TWI227035B - Substrate processing device of transporting type - Google Patents

Substrate processing device of transporting type Download PDF

Info

Publication number
TWI227035B
TWI227035B TW92120389A TW92120389A TWI227035B TW I227035 B TWI227035 B TW I227035B TW 92120389 A TW92120389 A TW 92120389A TW 92120389 A TW92120389 A TW 92120389A TW I227035 B TWI227035 B TW I227035B
Authority
TW
Taiwan
Prior art keywords
substrate
processing
water
downstream
mist
Prior art date
Application number
TW92120389A
Other languages
Chinese (zh)
Other versions
TW200504791A (en
Inventor
Hitoshi Tauchi
Haruhiko Koizumi
Original Assignee
Sumitomo Precision Prod Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to PCT/JP2002/001684 priority Critical patent/WO2003071594A1/en
Application filed by Sumitomo Precision Prod Co filed Critical Sumitomo Precision Prod Co
Application granted granted Critical
Publication of TWI227035B publication Critical patent/TWI227035B/en
Publication of TW200504791A publication Critical patent/TW200504791A/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement

Abstract

In a substrate processing device of transporting type performing the etching processing etc., the substrate (10) sequentially passes through a drug-fluid processing section (40) and a water-washing section (50) etc., its purpose is to prevent the occurrence of the spots at the bubble-jet processing section (54) mounted in the water-washing section (50), and at the same time to prevent the drying of the substrate (10). In order to attain this purpose, a shield-plate for preventing the mist sputtering is mounted at the up-stream side and the down-stream side of two fluid-nozzle rows (56) for performing the bubble-jet processing. At the down-stream side of the shield-plate located at least at the most down-stream side among several shield-plates, a water-supply means (58) supplying the cleansing water to the surface of the substrate (10) is mounted. A separating wall (52) is provided to separate the bubble-jet processing section (54) from the next processing section (55). At the down-stream side of the separating wall (52), a water-supply means (58) supplying the cleansing water to the surface of the substrate (10) is mounted.

Description

1227035 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a transportable substrate processing apparatus, and is preferably applied to the manufacture of a glass substrate for a liquid crystal display device. [Prior art] A glass substrate used in a liquid crystal display device is manufactured by repeatedly performing chemical treatments such as etching and peeling on the surface of a glass substrate which is a plain material. This type of substrate processing apparatus is largely divided into a dry type and a wet type, and the wet type is divided into an intermittent type and a paper feed type. In addition, the paper feed type is further divided into a positioning type and a conveyance type achieved by roller conveyance. Among these substrate processing apparatuses, the basic structure of the conveying member is to transport the substrate in the horizontal direction and supply the processing liquid to the surface of the substrate, and it has been used in the past due to its high efficiency. Etching or peeling. In the substrate transfer device used for etching, the substrate passes through the receiving section (loading section), the liquid avoiding section, the etching section, the washing section, and the dewatering section in this order. In the etching section, the etching solution is sprayed from a plurality of spray nozzles arranged in a matrix above the substrate transfer line, and the etching solution is supplied to the substrate by passing the substrate through the spray. Overall surface. With this spraying treatment, the surface of the substrate is selectively etched except for the portion that has been coated with the shielding material. In the water washing section immediately after the etching section, pure water for washing is sprayed out by a plurality of spray nozzle sections arranged in a matrix J3 above and below the substrate transfer line. By passing the substrate through this kind of spraying, 6 1227035 cleans both surfaces of the substrate. However, the purpose of the water washing treatment immediately after the etching part is to remove and rinse the etching solution remaining on the surface of the substrate, and also to purify the particles by removing the particles from the surface of the substrate. In order to improve the ability of the latter to purify, brush washing, bubble washing, and Megasonic washing are optional to have the addition to the spraying treatment (generally in the middle of the spraying treatment). Process to proceed. The so-called bubble cleaning is to make the two fluid nozzles mixed with pure water and gas aligned in a plurality of rows in the width direction of the substrate, and the plurality of aligned nozzle rows spray pure water onto the substrate in a mist form. For the surface treatment, this type of nozzle array is arranged in one or two or more stages in the substrate conveying direction at two positions above and below the conveying line holding the substrate. Compared with brush cleaning, it is more effective in removing and even floating larger particles larger than 5 // m. Bubble cleaning is effectively removed by the smaller mist diameter. , And even the effect of floating particles to a small degree of 1 to 5 // m is more effective, while the ultrasonic vibration (Megasonic) cleaning is more effective in removing finer particles and even making them float. . Therefore, if necessary, these optional treatments are performed in a single or a combined group device in a water washing treatment. Therefore, in terms of bubble cleaning, a large amount of gas is used in order to form a fine mist, and the ejection amount thereof is more than 1000 L / min per row on each nozzle row. Because of this large amount of gas spray, the mist is widely scattered on the upstream side and downstream side of the spray position, and the stain is caused by the wide range attached to the surface of the substrate. In addition, by using a large amount of 7 1227035 gas, the surface of the substrate is easy to dry, and this event also causes the generation of stains, etc., and the problem of the main body is caused by drying the surface of the substrate. An object of the present invention is to provide a transfer type substrate processing apparatus, which is capable of effectively preventing the generation of stains that cause problems in the bubbling process and the drying of the substrate. [Summary of the Invention] In order to achieve the above object, the transfer-type substrate processing apparatus of the present invention is a transfer-type substrate processing apparatus for transferring a substrate in a horizontal direction and passing through a plurality of processing sections through at least one of the plurality of processing sections. The water washing treatment including the bubble treatment is performed here, and a shielding plate for preventing mist scattering is provided on the upstream side and the downstream side of the two fluid nozzle row for performing the aforementioned bubble treatment. On the downstream side of at least the most downstream side of the shielding plates, there is a water supply device for supplying washing water to the surface of the substrate. In the transfer-type substrate processing apparatus of the present invention, the mist-scattering prevention plates are provided on the upstream side and the downstream side of the two-fluid nozzle array to prevent the mist-scattering. The shielding plates for preventing mist scattering are arranged on the upstream side and the downstream side of the two-fluid nozzle array to enhance the air flow directly below the two-fluid nozzle array and promote the drying of the substrate. However, in most shielding plates, A water supply device for supplying washing water to the surface of the substrate is provided on the downstream side of the shielding plate at least on the most downstream side, thereby preventing such drying. Judging from the viewpoint of more effective prevention of the scattering of the mist, it is preferable that the 827027035 is provided with a partition wall which is separated by the subsequent processing section from the bubble processing section. In addition, it is preferable to make the front end of the shielding plate close to the surface of the substrate as much as possible, or to reduce the interval of the through hole of the substrate provided on the partition wall. On the other hand, judging from the viewpoint of more effectively preventing drying of the substrate, it is preferable that a water supply device for supplying washing water to the surface of the substrate is provided on the downstream side of the partition wall. In general, the distance between the through holes of the substrate provided on the partition wall to the surface of the substrate is 3 to 6 mm. Judging from the point of improving the effect of preventing the scattering of fog, 'the smaller the distance, the better, preferably 1 to 3 mm, especially 1 to 2 mm, but this distance is caused by the vibration of the substrate being transported. Due to restrictions, the system cannot obtain 1 to 3mm, especially 1 to 2mm. The distance from the front end of the shielding plate to the surface of the substrate is the same. Therefore, in order to arrange the two-fluid nozzle row for mist spraying at the position of the pass line holding the substrate up and down, the mist injection pressure from the upper two-fluid nozzle row is set higher than that from the bottom The second side of the fluid nozzle row has a mist spray pressure, and when an auxiliary roller supporting the substrate from below is provided near the mist jetting section, the substrate between the upper and lower two fluid nozzle rows can be stabilized and used as a front end of the shielding plate. The distance to the substrate surface can be formed to 1 to 3 mm, or 1 to 2 mm. That is, in order to stably convey the substrate in the bubble processing section, it is necessary to arrange the two fluid nozzle rows for mist spraying above and below the pass line holding the substrate. However, when the mist ejection pressure from the upper two-fluid nozzle row and the mist ejection pressure from the lower two-fluid nozzle row are set to be the same, the substrate becomes unstable. By setting 9 1227035 near the mist spraying section, the auxiliary roller supporting the substrate from below is set, and the mist spraying pressure from the upper two-fluid nozzle row is set higher than the mist spraying pressure from the lower two-fluid nozzle row. Thereby, it is possible to form a more stable shape when passing the substrate through other parts. As the aforementioned water supply device, a curtain-shaped nozzle that sprays the washing water continuously in the width direction onto the surface of the substrate in the form of a water film is preferably a simple structure. [Embodiment] Hereinafter, an embodiment of the present invention will be described based on the drawings. · The substrate processing apparatus of this embodiment is an etching apparatus used in the manufacture of a glass substrate for a liquid crystal display device. This substrate processing apparatus includes, as shown in FIG. 1, a receiving section 20, a liquid-avoiding section 30, an etching section 40, a water washing section 50, and a dewatering section 60, which are sequentially arranged toward the carrying direction of the substrate 10. Each part is provided with a plurality of transfer rollers 21, 31, 41, 51, and 61 that carry the horizontal support substrate 10 and carry them in the horizontal direction. The liquid-repellent portion 30 provided between the receiving portion 20 and the etching portion 40 is a buffer portion that prevents the etching solution used in the etching portion 40 from entering the receiving portion 20. In the etching section 40, a spraying unit 42 for supplying an etching solution in a spray form from above on the substrate 10 is provided above the transport line of the substrate 10. The water washing section 50 is divided into a first sprinkler section 5 3, a bubble treatment section 5 4, and a second sprinkler section 55 by two partition walls 52 and 52. In the first sprinkler section 53, there are first and second sets of first spraying units 53a, 53a, which are arranged above and below the substrate 10, and the pure water is sprayed from the substrate 10 to the top and _ 10 1227035 from below. Spread. The bubble processing unit 54 is provided with two fluid nozzle rows 56 and 56 in the upper and lower groups, and the mist is sprayed from above and below the substrate 10. The second sprinkler section 55 is provided with upper and lower second spraying units 55a and 55a, and sprays pure water from the substrate 10 from above and below from the substrate 10 above and below. The upper and lower fluid nozzle rows 5 6 and 5 6 are arranged in two stages in the conveying direction of the substrate 10. Each of the two-fluid nozzle rows 56 is provided with a plurality of two-fluid nozzles 56b, 56b,... As shown in FIG. 2 and FIG. 3. installation. Most of the two fluid nozzles 56b, 56b, ... mix pure water supplied from the water supply pipe 56c and clean gas supplied from the air supply pipe 56d to form a mist of pure water and spray it to the substrate in a curtain shape. The surface of 10 is full width. In addition, on the upstream side and the downstream side of all of the two fluid nozzle rows 56, a pair of shielding plates 5 7 and 5 7 before and after preventing the mist from scattering are provided so as to be separated from the substrate 10 by a slight gap. shape. An auxiliary roller 59 for supporting the substrate 10 in the vicinity of the mist spraying portion is provided on the inner surface of the shielding plate 57 on the lower side and on the downstream side. In addition, on the downstream side of the shielding plates 5 7 and 5 7 located on the downstream side of the fluid nozzle rows 56 and 56 of the upper and lower groups, water supply devices 5 8 and 5 8 of the upper and lower groups are provided. Furthermore, on the upstream side of the shielding plates 57 and 57 on the most upstream side, water supply devices 5 8 and 5 8 of the upper and lower groups are also provided. Each water supply device 58 is a curtain-shaped nozzle for continuously spraying a curtain-shaped water film toward the vicinity of the front end of the shielding plate 57 in the width direction above or below the substrate 10. Specifically, as shown in FIG. 4, it is provided with: a header pipe 58a extending in the horizontal direction of the conveying direction of the vertical substrate 10; a sprinkler nozzle 58b in the longitudinal direction of the header pipe 58a Installation is performed at specified intervals; the water spray nozzle 5 8b sprays pure water in a fan shape toward the direction perpendicular to the conveying direction of the substrate 10 in an enlarged manner to overlap the sprayed water between adjacent nozzles. As shown in Fig. 1, the dewatering section 60 is provided with slit-shaped nozzles 62, 63 for a pair of upper and lower air knives arranged to hold the conveying line of the substrate 10 in an up-and-down manner. The slit-shaped nozzle 62 on the upper side blows gas into a film shape across the full width of the upper surface of the substrate 10 to remove water droplets and moisture from the upper surface of the substrate 10 after the cleaning. The slit-shaped nozzle 63 on the lower side blows gas into a thin film shape across the full width of the lower surface of the substrate 10 to remove water droplets and moisture from the lower surface of the substrate 10 after cleaning. The upper and lower slit-shaped nozzles 62 and 63 are inclined to the upstream side when the conveying direction of the substrate 10 is seen from the side in order to improve the removal efficiency of water droplets and moisture, and are inclined to the side when seen from the plane. In the transfer-type substrate processing apparatus of this embodiment, the substrate 10 passes the receiving section 20, the liquid-repellent section 30, the etching section 40, the water-washing section 50, and the dewatering section 60 in this order, and is placed on the substrate 10 After the etching process is performed, the upper and lower surfaces are washed, and then a drying process is performed. In the water washing unit 50, the substrate 10 passes through the first water spraying unit 53, the bubble processing unit 54, and the second watering unit 55 in this order. In the first water spraying section 53, the upper surface and the lower surface of the substrate 10 are sprayed with pure water sprayed from the first spraying units 53a, 53a. In the bubble processing unit 54 configured by spraying the two fluids of the upper and lower groups 12 1227035 nozzle rows 5 6 and 5 6 in two stages arranged on the substrate conveying direction, the upper and lower surfaces of the substrate 10 are made of pure water mist. Withstand spray processing. In the second spraying section 55, the spraying process is performed again with pure water sprayed from the second spraying units 5a and 5a. By adding a spraying process to perform a bubbling process, the upper and lower surfaces of the substrate 10 are not only cleaned by pure water (removal of the etching solution), but fine particles attached to the upper and lower surfaces of the substrate 10 can also be made. It floats and is partially removed. In the bubble processing unit 54, a large amount of gas is ejected from the upper and lower fluid nozzle rows 56, 56 together with the mist, colliding with the surface of the substrate 10, and scattering to the upstream side and the downstream side. The upper and lower fluid nozzle rows 5 6 and 5 6 are provided with shielding plates 5 7 and 5 7 respectively on the upstream side and the downstream side of the upper and lower fluid nozzle rows so that the mist spraying portion is isolated. In addition, the present system of the bubble treatment part 56 is separated by the front and rear sprinkler parts 5 3 and 5 5 by partition walls 5 2 and 5 2. Therefore, this kind of mist can be effectively prevented from scattering, especially the scattering toward the downstream side which causes the stain. In the bubble processing section 54 or in the downstream side of the mist spraying section ', the substrate 10 is supported by the auxiliary roller 59. In this state, the mist ejection pressure from the upper two-fluid nozzle row 56 is set to be higher than the mist ejection pressure from the lower two-fluid nozzle row 56. Thereby, the mist ejection part is moved and the substrate 10 is continuously pressed to the auxiliary roller 59 by the difference of the mist ejection pressure to form a fairly stable state. As a result, the distance from the front end of the shielding plate 57 to the surface of the substrate 10 can be 1 to 3 mm or 1 to 2 mm. In addition, the interval of the substrate through-holes provided on the partition wall 52 13 1227035 is 3 to 6 mm from the surface of the substrate 10. In addition, the auxiliary roller 59 is used to approach the mist spraying portion, and its diameter 値 is sufficiently smaller than the diameter 値 of the conveying roller. Specifically, when the diameter 値 of the conveying roller is 45 mm, the diameter 値 of the auxiliary roller is preferably about 15 mm. In addition, in order for the upper and lower sets of water supply devices 5 8 and 5 8 to be arranged on the further downstream side of the shielding plates 57 and 57 located on the downstream side of the fluid nozzle rows 56 and 56 of the upper and lower sets and the downstream side partitions On the further downstream side of the wall 52, pure water is supplied above and below the substrate 100. Therefore, it is also possible to prevent the generation of stains caused by the bubbling process and the drying of the substrate 10 which causes problems at the same time. Regarding the arrangement position of the water supply device 58, judging from the viewpoint of preventing the substrate 10 from drying, when the fluid nozzle rows 56 and 56 of the upper and lower groups are in one stage, the upper and lower groups must be separated. The water supply devices 5 8 and 5 8 are provided at least on the downstream side. When the fluid nozzle rows 5 6 and 5 6 of the upper and lower groups are in two or more stages, the water supply devices of the upper and lower groups must be provided. 5 8 and 5 8 are provided at least on the downstream side of the two fluid nozzle rows 5 6 and 5 6 on the most downstream side. Regarding the partition walls 5 2 and 5 2, it is sufficient to have at least the downstream side of the bubble processing section 54, and the partition wall 5 2 on the upstream side may be omitted. As an optional treatment in the water washing section 50, in the above embodiment, only the bubble treatment is used. However, in addition to this treatment, a brush washing treatment and a megasonic washing may be used. Treatment, high 14 1227035 One or more treatments in sprinkler water treatment. The brush cleaning treatment is performed on the upstream side of the bubble treatment, the ultrasonic vibration cleaning treatment is performed on the downstream side of the bubble treatment, and the high-pressure sprinkler treatment is performed between the bubble treatment and the ultrasonic vibration washing treatment. There are many implementers. In the case of using a brush washing process, a bubble spraying process, and an ultrasonic vibration washing process, the first spraying process, the brush cleaning process, the bubble spraying process, the ultrasonic vibration washing process, and the second The water spraying treatment is performed, and the ultrasonic vibration cleaning treatment is formed immediately after the bubble spraying treatment. In the case of the high-pressure sprinkler treatment, the treatment is performed immediately after the blasting treatment. In addition, in the case of using Megasonic cleaning, a partition wall must be formed on the downstream side and upstream side of the treatment section. In the transfer roller, at least the edges of both sides of the substrate 10 are supported from below to advance it. However, in the partial transfer rollers, the edges of both sides of the substrate 10 may be combined from above. The pin roller (51 'in Figs. 2 to 4) is clamped, and the substrate 10 can be reliably conveyed. [Possibility of Industrial Utilization] As described above, the transfer-type substrate processing apparatus of the present invention transfers a substrate in a horizontal direction, passes through a plurality of processing sections, and includes at least one of the plurality of processing sections The ice-washing treatment of the bubble treatment is characterized in that a shielding plate for preventing mist scattering is provided on the upstream side and the downstream side of the two-fluid nozzle row for performing the foregoing bubble treatment. At least the downstream side of the shielding plate on the most downstream side is provided with a water supply device for supplying washing water to the surface of the substrate, thereby providing a substrate and a substrate 15 that can effectively prevent the generation of stains that cause problems during the bubbling process. 1227035 of the two problems of drying. [Brief Description of the Drawings] Fig. 1 is a schematic side view of a transfer type substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a side view of the bubble processing section of the main part of the transfer type substrate processing apparatus. Fig. 3 is a schematic view taken along the line A-A in Fig. 2. Fig. 4 is a schematic view taken along line B-B in Fig. 2. [Description of Representative Symbols of Main Parts] · 1 〇: Substrate 20: Receiving section 2 1: Transport roller 3 〇: Liquid avoidance section * 3 1: Transport roller 40: Etching section 41: Transport roller 42: Spray unit φ 5 0: Washing section 5 1 ′: Pin roller 5 1: Transport roller 5 2: Partition wall 5 3 a: First spraying unit 5 3: First spraying section 54: Bubbling processing section '16 1227035
55a: second spraying unit 5 5: second sprinkler 5 6: two-fluid nozzle row 56a: header 56c: water supply pipe 5 6 d: air supply pipe 5 7: shielding plate 58a: header pipe 5 8b: sprinkler nozzle 5 8: Water supply device 5 9: Auxiliary roller 60: Dewatering section 6 1: Transport roller 62: Slit nozzle 63: Slit nozzle
17

Claims (1)

1227035 Patent application scope: 1 · A transfer type substrate processing device for carrying substrates in a horizontal direction, passing through a plurality of processing units, and performing a water washing process including a bubbling process in at least one of the plurality of processing units It is characterized in that a shielding plate for preventing mist scattering is provided on the upstream side and the downstream side of the two fluid nozzle row for performing the aforementioned bubble blowing treatment, and at the same time, a shielding plate on at least the most downstream side among most shielding plates. On the downstream side, there is a water supply device for supplying washing water to the surface of the substrate. 2. If the transfer-type substrate processing device according to item 1 of the patent application scope is provided with a partition wall, the aforementioned bubble processing section is isolated by the subsequent processing section. 3. The transfer type substrate processing apparatus according to item 2 of the patent application range, wherein a water supply device for supplying washing water to the surface of the substrate is provided on the downstream side of the partition wall. 4. For the transfer type substrate processing device according to item 1 or 3 of the patent application scope, wherein the aforementioned water supply device is to continuously spray the washing water on the substrate surface in the form of a water film in the width direction. 5. For the transfer type substrate processing device of the first item of the scope of patent application, the two fluid nozzles are arranged in a pass line position holding the substrate up and down, and a fluid from the upper side is arranged. The mist ejection pressure of the nozzle row is set to the mist ejection pressure of the two fluid nozzle row from the lower side, and an auxiliary roller supporting the substrate from below is provided near the mist ejection section. 6. For the transportable substrate processing device in the scope of the patent application, the distance between the front end of the aforementioned shielding plate and the surface of the substrate is 1 to 3 mm ° 18
TW92120389A 2002-02-25 2003-07-25 Substrate processing device of transporting type TWI227035B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/001684 WO2003071594A1 (en) 2002-02-25 2002-02-25 Carrier type substrate processing device

Publications (2)

Publication Number Publication Date
TWI227035B true TWI227035B (en) 2005-01-21
TW200504791A TW200504791A (en) 2005-02-01

Family

ID=27742310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92120389A TWI227035B (en) 2002-02-25 2003-07-25 Substrate processing device of transporting type

Country Status (3)

Country Link
JP (1) JPWO2003071594A1 (en)
TW (1) TWI227035B (en)
WO (1) WO2003071594A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365192B2 (en) * 2003-11-25 2009-11-18 住友精密工業株式会社 Transport type substrate processing equipment
JP4789446B2 (en) * 2004-09-27 2011-10-12 芝浦メカトロニクス株式会社 Substrate processing equipment
JP4851776B2 (en) * 2004-11-02 2012-01-11 昭和電工株式会社 Liquid honing machine and liquid honing method
KR100691479B1 (en) 2005-12-20 2007-03-12 주식회사 케이씨텍 Etching chamber for large area substrate
WO2008087903A1 (en) * 2007-01-15 2008-07-24 Shibaura Mechatronics Corporation Apparatus and method for processing substrate
JP5454834B2 (en) * 2007-08-30 2014-03-26 日立化成株式会社 Roughening device
JP4977230B2 (en) * 2010-03-31 2012-07-18 積水化学工業株式会社 Etching method and apparatus
JP2012126582A (en) * 2010-12-13 2012-07-05 Asahi Glass Co Ltd Method for producing cover glass for display device
JP2013026490A (en) * 2011-07-22 2013-02-04 Tokyo Electron Ltd Substrate processor
JP6366328B2 (en) * 2014-04-02 2018-08-01 株式会社中西製作所 Nozzle tube unit and cleaning device using the same
CN106971966A (en) * 2017-04-06 2017-07-21 安徽熙泰智能科技有限公司 A kind of semiconductor chip cleaning device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594863B2 (en) * 1995-06-01 2004-12-02 株式会社半導体エネルギー研究所 Method for manufacturing active matrix display device
JP3315611B2 (en) * 1996-12-02 2002-08-19 三菱電機株式会社 Two-fluid jet nozzle for cleaning, cleaning device, and semiconductor device
JP2000323813A (en) * 1999-05-12 2000-11-24 Dainippon Screen Mfg Co Ltd Substrate treatment unit

Also Published As

Publication number Publication date
WO2003071594A1 (en) 2003-08-28
JPWO2003071594A1 (en) 2005-06-16
TW200504791A (en) 2005-02-01

Similar Documents

Publication Publication Date Title
TWI227035B (en) Substrate processing device of transporting type
KR100212074B1 (en) Apparatus for removing liquid from substrate
JP3597639B2 (en) Substrate processing apparatus and substrate processing method
KR20080090070A (en) Air knife and apparatus drying substrates having the same
TW548697B (en) Substrate processing device
JPH10275792A (en) Substrate-drying equipment
TWI283441B (en) Substrate treating device
CN101219427A (en) Substrate processing device
JPH1144877A (en) Substrate washing device
KR20040110391A (en) substrate treatment apparatus
JP2003282525A (en) Substrate treatment device
TWI344398B (en)
KR100691473B1 (en) Air knife module for drying substrate and drying device using thereof
JP4352194B2 (en) Substrate drying apparatus and substrate drying method
JP3550277B2 (en) Substrate processing equipment
KR100764683B1 (en) Substrate processing apparatus
JP4365192B2 (en) Transport type substrate processing equipment
KR200295029Y1 (en) Apparatus for cleaning a panel
JP4675113B2 (en) Substrate cleaning device
KR20060027597A (en) Substrate cleaning system and method for cleaning the substrate
JP2003092284A (en) Substrate processing apparatus
JP3866856B2 (en) Substrate processing equipment
JP2007073649A (en) Resist stripping and cleaning device, method of stripping and cleaning resist, and method of manufacturing substrate
JP2017154111A (en) Substrate treatment apparatus and substrate treatment method
JP2010103383A (en) Substrate processing apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees