TWI620262B - 用於較小晶圓及晶圓片之晶圓載具 - Google Patents

用於較小晶圓及晶圓片之晶圓載具 Download PDF

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Publication number
TWI620262B
TWI620262B TW106112325A TW106112325A TWI620262B TW I620262 B TWI620262 B TW I620262B TW 106112325 A TW106112325 A TW 106112325A TW 106112325 A TW106112325 A TW 106112325A TW I620262 B TWI620262 B TW I620262B
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TW
Taiwan
Prior art keywords
region
top surface
carrier
electrode assembly
substrate
Prior art date
Application number
TW106112325A
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English (en)
Chinese (zh)
Other versions
TW201732992A (zh
Inventor
寇克斯麥可Ｓ
Michael S. Cox
坎博費勒查利Ａ
Cheryl A. Knepfler
Original Assignee
應用材料股份有限公司
Applied Materials, Inc.
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Filing date
Publication date
Application filed by 應用材料股份有限公司, Applied Materials, Inc. filed Critical 應用材料股份有限公司
Publication of TW201732992A publication Critical patent/TW201732992A/zh
Application granted granted Critical
Publication of TWI620262B publication Critical patent/TWI620262B/zh

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    • H10P72/722—
    • H10P72/3218—
    • H10P72/33—
    • H10P72/3306—
    • H10P72/74—
    • H10P72/78—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106112325A 2013-12-06 2014-10-29 用於較小晶圓及晶圓片之晶圓載具 TWI620262B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/099,856 2013-12-06
US14/099,856 US9460950B2 (en) 2013-12-06 2013-12-06 Wafer carrier for smaller wafers and wafer pieces

Publications (2)

Publication Number Publication Date
TW201732992A TW201732992A (zh) 2017-09-16
TWI620262B true TWI620262B (zh) 2018-04-01

Family

ID=53271907

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106112325A TWI620262B (zh) 2013-12-06 2014-10-29 用於較小晶圓及晶圓片之晶圓載具
TW103137451A TWI600110B (zh) 2013-12-06 2014-10-29 用於較小晶圓及晶圓片之晶圓載具

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103137451A TWI600110B (zh) 2013-12-06 2014-10-29 用於較小晶圓及晶圓片之晶圓載具

Country Status (6)

Country Link
US (2) US9460950B2 (enExample)
JP (1) JP6656153B2 (enExample)
KR (2) KR101757378B1 (enExample)
CN (1) CN105793974B (enExample)
TW (2) TWI620262B (enExample)
WO (1) WO2015084463A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9740111B2 (en) * 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
WO2018141366A1 (en) * 2017-01-31 2018-08-09 Applied Materials, Inc. Substrate carrier and method of processing a substrate
US11127620B2 (en) * 2017-06-19 2021-09-21 Applied Materials, Inc. Electrostatic chuck for high temperature processing chamber
US20180374736A1 (en) * 2017-06-22 2018-12-27 Applied Materials, Inc. Electrostatic carrier for die bonding applications
CN111128834B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 微元件转移设备及其制作方法
CN109545731B (zh) * 2018-11-20 2021-12-28 合肥京东方显示技术有限公司 转移头及其制备方法、转移方法、转移装置
US12125728B2 (en) * 2019-01-21 2024-10-22 Applied Materials, Inc. Substrate carrier
EP3953745A4 (en) * 2019-04-11 2023-04-26 Applied Materials, Inc. MULTILAYER FILM FOR OPTICAL DEVICES
CN110137130B (zh) * 2019-05-15 2020-12-29 江苏鲁汶仪器有限公司 一种干法刻蚀系统用尺寸转换托盘
JP7350438B2 (ja) * 2019-09-09 2023-09-26 株式会社ディスコ チャックテーブル及びチャックテーブルの製造方法
KR102842706B1 (ko) * 2020-05-18 2025-08-06 삼성디스플레이 주식회사 정전척
CN112117230B (zh) * 2020-10-19 2025-01-24 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置
KR102327829B1 (ko) * 2020-11-02 2021-11-17 주식회사 엘케이엔지니어링 정전척
JP7529912B1 (ja) * 2023-01-12 2024-08-06 日本碍子株式会社 ウエハ載置台
US20250391699A1 (en) * 2024-06-20 2025-12-25 Applied Materials Israel Ltd. Hybrid vacuum electrostatic chuck carrier for high warpage wafers
US20250391692A1 (en) * 2024-06-20 2025-12-25 Applied Materials Israel Ltd. Hybrid vacuum electrostatic chuck in vacuum chamber for high warpage wafers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6487063B1 (en) * 1999-11-16 2002-11-26 Nikon Corporation Electrostatic wafer chuck, and charged-particle-beam microlithography apparatus and methods comprising same
JP2004200620A (ja) * 2002-12-20 2004-07-15 Kyocera Corp 静電チャックおよびその製造方法
JP2010165805A (ja) * 2009-01-14 2010-07-29 Toto Ltd 静電チャックおよび静電チャックの製造方法
JP2012248741A (ja) * 2011-05-30 2012-12-13 Panasonic Corp プラズマ処理装置、搬送キャリア、及びプラズマ処理方法

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619655A (ja) * 1984-06-25 1986-01-17 Nippon Telegr & Teleph Corp <Ntt> 物体の固定方法および固定機構
JP2574407B2 (ja) * 1988-07-05 1997-01-22 富士通株式会社 電子ビーム露光装置用ウェハーホルダ
JP2535663B2 (ja) * 1990-10-02 1996-09-18 株式会社アビサレ 掲示装置
JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH07257751A (ja) 1994-03-18 1995-10-09 Kanagawa Kagaku Gijutsu Akad 静電浮上搬送装置及びその静電浮上用電極
JPH07297266A (ja) * 1994-04-28 1995-11-10 Fujitsu Ltd 静電チャックとウェハ吸着方法
US5751538A (en) * 1996-09-26 1998-05-12 Nikon Corporation Mask holding device and method for holding mask
US5886866A (en) 1998-07-06 1999-03-23 Applied Materials, Inc. Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
JP4296628B2 (ja) 1999-04-01 2009-07-15 住友電気工業株式会社 フレキシブルプリント配線板の製造方法
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
JP2001118776A (ja) * 1999-10-19 2001-04-27 Nikon Corp 転写型露光装置および該装置に使用されるマスク保持機構、および半導体素子の製造方法。
KR20020046214A (ko) 2000-12-11 2002-06-20 어드밴스드 세라믹스 인터내셔날 코포레이션 정전척 및 그 제조방법
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP2003037159A (ja) * 2001-07-25 2003-02-07 Toto Ltd 静電チャックユニット
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
TWI327336B (en) * 2003-01-13 2010-07-11 Oc Oerlikon Balzers Ag Arrangement for processing a substrate
WO2005004229A1 (ja) 2003-07-08 2005-01-13 Future Vision Inc. 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム
US20070223173A1 (en) 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck
JP2005285825A (ja) 2004-03-26 2005-10-13 Advantest Corp 静電チャック及び静電チャックによる基板固定方法
KR20060018338A (ko) * 2004-08-24 2006-03-02 동부아남반도체 주식회사 웨이퍼 고정용 정전척
CN100576486C (zh) 2005-05-20 2009-12-30 筑波精工株式会社 静电保持装置以及使用其的静电钳
JP4667140B2 (ja) 2005-06-30 2011-04-06 キヤノン株式会社 露光装置およびデバイス製造方法
CN101326627B (zh) 2005-12-06 2010-06-09 创意科技股份有限公司 静电卡盘用电极片以及静电卡盘
JP2007234940A (ja) * 2006-03-02 2007-09-13 Seiko Epson Corp ウエハ処理装置
JP4802018B2 (ja) 2006-03-09 2011-10-26 筑波精工株式会社 静電保持装置及びそれを用いた真空環境装置並びにアライメント装置又は貼り合わせ装置
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
KR101000094B1 (ko) 2007-08-08 2010-12-09 엘아이지에이디피 주식회사 기판 증착장치
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
JP5283699B2 (ja) 2008-07-08 2013-09-04 株式会社クリエイティブ テクノロジー 双極型静電チャック
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
JP2010219253A (ja) * 2009-03-16 2010-09-30 Tokyo Seimitsu Co Ltd プローブ検査方法およびプローバ
JP4709945B2 (ja) 2009-04-13 2011-06-29 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
JP5597502B2 (ja) * 2009-09-30 2014-10-01 京セラ株式会社 吸着用部材およびこれを用いた吸着装置、並びに光照射装置および荷電粒子線装置
KR20110099974A (ko) * 2010-03-03 2011-09-09 주식회사 코미코 정전척 및 이의 제조 방법
US20120227886A1 (en) 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
US20130107415A1 (en) 2011-10-28 2013-05-02 Applied Materials, Inc. Electrostatic chuck
US8902561B2 (en) * 2012-02-02 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic chuck with multi-zone control
KR102072872B1 (ko) * 2012-04-26 2020-02-03 인테벡, 인코포레이티드 진공 처리용 시스템 아키텍처
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
WO2015020813A1 (en) 2013-08-06 2015-02-12 Applied Materials, Inc. Locally heated multi-zone substrate support
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6487063B1 (en) * 1999-11-16 2002-11-26 Nikon Corporation Electrostatic wafer chuck, and charged-particle-beam microlithography apparatus and methods comprising same
JP2004200620A (ja) * 2002-12-20 2004-07-15 Kyocera Corp 静電チャックおよびその製造方法
JP2010165805A (ja) * 2009-01-14 2010-07-29 Toto Ltd 静電チャックおよび静電チャックの製造方法
JP2012248741A (ja) * 2011-05-30 2012-12-13 Panasonic Corp プラズマ処理装置、搬送キャリア、及びプラズマ処理方法

Also Published As

Publication number Publication date
JP6656153B2 (ja) 2020-03-04
CN105793974A (zh) 2016-07-20
US20160365269A1 (en) 2016-12-15
TW201523787A (zh) 2015-06-16
US10236201B2 (en) 2019-03-19
TW201732992A (zh) 2017-09-16
CN105793974B (zh) 2020-01-10
US20150162231A1 (en) 2015-06-11
KR20170020552A (ko) 2017-02-22
JP2017501572A (ja) 2017-01-12
WO2015084463A1 (en) 2015-06-11
US9460950B2 (en) 2016-10-04
KR20160093711A (ko) 2016-08-08
TWI600110B (zh) 2017-09-21
KR101757378B1 (ko) 2017-07-12

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