CN100440446C - Substrate treatment device - Google Patents
Substrate treatment device Download PDFInfo
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- CN100440446C CN100440446C CNB2006100714929A CN200610071492A CN100440446C CN 100440446 C CN100440446 C CN 100440446C CN B2006100714929 A CNB2006100714929 A CN B2006100714929A CN 200610071492 A CN200610071492 A CN 200610071492A CN 100440446 C CN100440446 C CN 100440446C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
This present invention provides an equipment in which there is no need of enlarging the equipment and the equipment is relatively easily manufactured and processing liquid removed from a substrate side is prevented from serving as mist and resticking to the substrate side, and the processing liquid sticked to the substrate side can be effectively removed. An exhaust port 16a is provided at a space side where an air knife 20a is arranged to a conveyance way of a substrate W, and at an upstream side in the substrate conveyance direction from an arranged position of the air knife 20a in a processing chamber 10. Inside the processing chamber 10 there are perpendicularly provided plural sheets of straightening vanes 22 which flow gas jetted from an exhaust nozzle of the air knife 20a and sprayed on the substrate W toward the exhaust port 16a.
Description
Technical field
The present invention relates to a kind of jet from air knife to liquid crystal indicator (LCD) with glass substrate, plasma display (PDP) gas with substrate injection air, inert gases etc. such as glass substrate, printed base plate, ceramic substrate, semiconductor wafer, electronic device substrates, remove substrate board treatment attached to the treatment fluid on the substrate.
Background technology
For example, in the manufacturing process of the flat-panel monitor (FPD) of LCD, PDP etc., supply with the cleaning fluid of treatment fluid, for example pure water etc. to the surface of glass substrate, and substrate is carried out wet processed (clean).And owing to the surface attachment at cleaned substrate has cleaning fluid, so in the cleaning device of the clean of carrying out substrate, set up liquid removing device and drying device, the substrate that clean finishes to remove cleaning fluid from the surface of substrate to liquid removing device by conveyance, then to drying device substrate surface is carried out final drying by conveyance.The liquid removing device of removing cleaning fluid from the surface of substrate comprises case type process chamber, and this process chamber has moving into mouth and taking out of mouth of substrate.Have by supporting substrates and the roller path that constitutes to a plurality of carrying rollers of horizontal direction conveyance in the internal configurations of process chamber, across conveyance route by the substrate of roller path conveyance, thereon, down both sides dispose a pair of (perhaps as required on the substrate transferring direction devices spaced apart and dispose many to) air knife.Air knife is to dispose in the mode of intersecting with the substrate transferring direction, at the whole Width of substrate, the jet with slit-shaped of gases such as injection air, inert gas.Also have, the relative vertical plane of air knife remains the posture of inclination, makes from the upstream side gas jet of its jet to the substrate transferring direction.And, in the substrate that the cleaning device clean is crossed is moved into the process chamber of liquid removing device, by roller path in process chamber in the process of horizontal direction conveyance, by from the jet of a pair of air knife with gas respectively up and down the two sides brush, from the two sides of substrate cleaning fluid is blown away thus and removes (for example with reference to patent documentation 1).
In above-mentioned liquid removing device,, in process chamber, produce complicated air-flow owing to spray a large amount of gas to substrate from air knife.Thus, can produce the droplet of the cleaning fluid that temporarily blows away from the surface of substrate and remove, adhere again to the situation of substrate surface along with air-flow.Also have, can produce the influence that is subjected to air-flow owing to the gas flow self of brushing to the surface of substrate from air knife, and the situation that can not efficiently remove cleaning fluid from substrate surface.In order to address these problems, in process chamber, carry out exhaust, but in addition, also to take to make the size of the short transverse of process chamber, particularly make the depth dimensions of the inner bottom part of chamber become big or make the such countermeasure of complex-shapedization of process chamber.
Patent documentation 1:JP spy open flat 9-94546 communique (the 5-6 page or leaf, Fig. 1)
But, deepening in such method in the degree of depth of the inner bottom part of process chamber, the device such problem more than the needs that maximizes appears making.Also have, the influence of gas being reduced in such method complex-shapedization of process chamber, have the making of device to become difficult, manufacturing cost uprises such problem.These problems become even more serious when substrate has the trend of maximization.
Also have,, the conveyance speed of substrate is accelerated even also do not change blanking time in order to want substrate size to become big the processing.If substrate transferring speed accelerates, then need from air knife the more effective gas jet of substrate is effectively blown away the cleaning fluid on the substrate.But exist in the conventional device structure, because the sinuous flow of gas only increases the problem that the gas spray volume can not improve the ability of removing of drop merely.
Summary of the invention
The present invention proposes in view of above problem, its objective is provides a kind of substrate board treatment, this substrate board treatment does not need to make device to maximize, the making ratio of device is easier to, and can prevent to become droplet and once more on the interarea attached to substrate from the treatment fluid that the interarea of substrate is removed, even the gas blowing amount from air knife does not become big, also can efficiently remove treatment fluid attached to the interarea of substrate.
(1), a kind of substrate board treatment of the present invention, have: base board delivery device, it is supporting the substrate that adhered to treatment fluid on interarea and to the horizontal direction conveyance; Process chamber, its closure ground surround by around the substrate of this base board delivery device conveyance; Air knife, it is in the inside of this process chamber, disposes in the mode of intersecting with the substrate transferring direction; And has a jet, this jet is to the interarea by the substrate of aforesaid substrate carrying device conveyance, on its whole Width, upstream side gas jet to the substrate transferring direction, it is characterized in that, has exhaust apparatus, this exhaust apparatus is in the space side that has disposed above-mentioned air knife with respect to the substrate transferring route of above-mentioned process chamber, and the substrate transferring direction upstream side at the air knife allocation position is provided with exhaust outlet, simultaneously, inside at above-mentioned process chamber, in the vertical direction is erect to be provided with to make from the jet of above-mentioned air knife and is sprayed and brush many cowling panels that the gas on the interarea of substrate flows to above-mentioned exhaust outlet, this exhaust apparatus carries out exhaust by above-mentioned exhaust outlet, and above-mentioned many cowling panels are provided with each other at interval and dispose, and forms the path of gas between cowling panel.
(2), the substrate board treatment of being put down in writing as above-mentioned (1), it is characterized in that, above-mentioned air knife is disposed to be overlooked on the direction that is tilting with respect to the substrate transferring direction down, and simultaneously, above-mentioned many cowling panels are disposed at overlooking down with respect to above-mentioned air knife on the direction of approximate vertical respectively.
(3), the substrate board treatment of being put down in writing as above-mentioned (1) or (2), it is characterized in that, above-mentioned air knife across the substrate transferring route and thereon, both sides dispose a pair of down, above-mentioned exhaust outlet is separately positioned on the superjacent air space side and the following side space side of the substrate transferring route of above-mentioned process chamber, simultaneously, above-mentioned many cowling panels are configured in the lower side space of substrate transferring route of above-mentioned process chamber.
(4), the substrate board treatment of being put down in writing as above-mentioned (3), it is characterized in that, to become the upstream side of substrate transferring direction and the mode in downstream to dispose the internal interval wall upper side separated by spaces of the substrate transferring route of above-mentioned process chamber at the allocation position place of above-mentioned air knife.
(5), as the substrate board treatment that above-mentioned (3) are put down in writing, it is characterized in that in the upper end of above-mentioned each cowling panel help roll is installed respectively, this help roll contacts and supporting substrates with lower surface by the substrate of aforesaid substrate carrying device conveyance.
(6), as the substrate board treatment that above-mentioned (4) are put down in writing, it is characterized in that in the upper end of above-mentioned each cowling panel help roll is installed respectively, this help roll contacts and supporting substrates with lower surface by the substrate of aforesaid substrate carrying device conveyance.
In the substrate board treatment that above-mentioned (1) is put down in writing, the gas that the interarea of substrate is sprayed to the upstream side of substrate transferring direction from the jet of air knife contacts with the interarea of substrate and turns back, and many cowling panels that are arranged on the inside of process chamber along setting flow, flow to exhaust outlet, by exhaust outlet from handling indoor exhaust.And blown away and remove from the substrate interarea by the gas that the interarea to substrate brushes attached to the treatment fluid on the interarea of substrate, together in process chamber, discharge with gas by exhaust outlet.Like this, spray and in process chamber, do not become the sinuous flow state to the exhaust outlet directing exhaust gas fast by cowling panel from the jet of air knife at the gas that the interarea of substrate is turned back, therefore the droplet of treatment fluid is also together discharged in process chamber with this gas, and the droplet of the treatment fluid of removing from the interarea of substrate is not once more on the interarea attached to substrate.Also have, owing to can suppress the sinuous flow of gas, so blow away treatment fluid on the substrate efficiently by gas from the jet ejection of air knife by cowling panel.
Therefore, if the substrate board treatment that uses (1) to be put down in writing, then can prevent becomes droplet once more on the interarea attached to substrate from the treatment fluid that the interarea of substrate is removed, even constant big from the gas blowing amount of air knife, also can remove efficiently attached to the treatment fluid on the interarea of substrate.And this substrate board treatment does not need to maximize, and makes than being easier to yet.
In the substrate board treatment that above-mentioned (2) are put down in writing, spray and the gas of turning back at the interarea of substrate from the jet of air knife, path between the cowling panel that the mode with relative air knife approximate vertical that flows at non-resistance ground disposes, and mobile along cowling panel, flow in the direction contact of the internal face inclination of process chamber relatively and to exhaust side.Therefore, owing to the gas that sprays from the jet of air knife is turned back at the internal face of process chamber and not have the direction to air knife to reverse, so can more effectively remove the treatment fluid on the substrate.
In the substrate board treatment that above-mentioned (3) are put down in writing, remove treatment fluid from the upper and lower faces of substrate, and the droplet of the treatment fluid of removing from the upper and lower faces of substrate surveys by the superjacent air space of process chamber and each exhaust outlet and the gas of side space side are together discharged down in process chamber.And, the lower surface of substrate is sprayed and contact with the lower surface of substrate and the gas of turning back is mobile along cowling panel from the jet of the air knife of downside, and it is mobile to exhaust outlet, carry out exhaust by the following exhaust outlet of side space side in process chamber, the droplet of the treatment fluid of removing from the lower surface of substrate and gas are together discharged in process chamber through the exhaust outlet of below air side.Also have, the part of the droplet of the treatment fluid of removing from the upper surface of substrate because acting in the process chamber of gravity fall, along with at the air-flow of side space side down, is discharged in process chamber through the exhaust outlet of side space side down.
In the substrate board treatment that above-mentioned (4) are put down in writing, by the gas that the upper surface of substrate is sprayed to the upstream side of substrate transferring direction from the jet of air knife, and from the upper surface of substrate blow away and the droplet of the treatment fluid removed by the internal interval wall, stop from the upstream side of the substrate transferring direction of air knife side inflow downstream.Therefore, the upper surface side of substrate that can prevent to have passed through the allocation position of air knife is adhered to the droplet of treatment fluid once more.
In the substrate board treatment that above-mentioned (5) and (6) are put down in writing because the help roll supporting substrates of the upper end by being installed in cowling panel, even so substrate maximize also not have and hinder and can carry out conveyance by supporting substrates.
Description of drawings
Fig. 1 represents an example of embodiments of the present invention, is the side sectional view of expression as the schematic configuration of the liquid removing device of substrate board treatment.
Fig. 2 is from the face down approximate vertical view of inside of process chamber of the liquid removing device shown in Figure 1 seen of substrate transferring.
Fig. 3 is the summary side elevation of the inner treatment chamber of expression liquid removing device shown in Figure 1.
Fig. 4 is the front view of structure example of the cowling panel of one of inscape of expression liquid removing device shown in Figure 1.
Fig. 5 represents other execution mode of the present invention, is from the face down approximate vertical view of inside of process chamber of the liquid removing device seen of substrate transferring.
Fig. 6 represents other execution mode of the present invention, is from the face down approximate vertical view of inside of process chamber of the liquid removing device seen of substrate transferring.
Embodiment
Below, at preferred forms of the present invention, describe with reference to accompanying drawing.
Fig. 1～Fig. 3 represents an example of embodiments of the present invention, Fig. 1 is the side sectional view of expression as the schematic configuration of the liquid removing device of substrate board treatment, Fig. 2 is that Fig. 3 is the summary side elevation of the inner treatment chamber of expression liquid removing device shown in Figure 1 from the face down approximate vertical view of inside of process chamber of the liquid removing device shown in Figure 1 seen of substrate transferring.
This liquid removing device comprises case type process chamber 10, and this process chamber 10 has moving into mouth 12 and taking out of mouth 14 of substrate W.Substrate W in process chamber 10 moves into mouthful 12 sides, is respectively arranged with exhaust outlet 16a, 16b in bottom surface and end face.As shown in Figure 2, the exhaust outlet 16a that is arranged on the bottom surface of process chamber 10 is configured in an angle part of process chamber 10.At each exhaust outlet 16a, 16b, though not shown, be communicated with respectively and be connected with blast pipe, each blast pipe is connected with the stream form with exhaust pump respectively.
In the inside of process chamber 10, dispose the roller path that constitutes to a plurality of carrying rollers 18 of horizontal direction conveyance by supporting substrates W.Carrying roller 18 supports in the mode of single armed respectively and is coupling in the both sides of process chamber 10.Also have, in process chamber 10 inside, across conveyance route, thereon, both sides dispose a pair of air knife 20a, 20b down by the substrate W of roller path conveyance.In addition, also can be on the conveyance direction of substrate W devices spaced apart and two pairs or the air knife on it are set. Air knife 20a, 20b dispose in the mode of intersecting with the substrate transferring direction, in this embodiment, as shown in Figure 2, overlooking down, dispose air knife on the direction that tilts with respect to the substrate transferring direction.In addition, for the ease of diagram, in Fig. 1, describe in the mode that air knife is vertical with the substrate transferring direction.At air knife 20a, 20b, with relative with substrate W to mode, on the Width of whole base plate W, be respectively arranged with the jet of the slit-shaped of gases such as injection air, inert gas.And air knife 20a, 20b remain the posture that relative vertical plane tilts, and make from the upstream side gas jet of its jet to the substrate transferring direction.
Also have,,, erect to vertical direction and to be provided with many cowling panels 22 in the lower side space of substrate transferring route and at the substrate transferring direction upstream side of air knife 20a allocation position in process chamber 10 inside.Each cowling panel 22 devices spaced apart and being configured in parallel to each other respectively are at 22 paths that form gas of cowling panel.Also have, each cowling panel 22 is disposed at respectively at the long axis direction of overlooking relative air knife 20a down and on the direction of approximate vertical, is formed on each path of 22 of cowling panels, overlook down with respect to process chamber 10 to move into the oral-lateral wall oblique to exhaust outlet 16a inclination respectively.In the upper end of cowling panel 22, be equipped with and the help roll (free roller) 24 (omitting diagram) that contacts supporting substrates W by the substrate W of roller path conveyance, the particularly lower surface of large-scale substrate W at Fig. 1.For example shown in Figure 4, will remain on upper end sheet part 28 bendings of the cowling panel 22 on the diapire face of process chamber 10 by strut rod 26, help roll 24 is coupling on this kink 30.
Also have, in the lower side space of substrate transferring route, and dispose a plurality of help rolls 32 in the substrate transferring direction downstream of air knife 20a allocation position.Help roll 32, though omit diagram, is supporting the upper end that is vertically set on the strut rod on the diapire face of process chamber 10.In addition, also can erect and be provided with many cowling panels, help roll 32 is installed in the upper end of these cowling panels in the substrate transferring direction downstream of air knife 20a allocation position.And then, in the inside of process chamber 10 so that the upper side space of substrate transferring route is separated into the upstream side of substrate transferring direction and the mode in downstream disposes internal interval wall 34 at the allocation position of air knife 20b.
In having the liquid removing device of said structure, the substrate W that finishes the clean that the cleaning device by prime carries out moves in process chamber 10 by moving into mouthfuls 12, in by the process of roller path, from the jet of air knife 20a, 20b upper and lower faces gas jet to substrate W with substrate W conveyance in process chamber 10.Contact with the upper and lower surface of substrate W and turn back from the gas of the jet of air knife 20a, 20b ejection to the upstream side of substrate transferring direction.At this moment, blow away cleaning fluid, remove cleaning fluid from the upper and lower surface of substrate W attached to pure water on the substrate W etc. by gas.And the substrate W that has removed cleaning fluid takes out of Ji drying device conveyance backward by taking out of mouth 14 in process chamber 10.
Spray and comprised the gas of the droplet of the cleaning fluid of removing from substrate W from the jet of air knife 20a, 20b, flow to exhaust outlet 16a, 16b.At this moment, the lower surface of substrate W is sprayed and contact with the lower surface of substrate W and the gas of turning back from the jet of the air knife 20a of downside, the path that the cowling panel that the inflow of non-resistance ground is disposed in the mode of relative air knife 20a approximate vertical is 22, mobile along cowling panel 22.And the gas that contains the droplet of cleaning fluid to exhaust outlet 16a side flow, is discharged in process chamber 10 by exhaust outlet 16a in the direction contact of tilting with respect to the internal face of process chamber 10.Like this, spray and the gas of turning back at the lower surface of substrate W from the jet of air knife 20a, be not the sinuous flow state and guide exhaust to exhaust outlet 16a fast by cowling panel 22 in process chamber 10, the droplet of cleaning fluid is also together discharged in process chamber 10 with this gas.Thus, the droplet that can prevent the cleaning fluid removed from the lower surface of substrate W disperses to the substrate transferring direction downstream of air knife 20a allocation position and adheres again to the lower surface of substrate W.Also have, the sinuous flow that can suppress air-flow by cowling panel 22, and then, since from the path effluent air of 22 of cowling panels with respect to the internal face of process chamber 10 and in the direction contact of tilting and to exhaust outlet 16a side flow, therefore can not produce following situation: the internal face gas at process chamber 10 is turned back, to air knife 20a side counter-rotating, owing to the air-flow of this counter-rotating makes jet-stream wind turmoil from air knife 20a.Thus, can remove efficiently attached to the cleaning fluid on the substrate W.
On the other hand, the upper surface of substrate W is sprayed and contact with the upper surface of substrate W and the gas of turning back from the jet of the air knife 20b of upside, become sinuous flow state and mobile sometimes to exhaust outlet 16b, but the part of the droplet of the cleaning fluid of removing from the upper surface of substrate W is because the effect of gravity and falling in process chamber 10, with the gas that the jet from the air knife 20a of downside sprays, in process chamber 10, discharge by exhaust outlet 16a.Also have, stop the droplet that blows away the cleaning fluid of removing from the upper surface of substrate W by internal interval wall 34 from the substrate transferring direction upstream side of air knife 20b side inflow downstream.Thus, the upper surface side of the substrate W that can prevent at the allocation position that has passed through air knife 20b is adhered to the droplet of cleaning fluid once more.
Fig. 5 is expression other a execution mode of the present invention, is from the face down approximate vertical view of inside of process chamber of the liquid removing device seen of substrate transferring.In Fig. 5,, put on the Reference numeral the same, the omission explanation with the Reference numeral that in Fig. 1 to Fig. 3, uses to having the same member of same function to each member of device shown in Figure 3 with Fig. 1.
In device shown in Figure 5, each cowling panel 36 is configuration in parallel to each other respectively not, but is configured in the mode that each path that is formed on 36 of cowling panels points to exhaust outlet 16 respectively.Same with Fig. 1 to device shown in Figure 3, in the upper end of cowling panel 36 help roll 38 is installed.By making such structure, spray and contact with the lower surface of substrate W and the gas of turning back from the jet of the air knife 20a of downside, together discharge to exhaust outlet 16a guiding faster with the droplet of cleaning fluid, and can efficiently remove attached to the cleaning fluid on the substrate W.
Also have, Fig. 6 represents other execution mode of the present invention, is from the face down approximate vertical view of inner treatment chamber of the liquid removing device seen of substrate transferring.In Fig. 6, also, put on the Reference numeral identical, the omission explanation with the Reference numeral that in Fig. 1 to Fig. 3, uses to having the same member of same function to each member of device shown in Figure 3 with Fig. 1.
In device shown in Figure 6, be respectively arranged with interior groove 40,44 along the side wall surface of a side and the wall of moving into oral-lateral in the inside of process chamber 10.The front end of interior groove 40,44 is connected and endcapped with exhaust outlet 16a respectively, is formed with the suction inlet 42,46 of slit-shaped on axis direction.The slit- shaped suction inlet 42,46 of interior groove 40,44 forms along with becoming big mode away from exhaust outlet 16a with its A/F.Also have, the suction inlet 42,46 of preferred interior groove 40,44 is configured near the terminal of cowling panel 22.By making such structure, spray and contact with the lower surface of substrate W and the gas of turning back from the jet of the air knife 20a of downside, flow along cowling panel 22, from the path outflow of 22 of cowling panels, former state is drawn in the interior groove 40,44 by suction inlet 42,46.Therefore, the sinuous flow of the air-flow in the process chamber 10 reduces more.The gas that is drawn into the droplet that comprises cleaning fluid in the interior groove 40,44 is discharged by exhaust outlet 16a in the groove 40,44 internally.
In addition, in the above-described embodiment, be illustrated, but the remove liquid of the present invention after for the wet processed of the substrate beyond cleaning is handled and also can be suitable at the device that will after cleaning base plate, remove attached to the cleaning fluid on the substrate.
Claims (6)
1. substrate board treatment has:
Base board delivery device, it is supporting the substrate that adhered to treatment fluid on interarea and to the horizontal direction conveyance;
Process chamber, its closure ground surround by around the substrate of this base board delivery device conveyance;
Air knife, it is in the inside of this process chamber, disposes in the mode of intersecting with the substrate transferring direction, and has a jet, this jet is to the interarea by the substrate of aforesaid substrate carrying device conveyance, on its whole Width, to the upstream side gas jet of substrate transferring direction;
It is characterized in that,
Has exhaust apparatus, this exhaust apparatus is in the space side that has disposed above-mentioned air knife with respect to the substrate transferring route of above-mentioned process chamber, and the substrate transferring direction upstream side at the air knife allocation position is provided with exhaust outlet, simultaneously, inside at above-mentioned process chamber, in the vertical direction is erect to be provided with to make from the jet of above-mentioned air knife and is sprayed and brush many cowling panels that the gas on the interarea of substrate flows to above-mentioned exhaust outlet, and this exhaust apparatus carries out exhaust by above-mentioned exhaust outlet
Above-mentioned many cowling panels are provided with each other at interval and dispose, and form the path of gas between cowling panel.
2. the substrate board treatment of putting down in writing as claim 1, it is characterized in that, above-mentioned air knife is disposed to be overlooked on the direction that is tilting with respect to the substrate transferring direction down, and simultaneously, above-mentioned many cowling panels are disposed at overlooking down with respect to above-mentioned air knife on the direction of approximate vertical respectively.
3. as claim 1 or 2 substrate board treatments of being put down in writing, it is characterized in that, above-mentioned air knife across the substrate transferring route and thereon, both sides dispose a pair of down, above-mentioned exhaust outlet is separately positioned on the superjacent air space side and the following side space side of the substrate transferring route of above-mentioned process chamber, simultaneously, above-mentioned many cowling panels are configured in the lower side space of substrate transferring route of above-mentioned process chamber.
4. the substrate board treatment of putting down in writing as claim 3, it is characterized in that, to become the upstream side of substrate transferring direction and the mode in downstream to dispose the internal interval wall upper side separated by spaces of the substrate transferring route of above-mentioned process chamber at the allocation position place of above-mentioned air knife.
5. the substrate board treatment of putting down in writing as claim 3 is characterized in that, in the upper end of above-mentioned each cowling panel help roll is installed respectively, and this help roll contacts and supporting substrates with lower surface by the substrate of aforesaid substrate carrying device conveyance.
6. the substrate board treatment of putting down in writing as claim 4 is characterized in that, in the upper end of above-mentioned each cowling panel help roll is installed respectively, and this help roll contacts and supporting substrates with lower surface by the substrate of aforesaid substrate carrying device conveyance.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005097719A JP4494269B2 (en) | 2005-03-30 | 2005-03-30 | Substrate processing equipment |
| JP2005097719 | 2005-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1840997A CN1840997A (en) | 2006-10-04 |
| CN100440446C true CN100440446C (en) | 2008-12-03 |
Family
ID=37030120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100714929A Expired - Fee Related CN100440446C (en) | 2005-03-30 | 2006-03-29 | Substrate treatment device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4494269B2 (en) |
| KR (1) | KR100770503B1 (en) |
| CN (1) | CN100440446C (en) |
| TW (1) | TWI285136B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826168A (en) * | 2015-01-28 | 2016-08-03 | 芝浦机械电子株式会社 | Substrate processing device |
| CN107065433A (en) * | 2017-05-08 | 2017-08-18 | 京东方科技集团股份有限公司 | Drying device |
| CN108074835A (en) * | 2016-11-09 | 2018-05-25 | 盟立自动化股份有限公司 | Wet process device |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4730286B2 (en) * | 2006-11-24 | 2011-07-20 | トヨタ自動車株式会社 | Foreign matter removing apparatus and foreign matter removing method |
| KR101043830B1 (en) * | 2008-11-12 | 2011-06-22 | 주식회사 엘지실트론 | Equipment for manufacturing semiconductor device |
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| CN105826168A (en) * | 2015-01-28 | 2016-08-03 | 芝浦机械电子株式会社 | Substrate processing device |
| CN105826168B (en) * | 2015-01-28 | 2018-10-26 | 芝浦机械电子株式会社 | Substrate board treatment |
| CN108074835A (en) * | 2016-11-09 | 2018-05-25 | 盟立自动化股份有限公司 | Wet process device |
| CN107065433A (en) * | 2017-05-08 | 2017-08-18 | 京东方科技集团股份有限公司 | Drying device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006278859A (en) | 2006-10-12 |
| TW200637666A (en) | 2006-11-01 |
| CN1840997A (en) | 2006-10-04 |
| TWI285136B (en) | 2007-08-11 |
| KR100770503B1 (en) | 2007-10-25 |
| JP4494269B2 (en) | 2010-06-30 |
| KR20060106754A (en) | 2006-10-12 |
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