KR101870117B1 - 반사 및 난연 특성이 탁월한 용품의 형성을 위한 조성물 및 이로부터 형성된 용품 - Google Patents

반사 및 난연 특성이 탁월한 용품의 형성을 위한 조성물 및 이로부터 형성된 용품 Download PDF

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KR101870117B1
KR101870117B1 KR1020157017280A KR20157017280A KR101870117B1 KR 101870117 B1 KR101870117 B1 KR 101870117B1 KR 1020157017280 A KR1020157017280 A KR 1020157017280A KR 20157017280 A KR20157017280 A KR 20157017280A KR 101870117 B1 KR101870117 B1 KR 101870117B1
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스탠턴 제임스 덴트
제이콥 윌리엄 스테인브레처
마이클 레이먼드 스트롱
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다우 실리콘즈 코포레이션
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016Flame-proofing or flame-retarding additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/5403Silicon-containing compounds containing no other elements than carbon or hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224Magnesium hydroxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
KR1020157017280A 2012-12-27 2013-12-19 반사 및 난연 특성이 탁월한 용품의 형성을 위한 조성물 및 이로부터 형성된 용품 Active KR101870117B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261746262P 2012-12-27 2012-12-27
US61/746,262 2012-12-27
PCT/US2013/076648 WO2014105645A1 (en) 2012-12-27 2013-12-19 Composition for forming an article having excellent reflectance and flame retardant properties and article formed therefrom

Publications (2)

Publication Number Publication Date
KR20150102031A KR20150102031A (ko) 2015-09-04
KR101870117B1 true KR101870117B1 (ko) 2018-06-25

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US (1) US9507054B2 (enExample)
EP (1) EP2938678B1 (enExample)
JP (1) JP6363618B2 (enExample)
KR (1) KR101870117B1 (enExample)
CN (1) CN104884534B (enExample)
TW (1) TWI630235B (enExample)
WO (1) WO2014105645A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132646A1 (ja) 2013-02-27 2014-09-04 株式会社朝日ラバー 白色反射膜用インク、白色反射膜用粉体塗料、白色反射膜の製造方法、白色反射膜、光源マウント及び照明器具シェード
CN105368064B (zh) * 2014-08-27 2018-01-23 广州慧谷化学有限公司 有机聚硅氧烷组合物及其制备方法及半导体器件
EP3218940A4 (en) * 2014-10-27 2018-08-15 Henkel AG & Co. KGaA A method for manufacturing an optical semiconductor device and a silicone resin composition therefor
FR3029924B1 (fr) * 2014-12-15 2016-12-09 Univ Claude Bernard Lyon Materiaux anisotropes obtenus par hydrosilylation, leur procede de preparation et leur utilisation
KR102591068B1 (ko) 2015-12-15 2023-10-18 마테리온 코포레이션 향상된 파장 변환 장치
KR20180034937A (ko) * 2016-09-28 2018-04-05 모멘티브퍼포먼스머티리얼스코리아 주식회사 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
CN108219472B (zh) * 2016-12-13 2021-02-02 北京科化新材料科技有限公司 一种液态硅树脂组合物及其制备方法和应用
CN112048180A (zh) * 2019-06-06 2020-12-08 富士能电子(昆山)有限公司 防延烧阻燃材料
JP2021042332A (ja) * 2019-09-12 2021-03-18 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、光反射材、及び、光半導体装置
WO2022207119A1 (de) * 2021-04-01 2022-10-06 Wacker Chemie Ag Keramifizierende aluminiumhydroxid enthaltende siliconzusammensetzung
FR3135086B1 (fr) * 2022-04-28 2025-07-04 Elkem Silicones France Sas Composition silicone réticulable par irradiation comprenant du Pt(octane-2,4-dione)2 comme catalyseur
KR20250073364A (ko) 2022-10-26 2025-05-27 와커 헤미 아게 배터리 모듈용 실리콘 기반 단열재

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189594A (ja) * 2009-02-20 2010-09-02 Shin-Etsu Chemical Co Ltd 高電圧電気絶縁体用シリコーンゴム組成物

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL131800C (enExample) 1965-05-17
US4087585A (en) 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
JPS5952798B2 (ja) * 1977-11-15 1984-12-21 松下電器産業株式会社 X線遮蔽能を有する難燃性シリコン組成物
FR2577233B1 (fr) * 1985-02-08 1987-02-27 Rhone Poulenc Spec Chim Compositions organopolysiloxaniques transformables en mousses ayant une resistance amelioree a la combustion
JPS6243435A (ja) * 1985-08-20 1987-02-25 Shin Etsu Chem Co Ltd 耐火性シリコ−ン発泡体組成物
US4766176A (en) 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3029680B2 (ja) 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
US5260372A (en) * 1991-11-18 1993-11-09 Wacker Silicones Corporation Flame retardant elastomeric composition
US5298536A (en) 1992-02-21 1994-03-29 Hercules Incorporated Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
JPH0644320U (ja) * 1992-11-04 1994-06-10 株式会社岡部マイカ工業所 耐火形バスダクト
EP0699717A3 (en) * 1994-08-30 1997-01-02 Dow Corning Organopolysiloxane compositions curable into products having good adhesiveness and reduced flammability
DE19740631A1 (de) * 1997-09-16 1999-03-18 Ge Bayer Silicones Gmbh & Co Additionsvernetzende Siliconkautschukmischungen, ein Verfahren zu deren Herstellung und deren Verwendung
JP2002527561A (ja) * 1998-10-12 2002-08-27 ジーイー・バイエル・シリコーンズ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング・ウント・コンパニー・コマンジツトゲゼルシヤフト 付加架橋性シリコーンゴムブレンド、その製造方法及びその使用
US6124407A (en) 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
JP3931968B2 (ja) * 2002-02-28 2007-06-20 信越化学工業株式会社 固体高分子型燃料電池セパレータシール用ゴム組成物及びこれを用いたシール材並びに固体高分子型燃料電池セパレータ
US7595113B2 (en) 2002-11-29 2009-09-29 Shin-Etsu Chemical Co., Ltd. LED devices and silicone resin composition therefor
JP4733933B2 (ja) * 2004-06-18 2011-07-27 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
WO2006030791A1 (ja) 2004-09-15 2006-03-23 Idemitsu Kosan Co., Ltd. 光反射シートおよびその成形品
DE102004050129A1 (de) * 2004-10-14 2006-04-20 Wacker Chemie Ag Siliconkautschuk Zusammensetzung enthaltend unbehandeltes Aluminiumhydroxid als Füllstoff
WO2006123833A1 (ja) 2005-05-19 2006-11-23 Teijin Chemicals Ltd. ポリカーボネート樹脂組成物
JP4800383B2 (ja) 2005-05-26 2011-10-26 ダウ・コーニング・コーポレイション 小さい形状を成形するための方法およびシリコーン封止剤組成物
KR100782265B1 (ko) 2005-12-30 2007-12-04 제일모직주식회사 광반사성 및 난연성이 우수한 폴리카보네이트 수지 조성물
WO2008002532A1 (en) * 2006-06-26 2008-01-03 Dow Corning Corporation Preparation of silicone rubber elastomers
KR100826396B1 (ko) 2007-01-18 2008-05-02 삼성전기주식회사 Led 칩 패키지
JP4623322B2 (ja) 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
JP2009256400A (ja) 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5340653B2 (ja) 2008-06-25 2013-11-13 スタンレー電気株式会社 色変換発光装置
JP5471180B2 (ja) 2008-09-11 2014-04-16 信越化学工業株式会社 シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置
KR101271584B1 (ko) 2008-09-11 2013-06-11 주식회사 엘지화학 발광 다이오드 소자의 봉지재 또는 렌즈용 실록산 고분자 및 이를 포함하는 고분자 조성물
JP2010106243A (ja) 2008-09-30 2010-05-13 Shin-Etsu Chemical Co Ltd 光半導体装置用シリコーン樹脂組成物
JP2010263165A (ja) 2009-05-11 2010-11-18 Mitsubishi Plastics Inc Led用反射基板及び発光装置
CN102473824B (zh) 2009-06-26 2015-08-05 株式会社朝日橡胶 白色反射材料及其制造方法
TWI422638B (zh) 2009-08-25 2014-01-11 臺灣永光化學工業股份有限公司 含矽樹脂封裝組成物
JP2011052115A (ja) 2009-09-02 2011-03-17 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2011054902A (ja) 2009-09-04 2011-03-17 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
CN101735619B (zh) 2009-12-28 2011-11-09 华南理工大学 一种无卤阻燃导热有机硅电子灌封胶及其制备方法
JP2011140550A (ja) 2010-01-06 2011-07-21 Shin-Etsu Chemical Co Ltd 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
WO2011118109A1 (ja) 2010-03-23 2011-09-29 株式会社朝日ラバー 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物
CN102339936B (zh) 2010-07-27 2015-04-29 展晶科技(深圳)有限公司 发光装置封装结构及其制造方法
JP5684511B2 (ja) 2010-08-11 2015-03-11 三菱樹脂株式会社 金属箔積層体、led搭載用基板及び光源装置
US20140008697A1 (en) 2010-12-08 2014-01-09 Brian R. Harkness Siloxane Compositions Including Titanium Dioxide Nanoparticles Suitable For Forming Encapsulants
JP2012149131A (ja) * 2011-01-17 2012-08-09 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP5522116B2 (ja) * 2011-04-28 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物及びそれを用いた光半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189594A (ja) * 2009-02-20 2010-09-02 Shin-Etsu Chemical Co Ltd 高電圧電気絶縁体用シリコーンゴム組成物

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WO2014105645A1 (en) 2014-07-03
CN104884534A (zh) 2015-09-02
TWI630235B (zh) 2018-07-21
EP2938678A1 (en) 2015-11-04
KR20150102031A (ko) 2015-09-04
TW201428059A (zh) 2014-07-16
US9507054B2 (en) 2016-11-29
JP6363618B2 (ja) 2018-07-25
CN104884534B (zh) 2018-03-30
EP2938678B1 (en) 2018-12-19
US20150362628A1 (en) 2015-12-17
JP2016505691A (ja) 2016-02-25

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