Γ285136 九、發明說明： 【發明所屬之技術領域】 本發明係、有關力-種從風刀的喷射口對⑨晶顯示裝 置（LCD)用玻璃基板、等離子顯示器（pDp)用玻璃基板、 印刷基板、m板、+導體晶片、電子器件基板等基板 喷射空氣、惰性氣體等的氣體，除去附著在基板上的處理 液的基板處理裝置。 【先前技術】 例如，在LCD、PDP等的平板顯示器（FPD )的製造工 序中，向玻璃基板的表面供給處理液、例如純水等的清洗 液，而對基板進行濕式處理（清洗處理）。而由於在清洗 處理後的基板的表面附著有清洗液，所以在進行基板的清 洗處理的清洗裝置中附設有除液裝置以及乾燥裝置，清洗 處理結束的基板被搬送到除液裝置來從基板的表面除去 清洗液’接著被搬送到乾燥裝置對基板表面進行最後乾 燥。從基板的表面除去清洗液的除液裝置包括封閉型的處 里至該處理至包括基板的搬入口和搬出口。在處理室的 内4配置有由支承基板並向水平方向搬送的複數個搬送 幸昆構成的輥式輸送機，隔著由輥式輸送機搬送的基板的搬 C路線’在其上、下兩側配置有一對（或者根據需要在基 板搬送方向上隔開間隔而配置多對）的風刀。風刀是以與 基板搬送方向交又的方式配置，在基板的整個寬度方向， 包括噴射空氣、惰性氣體等氣體的狹縫狀的喷射口。還 2014-7813-PF 5 1285136 有’風刀相對垂直面保持為傾斜的姿勢，使得從其喷射口 向基板搬送方向的上游側喷射氣體。而且，在清洗裝置清 洗處理過的基板被搬入除液裝置的處理室内，在由輥式輸 送機在處理室内向水平方向搬送的過程中，通過從一對的 風刀的喷射口將氣體分別向上、下兩面吹拂，由此從基板 的兩面將清洗液吹走而除去（例如參照專利文獻1 )。 在上述的除液裝置中，由於從風刀向基板喷射大量的 氣體’所以在處理室内產生複雜的氣流。由此，會產生從 • 基板的表面暫時吹走而除去的清洗液的霧滴，隨著氣流再 次附著到基板表面的情況。還有，會產生由於從風刀向基 板的表面吹拂的氣體的流動自身受氣流的影響，而不能從 基板表面高效除去清洗液的情況。為了解決這些問題，要 從處理室内進行排氣，但是此外，也要採取使處理室的高 度方向的尺寸、特別是使室的内底部的深度尺寸變大、或 使處理室的形狀複雜化這樣的對策。 專利文獻1 : JP特開平9 —94546號公報（第5〜6 ’圖 1) ’ 【發明内容】 但是，在處理室的内底部的深度變深這樣的方法中， 出現使裝置大型化到需要以上這樣的問題。還有， 理室的形狀複雜化而使氣體的影響降低這樣的方法中，: 裝置的製作變難，製造成本變高這樣的問題。這些問題， 在基板有大型化的趨勢時變得更為嚴重。 ，Γ 285 136 IX EMBODIMENT OF THE INVENTION The present invention relates to a glass substrate for a 9-crystal display device (LCD), a glass substrate for a plasma display (pDp), and a printed substrate. A substrate processing apparatus that removes a gas such as air or an inert gas from a substrate such as an m-plate, a +-conductor wafer, or an electronic device substrate to remove the processing liquid adhering to the substrate. [Prior Art] For example, in a manufacturing process of a flat panel display (FPD) such as an LCD or a PDP, a cleaning liquid such as pure water is supplied to a surface of a glass substrate, and the substrate is subjected to a wet treatment (cleaning treatment). . In addition, since the cleaning liquid adheres to the surface of the substrate after the cleaning process, the cleaning device that performs the cleaning process of the substrate is provided with a liquid removal device and a drying device, and the substrate after the cleaning process is transferred to the liquid removal device to be removed from the substrate. The surface is removed from the cleaning liquid' and then transferred to a drying device to perform final drying on the surface of the substrate. The liquid removing means for removing the cleaning liquid from the surface of the substrate includes a closed type to the processing to the transfer inlet and the transfer opening including the substrate. In the inner chamber 4 of the processing chamber, a plurality of roller conveyors that are transported by the support substrate and transported in the horizontal direction are disposed, and the loading and unloading route of the substrate conveyed by the roller conveyor is placed on the upper and lower sides. A pair of air knives are disposed on the side (or a plurality of pairs are arranged at intervals in the substrate transport direction as needed). The air knife is disposed so as to be in contact with the substrate conveyance direction, and includes a slit-shaped injection port that ejects a gas such as air or an inert gas over the entire width direction of the substrate. Further, the 2014-7813-PF 5 1285136 has a posture in which the air knife is kept inclined with respect to the vertical plane so that the gas is ejected from the ejection port toward the upstream side in the substrate conveying direction. Further, when the substrate cleaned by the cleaning device is carried into the processing chamber of the liquid removing device, the gas is lifted upward from the ejection ports of the pair of air blades during the horizontal transfer from the roller conveyor in the processing chamber. The lower surface is blown to remove the cleaning liquid from both sides of the substrate (for example, refer to Patent Document 1). In the above liquid removal apparatus, since a large amount of gas is ejected from the air knife to the substrate, a complicated air flow is generated in the processing chamber. As a result, droplets of the cleaning liquid which are temporarily removed from the surface of the substrate are removed, and the airflow adheres to the surface of the substrate again. Further, there is a case where the flow of the gas blown from the air knife to the surface of the substrate itself is affected by the air flow, and the cleaning liquid cannot be efficiently removed from the surface of the substrate. In order to solve these problems, it is necessary to evacuate from the processing chamber, but it is also necessary to increase the size of the processing chamber in the height direction, in particular, to increase the depth of the inner bottom portion of the chamber, or to complicate the shape of the processing chamber. Countermeasures. [Patent Document 1] JP-A-H09-94546 (Picture 5 to 6 'Fig. 1) [Explanation] However, in a method in which the depth of the inner bottom portion of the processing chamber is deepened, there is a need to increase the size of the device. The above question. Further, in the method in which the shape of the chamber is complicated and the influence of the gas is lowered, the production of the apparatus becomes difficult, and the manufacturing cost becomes high. These problems become more serious when the substrate has a tendency to increase in size. ,
2014-7813-PF 1285136 還有’為了要即使基板尺寸變大處理間隔時間也沒有 變化’就需要使基板的搬送速度變快。若基板搬送速度變 快’則需要從風刀對基板更有效的噴射氣體，有效的吹走 基板上的清洗液。但是存在現有的裝置結構中，由於氣體 的亂流’僅單純增加氣體噴出量不能提高液滴的除去能力 的問題。 本發明疋餐於以上的問題而提出的，其目的是提供一 種基板處理裝置，該基板處理裝置不需要使裝置大型化， 裝置的製作比較容易，並能夠防止從基板的主面除去的處 理液成為霧滴而再次附著在基板的主面上，即使來自風刀 的氣體喷射量沒有變大，也能夠高效除去附著在基板的主 面的處理液。 (1 )、本發明所述的一種基板處理裝置，包括：基 板搬送裝置’其支承著在主面上附著了處理液的基板並向 水平方向搬送；處理室，其封閉性地包圍由該基板搬送裝 置搬送的基板的周圍；風刀，其在該處理室的内部，以與 基板搬送方向交叉的方式配置，並包括喷射口，該喷射口 對由上述基板搬送裝置搬送的基板的主面，在其整個寬度 方向上，向基板搬送方向的上游側喷射氣體，其特徵在 於：包括排氣裝置，該排氣裝置在上述處理室的相對於基 板搬送路線而配置了上述風刀的空間側，並且在風刀配置 位置的基板搬送方向上游側設置有排氣口，同時，在上述 處理室的内部’在垂直方向上豎立設置有使從上述風刀的 喷射口喷射而吹拂到基板的主面上的氣體向上述排氣口 2014-7813-PF 7 1285136 心L動的多張整流板’該排氣裝置通過上述排氣口進行排 氣。 (2) 、如上述（1)所記載的基板處理裝置，其特徵 在於：上述風刀配置於在俯視下相對於基板搬送方向而傾 斜的方向上，同時，上述多張整流板分別配置於在俯視下 相對於上述風刀而大致垂直的方向上。 (3) 、如上述（1)或（2)所記載的基板處理裝置， 其特徵在於：上述風刀隔著基板搬送路線而在其上、下兩 側配置有一對，上述排氣口分別設置在上述處理室的基板 搬送路線的上方空間側以及下方空間側，同時，上述多張 整流板配置在上述處理室的基板搬送路線的下方側空間 中。 (4) 、如上述（3)所記載的基板處理裝置，其特徵 在於：以在上述風刀的配置位置處將上述處理室的美板搬 送路線的上方側空間分隔成基板搬送方向的上游侧和下 游側的方式配置有内部間隔壁。 (5 )、如上述（3 )所記載的基板處理裝置，其特徵 在於：在上述各整流板的上端部分別安裝有輔助輥，該輔 助輥與由上述基板搬送裝置搬送的基板的下表面接^而 支承基板。 (6)、如上述（4)所記載的基板處理裝置，其特徵 在於：在上述各整流板的上端部分別安裝有辅助輥，該輔 助輥與由上述基板搬送裝置搬送的基板的下表面接觸而 支承基板。 2014-7813-PF 8 1285136 ；L )所記載的基板處理裝置中，從風刀的喷 子土板的主面向基板搬送方向的上游側噴射的氣體 與基板的主面接觸而折返，並沿著SiL設置在處理室的内 :的多張整流板流動’向排氣口流動，通過排氣口從處理 室内排氣。而附著在基板的主面上的處理液被向基板的主 面吹拂的氣體吹走而從基板主面除去，與氣體—同通過排 氣口從處理室内排出。這樣，從風刀的喷射口喷射而在基 板的主面折返的氣體通過整流板快速的向排氣口引導排 氣而不在處S室内《為亂流狀態，_液的霧滴也與該氣 體一同從處理室内排出，因此從基板的主面除去的處理液 的霧滴不會再次附著在基板的主面上。還有，由於通過整 流板能夠抑制氣體的亂流，所以通過從風刀的喷射口喷出 的氣體高效的吹走基板上的處理液。 因此如果使用（1)所記載的基板處理裝置，則能 夠防止從基板的主面除去的處理液成為霧滴再次附著在 基板的主面上，即使來自風刀的氣體噴射量不變大，也能 夠咼效的除去附著在基板的主面上的處理液。而且，該基 板處理裝置不需要大型化，製作也比較容易。 上述（2)所記載的基板處理裝置中，從風刀的喷射 口喷射而在基板的主面折返的氣體，無阻力地流入以相對 風刀大致垂直的方式配置的整流板間的通路，並沿整流板 流動，在相對處理室的内壁面傾斜的方向接觸而向排氣口 侧流動。因此，由於從風刀的喷射口噴射的氣體在處理室 的内壁面折返而沒有向風刀的方向反轉，所以能夠更有效 2014-7813-PF 9 1285136 的除去基板上的處理液。2014-7813-PF 1285136 Further, in order to increase the processing interval without changing the substrate size, it is necessary to increase the transport speed of the substrate. If the substrate transport speed is increased, it is necessary to eject the gas from the air knife to the substrate more effectively, and the cleaning liquid on the substrate is effectively blown away. However, in the conventional device structure, the problem of the ability to remove droplets cannot be improved simply by increasing the amount of gas ejected due to the turbulent flow of gas. The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus which does not require an increase in size of a device, is easy to manufacture, and can prevent a treatment liquid removed from a main surface of a substrate. When it is a mist droplet and adheres again to the main surface of the substrate, even if the amount of gas jetted from the air knife does not become large, the treatment liquid adhering to the main surface of the substrate can be efficiently removed. (1) A substrate processing apparatus according to the present invention, comprising: a substrate transfer device that supports a substrate having a processing liquid adhered to a main surface and transports it in a horizontal direction; and a processing chamber that encloses the substrate in a closed manner The periphery of the substrate conveyed by the transport device; the air knife is disposed inside the processing chamber so as to intersect the substrate transport direction, and includes an ejection port that faces the main surface of the substrate transported by the substrate transport device; In the entire width direction, the gas is ejected toward the upstream side in the substrate transport direction, and includes an exhaust device that is disposed on the space side of the air knife in the processing chamber with respect to the substrate transport path. Further, an exhaust port is provided on the upstream side in the substrate transport direction of the air knife arrangement position, and a main surface that is ejected from the ejection port of the air knife and blown to the substrate is erected in the vertical direction inside the processing chamber. The upper gas is exhausted to the exhaust port 2014-7813-PF 7 1285136, and the exhaust device is exhausted through the exhaust port. (2) The substrate processing apparatus according to the above aspect, wherein the air knife is disposed in a direction inclined with respect to a substrate conveyance direction in a plan view, and the plurality of flow regulating plates are disposed at the same It is in a direction substantially perpendicular to the air knife in plan view. (3) The substrate processing apparatus according to the above aspect (1), wherein the air knife is disposed on the upper and lower sides thereof via a substrate transport path, and the exhaust ports are respectively provided. At the upper space side and the lower space side of the substrate transfer path of the processing chamber, the plurality of rectifying plates are disposed in a space below the substrate transfer path of the processing chamber. (4) The substrate processing apparatus according to the above (3), wherein the upper side space of the sheet conveying path of the processing chamber is partitioned at the upstream side of the substrate conveying direction at the position where the air knife is disposed. An internal partition wall is disposed in a manner on the downstream side. (5) The substrate processing apparatus according to the above (3), wherein an auxiliary roller is attached to an upper end portion of each of the rectifying plates, and the auxiliary roller is connected to a lower surface of the substrate conveyed by the substrate transfer device. ^ Support the substrate. (6) The substrate processing apparatus according to the above (4), wherein an auxiliary roller that is in contact with a lower surface of the substrate conveyed by the substrate transfer device is attached to an upper end portion of each of the rectifying plates And support the substrate. In the substrate processing apparatus of the present invention, the gas ejected from the main surface of the rotor blade of the air knife in the substrate transport direction is brought into contact with the main surface of the substrate and is folded back along the substrate processing apparatus. The SiL is disposed in the processing chamber: the plurality of rectifying plates flow 'flow toward the exhaust port, and are exhausted from the processing chamber through the exhaust port. On the other hand, the processing liquid adhering to the main surface of the substrate is blown away by the gas blown to the main surface of the substrate, and is removed from the main surface of the substrate, and is discharged from the processing chamber through the exhaust port together with the gas. In this way, the gas that is ejected from the ejection orifice of the air knife and that is folded back on the main surface of the substrate is quickly guided to the exhaust port through the rectifying plate without being in the S chamber. In the turbulent state, the droplet of the liquid is also associated with the gas. Since they are discharged from the processing chamber together, the mist of the treatment liquid removed from the main surface of the substrate does not adhere to the main surface of the substrate again. Further, since the turbulent flow of the gas can be suppressed by the flow plate, the treatment liquid on the substrate is efficiently blown off by the gas ejected from the injection port of the air knife. Therefore, when the substrate processing apparatus according to (1) is used, it is possible to prevent the processing liquid removed from the main surface of the substrate from adhering to the main surface of the substrate again, and even if the amount of gas injected from the air knife does not become large, The treatment liquid adhering to the main surface of the substrate can be removed in an effective manner. Further, the substrate processing apparatus does not need to be enlarged, and the production is relatively easy. In the substrate processing apparatus according to the above (2), the gas which is ejected from the ejection opening of the air knife and is folded back on the main surface of the substrate flows into the passage between the rectifying plates which are disposed substantially perpendicular to the air knife without resistance. The flow along the flow regulating plate is in contact with the inner wall surface of the processing chamber in an oblique direction and flows toward the exhaust port side. Therefore, since the gas ejected from the ejection port of the air knife is folded back on the inner wall surface of the processing chamber without being reversed in the direction of the air knife, the processing liquid on the substrate can be more effectively removed from 2014-7813-PF 9 1285136.
處理室内排出。還有，從基板的上表面除去的處理液的霧 滴的一部分，由於重力的作用在處理室内落下，隨著在下 方空間側的氣流，經過下方空間側的排氣口從處理室内排 出〇 在上述（3)所記載的基板處理裝置中從基板的上、 Π面除去處理液’而從基板的上、下兩面除去的處理液 通過處理室的上方^測以及下方㈣側的各排 氣口與氣體一同從處理室内排出。…從下侧的風刀的 噴射口對基板的下表面喷射並與基板的下表面接觸而折 返的氣體沿整流板流動’並向排氣口流動，通過下方空間 侧的排氣口從處理室内進行排氣，從基板的下表面除去的 處理液的霧滴與氣體一同經過下方空氣側的排氣口而從 在上述（4)所記載的基板處理裝置中，通過從風刀 的喷射口對基板的上表面向基板搬送方向的上游側喷射 的氣體，而從基板的上表面吹走而除去的處理液的霧滴通 過内部間隔壁，阻止從風刀的基板搬送方向的上游側向下 游側流入。因此，能约防止通過了風刀的配置位置的基板 的上表面側再次附著處理液的霧滴。 在上述（5)以及（6)所記載的基板處理裝置中，由 於通過安裝在整流板的上端部的輔助輥支承基板，因此基 板即使大型化也不會有妨礙而能夠支承基板進行搬送。 【實施方式】 2014-7813-PF 10 1285136 以下針對本發明的最佳實施形態，$照附圖進行說 明。 圖卜圖3表示本發明的實施形態的一個例子，圖i 是表示作為基板處理裝置的除液裝置的概略結構的側面 剖視圖’ ® 2是從基板搬送面向下看到的圖丄所示的除液 裝置的處理室的内部的概略俯視圖，冑3是表示圖i所示 的除液裝置的處理室内部的概略側視圖。 該除液裝置包括封閉型的處理室1〇，該處理室1〇包 括基板W的搬入口 12以及搬出口 14。在處理室1〇内的基 板W的搬入口 12侧，在底面和頂面分別設置有排氣口 16a、16b。如圖2所示，設置在處理室1〇的底面的排氣 口 16a配置在處理室1〇的一個角部分。在各排氣口 16&、 16b，雖未圖示，但分別連通並連接有排氣管，各排氣管 分別與排氣泵以流路形式連接。 在處理室10的内部，配置有由支承基板w而向水平 方向搬送的複數個搬送輥18構成的輥式輸送機。搬送輥 18分別以單臂的方式支承並軸接於處理室1 〇的兩側。還 有，在處理室10内部，隔著由輥式輸送機搬送的基板w 的搬送路線，在其上、下兩側配置有一對的風刀2〇a、20b。 此外，也可以在基板W的搬送方向上隔開間隔而設置兩對 或者其上的風刀。風刀20a、20b以與基板搬送方向交叉 的方式配置，在該實施形態中，如圖2所示，在俯視下， 在相對於基板搬送方向而傾斜的方向上配置風刀。此外， 為了便於圖示，在圖1中以將風刀與基板搬送方向垂直的 2014-7813-PF 11 1285136 方式進行描繪。在風刀2 0a、20b，以和基板W相對向的方 式’在整個基板W的寬度方向上分別設置有喷射空氣、惰 性氣體等氣體的狹縫狀的喷射口。並且，風刀20a、20b 保持為相對垂直面傾斜的姿勢，使得從其喷射口向基板搬 送方向的上游側喷射氣體。 還有’在處理室10内部，在基板搬送路線的下方側 空間並在風刀20a配置位置的基板搬送方向上游側，向垂 直方向豎立設置有多張整流板22。各整流板22隔開間隔 籲而分別相互平行地進行配置，在整流板22㈣成氣體的 通路還有，各整流板2 2分別配置於在俯視下相對風刀 20a的長軸方向而大致垂直的方向上，形成在整流板u 間的各通路，在俯視下相對於處理室丨〇的搬入口侧壁面 分別向排氣口 16a側傾斜。在整流板22的上端部，安裝 有與由輥式輸送機搬送的基板w、特別是大型的基板w的 I表面接觸來支承基板W的辅助輥（自由輥）24 (在圖i 省略圖示）。例如圖4所示，將通過支柱桿26而保持在 處理至1 〇的底壁面上的整流板22的上端板片部彎折， 輔助輥24轴接於該彎折部3〇上。 還有，在基板搬送路線的下方側空間中，並在風刀2〇a 配置位置的基板搬送方向下游側配置有複數個輔助報 32辅助輥32，雖省略圖示，但被垂直設置在處理室 的底壁面上的支柱桿的上端部支承著。此外，也可以在風 刀20a配置位置的基板搬送方向下游侧賢立設置有多張整 流板，在這些整流板的上端部安裝辅助輥Μ。進而，在處Discharge in the treatment room. Further, a part of the mist of the treatment liquid removed from the upper surface of the substrate is dropped in the treatment chamber due to the action of gravity, and is discharged from the treatment chamber through the exhaust port on the lower space side with the air flow on the lower space side. In the substrate processing apparatus according to the above (3), the processing liquid removed from the upper and lower sides of the substrate and the processing liquid removed from the upper and lower surfaces of the substrate passes through the upper portion of the processing chamber and the respective exhaust ports on the lower (four) side. Exhaust from the processing chamber together with the gas. ...the gas that is ejected from the lower surface of the lower blade of the lower side of the substrate and is in contact with the lower surface of the substrate and flows back along the rectifying plate flows toward the exhaust port, and passes through the exhaust port on the lower space side from the processing chamber When the exhaust gas is exhausted, the mist of the treatment liquid removed from the lower surface of the substrate passes through the exhaust port on the lower air side together with the gas, and passes through the injection port of the air knife from the substrate processing apparatus described in the above (4). The gas ejected from the upper surface of the substrate to the upstream side in the substrate transport direction, and the mist of the processing liquid that is blown away from the upper surface of the substrate passes through the internal partition wall, and prevents the upstream side to the downstream side in the substrate transport direction of the air knife. Inflow. Therefore, it is possible to prevent the mist of the treatment liquid from being adhered again to the upper surface side of the substrate which has passed through the arrangement position of the air knife. In the substrate processing apparatus according to the above (5) and (6), since the substrate is supported by the auxiliary roller attached to the upper end portion of the flow regulating plate, the substrate can be supported and transported without any hindrance even if the substrate is enlarged. [Embodiment] 2014-7813-PF 10 1285136 Hereinafter, a best mode for carrying out the invention will be described with reference to the accompanying drawings. FIG. 3 is a view showing an example of the embodiment of the present invention, and FIG. 1 is a side cross-sectional view showing a schematic configuration of a liquid removal device as a substrate processing apparatus, where the ® 2 is removed from the substrate transfer surface. A schematic plan view of the inside of the processing chamber of the liquid device, and 胄3 is a schematic side view showing the inside of the processing chamber of the liquid removing device shown in Fig. i. The liquid removal device includes a closed type processing chamber 1 that includes a transfer inlet 12 and a transfer port 14 of the substrate W. On the side of the inlet 12 of the substrate W in the processing chamber 1A, exhaust ports 16a and 16b are provided on the bottom surface and the top surface, respectively. As shown in Fig. 2, an exhaust port 16a provided on the bottom surface of the processing chamber 1 is disposed at a corner portion of the processing chamber 1A. Each of the exhaust ports 16&, 16b is connected to and connected to an exhaust pipe, and each of the exhaust pipes is connected to the exhaust pump in a flow path. Inside the processing chamber 10, a roller conveyor composed of a plurality of conveying rollers 18 that are conveyed in the horizontal direction by the support substrate w is disposed. The conveying rollers 18 are respectively supported by a single arm and are axially coupled to both sides of the processing chamber 1 . Further, inside the processing chamber 10, a pair of air knives 2a, 20b are disposed on the upper and lower sides thereof via a transport path of the substrate w transported by the roller conveyor. Further, two pairs or air knives thereon may be provided at intervals in the transport direction of the substrate W. The air knives 20a and 20b are arranged to intersect the substrate transport direction. In this embodiment, as shown in Fig. 2, the air knives are arranged in a direction inclined with respect to the substrate transport direction in plan view. Further, for convenience of illustration, in Fig. 1, a description will be made in the manner of 2014-7813-PF 11 1285136 which is perpendicular to the direction in which the air knife is conveyed. In the wind blade 20a, 20b, a slit-shaped injection port for ejecting a gas such as air or an inert gas is provided in the width direction of the entire substrate W in a manner of facing the substrate W. Further, the air blades 20a and 20b are held in a posture inclined with respect to the vertical plane so that the gas is ejected from the ejection port toward the upstream side in the substrate conveying direction. Further, inside the processing chamber 10, a plurality of rectifying plates 22 are erected in the vertical direction in the lower side of the substrate transport path and on the upstream side in the substrate transport direction where the air knife 20a is disposed. Each of the rectifying plates 22 is disposed in parallel with each other, and the rectifying plates 22 (four) are formed in a gas passage, and each of the rectifying plates 2 2 is disposed substantially perpendicular to the longitudinal direction of the air knife 20a in plan view. In the direction, each of the passages formed between the flow regulating plates u is inclined toward the exhaust port 16a side with respect to the inlet side wall surface of the processing chamber 俯视 in plan view. An auxiliary roller (free roller) 24 that supports the substrate W in contact with the substrate w conveyed by the roller conveyor, in particular, the I surface of the large substrate w, is attached to the upper end portion of the flow regulating plate 22 (not shown in FIG. ). For example, as shown in Fig. 4, the upper end plate portion of the rectifying plate 22 held by the strut rod 26 on the bottom wall surface treated to 1 弯 is bent, and the auxiliary roller 24 is axially coupled to the bent portion 3''. In the space on the lower side of the substrate transport path, a plurality of auxiliary sub-32 auxiliary rollers 32 are disposed on the downstream side in the substrate transport direction at the position where the air knife 2〇a is disposed, and are vertically disposed in the processing, although not shown. The upper end portion of the strut rod on the bottom wall surface of the chamber is supported. Further, a plurality of rectifying plates may be provided on the downstream side in the substrate conveying direction at the position where the air knife 20a is disposed, and the auxiliary rollers may be attached to the upper end portions of the rectifying plates. Further, at
2014-7813-PF 12 1285136 至1 〇的内部以將基板搬送路線的上方側空間在風刀 2〇b的配置位置分隔成基板搬送方向的上游側和下游側的 方式配置有内部間隔壁3 4。 在包括上述結構的除液裝置中，完成由前級的清洗裝 置進行的清洗處理的基板W通過搬入口 12向處理室丨〇内 搬入，在由輥式輸送機將基板W在處理室1〇内搬送的過 程中，從風刀20a、20b的喷射口向基板w的上、下兩面 喷射氣體。從風刀20a、2 Ob的喷射口喷出的氣體與基板w _ 的上下兩面接觸並向基板搬送方向的上游側折返。此時， 通過氣體吹走附著在基板W上的純水等的清洗液，從基板 W的上下兩面除去清洗液。而且，除去了清洗液的基板w 通過搬出口 14從處理室10内搬出，向後級的乾燥裝置搬 送。 從風刀20a、20b的喷射口喷射並包含了從基板w除 去的清洗液的霧滴的氣體，向排氣口 16a、16b流動。這 時，從下側的風刀20a的喷射口對基板w的下表面喷射並 _ 與基板W的下表面接觸而折返的氣體，無阻力地流入以相 對風刀20a大致垂直的方式配置的整流板22間的通路， 沿整流板22流動。而且，含有清洗液的霧滴的氣體相對 於處理室10的内壁面在傾斜的方向接觸而向排氣口 l6a 側流動，通過排氣口 16 a從處理室1 〇内排出。這樣，從 風刀20a的喷射口喷射而在基板W的下表面折返的氣體， 在處理室10内沒有呈亂流狀態而通過整流板2 2快速向排 氣口 16a引導來排氣，清洗液的霧滴也與該氣體一同從處2014-7813-PF 12 1285136 The inner partition wall is disposed such that the upper space of the substrate transport path is divided into the upstream side and the downstream side of the substrate transport direction at the arrangement position of the air knife 2〇b. . In the liquid removal apparatus including the above-described configuration, the substrate W that has been subjected to the cleaning process by the cleaning device of the preceding stage is carried into the processing chamber through the inlet 12, and the substrate W is placed in the processing chamber by the roller conveyor. During the inner conveyance, gas is ejected from the injection ports of the air blades 20a and 20b toward the upper and lower surfaces of the substrate w. The gas ejected from the ejection openings of the air knives 20a and 2Bb comes into contact with the upper and lower surfaces of the substrate w_ and is folded back toward the upstream side in the substrate transport direction. At this time, the cleaning liquid such as pure water adhering to the substrate W is blown off by the gas, and the cleaning liquid is removed from the upper and lower surfaces of the substrate W. Then, the substrate w from which the cleaning liquid has been removed is carried out from the processing chamber 10 through the delivery port 14, and is transported to the drying device of the subsequent stage. The gas which is ejected from the ejection openings of the air blades 20a and 20b and contains the droplets of the cleaning liquid removed from the substrate w flows to the exhaust ports 16a and 16b. At this time, the gas which is ejected from the lower surface of the substrate w from the lower surface of the air knife 20a and which is brought into contact with the lower surface of the substrate W flows into the rectifying plate which is disposed substantially perpendicularly to the air knife 20a without resistance. 22 passages flow along the rectifying plate 22. Further, the gas containing the mist of the cleaning liquid comes into contact with the inner wall surface of the processing chamber 10 in the oblique direction, flows toward the exhaust port 16a side, and is discharged from the processing chamber 1 through the exhaust port 16a. In this way, the gas which is ejected from the ejection opening of the air knife 20a and is folded back on the lower surface of the substrate W is not turbulent in the processing chamber 10, and is quickly guided to the exhaust port 16a through the rectifying plate 2 to exhaust the cleaning liquid. The droplets of mist are also along with the gas
2014-7813-PF 13 12851362014-7813-PF 13 1285136
理室ίο内排出。由此，能夠防止從基板w的下表面除去 的清洗液的霧滴飛散到風刀2〇a配置位置的基板搬送方向 下游側而再次附著到基板W的下表面。還有，通過整流板 22旎夠抑制氣流的亂流，進而，由於從整流板22間的通 路流出的氣體相對於處理室10的内壁面而在傾斜的方向 接觸而向排氣口 1 6a側流動，因此不會產生如下情況：在 處理室10的内壁面氣體折返，向風刀2〇a侧反轉，由於 該反轉的氣流而使來自風刀2〇a的噴射氣流變亂。由此， 能夠高效的除去附著在基板W上的清洗液。 另一方面，從上側的風刀2〇b的喷射口對基板w的上 表面喷射並與基板W的上表面接觸而折返的氣體，有時會 變成亂流狀態並向排氣口 16b流動，但從基板的上表面 除去的清洗液的霧滴的一部分由於重力的作用而在處理 室10内落下，與從下側的風刀20a的喷射口喷射的氣體 一起，通過排氣口 16a從處理室10内排出。還有，通過 内部間㈣34阻止從基板W的上表面吹走而除去的清洗 液的霧滴從風刀20b的基板搬送方向上游側向下游侧流 入。由此，能夠防止在通過了風刀2〇b的配置位置的基$ W的上表面侧再次附著清洗液的霧滴。 圖5是表示本發明的其他的實施形態，是從基板搬送 面向下看到的除液裝置的處理室的内部的概略俯視圖。在 圖5中，對與圖i至圖3所示的裝置的各構件包括相同作 用的同-構件，標上與在圖1至圖3中使用的附圖標記— 樣的附圖標記，省略說明。 2014-7813-PF 14 1285136 在圖5所示的裝置中，各整流板36沒有分別相互平 行地配置，而是以形成在整流板36間的各通路分別指向 排氣口 16的方式進行配置。與圖1至圖3所示的裝置同 樣’在整流板36的上端部安裝有辅助輥38。通過做成這 樣的結構，從下側的風刀2Oa的喷射口噴射並與基板w的 下表面接觸而折返的氣體，與清洗液的霧滴一同更快速的 向排氣口 16a引導而排出，而能夠高效除去附著在基板w 上的清洗液。 還有，圖6表示本發明的另外的實施形態，是從基板 搬送面向下看到的除液裝置的處理室内部的概略俯視 圖。在圖6中，也對與圖1至圖3所示的裝置的各構件包 括相同作用的同一構件，標上與在圖1至圖3中使用的附 圖標記相同的附圖標記，省略說明。 在圖6所示的裝置中，在處理室1〇的内部沿一側的 側壁面以及搬入口側的壁面分別設置有内部槽4〇、44。内 部槽40、44的前端分別與排氣口 16a連接而末端封閉， 在軸線方向上形成有狹縫狀的吸入口 42、46。内部槽4〇、 44的狹縫狀吸入口 42、46以其開口寬度隨著遠離排氣口 16a而變大的方式形成。還有，優選内部槽4〇、44的吸入 口 42、46配置在整流板22的終端附近。通過做成這樣的 結構，從下側的風刀20a的喷射口喷射並與基板w的下表 面接觸而折返的氣體，沿整流板22流動，從整流板22間 的通路流出，原樣通過吸入口 42、46吸入到内部槽4〇、 44内。因此，處理室10内的氣流的亂流更加減少。吸入 2014-7813-PF 15 1285136 到内部槽40、44内的包含清洗液的霧滴的氣體從内部槽 40、44内通過排氣口 16a排出。 此外，在上述的實施形態中，針對將在清洗基板之後 附著在基板上的清洗液除去的裝置進行了說明，但本發明 對於清洗以外的基板的濕式處理後的除液處理也能夠適 用。 【圖式簡單說明】 _ 目1表示本發明的實施形態的—個例子，是表示作為 基板處理裝置的除液裝置的概略結構的側面剖視圖。 圖2是從基板搬送面向下看到的圖丨所示的除液裝置 的處理室的内部的概略俯視圖。 圖3是表示圖1所示的除液裝置的處理室内部的概略 側視圖。 圖4是表示圖1所示的除液裝置的構成要素之一的整 流板的結構例的主視圖。 B 圖5表不本發明的其他的實施形態，是從基板搬送面 向下看到的除液裝置的處理室的内部的概略俯視圖。 圖6表示本發明的另外的實施形態，是從基板搬送面 向下看到的除液裝置的處理室的内部的概略俯視圖。 【主要元件符號說明】 10〜處理室； 12〜搬入口； 2014-7813-PF 16 1285136 14〜搬出口； 16a、16b〜排氣口； 18〜搬送輥； 20a、20b〜風刀； 22、36〜整流板； 24、32、38〜輔助輥； 30〜彎折部； 34〜内部間隔壁； # 40、44〜内部槽； 42、46〜吸入口 ； W〜基板。The room is discharged inside the room. Thereby, it is possible to prevent the droplets of the cleaning liquid removed from the lower surface of the substrate w from scattering to the downstream side of the substrate conveyance direction at the position where the air knife 2〇a is disposed, and to adhere to the lower surface of the substrate W again. Further, the turbulent flow of the airflow is suppressed by the rectifying plate 22, and the gas flowing out from the passage between the rectifying plates 22 is in contact with the inner wall surface of the processing chamber 10 in the oblique direction, and is directed to the exhaust port 16a side. Since the flow does not occur, the gas is folded back on the inner wall surface of the processing chamber 10, and is reversed toward the air knife 2〇a side, and the jet airflow from the air knife 2〇a is disturbed by the reversed air flow. Thereby, the cleaning liquid adhering to the substrate W can be efficiently removed. On the other hand, the gas which is ejected from the upper surface of the upper surface of the substrate w and is brought into contact with the upper surface of the substrate W and is folded back may be in a turbulent state and flow to the exhaust port 16b. However, a part of the mist of the cleaning liquid removed from the upper surface of the substrate falls in the processing chamber 10 due to the action of gravity, and is processed from the gas discharged from the injection port of the lower air knife 20a through the exhaust port 16a. The chamber 10 is discharged. In addition, the droplets of the cleaning liquid which are removed by the internal portion (four) 34 from being blown away from the upper surface of the substrate W flow from the upstream side to the downstream side in the substrate conveyance direction of the air knife 20b. Thereby, it is possible to prevent the droplets of the cleaning liquid from being attached again to the upper surface side of the base W that has passed through the arrangement position of the air knife 2〇b. Fig. 5 is a schematic plan view showing the inside of a processing chamber of the liquid removing device as seen from the substrate transporting surface, showing another embodiment of the present invention. In FIG. 5, the same components as those of the components shown in FIGS. i to 3 are denoted by the same reference numerals as those used in FIGS. 1 to 3, and are omitted. Description. 2014-7813-PF 14 1285136 In the apparatus shown in Fig. 5, the respective rectifying plates 36 are not arranged in parallel with each other, but are arranged such that the respective passages formed between the rectifying plates 36 are directed to the exhaust port 16, respectively. Similarly to the apparatus shown in Figs. 1 to 3, an auxiliary roller 38 is attached to the upper end portion of the flow regulating plate 36. With such a configuration, the gas which is ejected from the ejection opening of the lower air knife 2Oa and is brought into contact with the lower surface of the substrate w is guided and discharged to the exhaust port 16a more quickly together with the droplet of the cleaning liquid. Further, the cleaning liquid adhering to the substrate w can be efficiently removed. Further, Fig. 6 shows a schematic plan view of the inside of the processing chamber of the liquid removing device viewed from the substrate transfer surface facing down in another embodiment of the present invention. In FIG. 6, the same members that have the same functions as those of the members of the apparatus shown in FIGS. 1 to 3 are denoted by the same reference numerals as those used in FIGS. 1 to 3, and description thereof will be omitted. . In the apparatus shown in Fig. 6, internal grooves 4, 44 are provided in the inside of the processing chamber 1 沿 along the side wall surface on one side and the wall surface on the inlet side. The front ends of the inner grooves 40, 44 are connected to the exhaust port 16a, respectively, and the ends thereof are closed, and slit-shaped suction ports 42, 46 are formed in the axial direction. The slit-shaped suction ports 42 and 46 of the internal grooves 4, 44 are formed such that the opening width thereof becomes larger as it goes away from the exhaust port 16a. Further, it is preferable that the suction ports 42, 46 of the internal grooves 4, 44 are disposed near the end of the rectifying plate 22. With such a configuration, the gas which is ejected from the ejection opening of the lower air knife 20a and is brought into contact with the lower surface of the substrate w flows along the rectifying plate 22, flows out from the passage between the rectifying plates 22, and passes through the suction port as it is. 42, 46 are drawn into the inner slots 4, 44. Therefore, the turbulent flow of the airflow in the processing chamber 10 is further reduced. Inhalation 2014-7813-PF 15 1285136 The gas containing the droplets of the cleaning liquid in the internal tanks 40, 44 is discharged from the internal tanks 40, 44 through the exhaust port 16a. Further, in the above-described embodiment, the apparatus for removing the cleaning liquid adhering to the substrate after cleaning the substrate has been described. However, the present invention can be applied to the liquid removal treatment after the wet processing of the substrate other than the cleaning. [Brief Description of the Drawings] An example of the embodiment of the present invention is a side cross-sectional view showing a schematic configuration of a liquid removing device as a substrate processing apparatus. Fig. 2 is a schematic plan view showing the inside of a processing chamber of the liquid removing apparatus shown in Fig. 看到 as seen from the substrate conveying surface. Fig. 3 is a schematic side view showing the inside of a processing chamber of the liquid removal device shown in Fig. 1; Fig. 4 is a front elevational view showing a configuration example of a flow regulating plate which is one of the constituent elements of the liquid removing device shown in Fig. 1 . B. Fig. 5 shows a schematic plan view of the inside of the processing chamber of the liquid removal apparatus as seen from the substrate transfer surface, in accordance with another embodiment of the present invention. Fig. 6 is a schematic plan view showing the inside of a processing chamber of the liquid removing device as seen from the substrate conveying surface, in another embodiment of the present invention. [Description of main components] 10~Processing chamber; 12~Transport; 2014-7813-PF 16 1285136 14~Transport; 16a, 16b~Exhaust; 18~Transport roller; 20a, 20b~Air knife; 36 ~ rectifying plate; 24, 32, 38 ~ auxiliary roller; 30 ~ bent portion; 34 ~ internal partition wall; # 40, 44 ~ internal groove; 42, 46 ~ suction port; W ~ substrate.
2014-7813-PF 172014-7813-PF 17