TWI618905B - Substrate processing device - Google Patents

Substrate processing device Download PDF

Info

Publication number
TWI618905B
TWI618905B TW104139421A TW104139421A TWI618905B TW I618905 B TWI618905 B TW I618905B TW 104139421 A TW104139421 A TW 104139421A TW 104139421 A TW104139421 A TW 104139421A TW I618905 B TWI618905 B TW I618905B
Authority
TW
Taiwan
Prior art keywords
substrate
gas supply
gas
processing chamber
supply unit
Prior art date
Application number
TW104139421A
Other languages
English (en)
Chinese (zh)
Other versions
TW201706548A (zh
Inventor
Ryuhei Takahara
Yukinobu Nishibe
Akinori Iso
Kenji Sakashita
Daiki Matsuda
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201706548A publication Critical patent/TW201706548A/zh
Application granted granted Critical
Publication of TWI618905B publication Critical patent/TWI618905B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW104139421A 2015-01-28 2015-11-26 Substrate processing device TWI618905B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015014155 2015-01-28
JP2015184630A JP6209572B2 (ja) 2015-01-28 2015-09-18 基板処理装置

Publications (2)

Publication Number Publication Date
TW201706548A TW201706548A (zh) 2017-02-16
TWI618905B true TWI618905B (zh) 2018-03-21

Family

ID=56686152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104139421A TWI618905B (zh) 2015-01-28 2015-11-26 Substrate processing device

Country Status (3)

Country Link
JP (2) JP6209572B2 (ja)
CN (1) CN105826168B (ja)
TW (1) TWI618905B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807215B (zh) * 2017-04-28 2021-01-29 苏州均晟豪智能科技有限公司 处理装置
CN107065433B (zh) * 2017-05-08 2021-01-26 京东方科技集团股份有限公司 干燥装置
JP7031831B1 (ja) 2021-03-16 2022-03-08 株式会社アルフテクノ 乾燥装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW369669B (en) * 1997-03-31 1999-09-11 Nec Lcd Technologies Ltd Substrate drying device and method
JP2002022359A (ja) * 2000-07-07 2002-01-23 Matsushita Electric Ind Co Ltd 基板の乾燥装置
JP3754905B2 (ja) * 2001-09-10 2006-03-15 東京エレクトロン株式会社 基板乾燥装置
TWI285136B (en) * 2005-03-30 2007-08-11 Dainippon Screen Mfg Substrate processing equipment
JP2008029922A (ja) * 2006-07-26 2008-02-14 Shibaura Mechatronics Corp 基板の処理装置
TWI321641B (ja) * 2003-06-27 2010-03-11 Tokyo Ohka Kogyo Co Ltd
CN201561627U (zh) * 2009-12-17 2010-08-25 无锡尚德太阳能电力有限公司 硅片吹干系统
TWI372318B (en) * 2006-12-22 2012-09-11 Tokyo Electron Ltd Decompression drying device
JP2013045877A (ja) * 2011-08-24 2013-03-04 Tokyo Electron Ltd 基板処理装置
CN203672080U (zh) * 2014-01-06 2014-06-25 宇宙电路板设备(深圳)有限公司 触控面板用烘干装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919273Y2 (ja) * 1979-10-03 1984-06-04 株式会社阪田商会 乾燥装置
JP4382306B2 (ja) * 2001-07-05 2009-12-09 Ｎｅｃ液晶テクノロジー株式会社 薬液塗布方法及びその塗布装置
JP4229670B2 (ja) * 2002-09-30 2009-02-25 株式会社日本設計工業 薄板状材の搬送方法及び装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW369669B (en) * 1997-03-31 1999-09-11 Nec Lcd Technologies Ltd Substrate drying device and method
JP2002022359A (ja) * 2000-07-07 2002-01-23 Matsushita Electric Ind Co Ltd 基板の乾燥装置
JP3754905B2 (ja) * 2001-09-10 2006-03-15 東京エレクトロン株式会社 基板乾燥装置
TWI321641B (ja) * 2003-06-27 2010-03-11 Tokyo Ohka Kogyo Co Ltd
TWI285136B (en) * 2005-03-30 2007-08-11 Dainippon Screen Mfg Substrate processing equipment
JP2008029922A (ja) * 2006-07-26 2008-02-14 Shibaura Mechatronics Corp 基板の処理装置
TWI372318B (en) * 2006-12-22 2012-09-11 Tokyo Electron Ltd Decompression drying device
CN201561627U (zh) * 2009-12-17 2010-08-25 无锡尚德太阳能电力有限公司 硅片吹干系统
JP2013045877A (ja) * 2011-08-24 2013-03-04 Tokyo Electron Ltd 基板処理装置
CN203672080U (zh) * 2014-01-06 2014-06-25 宇宙电路板设备(深圳)有限公司 触控面板用烘干装置

Also Published As

Publication number Publication date
JP6495986B2 (ja) 2019-04-03
JP2016145702A (ja) 2016-08-12
CN105826168A (zh) 2016-08-03
CN105826168B (zh) 2018-10-26
TW201706548A (zh) 2017-02-16
JP6209572B2 (ja) 2017-10-04
JP2017211178A (ja) 2017-11-30

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