TWI627640B - 金屬奈米結構化之網絡及透明導電材料 - Google Patents

金屬奈米結構化之網絡及透明導電材料 Download PDF

Info

Publication number
TWI627640B
TWI627640B TW102122029A TW102122029A TWI627640B TW I627640 B TWI627640 B TW I627640B TW 102122029 A TW102122029 A TW 102122029A TW 102122029 A TW102122029 A TW 102122029A TW I627640 B TWI627640 B TW I627640B
Authority
TW
Taiwan
Prior art keywords
transparent conductive
coating
metal
nanowires
network
Prior art date
Application number
TW102122029A
Other languages
English (en)
Chinese (zh)
Other versions
TW201405583A (zh
Inventor
艾杰 維卡
李英熙
楊希強
梅奧本Ｃ 雷謬斯
Original Assignee
C3奈米有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49769704&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI627640(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US13/530,822 external-priority patent/US10029916B2/en
Application filed by C3奈米有限公司 filed Critical C3奈米有限公司
Publication of TW201405583A publication Critical patent/TW201405583A/zh
Application granted granted Critical
Publication of TWI627640B publication Critical patent/TWI627640B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
TW102122029A 2012-06-22 2013-06-20 金屬奈米結構化之網絡及透明導電材料 TWI627640B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US13/530,822 US10029916B2 (en) 2012-06-22 2012-06-22 Metal nanowire networks and transparent conductive material
US13/530,822 2012-06-22
US201261684409P 2012-08-17 2012-08-17
US61/684,409 2012-08-17
US13/664,159 US9920207B2 (en) 2012-06-22 2012-10-30 Metal nanostructured networks and transparent conductive material
US13/664,159 2012-10-30

Publications (2)

Publication Number Publication Date
TW201405583A TW201405583A (zh) 2014-02-01
TWI627640B true TWI627640B (zh) 2018-06-21

Family

ID=49769704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102122029A TWI627640B (zh) 2012-06-22 2013-06-20 金屬奈米結構化之網絡及透明導電材料

Country Status (7)

Country Link
US (3) US9920207B2 (OSRAM)
EP (2) EP2864990B1 (OSRAM)
JP (1) JP6392213B2 (OSRAM)
KR (3) KR102027623B1 (OSRAM)
CN (1) CN104685577B (OSRAM)
TW (1) TWI627640B (OSRAM)
WO (1) WO2013192437A2 (OSRAM)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2619816A4 (en) 2010-09-24 2014-06-11 Univ California NANO WIRE POLYMER COMPOSITE ELECTRODES
WO2013051516A1 (ja) * 2011-10-03 2013-04-11 日立化成株式会社 導電パターンの形成方法、導電パターン基板及びタッチパネルセンサ
EP2845263B1 (en) * 2012-05-01 2019-09-25 Nanoton, Inc. Radio frequency (rf) conductive medium
FR2991342B1 (fr) * 2012-06-05 2014-07-04 Commissariat Energie Atomique Procede d'amelioration des performances electriques et optiques d'un materiau conducteur electrique et transparent a base de nanofils d'argent
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US9519366B2 (en) * 2013-05-10 2016-12-13 Samsung Electro-Mechanics Co., Ltd. Touch sensor
WO2014204206A1 (en) * 2013-06-20 2014-12-24 Lg Electronics Inc. Conductive film and touch panel including the same
TWI533331B (zh) * 2013-09-04 2016-05-11 國立清華大學 導電結構及其製造方法
JP6247876B2 (ja) * 2013-09-26 2017-12-13 Ｄｏｗａエレクトロニクス株式会社 糸状銀粉、銀粉混合物及びその製造方法、並びに導電性ペースト
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US10166571B2 (en) * 2013-12-10 2019-01-01 Lg Display Co., Ltd. Refining method for microstructure
US20150208498A1 (en) * 2014-01-22 2015-07-23 Nuovo Film, Inc. Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures
US9496062B2 (en) * 2014-01-22 2016-11-15 Nuovo Film, Inc. Method of making merged junction in metal nanowires
CN104849317B (zh) 2014-02-18 2018-09-18 元太科技工业股份有限公司 半导体感测装置及制作方法
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
CN105225727B (zh) 2014-06-30 2017-06-09 乐金显示有限公司 透明导电层、用于制造其的方法及包括其的显示装置
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
CA2957843A1 (en) * 2014-08-15 2016-02-18 Herve Dietsch Composition comprising silver nanowires and dispersed polymer beads for the preparation of electroconductive transparent layers
CN104299722B (zh) * 2014-09-05 2017-06-09 中国科学院合肥物质科学研究院 一种利用溶液法提高银纳米线透明导电薄膜导电性的方法
US20160096967A1 (en) 2014-10-03 2016-04-07 C3Nano Inc. Property enhancing fillers for transparent coatings and transparent conductive films
US11111396B2 (en) 2014-10-17 2021-09-07 C3 Nano, Inc. Transparent films with control of light hue using nanoscale colorants
CN105573542B (zh) * 2014-11-07 2018-07-24 宸鸿光电科技股份有限公司 制作纳米级导电薄膜的方法及其触控显示装置
FR3029010B1 (fr) * 2014-11-24 2017-12-15 Commissariat Energie Atomique Materiau nanostructure semi-conducteur polycristallin
KR101637920B1 (ko) * 2015-01-06 2016-07-08 연세대학교 산학협력단 투명필름히터 및 그의 제조방법
CN107431133B (zh) * 2015-01-26 2020-10-27 德山金属株式会社 核壳纳米线、核壳纳米线的合成方法、包括核壳纳米线的透明电极以及有机发光二极管
KR101711938B1 (ko) * 2015-01-26 2017-03-03 덕산하이메탈(주) 코어-쉘 나노와이어 및 이의 합성방법과 코어-쉘 나노와이어를 포함하는 투광성 전극 및 유기발광소자
US9468989B2 (en) * 2015-02-26 2016-10-18 Northrop Grumman Systems Corporation High-conductivity bonding of metal nanowire arrays
US10390433B2 (en) * 2015-03-31 2019-08-20 Texas Instruments Incorporated Methods of forming conductive and resistive circuit structures in an integrated circuit or printed circuit board
US9530534B2 (en) 2015-04-03 2016-12-27 C3Nano Inc. Transparent conductive film
US10526501B2 (en) * 2015-04-09 2020-01-07 Basf Se Composition comprising silver nanowires in an alcohol/water mixture and dispersed styrene/(meth)acrylic copolymers for the preparation of electroconductive transparent layers
TWI719976B (zh) 2015-04-16 2021-03-01 德商巴斯夫歐洲公司 製造圖案化透明導電膜及透明導電膜的方法
EP3118265A1 (en) * 2015-07-14 2017-01-18 Henkel AG & Co. KGaA Conductive transparent coating
US20180147603A1 (en) * 2015-07-16 2018-05-31 Dow Global Technologies Llc Method of treating nanoparticles
KR102345543B1 (ko) * 2015-08-03 2021-12-30 삼성전자주식회사 펠리클 및 이를 포함하는 포토마스크 조립체
KR20170018718A (ko) 2015-08-10 2017-02-20 삼성전자주식회사 비정질 합금을 이용한 투명 전극 및 그 제조 방법
WO2017034870A1 (en) * 2015-08-21 2017-03-02 3M Innovative Properties Company Transparent conductors including metal traces and methods of making same
JP2017068219A (ja) * 2015-10-02 2017-04-06 株式会社コベルコ科研 電極構造
KR102543985B1 (ko) * 2015-10-27 2023-06-14 삼성전자주식회사 전도막 및 이를 포함하는 전자 소자
CN105355272A (zh) * 2015-11-18 2016-02-24 中国科学院上海硅酸盐研究所 一种双面导电透明导电薄膜及其制备方法
US10147512B2 (en) 2015-12-09 2018-12-04 C3Nano Inc. Methods for synthesizing silver nanoplates and noble metal coated silver nanoplates and their use in transparent films for control of light hue
ES2625024B1 (es) * 2015-12-18 2018-05-10 Consejo Superior De Investigaciones Cientificas Material que comprende tectómeros de oligoglicina y nanohilos
EP3394859B1 (en) 2015-12-23 2023-06-28 Henkel AG & Co. KGaA Polymer emulsion as binder for conductive composition
WO2017175142A1 (en) * 2016-04-06 2017-10-12 Centre For Nano And Soft Matter Sciences A synergistic mixture of water and isopropyl alcohol and application thereof
KR102458995B1 (ko) 2016-04-06 2022-10-25 바스프 에스이 표면 개질된 은 나노와이어를 포함하는 생성물의 제조 방법, 및 생성물의 용도
KR101812024B1 (ko) * 2016-06-10 2017-12-27 한국기계연구원 열선 및 이를 포함하는 면상 발열 시트
KR101828578B1 (ko) * 2016-06-21 2018-03-29 광주과학기술원 금속 나노와이어와 금속입자가 용접된 금속복합구조체의 제조방법
WO2018017364A1 (en) 2016-07-22 2018-01-25 E. I. Du Pont De Nemours And Company Thin-film heating device
EP3526801B1 (en) 2016-10-14 2022-12-07 C3Nano Inc. Stabilized sparse metal conductive films and solutions for delivery of stabilizing compounds
KR102054190B1 (ko) 2017-01-23 2019-12-10 동우 화인켐 주식회사 고성능 필름형 터치 센서 및 그 제조방법
WO2018140226A1 (en) * 2017-01-24 2018-08-02 The Regents Of The University Of California Conductive core-shell metal nanowires for transparent conductors
US10685163B2 (en) * 2017-03-01 2020-06-16 Synopsys, Inc. Computationally efficient nano-scale conductor resistance model
CN108621753A (zh) * 2017-03-24 2018-10-09 凯姆控股有限公司 平面加热结构
KR102002213B1 (ko) * 2017-05-08 2019-07-22 연세대학교 산학협력단 금속 나노 구조체, 이의 제조 방법 및 이를 포함하는 전기 장치
CN109822996A (zh) * 2017-11-23 2019-05-31 宸美（厦门）光电有限公司 电控变色车用玻璃
US10714230B2 (en) 2017-12-06 2020-07-14 C3Nano Inc. Thin and uniform silver nanowires, method of synthesis and transparent conductive films formed from the nanowires
CN111448621B (zh) * 2018-01-11 2021-10-22 三菱制纸株式会社 导电材料及处理方法
WO2019167396A1 (ja) * 2018-02-27 2019-09-06 富士フイルム株式会社 導電膜の製造方法
KR102147466B1 (ko) * 2018-05-18 2020-08-25 주식회사 에스지플렉시오 전도성 잉크 및 이를 이용한 전도성 필름의 제조방법
CN108539058A (zh) * 2018-05-28 2018-09-14 吉林建筑大学 一种银纳米线网格电极的制备方法
CN108766666B (zh) * 2018-06-07 2021-10-15 乐凯华光印刷科技有限公司 一种低阻值、高透光率的纳米银线透明导电膜及其制备方法
CN208569591U (zh) * 2018-06-30 2019-03-01 云谷（固安）科技有限公司 触控面板及显示装置
WO2020014860A1 (zh) * 2018-07-17 2020-01-23 深圳市柔宇科技有限公司 导电薄膜及其制备方法、触控面板及显示装置
CN110875098A (zh) * 2018-08-29 2020-03-10 天津大学 基于热压烧结的纳米银线导电墨水烧结薄膜及其制备方法和应用
CN110875100A (zh) * 2018-08-29 2020-03-10 天津大学 基于氯化钠热压烧结的纳米银线导电墨水烧结薄膜及其制备方法和应用
CN111435614A (zh) * 2019-01-11 2020-07-21 天津大学 一种纳米银片/纳米银颗粒复合薄膜及其制备方法和应用
US11910525B2 (en) 2019-01-28 2024-02-20 C3 Nano, Inc. Thin flexible structures with surfaces with transparent conductive films and processes for forming the structures
GB201902515D0 (en) * 2019-02-25 2019-04-10 Univ Oxford Innovation Ltd Sensor
CN110327973B (zh) * 2019-07-26 2021-12-21 湖北工程学院 一种交联降冰片烯共聚物/炭黑三维网络负载铜纳米催化剂及其制备方法与应用
CN114930469A (zh) 2019-11-18 2022-08-19 C3奈米有限公司 用于稀疏金属导电层的稳定化的透明导电膜的涂覆和处理
CN112837847A (zh) * 2019-11-22 2021-05-25 重庆神华薄膜太阳能科技有限公司 一种导电薄膜的制备方法与应用
US11987717B2 (en) * 2020-07-10 2024-05-21 The Research Foundation For The State University Of New York Air-stable conductive ink
CN114466578B (zh) * 2020-11-10 2024-11-15 苏州苏大维格科技集团股份有限公司 一种复合结构电磁屏蔽膜及其制作方法
CN112397218B (zh) * 2020-11-18 2022-03-08 重庆文理学院 一种核壳结构的银@pvp纳米线薄膜电极及其制备方法
CN113744927B (zh) * 2021-08-03 2024-06-28 暨南大学 一种金属纳米线的光熔接方法、金属透明导电电极及金属纳米线油墨
CN113744931A (zh) * 2021-09-07 2021-12-03 浙江星隆新材料科技有限公司 一种图案化导电膜的制备方法
JP2023066744A (ja) * 2021-10-29 2023-05-16 日東電工株式会社 透明導電性フィルム
WO2024076691A2 (en) 2022-10-07 2024-04-11 C3 Nano, Inc. Silver nano wire and noble-metal coated silver nano wire conductive polymer composites with low loading percolation conduction
KR20250133872A (ko) * 2023-01-04 2025-09-09 닛토덴코 가부시키가이샤 투명 도전성 필름 유래 입체 성형체
CN116372158A (zh) * 2023-02-13 2023-07-04 河北光兴半导体技术有限公司 一种银镍双金属纳米线及其制备方法和应用
CN116285502B (zh) * 2023-02-27 2023-10-20 暨南大学 一种用于降低金属纳米线熔点的墨水、光学不可视的图案电极的制备方法以及电极
WO2025004503A1 (ja) * 2023-06-28 2025-01-02 日東電工株式会社 透明導電性フィルム
WO2025072714A1 (en) * 2023-09-27 2025-04-03 Ekc Technology, Inc. Silver nanowire based, electrically conductive inks, pastes and electrically conductive polymer composites with metal particulates, and corresponding methods
CN117363061B (zh) * 2023-09-28 2024-07-16 哈尔滨工业大学 一种用于防月尘黏附的超疏水导电复合涂层及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200839794A (en) * 2006-10-12 2008-10-01 Cambrios Technologies Corp Nanowire-based transparent conductors and applications thereof
TW200939251A (en) * 2007-12-27 2009-09-16 Honeywell Int Inc Transparent conductors and methods for fabricating transparent conductors
TW200946266A (en) * 2008-02-27 2009-11-16 Kuraray Co Method of manufacturing metalnanowire and dispersion medium comprising the resultant metalnanowire, and transparent conductive film
TW201140862A (en) * 2010-04-23 2011-11-16 Applied Materials Inc Enhanced silicon-TCO interface in thin film silicon solar cells using nickel nanowires
US20120127097A1 (en) * 2010-07-30 2012-05-24 Whitney Gaynor Conductive films
CN102481757A (zh) * 2009-07-17 2012-05-30 卡尔斯特里姆保健公司 包括水溶性粘合剂的透明导电薄膜
US20120132930A1 (en) * 2010-08-07 2012-05-31 Michael Eugene Young Device components with surface-embedded additives and related manufacturing methods
TW201221597A (en) * 2010-11-03 2012-06-01 Cambrios Technologies Corp Coating compositions for forming nanocomposite films

Family Cites Families (144)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6741019B1 (en) 1999-10-18 2004-05-25 Agere Systems, Inc. Article comprising aligned nanowires
US6806206B2 (en) 2001-03-29 2004-10-19 Sony Corporation Etching method and etching liquid
KR100924479B1 (ko) 2001-07-23 2009-11-03 소니 가부시끼 가이샤 에칭 방법 및 에칭액
KR100642183B1 (ko) 2001-08-22 2006-11-06 샤프 가부시키가이샤 터치 센서, 터치 센서가 부착된 표시 장치, 및 위치데이터 생성 방법
US8865347B2 (en) 2001-09-28 2014-10-21 Siluria Technologies, Inc. Digital alloys and methods for forming the same
US7566360B2 (en) 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7601406B2 (en) 2002-06-13 2009-10-13 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
WO2005005687A1 (en) 2003-07-02 2005-01-20 Seldon Technologies, Llc Method of coating nanosturctures with metal using metal salts
US7062848B2 (en) 2003-09-18 2006-06-20 Hewlett-Packard Development Company, L.P. Printable compositions having anisometric nanostructures for use in printed electronics
EP1726193A2 (en) 2004-02-25 2006-11-29 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US20050196707A1 (en) 2004-03-02 2005-09-08 Eastman Kodak Company Patterned conductive coatings
WO2006076027A2 (en) 2004-05-17 2006-07-20 Cambrios Technology Corp. Biofabrication of transistors including field effect transistors
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US20060083694A1 (en) 2004-08-07 2006-04-20 Cabot Corporation Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same
JP4517230B2 (ja) 2004-08-31 2010-08-04 三菱マテリアル株式会社 金属微粒子含有組成物、およびその用途
JP2008527169A (ja) 2005-01-10 2008-07-24 イシウム リサーチ デベロップメント カンパニー オブ ザ ヘブリュー ユニバーシティー オブ イエルサレム 金属ナノ粒子の水系分散物
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
US7218004B2 (en) 2005-03-11 2007-05-15 Hewlett-Packard Development Company, L.P. Fusing nanowires using in situ crystal growth
US7902639B2 (en) 2005-05-13 2011-03-08 Siluria Technologies, Inc. Printable electric circuits, electronic components and method of forming the same
US8105472B2 (en) 2005-06-10 2012-01-31 Cima Nanotech Israel Ltd. Enhanced transparent conductive coatings and methods for making them
JP5546763B2 (ja) 2005-08-12 2014-07-09 カンブリオス テクノロジーズ コーポレイション ナノワイヤに基づく透明導電体
US20080003130A1 (en) 2006-02-01 2008-01-03 University Of Washington Methods for production of silver nanostructures
EP1832632A1 (en) 2006-03-07 2007-09-12 DSM IP Assets B.V. Conductive ink
US20090305437A1 (en) 2006-03-09 2009-12-10 Cambrios Technologies Corporation Fabrication of inorganic materials using templates with labile linkage
US7976726B2 (en) 2006-04-27 2011-07-12 Siluria Technologies, Inc. Prevention of quantum dot quenching on metal surfaces
WO2008073143A2 (en) 2006-06-21 2008-06-19 Cambrios Technologies Corporation Methods of controlling nanostructure formations and shapes
DE102006029947B4 (de) 2006-06-29 2013-01-17 Basf Se Verfahren zum Aufbringen einer metallischen Deckschicht auf einen Hochtemperatursupraleiter
WO2008009779A1 (en) 2006-07-21 2008-01-24 Valtion Teknillinen Tutkimuskeskus Method for manufacturing conductors and semiconductors
US20090052029A1 (en) 2006-10-12 2009-02-26 Cambrios Technologies Corporation Functional films formed by highly oriented deposition of nanowires
TWI550646B (zh) 2006-10-12 2016-09-21 坎畢歐科技公司 製造透明導體之方法
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
US8815346B2 (en) 2006-10-13 2014-08-26 Samsung Electronics Co., Ltd. Compliant and nonplanar nanostructure films
WO2008127313A2 (en) 2006-11-17 2008-10-23 The Regents Of The University Of California Electrically conducting and optically transparent nanowire networks
US20080147019A1 (en) 2006-12-19 2008-06-19 Kimberly-Clark Worldwide, Inc. Antimicrobial component system containing metallic nanoparticles and chitosan and/or its derivatives
WO2008131304A1 (en) 2007-04-20 2008-10-30 Cambrios Technologies Corporation Composite transparent conductors and methods of forming the same
WO2009017852A2 (en) 2007-04-20 2009-02-05 Cambrios Technologies Corporation High contrast transparent conductors and methods of forming the same
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US20080292979A1 (en) 2007-05-22 2008-11-27 Zhe Ding Transparent conductive materials and coatings, methods of production and uses thereof
US20090011604A1 (en) * 2007-07-05 2009-01-08 Interuniversitair Microelektronica Centrum Vzw (Imec) Photon induced removal of copper
JPWO2009035059A1 (ja) 2007-09-12 2010-12-24 株式会社クラレ 導電膜、導電部材および導電膜の製造方法
JP2009108407A (ja) 2007-10-12 2009-05-21 Fujifilm Corp 屈曲棒状金属粒子及びその製造方法、並びに屈曲棒状金属粒子含有組成物、及び導電性材料
JPWO2009063744A1 (ja) 2007-11-16 2011-03-31 コニカミノルタホールディングス株式会社 金属ナノワイヤの製造方法、金属ナノワイヤ及び透明導電体
JP2009129882A (ja) 2007-11-28 2009-06-11 Konica Minolta Holdings Inc 透明導電膜、透明導電性フィルム及びフレキシブル透明面電極
JP5245111B2 (ja) 2007-12-06 2013-07-24 コニカミノルタ株式会社 透明導電フィルム
KR20160010646A (ko) 2007-12-20 2016-01-27 시마 나노 테크 이스라엘 리미티드 충전제 재료를 포함하는 투명한 전도성 코팅
US7922787B2 (en) * 2008-02-02 2011-04-12 Seashell Technology, Llc Methods for the production of silver nanowires
JP2011515510A (ja) 2008-02-26 2011-05-19 カンブリオス テクノロジーズ コーポレイション 導電性特徴をスクリーン印刷するための方法および組成物
JP5203769B2 (ja) 2008-03-31 2013-06-05 富士フイルム株式会社 銀ナノワイヤー及びその製造方法、並びに水性分散物及び透明導電体
JP2009299162A (ja) 2008-06-16 2009-12-24 Fujifilm Corp 銀ナノワイヤー及びその製造方法、並びに水性分散物及び透明導電体
US8178120B2 (en) 2008-06-20 2012-05-15 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
EP2303492A1 (en) 2008-06-23 2011-04-06 Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd. Core-shell metallic nanoparticles, methods of production thereof, and ink compositions containing same
JP5454476B2 (ja) 2008-07-25 2014-03-26 コニカミノルタ株式会社 透明電極および透明電極の製造方法
JP5289859B2 (ja) 2008-08-13 2013-09-11 日本写真印刷株式会社 導電性パターン被覆体の製造方法および導電性パターン被覆体
ES2448765T3 (es) 2008-09-02 2014-03-17 Ramot At Tel-Aviv University Ltd. Películas finas de nanohilos metálicos
US7819710B2 (en) 2008-09-23 2010-10-26 Tyco Electronics Corporation Termination cap for terminating an electrical lead directly to a stud of an electrode and an electrode lead assembly containing such termination cap
WO2010036113A1 (en) 2008-09-29 2010-04-01 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Kit for preparing a conductive pattern
JP5189449B2 (ja) 2008-09-30 2013-04-24 富士フイルム株式会社 金属ナノワイヤー含有組成物、及び透明導電体
JP5306760B2 (ja) 2008-09-30 2013-10-02 富士フイルム株式会社 透明導電体、タッチパネル、及び太陽電池パネル
US20100101832A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Compound magnetic nanowires for tco replacement
US20120168684A1 (en) 2009-03-24 2012-07-05 Yissum Research Development Company of the Hebrew University of Jerusaem, Ltd. Process for sintering nanoparticles at low temperatures
KR101479788B1 (ko) 2009-04-08 2015-01-06 인스콘테크(주) 이온성 액체를 이용한 금속 나노구조체의 제조방법
SG175853A1 (en) 2009-05-05 2011-12-29 Cambrios Technologies Corp Reliable and durable conductive films comprising metal nanostructures
US20110024159A1 (en) 2009-05-05 2011-02-03 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
SG178525A1 (en) 2009-08-24 2012-03-29 Cambrios Technologies Corp Purification of metal nanostructures for improved haze in transparent conductors made from the same
TW201132990A (en) 2009-08-24 2011-10-01 Cambrios Technologies Corp Contact resistance measurement for resistance linearity in nanostructure thin films
WO2011031483A2 (en) 2009-08-25 2011-03-17 Cambrios Technologies Corporation Methods for controlling metal nanostructures morphology
US8581871B2 (en) 2009-09-11 2013-11-12 Nissha Printing Co., Ltd. Narrow frame touch input sheet, manufacturing method of same, and conductive sheet used in narrow frame touch input sheet
TWI420540B (zh) 2009-09-14 2013-12-21 Ind Tech Res Inst 藉由光能或熱能成形之導電材料、導電材料之製備方法以及導電組合物
US8431925B2 (en) 2009-09-29 2013-04-30 Plextronics, Inc. Organic electronic devices, compositions, and methods
JP2011090878A (ja) 2009-10-22 2011-05-06 Fujifilm Corp 透明導電体の製造方法
US9586816B2 (en) 2009-12-04 2017-03-07 Cam Holding Corporation Nanostructure-based transparent conductors having increased haze and devices comprising the same
JP2011119142A (ja) 2009-12-04 2011-06-16 Konica Minolta Holdings Inc 透明導電基材の製造方法
TWI415969B (zh) 2009-12-23 2013-11-21 Univ Nat Taipei Technology Preparation of nanostructures
KR101992172B1 (ko) 2010-01-15 2019-06-24 캄브리오스 필름 솔루션스 코포레이션 저헤이즈 투명 도전체
CN102834472B (zh) 2010-02-05 2015-04-22 凯博瑞奥斯技术公司 光敏墨组合物和透明导体以及它们的使用方法
TWI563042B (en) * 2010-02-05 2016-12-21 Cambrios Technologies Corp Photosensitive ink compositions and transparent conductors and method of using the same
WO2011106730A2 (en) 2010-02-27 2011-09-01 Innova Dynamics, Inc . Structures with surface-embedded additives and related manufacturing methods
TWI573846B (zh) 2010-03-09 2017-03-11 西瑪奈米技術以色列有限公司 形成具有燒結添加物之透明導電塗層的方法
CN102193697A (zh) 2010-03-18 2011-09-21 宇辰光电股份有限公司 单层电容式触控装置
JP5567871B2 (ja) * 2010-03-19 2014-08-06 パナソニック株式会社 透明導電膜付き基材及びその製造方法
TWI549900B (zh) 2010-03-23 2016-09-21 坎畢歐科技公司 奈米結構透明導體之圖案化蝕刻
JP5582498B2 (ja) 2010-03-29 2014-09-03 国立大学法人信州大学 電気伝導体及びその形成方法
JP5638437B2 (ja) 2010-04-09 2014-12-10 富士フイルム株式会社 導電膜及びその製造方法、並びにタッチパネル及び太陽電池
JP2011238471A (ja) * 2010-05-11 2011-11-24 Konica Minolta Holdings Inc 透明電極の製造方法
JP2012009383A (ja) 2010-06-28 2012-01-12 Jnc Corp 塗膜形成用組成物、該組成物から得られるパターニングされた透明導電膜を有する基板の製造方法および該製造物の用途
JP2012022844A (ja) 2010-07-13 2012-02-02 Fujifilm Corp 導電膜形成用積層体及びその製造方法、並びにパターン形成方法、タッチパネル及び集積型太陽電池
KR20130132800A (ko) 2010-10-22 2013-12-05 캄브리오스 테크놀로지즈 코포레이션 나노와이어 잉크 조성물 및 이의 인쇄
TWI543199B (zh) 2010-11-02 2016-07-21 坎畢歐科技公司 供低薄片電阻應用之柵狀及奈米結構的透明導體及其形成方法
US20120127113A1 (en) 2010-11-22 2012-05-24 Industrial Technology Research Institute Flexible resistive touch sensor structure
KR101238435B1 (ko) * 2010-12-03 2013-03-04 도레이첨단소재 주식회사 투명 전도성 필름의 제조방법
JP2014505963A (ja) 2010-12-07 2014-03-06 ロディア オペレーションズ 導電性ナノ構造、そのようなナノ構造を作製するための方法、そのようなナノ構造を含有する導電性ポリマーフィルム、およびそのようなフィルムを含有する電子デバイス
US8763525B2 (en) 2010-12-15 2014-07-01 Carestream Health, Inc. Gravure printing of transparent conductive films containing networks of metal nanoparticles
WO2012083082A1 (en) 2010-12-15 2012-06-21 Sun Chemical Corporation Printable etchant compositions for etching silver nanoware-based transparent, conductive film
TW201236967A (en) 2010-12-28 2012-09-16 Applied Materials Inc Silver-nickel core-sheath nanostructures and methods to fabricate
JP2013016455A (ja) 2011-01-13 2013-01-24 Jnc Corp 透明導電膜の形成に用いられる塗膜形成用組成物
KR101795419B1 (ko) 2011-01-26 2017-11-13 주식회사 잉크테크 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막
WO2012108068A1 (ja) 2011-02-07 2012-08-16 ソニー株式会社 透明導電性素子、入力装置、電子機器および透明導電性素子作製用原盤
CN103430241B (zh) 2011-02-28 2017-08-04 无限科技全球公司 金属纳米纤维油墨、实质上透明的导体、及其制造方法
US20140054515A1 (en) 2011-02-28 2014-02-27 Nthdegree Technologies Worldwide Inc. Metallic Nanowire Ink Composition for a Substantially Transparent Conductor
SG193253A1 (en) 2011-03-04 2013-10-30 Cambrios Technologies Corp Method of tuning work function of metal nanostructure-based transparent conductor
TW201245359A (en) 2011-03-17 2012-11-16 Sumitomo Chemical Co Metal complex composition and its mixture
JP5066272B2 (ja) * 2011-03-29 2012-11-07 アルプス電気株式会社 入力装置及びその製造方法
JP2012216535A (ja) 2011-03-31 2012-11-08 Mitsubishi Chemicals Corp 金属ナノワイヤー含有透明導電膜及びその塗布液
CN102819341B (zh) 2011-06-09 2016-02-24 天津富纳源创科技有限公司 触摸屏面板的制备方法
KR20150028759A (ko) 2011-06-09 2015-03-16 이섬 리서치 디벨러프먼트 컴파니 오브 더 히브루 유니버시티 오브 예루살렘 엘티디. 상온 직접 증발식 리소그래피에 의한 연성 투명 전도성 코팅
CN102819338A (zh) 2011-06-09 2012-12-12 天津富纳源创科技有限公司 触摸屏面板及其制备方法
CN102259190A (zh) * 2011-06-16 2011-11-30 浙江科创新材料科技有限公司 一种快速大批量制备高长径比纳米银线的方法
US8466366B2 (en) 2011-06-28 2013-06-18 Innova Dynamics, Inc. Transparent conductors incorporating additives and related manufacturing methods
US9573163B2 (en) 2011-07-01 2017-02-21 Cam Holding Corporation Anisotropy reduction in coating of conductive films
KR101325536B1 (ko) 2011-07-06 2013-11-07 솔로테크 주식회사 이온성 액체를 이용한 은 나노와이어 제조방법
HK1201633A1 (en) 2011-08-24 2015-09-04 宸鸿科技控股有限公司 Patterned transparent conductors and related manufacturing methods
WO2013040245A2 (en) 2011-09-13 2013-03-21 The Regents Of The University Of California Solution process for improved nanowire electrodes and devices that use the electrodes
JP5721601B2 (ja) 2011-09-30 2015-05-20 富士フイルム株式会社 タッチパネル、及びタッチパネルの製造方法
WO2013056242A1 (en) 2011-10-13 2013-04-18 The Regents Of The University Of California Solution processed nanoparticle-nanowire composite film as a transparent conductor for opto-electronic devices
US9312426B2 (en) 2011-12-07 2016-04-12 International Business Machines Corporation Structure with a metal silicide transparent conductive electrode and a method of forming the structure
JP2013125684A (ja) 2011-12-15 2013-06-24 Jnc Corp 透明導電膜の形成に用いられる塗膜形成用組成物
KR101305710B1 (ko) 2011-12-21 2013-09-09 엘지이노텍 주식회사 나노 와이어 조성물 및 투명전극 제조 방법
KR20140109965A (ko) 2011-12-21 2014-09-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화
CN102544223B (zh) 2012-01-20 2014-04-16 华南师范大学 晶体硅太阳能电池透明电极的制备方法
US20130192423A1 (en) * 2012-01-27 2013-08-01 Blue Nano Inc. Method of producing silver nanowires
WO2013128458A1 (en) 2012-03-01 2013-09-06 Ramot At Tel-Aviv University Ltd. Conductive nanowire films
US20150017457A1 (en) 2012-03-06 2015-01-15 Dexerials Corporation Transparent conductive film, conductive element, composition, input device, display device and electronic instrument
CN104145312B (zh) 2012-03-06 2017-08-15 迪睿合电子材料有限公司 透明导电膜、导电性元件、组合物、有色自组织材料、输入装置、显示装置和电子设备
KR101991676B1 (ko) 2012-03-08 2019-06-21 주식회사 동진쎄미켐 투명 전극 형성용 전도성 잉크 조성물
KR20140138149A (ko) 2012-03-15 2014-12-03 후루카와 덴키 고교 가부시키가이샤 금속 나노 네트워크 및 그 제조 방법 및 그것을 이용한 도전 필름, 도전 기재
US9441117B2 (en) 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US9099222B2 (en) 2012-10-10 2015-08-04 Carestream Health, Inc. Patterned films and methods
CN104870361A (zh) 2012-12-14 2015-08-26 率路技术株式会社 使用离子液体制备银纳米线的方法
JP5569607B2 (ja) 2013-02-01 2014-08-13 コニカミノルタ株式会社 透明導電膜、透明導電性フィルム及びフレキシブル透明面電極
DE102013002855A1 (de) 2013-02-20 2014-08-21 Heraeus Precious Metals Gmbh & Co. Kg Formulierungen aus gewaschenen Silberdrähten und PEDOT
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US20140255707A1 (en) 2013-03-06 2014-09-11 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
US8957318B2 (en) 2013-03-13 2015-02-17 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US20150208498A1 (en) 2014-01-22 2015-07-23 Nuovo Film, Inc. Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures
US9496062B2 (en) 2014-01-22 2016-11-15 Nuovo Film, Inc. Method of making merged junction in metal nanowires
JP6353671B2 (ja) 2014-03-14 2018-07-04 Ｄｏｗａエレクトロニクス株式会社 銀ナノワイヤインクの製造方法および銀ナノワイヤインク並びに透明導電塗膜
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
US20160096967A1 (en) 2014-10-03 2016-04-07 C3Nano Inc. Property enhancing fillers for transparent coatings and transparent conductive films
US11111396B2 (en) 2014-10-17 2021-09-07 C3 Nano, Inc. Transparent films with control of light hue using nanoscale colorants
US20160122562A1 (en) 2014-10-29 2016-05-05 C3Nano Inc. Stable transparent conductive elements based on sparse metal conductive layers

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200839794A (en) * 2006-10-12 2008-10-01 Cambrios Technologies Corp Nanowire-based transparent conductors and applications thereof
TW200939251A (en) * 2007-12-27 2009-09-16 Honeywell Int Inc Transparent conductors and methods for fabricating transparent conductors
TW200946266A (en) * 2008-02-27 2009-11-16 Kuraray Co Method of manufacturing metalnanowire and dispersion medium comprising the resultant metalnanowire, and transparent conductive film
CN102481757A (zh) * 2009-07-17 2012-05-30 卡尔斯特里姆保健公司 包括水溶性粘合剂的透明导电薄膜
TW201140862A (en) * 2010-04-23 2011-11-16 Applied Materials Inc Enhanced silicon-TCO interface in thin film silicon solar cells using nickel nanowires
US20120127097A1 (en) * 2010-07-30 2012-05-24 Whitney Gaynor Conductive films
US20120132930A1 (en) * 2010-08-07 2012-05-31 Michael Eugene Young Device components with surface-embedded additives and related manufacturing methods
TW201221597A (en) * 2010-11-03 2012-06-01 Cambrios Technologies Corp Coating compositions for forming nanocomposite films

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Anuj R. Madaria, Akshay Kumar, Fumiaki N. Ishikawa, and Chongwu Zhou,"Uniform, Highly Conductive, and Patterned Transparent Films of a Percolating Silver Nanowire Network on Rigid and Flexible Substrates Using a Dry Transfer Technique,"Nano Research (2010) 3: 564–573.
C. H. Liu and X. Yu, "Silver nanowire-based transparent, flexible, and conductive thin film," Nanoscale Research Letters, 6:75-83, 2011.
C. H. Liu and X. Yu, "Silver nanowire-based transparent, flexible, and conductive thin film," Nanoscale Research Letters, 6:75-83, 2011. Xiaopeng Li, Fan Gao, Zhiyong Gu, "Nanowire Joining Methods," The Open Surface Science Journal, 2011, 3: 91-104. Anuj R. Madaria, Akshay Kumar, Fumiaki N. Ishikawa, and Chongwu Zhou,"Uniform, Highly Conductive, and Patterned Transparent Films of a Percolating Silver Nanowire Network on Rigid and Flexible Substrates Using a Dry Transfer Technique,"Nano Research (2010) 3: 564–573. *
Xiaopeng Li, Fan Gao, Zhiyong Gu, "Nanowire Joining Methods," The Open Surface Science Journal, 2011, 3: 91-104.

Also Published As

Publication number Publication date
WO2013192437A2 (en) 2013-12-27
CN104685577A (zh) 2015-06-03
US10781324B2 (en) 2020-09-22
KR20190112187A (ko) 2019-10-02
EP2864990A4 (en) 2016-04-13
US11987713B2 (en) 2024-05-21
KR102027623B1 (ko) 2019-10-01
JP6392213B2 (ja) 2018-09-19
EP2864990A2 (en) 2015-04-29
EP2864990B1 (en) 2019-10-02
US20180155558A1 (en) 2018-06-07
KR102143963B1 (ko) 2020-08-13
EP3611231A1 (en) 2020-02-19
KR20200096852A (ko) 2020-08-13
CN104685577B (zh) 2018-01-16
WO2013192437A3 (en) 2014-03-13
KR20150040865A (ko) 2015-04-15
US20200377744A1 (en) 2020-12-03
KR102376788B1 (ko) 2022-03-18
TW201405583A (zh) 2014-02-01
JP2015530693A (ja) 2015-10-15
US20130342221A1 (en) 2013-12-26
US9920207B2 (en) 2018-03-20
EP3611231B1 (en) 2022-09-14

Similar Documents

Publication Publication Date Title
TWI627640B (zh) 金屬奈米結構化之網絡及透明導電材料
US11968787B2 (en) Metal nanowire networks and transparent conductive material
JP6657336B2 (ja) 融着金属ナノ構造化ネットワーク、および還元剤を有する融着溶液
JP6644684B2 (ja) 金属ナノワイヤおよびポリマーバインダーを主成分とする透明導電性コーティング、その溶液処理、およびパターン化方法
US9318230B2 (en) Nanostructure dispersions and transparent conductors
TW201200467A (en) Nanowire-based transparent conductors and methods of patterning same
HK40023116A (en) Metal nanostructured networks and transparent conductive material
HK40023116B (en) Metal nanostructured networks and transparent conductive material
Cann Laser ablation processes of silver nanowire transparent conductors for capacitive touch sensors.