) * | 2017-11-28 | 2021-09-15 | 東レフィルム加工株式会社 | 転写フィルム用離型フィルムおよび転写フィルム |
JP7358729B2 (ja) * | 2018-01-29 | 2023-10-11 | 東レ株式会社 | 離型フィルム |
JP7070128B2 (ja) * | 2018-06-15 | 2022-05-18 | 大日本印刷株式会社 | 積層体、ポリイミドフィルム、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置並びにポリイミドフィルムの製造方法、積層体の製造方法及びディスプレイ用表面材の製造方法 |
JP7223672B2 (ja) * | 2019-11-08 | 2023-02-16 | 日本特殊陶業株式会社 | 多層配線基板 |
CN113498270B (zh) * | 2021-07-08 | 2023-06-02 | 江西晶弘新材料科技有限责任公司 | 一种用于氮化铝陶瓷基板中固化油墨的退洗方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11300894A (ja) * | 1998-04-16 | 1999-11-02 | Shin Etsu Chem Co Ltd | 工程用離型フィルム |
US20050261438A1 (en) * | 2004-05-24 | 2005-11-24 | Lintec Corporation | Release agent cpmposition and release liner |
US20070166523A1 (en) * | 2006-01-17 | 2007-07-19 | Lintec Corporation | Release film and process for producing the film |
US20090084487A1 (en) * | 2007-09-28 | 2009-04-02 | Tdk Corporation | Manufacturing method of laminated film and multilayer ceramic electronic device thereof |
US20110085437A1 (en) * | 2008-06-17 | 2011-04-14 | Lintec Corporation | Sheet for multilayer optical recording medium and multilayer optical recording medium using the same |
WO2012153776A1 (ja) * | 2011-05-11 | 2012-11-15 | 日本曹達株式会社 | 離型剤組成物及びそれを用いた転写箔 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5212578B1 (ko) | 1970-08-25 | 1977-04-08 | ||
JP2000255006A (ja) * | 1999-03-10 | 2000-09-19 | Toyobo Co Ltd | 離型フィルム |
JP2000280408A (ja) * | 1999-03-29 | 2000-10-10 | Toyobo Co Ltd | 離型フィルム |
JP2000301665A (ja) * | 1999-04-22 | 2000-10-31 | Toyobo Co Ltd | 転写シート用離型フィルム及び転写シート |
JP2003251739A (ja) | 2002-03-01 | 2003-09-09 | Mitsubishi Gas Chem Co Inc | アディティブ用基材入り金属箔付きbステージ樹脂組成物シート。 |
US8263691B2 (en) * | 2006-02-21 | 2012-09-11 | Sabic Innovative Plastics Ip B.V. | Release agent for transparent polyimide blends |
CN101421086B (zh) * | 2006-04-19 | 2013-04-24 | 索马龙株式会社 | 热压用脱模薄层及使用其的挠性印刷电路板的制造方法 |
JP4762177B2 (ja) * | 2007-03-07 | 2011-08-31 | リンテック株式会社 | 剥離シート及び接着性剥離シート積層体 |
JP2008302525A (ja) * | 2007-06-05 | 2008-12-18 | Kaneka Corp | 積層体、およびその利用 |
KR101240916B1 (ko) * | 2011-02-01 | 2013-03-11 | 도레이첨단소재 주식회사 | 반사시트용 점착필름 및 그를 이용한 반사시트 |
-
2014
- 2014-12-09 WO PCT/JP2014/082587 patent/WO2015087884A1/ja active Application Filing
- 2014-12-09 CN CN201480067285.9A patent/CN106232355A/zh active Pending
- 2014-12-09 KR KR1020167015184A patent/KR102344267B1/ko active IP Right Grant
- 2014-12-09 JP JP2015552467A patent/JP6561841B2/ja active Active
- 2014-12-09 TW TW103142930A patent/TWI645966B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11300894A (ja) * | 1998-04-16 | 1999-11-02 | Shin Etsu Chem Co Ltd | 工程用離型フィルム |
US20050261438A1 (en) * | 2004-05-24 | 2005-11-24 | Lintec Corporation | Release agent cpmposition and release liner |
US20070166523A1 (en) * | 2006-01-17 | 2007-07-19 | Lintec Corporation | Release film and process for producing the film |
US20090084487A1 (en) * | 2007-09-28 | 2009-04-02 | Tdk Corporation | Manufacturing method of laminated film and multilayer ceramic electronic device thereof |
US20110085437A1 (en) * | 2008-06-17 | 2011-04-14 | Lintec Corporation | Sheet for multilayer optical recording medium and multilayer optical recording medium using the same |
WO2012153776A1 (ja) * | 2011-05-11 | 2012-11-15 | 日本曹達株式会社 | 離型剤組成物及びそれを用いた転写箔 |
Also Published As
Publication number | Publication date |
---|---|
KR102344267B1 (ko) | 2021-12-27 |
TW201532822A (zh) | 2015-09-01 |
WO2015087884A1 (ja) | 2015-06-18 |
KR20160094972A (ko) | 2016-08-10 |
CN106232355A (zh) | 2016-12-14 |
JP6561841B2 (ja) | 2019-08-21 |
JPWO2015087884A1 (ja) | 2017-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI645966B (zh) | 聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法 | |
KR101681512B1 (ko) | 수지 조성물 | |
JP2020023714A (ja) | 樹脂材料及び多層プリント配線板 | |
TWI516518B (zh) | An epoxy resin composition, a prepreg using the epoxy resin composition, a resin film with a support, a laminated sheet of a metal foil, and a multilayer printed circuit board | |
JP6428147B2 (ja) | 樹脂組成物 | |
KR102077863B1 (ko) | 수지 조성물 | |
JP6428153B2 (ja) | 樹脂組成物 | |
KR20220091448A (ko) | 수지 조성물 | |
JP2017179351A (ja) | 樹脂組成物の硬化物、樹脂組成物及び多層基板 | |
JP2015199905A (ja) | 印刷回路基板用絶縁樹脂組成物及びそれを用いた製品 | |
JP6477494B2 (ja) | 接着層付き離型ポリイミドフィルム、接着層付き離型ポリイミドフィルム付き積層板、積層板、接着層付き離型ポリイミドフィルム付き単層又は多層配線板、及び多層配線板の製造方法 | |
JP6623632B2 (ja) | 絶縁樹脂フィルム及び多層プリント配線板 | |
JP6291742B2 (ja) | 樹脂組成物、めっきプロセス用接着補助層、支持体付きめっきプロセス用接着補助層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法 | |
JP2013035960A (ja) | プリント配線板用樹脂組成物、プリプレグおよび積層板 | |
JP2014185330A (ja) | 樹脂組成物、めっきプロセス用プライマー層、支持体付きめっきプロセス用プライマー層、硬化後めっきプロセス用プライマー層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法 | |
JP6295708B2 (ja) | 樹脂組成物、めっきプロセス用プライマー層、支持体付きめっきプロセス用プライマー層、硬化後めっきプロセス用プライマー層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法 | |
JP2013075440A (ja) | 積層体の製造方法及び積層構造体 | |
US20120305291A1 (en) | Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereof | |
KR102259485B1 (ko) | 배선판의 제조 방법 | |
JP6608908B2 (ja) | 樹脂材料及び多層プリント配線板 | |
JP6699148B2 (ja) | 積層体及びその製造方法、並びに、プリント配線板の製造方法 | |
JP6459182B2 (ja) | 樹脂組成物、めっきプロセス用プライマー層、支持体付きめっきプロセス用プライマー層、硬化後めっきプロセス用プライマー層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法 | |
JP5351910B2 (ja) | Bステージフィルム及び多層基板 | |
JP2014009356A (ja) | エポキシ樹脂組成物、これから製造された絶縁フィルム、及びこれを備えた多層プリント基板 | |
JP2019011481A (ja) | 樹脂組成物 |