TWI625240B - 積層體之製造方法及製造裝置 - Google Patents

積層體之製造方法及製造裝置 Download PDF

Info

Publication number
TWI625240B
TWI625240B TW102104082A TW102104082A TWI625240B TW I625240 B TWI625240 B TW I625240B TW 102104082 A TW102104082 A TW 102104082A TW 102104082 A TW102104082 A TW 102104082A TW I625240 B TWI625240 B TW I625240B
Authority
TW
Taiwan
Prior art keywords
surface material
bonding
laminated body
resin layer
manufacturing
Prior art date
Application number
TW102104082A
Other languages
English (en)
Chinese (zh)
Other versions
TW201338984A (zh
Inventor
Yasunori Ito
Yu Nojiri
Kazuyuki Asano
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201338984A publication Critical patent/TW201338984A/zh
Application granted granted Critical
Publication of TWI625240B publication Critical patent/TWI625240B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Electroluminescent Light Sources (AREA)
TW102104082A 2012-02-01 2013-02-01 積層體之製造方法及製造裝置 TWI625240B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012020014 2012-02-01

Publications (2)

Publication Number Publication Date
TW201338984A TW201338984A (zh) 2013-10-01
TWI625240B true TWI625240B (zh) 2018-06-01

Family

ID=48905109

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102104082A TWI625240B (zh) 2012-02-01 2013-02-01 積層體之製造方法及製造裝置

Country Status (5)

Country Link
JP (1) JP6136936B2 (ja)
KR (1) KR102050770B1 (ja)
CN (1) CN104093569B (ja)
TW (1) TWI625240B (ja)
WO (1) WO2013115068A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102181329B1 (ko) * 2013-12-27 2020-11-20 엘지디스플레이 주식회사 라미네이션 장치
JP2015157451A (ja) * 2014-02-25 2015-09-03 旭硝子株式会社 積層体の製造方法、積層体、および粘着層付き透明面材
DE102015205041A1 (de) * 2015-03-19 2016-09-22 Via Optronics Gmbh Laminiervorrichtung
JP6720741B2 (ja) * 2015-08-07 2020-07-08 Ａｇｃ株式会社 積層板および中間膜
JP6834609B2 (ja) * 2017-03-07 2021-02-24 デクセリアルズ株式会社 画像表示装置の製造方法
KR102264217B1 (ko) 2018-05-24 2021-06-11 주식회사 엘지화학 기능성층이 구비된 곡면 박판 유리의 제조 방법 및 기능성층이 구비된 곡면 접합 유리의 제조 방법
CN110683230B (zh) * 2019-11-19 2021-06-22 盐城工业职业技术学院 一种用于海上运输的防霉变集装箱

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07242350A (ja) * 1994-03-07 1995-09-19 Sakura Seiki Kk 薄板の剥離及び貼付け方法
JP2002260306A (ja) * 2001-03-02 2002-09-13 Sony Corp 光ディスクの製造方法および光ディスクの製造装置
JP2004153159A (ja) * 2002-10-31 2004-05-27 Enzan Seisakusho:Kk 半導体ウェハの保護部材貼着方法及びその装置
JP2004296139A (ja) * 2003-03-25 2004-10-21 Sony Corp 貼合装置および貼合方法、ならびに表示装置の製造方法
JP2008152130A (ja) * 2006-12-19 2008-07-03 Ricoh Co Ltd ワークの貼り合わせ方法、ワーク貼り合わせ装置、偏光板ユニット及びプロジェクタ
JP2009294551A (ja) * 2008-06-06 2009-12-17 Kuraimu Prod Kk ワーク貼合装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137035A (ja) * 1983-12-26 1985-07-20 Toshiba Ceramics Co Ltd ウエ−ハ接着装置
JPS6181474A (ja) * 1984-09-28 1986-04-25 Toshiba Ceramics Co Ltd ウエ−ハ接着装置
JPS62134252A (ja) * 1985-12-06 1987-06-17 ラヴィ　アクチエンゲゼルシャフト 積層物形成方法及び装置
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
JPH0622200B2 (ja) * 1988-03-25 1994-03-23 ソマール株式会社 薄膜張付方法及びその実施装置
JPH0582493A (ja) * 1991-03-11 1993-04-02 Hitachi Ltd ウエハ接着装置およびその装置を用いたウエハの接着方法
JP3932660B2 (ja) 1998-03-30 2007-06-20 株式会社デンソー Ｅｌ表示装置の製造方法
JP2000191985A (ja) * 1998-12-25 2000-07-11 Seiko Epson Corp 部材の貼り合わせ方法、貼り合わせ体の製造方法及び貼り合わせ装置
JP2002313688A (ja) * 2001-04-16 2002-10-25 Toshiba Corp ウェーハ接着装置
JP2003005145A (ja) * 2001-06-25 2003-01-08 Sharp Corp 基板貼付装置および基板貼付方法
JP4218285B2 (ja) * 2002-08-26 2009-02-04 株式会社日立プラントテクノロジー 基板貼り合わせ方法及びその装置
JP4666519B2 (ja) * 2006-09-08 2011-04-06 リンテック株式会社 シート貼付装置
JP4841412B2 (ja) * 2006-12-06 2011-12-21 日東電工株式会社 基板貼合せ装置
JP2009180911A (ja) 2008-01-30 2009-08-13 Toray Eng Co Ltd 基板貼合せ方法、基板貼合せ装置、及びこれらの方法または装置を用いて製作したディスプレイ装置
JP2010018740A (ja) * 2008-07-11 2010-01-28 Fujitsu Ltd 貼り合わせ装置及び貼り合わせ方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07242350A (ja) * 1994-03-07 1995-09-19 Sakura Seiki Kk 薄板の剥離及び貼付け方法
JP2002260306A (ja) * 2001-03-02 2002-09-13 Sony Corp 光ディスクの製造方法および光ディスクの製造装置
JP2004153159A (ja) * 2002-10-31 2004-05-27 Enzan Seisakusho:Kk 半導体ウェハの保護部材貼着方法及びその装置
JP2004296139A (ja) * 2003-03-25 2004-10-21 Sony Corp 貼合装置および貼合方法、ならびに表示装置の製造方法
JP2008152130A (ja) * 2006-12-19 2008-07-03 Ricoh Co Ltd ワークの貼り合わせ方法、ワーク貼り合わせ装置、偏光板ユニット及びプロジェクタ
JP2009294551A (ja) * 2008-06-06 2009-12-17 Kuraimu Prod Kk ワーク貼合装置

Also Published As

Publication number Publication date
JP6136936B2 (ja) 2017-05-31
JPWO2013115068A1 (ja) 2015-05-11
KR102050770B1 (ko) 2019-12-02
KR20140119088A (ko) 2014-10-08
CN104093569B (zh) 2016-11-16
WO2013115068A1 (ja) 2013-08-08
TW201338984A (zh) 2013-10-01
CN104093569A (zh) 2014-10-08

Similar Documents

Publication Publication Date Title
TWI625240B (zh) 積層體之製造方法及製造裝置
JP5513136B2 (ja) エンハンスメント積層表示装置システムを生成する方法
US20090283211A1 (en) Method of Manufacturing a Display Device and Bonding Method
KR20200068026A (ko) 곡선면 라미네이팅 장치 및 방법
JPWO2009078195A1 (ja) 粘着シート及び表示装置
US20180107047A1 (en) Adhesive Tape, Fabricating Method Thereof, and Display Device
US20090186218A1 (en) Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
JP2010062269A (ja) ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
TWI317353B (ja)
TW201346004A (zh) 附黏著層之透明面材、顯示裝置及彼等之製造方法
JPWO2014054592A1 (ja) 粘着層付き透明面材、その製造方法および表示装置
JP6209154B2 (ja) 基板貼合装置、表示パネル製造装置及び表示パネル製造方法
KR101871967B1 (ko) 개선된 곡면 커버 부재의 합착 장치
JP2000241822A (ja) 液晶パネルの製造方法
JP2012136622A (ja) ガラスパネル材の貼り合せ構造とその貼り合せ方法
KR20090110635A (ko) 양면 점착 시트, 이를 이용한 표시 장치 및 그 제조 방법
JP6692709B2 (ja) 接合体の製造方法、接続方法
JP5864986B2 (ja) シート状部材の凹凸追従性評価方法および該方法に用いる評価装置
JP2010090344A (ja) 両面粘着テープ、表示装置、貼り合わせ基板の製造方法及び表示装置の製造方法
CN112698519B (zh) 显示器层压装置及利用此的支撑卡盘平衡方法
JP5384930B2 (ja) 液晶パネル積層体の製造方法並びにその装置
KR101090937B1 (ko) 구조화된 광학 시트의 패키지 및 그 제조 방법
CN112157898A (zh) 一种用于液晶显示器保护部件的粘贴方法
JP2002296601A (ja) 液晶基板の貼り合わせ方法
CN221239163U (zh) 显示面板及显示装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees