CN105368064B - 有机聚硅氧烷组合物及其制备方法及半导体器件 - Google Patents
有机聚硅氧烷组合物及其制备方法及半导体器件 Download PDFInfo
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- CN105368064B CN105368064B CN201410428763.6A CN201410428763A CN105368064B CN 105368064 B CN105368064 B CN 105368064B CN 201410428763 A CN201410428763 A CN 201410428763A CN 105368064 B CN105368064 B CN 105368064B
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- alkenyl
- organopolysiloxane
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- 239000003054 catalyst Substances 0.000 claims abstract description 12
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- 229910020447 SiO2/2 Inorganic materials 0.000 claims abstract description 8
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- 239000007788 liquid Substances 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
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- 125000003342 alkenyl group Chemical group 0.000 claims description 26
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- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 7
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- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
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- KZMAWJRXKGLWGS-UHFFFAOYSA-N 2-chloro-n-[4-(4-methoxyphenyl)-1,3-thiazol-2-yl]-n-(3-methoxypropyl)acetamide Chemical compound S1C(N(C(=O)CCl)CCCOC)=NC(C=2C=CC(OC)=CC=2)=C1 KZMAWJRXKGLWGS-UHFFFAOYSA-N 0.000 description 2
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- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
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- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
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- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
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- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
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PCT/CN2015/071380 WO2016029643A1 (zh) | 2014-08-27 | 2015-01-23 | 有机聚硅氧烷组合物及其制备方法及半导体器件 |
US15/507,238 US10066137B2 (en) | 2014-08-27 | 2015-01-23 | Organopolysiloxane composition, preparation method therefor, and semiconductor component |
JP2017511201A JP6414919B2 (ja) | 2014-08-27 | 2015-01-23 | オルガノポリシロキサン組成物およびその製造方法並びに半導体部材 |
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WO2020132020A1 (en) * | 2018-12-19 | 2020-06-25 | Dow Global Technologies Llc | Silicone rubber compositions and elastomeric materials |
WO2020132028A1 (en) * | 2018-12-19 | 2020-06-25 | Dow Silicones Corporation | Silicone rubber compositions and elastomeric materials |
CN110951411A (zh) * | 2019-12-31 | 2020-04-03 | 广州机械科学研究院有限公司 | 一种单组分加成型有机硅密封粘接剂及其制备方法 |
CN112521608B (zh) * | 2020-11-23 | 2023-07-18 | 江苏晟大元通新材料科技有限公司 | 一种硅树脂及其制备方法和其在集成电路封装材料中的应用 |
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TWI373150B (en) * | 2003-07-09 | 2012-09-21 | Shinetsu Chemical Co | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
JP5247979B2 (ja) * | 2005-06-01 | 2013-07-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 透明な硬化物を与えるポリオルガノシロキサン組成物 |
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CN102300933A (zh) * | 2009-02-02 | 2011-12-28 | 道康宁东丽株式会社 | 提供高度透明的固化有机硅材料的能固化的有机硅组合物 |
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