CN105793974B - 用于较小晶片及晶片片段的晶片载具 - Google Patents

用于较小晶片及晶片片段的晶片载具 Download PDF

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Publication number
CN105793974B
CN105793974B CN201480065526.6A CN201480065526A CN105793974B CN 105793974 B CN105793974 B CN 105793974B CN 201480065526 A CN201480065526 A CN 201480065526A CN 105793974 B CN105793974 B CN 105793974B
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China
Prior art keywords
carrier
clamping
substrate
electrode assembly
electrostatic
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Chinese (zh)
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CN105793974A (zh
Inventor
迈克尔·S·考克斯
谢丽尔·A·克内佩弗莱雷
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201480065526.6A 2013-12-06 2014-09-19 用于较小晶片及晶片片段的晶片载具 Active CN105793974B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/099,856 2013-12-06
US14/099,856 US9460950B2 (en) 2013-12-06 2013-12-06 Wafer carrier for smaller wafers and wafer pieces
PCT/US2014/056607 WO2015084463A1 (en) 2013-12-06 2014-09-19 Wafer carrier for smaller wafers and wafer pieces

Publications (2)

Publication Number Publication Date
CN105793974A CN105793974A (zh) 2016-07-20
CN105793974B true CN105793974B (zh) 2020-01-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480065526.6A Active CN105793974B (zh) 2013-12-06 2014-09-19 用于较小晶片及晶片片段的晶片载具

Country Status (6)

Country Link
US (2) US9460950B2 (enExample)
JP (1) JP6656153B2 (enExample)
KR (2) KR101757378B1 (enExample)
CN (1) CN105793974B (enExample)
TW (2) TWI600110B (enExample)
WO (1) WO2015084463A1 (enExample)

Families Citing this family (16)

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US9740111B2 (en) * 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
WO2018141366A1 (en) * 2017-01-31 2018-08-09 Applied Materials, Inc. Substrate carrier and method of processing a substrate
TWI801390B (zh) * 2017-06-19 2023-05-11 美商應用材料股份有限公司 用於高溫處理腔室的靜電吸座及其形成方法
WO2018236670A1 (en) * 2017-06-22 2018-12-27 Applied Materials, Inc. ELECTROSTATIC SUPPORT FOR FIXING APPLICATIONS OF CHIPS
CN111128834B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 微元件转移设备及其制作方法
CN109545731B (zh) * 2018-11-20 2021-12-28 合肥京东方显示技术有限公司 转移头及其制备方法、转移方法、转移装置
US12125728B2 (en) * 2019-01-21 2024-10-22 Applied Materials, Inc. Substrate carrier
WO2020210309A1 (en) 2019-04-11 2020-10-15 Applied Materials, Inc. Multi-depth film for optical devices
CN110137130B (zh) * 2019-05-15 2020-12-29 江苏鲁汶仪器有限公司 一种干法刻蚀系统用尺寸转换托盘
JP7350438B2 (ja) * 2019-09-09 2023-09-26 株式会社ディスコ チャックテーブル及びチャックテーブルの製造方法
KR102842706B1 (ko) * 2020-05-18 2025-08-06 삼성디스플레이 주식회사 정전척
CN112117230B (zh) * 2020-10-19 2025-01-24 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置
KR102327829B1 (ko) * 2020-11-02 2021-11-17 주식회사 엘케이엔지니어링 정전척
KR102739442B1 (ko) * 2023-01-12 2024-12-10 엔지케이 인슐레이터 엘티디 웨이퍼 적재대
US20250391692A1 (en) * 2024-06-20 2025-12-25 Applied Materials Israel Ltd. Hybrid vacuum electrostatic chuck in vacuum chamber for high warpage wafers
US20250391699A1 (en) * 2024-06-20 2025-12-25 Applied Materials Israel Ltd. Hybrid vacuum electrostatic chuck carrier for high warpage wafers

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Publication number Priority date Publication date Assignee Title
US5751538A (en) * 1996-09-26 1998-05-12 Nikon Corporation Mask holding device and method for holding mask
US6487063B1 (en) * 1999-11-16 2002-11-26 Nikon Corporation Electrostatic wafer chuck, and charged-particle-beam microlithography apparatus and methods comprising same
JP2010219253A (ja) * 2009-03-16 2010-09-30 Tokyo Seimitsu Co Ltd プローブ検査方法およびプローバ
JP2012248741A (ja) * 2011-05-30 2012-12-13 Panasonic Corp プラズマ処理装置、搬送キャリア、及びプラズマ処理方法

Also Published As

Publication number Publication date
KR20160093711A (ko) 2016-08-08
KR20170020552A (ko) 2017-02-22
WO2015084463A1 (en) 2015-06-11
TWI600110B (zh) 2017-09-21
US9460950B2 (en) 2016-10-04
TWI620262B (zh) 2018-04-01
US10236201B2 (en) 2019-03-19
TW201732992A (zh) 2017-09-16
KR101757378B1 (ko) 2017-07-12
TW201523787A (zh) 2015-06-16
US20160365269A1 (en) 2016-12-15
JP6656153B2 (ja) 2020-03-04
JP2017501572A (ja) 2017-01-12
US20150162231A1 (en) 2015-06-11
CN105793974A (zh) 2016-07-20

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