KR101757378B1 - 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어 - Google Patents

보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어 Download PDF

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KR101757378B1
KR101757378B1 KR1020167017937A KR20167017937A KR101757378B1 KR 101757378 B1 KR101757378 B1 KR 101757378B1 KR 1020167017937 A KR1020167017937 A KR 1020167017937A KR 20167017937 A KR20167017937 A KR 20167017937A KR 101757378 B1 KR101757378 B1 KR 101757378B1
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substrate
carrier
chucking
electrode assembly
mask
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Korean (ko)
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KR20160093711A (ko
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마이클 에스. 콕스
체릴 에이. 크넵플레어
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020167017937A 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어 Active KR101757378B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/099,856 US9460950B2 (en) 2013-12-06 2013-12-06 Wafer carrier for smaller wafers and wafer pieces
US14/099,856 2013-12-06
PCT/US2014/056607 WO2015084463A1 (en) 2013-12-06 2014-09-19 Wafer carrier for smaller wafers and wafer pieces

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020177004117A Division KR20170020552A (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어

Publications (2)

Publication Number Publication Date
KR20160093711A KR20160093711A (ko) 2016-08-08
KR101757378B1 true KR101757378B1 (ko) 2017-07-12

Family

ID=53271907

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177004117A Ceased KR20170020552A (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어
KR1020167017937A Active KR101757378B1 (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020177004117A Ceased KR20170020552A (ko) 2013-12-06 2014-09-19 보다 작은 웨이퍼들 및 웨이퍼 피스들을 위한 웨이퍼 캐리어

Country Status (6)

Country Link
US (2) US9460950B2 (enExample)
JP (1) JP6656153B2 (enExample)
KR (2) KR20170020552A (enExample)
CN (1) CN105793974B (enExample)
TW (2) TWI600110B (enExample)
WO (1) WO2015084463A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9740111B2 (en) * 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
KR20200102557A (ko) * 2017-01-31 2020-08-31 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 및 기판을 프로세싱하는 방법
TWI801390B (zh) * 2017-06-19 2023-05-11 美商應用材料股份有限公司 用於高溫處理腔室的靜電吸座及其形成方法
JP2020524898A (ja) * 2017-06-22 2020-08-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ダイ結合用途のための静電キャリア
CN111128834B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 微元件转移设备及其制作方法
CN109545731B (zh) * 2018-11-20 2021-12-28 合肥京东方显示技术有限公司 转移头及其制备方法、转移方法、转移装置
US12125728B2 (en) * 2019-01-21 2024-10-22 Applied Materials, Inc. Substrate carrier
WO2020210309A1 (en) 2019-04-11 2020-10-15 Applied Materials, Inc. Multi-depth film for optical devices
CN110137130B (zh) * 2019-05-15 2020-12-29 江苏鲁汶仪器有限公司 一种干法刻蚀系统用尺寸转换托盘
JP7350438B2 (ja) * 2019-09-09 2023-09-26 株式会社ディスコ チャックテーブル及びチャックテーブルの製造方法
KR102842706B1 (ko) * 2020-05-18 2025-08-06 삼성디스플레이 주식회사 정전척
CN112117230B (zh) * 2020-10-19 2025-01-24 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置
KR102327829B1 (ko) * 2020-11-02 2021-11-17 주식회사 엘케이엔지니어링 정전척
KR102739442B1 (ko) * 2023-01-12 2024-12-10 엔지케이 인슐레이터 엘티디 웨이퍼 적재대

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433346B1 (en) 1999-10-19 2002-08-13 Nikon Corporation Electrostatic reticle chucks, charged-particle-beam microlithography apparatus and methods, and semiconductor-device manufacturing methods comprising same
JP2011091410A (ja) 2009-04-13 2011-05-06 Panasonic Corp プラズマ処理装置及びプラズマ処理方法
US20130107415A1 (en) 2011-10-28 2013-05-02 Applied Materials, Inc. Electrostatic chuck

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619655A (ja) * 1984-06-25 1986-01-17 Nippon Telegr & Teleph Corp <Ntt> 物体の固定方法および固定機構
JP2574407B2 (ja) * 1988-07-05 1997-01-22 富士通株式会社 電子ビーム露光装置用ウェハーホルダ
JP2535663B2 (ja) * 1990-10-02 1996-09-18 株式会社アビサレ 掲示装置
JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH07257751A (ja) 1994-03-18 1995-10-09 Kanagawa Kagaku Gijutsu Akad 静電浮上搬送装置及びその静電浮上用電極
JPH07297266A (ja) * 1994-04-28 1995-11-10 Fujitsu Ltd 静電チャックとウェハ吸着方法
US5751538A (en) * 1996-09-26 1998-05-12 Nikon Corporation Mask holding device and method for holding mask
US5886866A (en) 1998-07-06 1999-03-23 Applied Materials, Inc. Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
JP4296628B2 (ja) 1999-04-01 2009-07-15 住友電気工業株式会社 フレキシブルプリント配線板の製造方法
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
JP2001144168A (ja) * 1999-11-16 2001-05-25 Nikon Corp 静電チャック、それを有する荷電粒子線露光装置、ウエハ保持方法及びそれを用いたデバイス製造方法
US6678143B2 (en) 2000-12-11 2004-01-13 General Electric Company Electrostatic chuck and method of manufacturing the same
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP2003037159A (ja) * 2001-07-25 2003-02-07 Toto Ltd 静電チャックユニット
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
JP4099053B2 (ja) * 2002-12-20 2008-06-11 京セラ株式会社 静電チャックの製造方法
TWI327336B (en) * 2003-01-13 2010-07-11 Oc Oerlikon Balzers Ag Arrangement for processing a substrate
US7916447B2 (en) 2003-07-08 2011-03-29 Future Vision Inc. Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
JP4684222B2 (ja) 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
JP2005285825A (ja) 2004-03-26 2005-10-13 Advantest Corp 静電チャック及び静電チャックによる基板固定方法
KR20060018338A (ko) * 2004-08-24 2006-03-02 동부아남반도체 주식회사 웨이퍼 고정용 정전척
CN100576486C (zh) 2005-05-20 2009-12-30 筑波精工株式会社 静电保持装置以及使用其的静电钳
JP4667140B2 (ja) 2005-06-30 2011-04-06 キヤノン株式会社 露光装置およびデバイス製造方法
KR100994299B1 (ko) 2005-12-06 2010-11-12 가부시키가이샤 크리에이티브 테크놀러지 정전척용 전극 시트 및 정전척
JP2007234940A (ja) * 2006-03-02 2007-09-13 Seiko Epson Corp ウエハ処理装置
JP4802018B2 (ja) 2006-03-09 2011-10-26 筑波精工株式会社 静電保持装置及びそれを用いた真空環境装置並びにアライメント装置又は貼り合わせ装置
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
KR101000094B1 (ko) 2007-08-08 2010-12-09 엘아이지에이디피 주식회사 기판 증착장치
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
EP2306505A4 (en) 2008-07-08 2011-09-14 Creative Tech Corp BIPOLAR ELECTROSTATIC CHUCK
JP5293211B2 (ja) * 2009-01-14 2013-09-18 Ｔｏｔｏ株式会社 静電チャックおよび静電チャックの製造方法
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
JP2010219253A (ja) * 2009-03-16 2010-09-30 Tokyo Seimitsu Co Ltd プローブ検査方法およびプローバ
JP5597502B2 (ja) * 2009-09-30 2014-10-01 京セラ株式会社 吸着用部材およびこれを用いた吸着装置、並びに光照射装置および荷電粒子線装置
KR20110099974A (ko) * 2010-03-03 2011-09-09 주식회사 코미코 정전척 및 이의 제조 방법
US20120227886A1 (en) 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP5528394B2 (ja) * 2011-05-30 2014-06-25 パナソニック株式会社 プラズマ処理装置、搬送キャリア、及びプラズマ処理方法
US8902561B2 (en) * 2012-02-02 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic chuck with multi-zone control
SG11201406893XA (en) * 2012-04-26 2014-11-27 Intevac Inc System architecture for vacuum processing
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
KR20180110213A (ko) 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6433346B1 (en) 1999-10-19 2002-08-13 Nikon Corporation Electrostatic reticle chucks, charged-particle-beam microlithography apparatus and methods, and semiconductor-device manufacturing methods comprising same
JP2011091410A (ja) 2009-04-13 2011-05-06 Panasonic Corp プラズマ処理装置及びプラズマ処理方法
US20130107415A1 (en) 2011-10-28 2013-05-02 Applied Materials, Inc. Electrostatic chuck

Also Published As

Publication number Publication date
US10236201B2 (en) 2019-03-19
TW201523787A (zh) 2015-06-16
US20150162231A1 (en) 2015-06-11
TWI620262B (zh) 2018-04-01
TWI600110B (zh) 2017-09-21
CN105793974B (zh) 2020-01-10
KR20170020552A (ko) 2017-02-22
US20160365269A1 (en) 2016-12-15
US9460950B2 (en) 2016-10-04
KR20160093711A (ko) 2016-08-08
TW201732992A (zh) 2017-09-16
JP2017501572A (ja) 2017-01-12
JP6656153B2 (ja) 2020-03-04
CN105793974A (zh) 2016-07-20
WO2015084463A1 (en) 2015-06-11

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