TWI630235B - 用以形成具有優異反射及阻燃性質之物件之組合物及由其形成之物件 - Google Patents

用以形成具有優異反射及阻燃性質之物件之組合物及由其形成之物件 Download PDF

Info

Publication number
TWI630235B
TWI630235B TW102148840A TW102148840A TWI630235B TW I630235 B TWI630235 B TW I630235B TW 102148840 A TW102148840 A TW 102148840A TW 102148840 A TW102148840 A TW 102148840A TW I630235 B TWI630235 B TW I630235B
Authority
TW
Taiwan
Prior art keywords
composition
silicon
weight
parts
sio
Prior art date
Application number
TW102148840A
Other languages
English (en)
Chinese (zh)
Other versions
TW201428059A (zh
Inventor
傑科 威廉 史丹布雀
麥可 瑞門 史創
史丹頓 詹母士 丹特
Original Assignee
美商道康寧公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商道康寧公司 filed Critical 美商道康寧公司
Publication of TW201428059A publication Critical patent/TW201428059A/zh
Application granted granted Critical
Publication of TWI630235B publication Critical patent/TWI630235B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW102148840A 2012-12-27 2013-12-27 用以形成具有優異反射及阻燃性質之物件之組合物及由其形成之物件 TWI630235B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261746262P 2012-12-27 2012-12-27
US61/746,262 2012-12-27

Publications (2)

Publication Number Publication Date
TW201428059A TW201428059A (zh) 2014-07-16
TWI630235B true TWI630235B (zh) 2018-07-21

Family

ID=49950056

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102148840A TWI630235B (zh) 2012-12-27 2013-12-27 用以形成具有優異反射及阻燃性質之物件之組合物及由其形成之物件

Country Status (7)

Country Link
US (1) US9507054B2 (enExample)
EP (1) EP2938678B1 (enExample)
JP (1) JP6363618B2 (enExample)
KR (1) KR101870117B1 (enExample)
CN (1) CN104884534B (enExample)
TW (1) TWI630235B (enExample)
WO (1) WO2014105645A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132646A1 (ja) 2013-02-27 2014-09-04 株式会社朝日ラバー 白色反射膜用インク、白色反射膜用粉体塗料、白色反射膜の製造方法、白色反射膜、光源マウント及び照明器具シェード
CN105368064B (zh) * 2014-08-27 2018-01-23 广州慧谷化学有限公司 有机聚硅氧烷组合物及其制备方法及半导体器件
EP3218940A4 (en) * 2014-10-27 2018-08-15 Henkel AG & Co. KGaA A method for manufacturing an optical semiconductor device and a silicone resin composition therefor
FR3029924B1 (fr) * 2014-12-15 2016-12-09 Univ Claude Bernard Lyon Materiaux anisotropes obtenus par hydrosilylation, leur procede de preparation et leur utilisation
KR102591068B1 (ko) 2015-12-15 2023-10-18 마테리온 코포레이션 향상된 파장 변환 장치
KR20180034937A (ko) * 2016-09-28 2018-04-05 모멘티브퍼포먼스머티리얼스코리아 주식회사 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
CN108219472B (zh) * 2016-12-13 2021-02-02 北京科化新材料科技有限公司 一种液态硅树脂组合物及其制备方法和应用
CN112048180A (zh) * 2019-06-06 2020-12-08 富士能电子(昆山)有限公司 防延烧阻燃材料
JP2021042332A (ja) * 2019-09-12 2021-03-18 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、光反射材、及び、光半導体装置
WO2022207119A1 (de) * 2021-04-01 2022-10-06 Wacker Chemie Ag Keramifizierende aluminiumhydroxid enthaltende siliconzusammensetzung
FR3135086B1 (fr) * 2022-04-28 2025-07-04 Elkem Silicones France Sas Composition silicone réticulable par irradiation comprenant du Pt(octane-2,4-dione)2 comme catalyseur
KR20250073364A (ko) 2022-10-26 2025-05-27 와커 헤미 아게 배터리 모듈용 실리콘 기반 단열재

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1282354A (zh) * 1997-09-16 2001-01-31 Ge拜尔硅股份有限公司 加成交联的硅橡胶混合物、其制备方法和其用途
CN102757649A (zh) * 2011-04-28 2012-10-31 信越化学工业株式会社 加成固化型有机硅组合物以及使用它的光半导体装置

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL131800C (enExample) 1965-05-17
US4087585A (en) 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
JPS5952798B2 (ja) * 1977-11-15 1984-12-21 松下電器産業株式会社 Ｘ線遮蔽能を有する難燃性シリコン組成物
FR2577233B1 (fr) * 1985-02-08 1987-02-27 Rhone Poulenc Spec Chim Compositions organopolysiloxaniques transformables en mousses ayant une resistance amelioree a la combustion
JPS6243435A (ja) * 1985-08-20 1987-02-25 Shin Etsu Chem Co Ltd 耐火性シリコ−ン発泡体組成物
US4766176A (en) 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3029680B2 (ja) 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
US5260372A (en) * 1991-11-18 1993-11-09 Wacker Silicones Corporation Flame retardant elastomeric composition
US5298536A (en) 1992-02-21 1994-03-29 Hercules Incorporated Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
JPH0644320U (ja) * 1992-11-04 1994-06-10 株式会社岡部マイカ工業所 耐火形バスダクト
EP0699717A3 (en) * 1994-08-30 1997-01-02 Dow Corning Organopolysiloxane compositions curable into products having good adhesiveness and reduced flammability
JP2002527561A (ja) * 1998-10-12 2002-08-27 ジーイー・バイエル・シリコーンズ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング・ウント・コンパニー・コマンジツトゲゼルシヤフト 付加架橋性シリコーンゴムブレンド、その製造方法及びその使用
US6124407A (en) 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
JP3931968B2 (ja) * 2002-02-28 2007-06-20 信越化学工業株式会社 固体高分子型燃料電池セパレータシール用ゴム組成物及びこれを用いたシール材並びに固体高分子型燃料電池セパレータ
US7595113B2 (en) 2002-11-29 2009-09-29 Shin-Etsu Chemical Co., Ltd. LED devices and silicone resin composition therefor
JP4733933B2 (ja) * 2004-06-18 2011-07-27 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
WO2006030791A1 (ja) 2004-09-15 2006-03-23 Idemitsu Kosan Co., Ltd. 光反射シートおよびその成形品
DE102004050129A1 (de) * 2004-10-14 2006-04-20 Wacker Chemie Ag Siliconkautschuk Zusammensetzung enthaltend unbehandeltes Aluminiumhydroxid als Füllstoff
WO2006123833A1 (ja) 2005-05-19 2006-11-23 Teijin Chemicals Ltd. ポリカーボネート樹脂組成物
JP4800383B2 (ja) 2005-05-26 2011-10-26 ダウ・コーニング・コーポレイション 小さい形状を成形するための方法およびシリコーン封止剤組成物
KR100782265B1 (ko) 2005-12-30 2007-12-04 제일모직주식회사 광반사성 및 난연성이 우수한 폴리카보네이트 수지 조성물
WO2008002532A1 (en) * 2006-06-26 2008-01-03 Dow Corning Corporation Preparation of silicone rubber elastomers
KR100826396B1 (ko) 2007-01-18 2008-05-02 삼성전기주식회사 Ｌｅｄ 칩 패키지
JP4623322B2 (ja) 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
JP2009256400A (ja) 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5340653B2 (ja) 2008-06-25 2013-11-13 スタンレー電気株式会社 色変換発光装置
JP5471180B2 (ja) 2008-09-11 2014-04-16 信越化学工業株式会社 シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びｌｅｄ装置
KR101271584B1 (ko) 2008-09-11 2013-06-11 주식회사 엘지화학 발광 다이오드 소자의 봉지재 또는 렌즈용 실록산 고분자 및 이를 포함하는 고분자 조성물
JP2010106243A (ja) 2008-09-30 2010-05-13 Shin-Etsu Chemical Co Ltd 光半導体装置用シリコーン樹脂組成物
JP5322689B2 (ja) * 2009-02-20 2013-10-23 信越化学工業株式会社 高電圧電気絶縁体用シリコーンゴム組成物
JP2010263165A (ja) 2009-05-11 2010-11-18 Mitsubishi Plastics Inc Ｌｅｄ用反射基板及び発光装置
CN102473824B (zh) 2009-06-26 2015-08-05 株式会社朝日橡胶 白色反射材料及其制造方法
TWI422638B (zh) 2009-08-25 2014-01-11 臺灣永光化學工業股份有限公司 含矽樹脂封裝組成物
JP2011052115A (ja) 2009-09-02 2011-03-17 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2011054902A (ja) 2009-09-04 2011-03-17 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
CN101735619B (zh) 2009-12-28 2011-11-09 华南理工大学 一种无卤阻燃导热有机硅电子灌封胶及其制备方法
JP2011140550A (ja) 2010-01-06 2011-07-21 Shin-Etsu Chemical Co Ltd 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
WO2011118109A1 (ja) 2010-03-23 2011-09-29 株式会社朝日ラバー 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物
CN102339936B (zh) 2010-07-27 2015-04-29 展晶科技(深圳)有限公司 发光装置封装结构及其制造方法
JP5684511B2 (ja) 2010-08-11 2015-03-11 三菱樹脂株式会社 金属箔積層体、ｌｅｄ搭載用基板及び光源装置
US20140008697A1 (en) 2010-12-08 2014-01-09 Brian R. Harkness Siloxane Compositions Including Titanium Dioxide Nanoparticles Suitable For Forming Encapsulants
JP2012149131A (ja) * 2011-01-17 2012-08-09 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び当該組成物を使用した光半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1282354A (zh) * 1997-09-16 2001-01-31 Ge拜尔硅股份有限公司 加成交联的硅橡胶混合物、其制备方法和其用途
CN102757649A (zh) * 2011-04-28 2012-10-31 信越化学工业株式会社 加成固化型有机硅组合物以及使用它的光半导体装置

Also Published As

Publication number Publication date
WO2014105645A1 (en) 2014-07-03
CN104884534A (zh) 2015-09-02
EP2938678A1 (en) 2015-11-04
KR20150102031A (ko) 2015-09-04
TW201428059A (zh) 2014-07-16
US9507054B2 (en) 2016-11-29
KR101870117B1 (ko) 2018-06-25
JP6363618B2 (ja) 2018-07-25
CN104884534B (zh) 2018-03-30
EP2938678B1 (en) 2018-12-19
US20150362628A1 (en) 2015-12-17
JP2016505691A (ja) 2016-02-25

Similar Documents

Publication Publication Date Title
TWI630235B (zh) 用以形成具有優異反射及阻燃性質之物件之組合物及由其形成之物件
JP4851710B2 (ja) 付加架橋性シリコーン樹脂組成物、これからなる成形体および前記組成物の使用
JP4591690B2 (ja) 蛍光物質入りｌｅｄ発光装置
KR101939140B1 (ko) 광학 컴포넌트용, 개선된 기계적 특성을 가지는 경화성 고투명성 실리콘 조성물
KR101780526B1 (ko) 투명성이 우수한 열전도성 실리콘 조성물 및 경화물
KR20120063432A (ko) 실리콘 수지 조성물의 경화 방법
CN102918318B (zh) 用硅橡胶密封的照明构件及其制造方法
CN103619958B (zh) 用于led封装的可固化的硅树脂
CN115427508A (zh) 具有增加的触变指数的可固化导热聚硅氧烷组合物
TWI891845B (zh) 固化性有機矽組成物、密封材料和光半導體裝置
US20150045503A1 (en) Heat-stabilized silicone mixture
CN113025055B (zh) 固化性白色有机硅组合物、光半导体装置用反射材料以及光半导体装置
TW202428781A (zh) 固化性矽酮組成物
CN111218204B (zh) 吸湿性有机硅树脂组合物、有机el用透明密封材料、透明干燥材料及其使用方法
TW202012542A (zh) 可固化聚矽氧組成物、及由其形成之光擴散材料
JP7302503B2 (ja) 吸湿性シリコーン樹脂組成物、有機ｅｌ素子用透明封止材、有機ｅｌ素子用透明乾燥材、およびこれらの使用方法
JP2025147607A (ja) 紫外線反射樹脂組成物およびその硬化物
TW202407047A (zh) 可固化組成物及形成固化產物的方法
WO2025133479A1 (fr) Composition silicone réticulable par polyaddition pour la préparation d'élastomère silicone thermoconducteur
WO2025105104A1 (ja) 紫外線硬化性シリコーンゲル組成物、該組成物を硬化してなるシリコーンゲル硬化物
CN114106770A (zh) 固化性有机硅组合物、密封材料以及光半导体装置