TWI446480B - Substrate cooling apparatus - Google Patents

Description

Substrate cooling device

The present invention relates to a thin-plate-shaped precision electronic substrate such as a glass substrate for a liquid crystal display device after heating, a glass substrate for a PDP (plasma display panel), a semiconductor wafer, a substrate for a recording disk, and a substrate for a solar cell. (hereinafter simply referred to as "substrate") A substrate cooling device that performs cooling treatment.

In the processing step of the substrate, for example, after the substrate coated with the processing liquid such as a photoresist is heated and formed into a film, the substrate is appropriately cooled. Previously, as a method of cooling the heated substrate, a method of placing the substrate on a cooling plate of water-cooled metal was generally employed. Moreover, in recent years, in order to increase the throughput, the substrate which has been heated by the transfer roller cooled by the refrigerant is cooled while being heated. The substrate cooling device is disclosed, for example, in Patent Document 1.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-94281

However, in the method in which the heated substrate is placed on a cooling plate and cooled, it is difficult to increase the throughput (the cooling plate must be arranged in a plurality of stages in order to increase the throughput), and it is also impossible to increase the size of the substrate. Respond to the problem. Further, in the method in which the substrate is conveyed while being cooled by the cooling transfer roller, the transfer roller and the substrate are directly brought into contact with each other and peeled off. Therefore, generation of static electricity due to peeling electrification becomes a problem.

As a cooling method for solving such problems, a method of cooling the substrate blowing air flow while conveying the heated substrate is considered. When a fan filter unit having a HEPA (high efficiency particulate air) filter is used as a unit for blowing air flow, and the substrate is supplied with a downflow, the air flow is weak, along The flow rate of the air flow on the surface of the substrate is almost zero, so that the heat of the substrate cannot be efficiently removed and cooled. Further, in the method in which the substrate to be transported is compressed in a curtain shape from the slit-shaped nozzle, the heat of the substrate can be removed only when the air flow contacts the substrate, and thereafter the air flow spreads to the periphery. It is difficult to effect uniform cooling.

The present invention has been made in view of the above problems, and an object thereof is to provide a substrate cooling device capable of uniformly cooling a substrate surface while efficiently transporting a substrate.

In order to solve the above problems, the invention of claim 1 is a substrate cooling device characterized in that it cools a substrate after heating, and includes: a transfer mechanism that transports the substrate in a specific direction; and a wind tunnel portion A gas flow path in which both end portions are open is formed around the transfer path of the substrate of the transfer mechanism, and an air flow forming mechanism that forms an air flow in the gas flow path along the transfer direction of the substrate.

The substrate cooling device according to the invention of claim 1, wherein the wind tunnel portion is formed with an exhaust port that communicates with the gas flow path, and the air flow forming mechanism has a gas flow path. An exhaust mechanism from which the ambient gas is discharged from the exhaust port.

The substrate cooling device according to the invention of claim 2, wherein the exhaust port is formed in a central portion of the wind tunnel portion in the transport direction.

The substrate cooling device according to any one of claims 1 to 3, wherein the airflow forming means includes a gas ejecting gas which is blown into at least one of both end portions of the gas flow path. mechanism.

The substrate cooling device according to the invention of claim 4, wherein the gas ejecting mechanism includes ionization that generates ions and blows them into at least one of both end portions of the gas flow path together with the gas. Device.

The substrate cooling device according to any one of claims 1 to 5, wherein a ventilating cylinder for guiding a gas to at least one of both end portions of the gas flow path is attached to the wind tunnel unit.

The substrate cooling device according to the invention of claim 6, wherein the ventilating cylinder is disposed above and below the transport path, and the ventilator provided above and below is provided with the narrowest interval between the two. The reduced diameter portion is spaced apart from the transfer passage by the reduced diameter portion of the lower ventilating cylinder and smaller than the distance between the reduced diameter portion of the upper ventilating cylinder and the transfer passage.

The substrate cooling device according to any one of claims 1 to 7, wherein the rectifying fan extends in parallel with the conveying direction on an inner wall surface of the wind tunnel portion.

The substrate cooling device according to any one of claims 1 to 8, wherein the conveying mechanism is conveyed by a part of a roller protruding from an opening provided in a bottom surface of the wind tunnel portion. The substrate is further provided with a shroud covering the entire lower surface of the roller than the bottom surface on the outer wall of the bottom surface of the wind tunnel portion.

Further, the invention of claim 10 is a substrate cooling device characterized in that it cools a substrate after heating, and includes: a transfer mechanism that transports the substrate in a specific direction; and a cover that is covered by the cover a surface of the substrate conveyed by the transport mechanism, and a gas flow path opened at both ends between the substrate and the surface of the substrate; and an air flow forming mechanism that forms an air flow along the transport direction of the substrate in the gas flow path .

The substrate cooling device of the invention of claim 10, wherein the cover body is formed with an exhaust port that communicates with the gas flow path, and the air flow forming mechanism includes the gas flow path. An exhaust mechanism from which the ambient gas is discharged from the exhaust port.

The substrate cooling device according to the invention of claim 10 or 11, wherein the air flow forming means includes a gas discharge mechanism that blows a gas into at least one of both end portions of the gas flow path.

The substrate cooling device according to the invention of claim 12, wherein the gas ejecting mechanism includes ionization that generates ions and blows them into at least one of both end portions of the gas flow path together with the gas. Device.

The substrate cooling device according to any one of claims 10 to 13, wherein the ventilator that guides gas to at least one of both end portions of the gas flow path is attached to the cover. Physically.

The substrate cooling device according to any one of claims 10 to 14, wherein a rectifying fan extends in parallel with the conveying direction on an inner wall surface of the lid body.

According to the inventions of claims 1 to 9, the gas flow is formed along the transport direction of the substrate in the gas flow path formed around the transfer path of the substrate and opened at both ends, so that the air flow can be prevented from being carried along the substrate after heating. The surface flows in parallel and spreads, so that the substrate surface can be uniformly cooled while being efficiently conveyed.

In particular, according to the invention of claim 5, ions are generated and blown into the gas flow path together with the gas, whereby the static electricity generated on the surface of the substrate can be neutralized and removed.

In particular, according to the invention of claim 6, the ventilating cylinder for guiding the gas to at least one of the both end portions of the gas flow path is attached to the wind tunnel portion, so that a larger amount can be obtained by the Coanda effect and the Bernoulli effect. Since the gas is efficiently supplied to the gas flow path, the flow rate of the gas flow formed in the gas flow path can be increased to further improve the cooling efficiency of the substrate.

In particular, according to the invention of claim 7, the interval between the reduced diameter portion of the lower ventilating cylinder and the transport path is smaller than the interval between the reduced diameter portion of the upper ventilating cylinder and the transport path, so that it is generated on the lower side of the upper side of the substrate. The strong Bernoulli effect causes the gas pressure on the lower side of the substrate to be lower than the upper side air pressure, and as a result, the substrate can be prevented from floating from the transfer path.

In particular, according to the invention of claim 8, the rectifying fan is extended in parallel with the conveying direction on the inner wall surface of the wind tunnel portion, so that the air flow is rectified to linearly flow in the gas flow path, and the surface of the substrate can be uniformly supplied. Air flow so that the substrate can be cooled more evenly.

In particular, according to the invention of claim 9, the transport mechanism transports the substrate by a portion of the roller protruding from the opening of the bottom surface of the wind tunnel portion, and the outer wall of the wind tunnel portion is provided with a lower surface of the cover roller. In the entire shroud, the flow of the air flowing through the gas flow path from the gap between the opening and the roller to the outside is suppressed to a minimum, and the disorder of the air flow formed in the gas flow path can be prevented. The substrate is cooled more uniformly.

According to the inventions of claims 10 to 15, the gas flow is formed in the gas flow path formed between the lid body covering the surface of the transfer substrate and the surface of the substrate and the both end portions are open, and the gas flow is formed along the substrate transport direction. The surface of the substrate that has not been transported after being heated flows in parallel, so that the substrate can be uniformly cooled while being efficiently conveyed while the substrate is being conveyed.

In particular, according to the invention of claim 13, ions are generated and blown into the gas flow path together with the gas, so that the static electricity generated on the surface of the substrate can be neutralized and removed.

In particular, according to the invention of claim 14, the ventilating cylinder for guiding the gas to at least one of the both end portions of the gas flow path is attached to the lid body, so that the amount can be increased by the Coanda effect and the Bernoulli effect. The gas is efficiently fed into the gas flow path, so that the flow rate of the gas flow formed in the gas flow path can be increased to further improve the cooling efficiency of the substrate.

In particular, according to the invention of claim 15, the rectifying fan is extended in parallel with the conveying direction on the inner wall surface of the lid body, so that the air flow in the gas flow path is rectified to linearly flow, and the surface of the substrate can be uniformly supplied. Air flow so that the substrate can be cooled more evenly.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First embodiment>

Fig. 1 is a side view showing the configuration of a main part of a substrate cooling device 1 according to a first embodiment of the present invention. In each of FIG. 1 and the following drawings, in order to clarify the directional relationship of the portions, an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane is appropriately attached. In addition, in each of FIG. 1 and the following drawings, in order to make it easy to understand, the dimension of each part is expanded as needed.

The substrate cooling device 1 of the present invention is a device for performing a cooling process while transporting the substrate W (the glass substrate for a liquid crystal display device having a rectangular shape in the present embodiment) which has been subjected to heat treatment. First, the overall schematic configuration of the substrate cooling device 1 will be described. The main components of the substrate cooling device 1 include a roller transport mechanism 10, a wind tunnel portion 20, and an air flow forming mechanism 60.

The roller transport mechanism 10 includes a plurality of rollers 11 and a motor (not shown) that rotates part or all of the rollers. The roller transport mechanism 10 transports the substrate W supported by the roller 11 at a specific speed in the Y direction by rotating a plurality of rollers 11 . In the present embodiment, the substrate W is transferred from the (-Y) side (+Y) side. In the present specification, the Y direction of the transport substrate W is referred to as a "transport direction", and the horizontal direction (ie, the X direction) orthogonal to the transport direction is referred to as a "width direction".

A roller conveyor is disposed on the upstream side ((-Y) side) and the downstream side ((+Y) side) of the substrate cooling device 1 respectively. The roller conveyor also has a plurality of rollers 19, and the substrate 19 is conveyed in the Y direction by rotating the roller 19. The roller conveyor on the upstream side receives the heated substrate W from the heating device of the previous step and conveys the substrate W to the substrate cooling device 1. The roller conveyor on the downstream side receives the substrate W from the substrate cooling device 1 and transports the substrate W to a device (for example, an exposure device) of the next step. In addition, in FIG. 1, for the convenience of illustration, only one roller 19 is shown to the roller conveyor of the upstream side and the downstream side, respectively.

The plane formed by the plurality of rollers 19 of the roller conveyors on the upstream side and the downstream side and the apexes of the plurality of rollers 11 of the roller transport mechanism 10 is the transport plane of the substrate W, and the substrate is formed in the Y direction along the transport plane. W transfer path. Further, the height positions of the apexes of the plurality of rollers 19 are the same as the height positions of the apexes of the plurality of rollers 11 of the roller transport mechanism 10.

The wind tunnel portion 20 is provided so as to surround the periphery of the transport path of the substrate W formed by the roller transport mechanism 10. The wind tunnel portion 20 is formed in a tunnel shape in which both end portions are open. Specifically, the end portions of the wind tunnel portion 20 along the inlet side ((-Y) side) and the outlet side ((+Y) side) of the conveyance path are opened, and the substrate W can be passed. . Further, a ventilating cylinder 50 is attached to the inlet side end portion and the outlet side end portion of the wind tunnel portion 20.

A wind tunnel portion 20 having both end portions opened is provided so as to surround the periphery of the transport path of the substrate W, and a ventilating cylinder 50 is attached to both end portions of the wind tunnel portion 20, whereby the wind tunnel portion 20 and the inner cavity portion of the ventilating cylinder 50 are provided It is defined as a gas flow path 25 that is open at both ends. The gas flow path 25 is formed around the transfer path of the substrate W formed by the roller transport mechanism 10. In the present specification, the inlet side end portion of the gas flow path 25 (that is, the opening on the (-Y) side in FIG. 1) is referred to as "substrate transfer inlet 21", and the outlet side end portion ((+Y) side of FIG. 1) The opening is referred to as "substrate transfer port 22".

In the first embodiment, the exhaust box 70 is connected to the center portion of the wind tunnel portion 20 in the conveying direction. The exhaust box 70 discharges the ambient gas in the gas flow path 25. Further, an air knife nozzle 80 is provided in the vicinity of the substrate carrying inlet 21 and the substrate carrying port 22. The air knife nozzle 80 blows air into the gas flow path 25 from the substrate transfer port 21 or the substrate transfer port 22 . The air from the exhaust port of the exhaust box 70 and the air blow nozzle 80 are blown into the gas flow path 25 to form an air flow along the transport direction of the substrate W. That is, in the first embodiment, the air flow forming mechanism 60 is configured by the exhaust box 70 and the air knife nozzle 80. Hereinafter, the configuration of each part will be described in more detail.

Fig. 2 is a view of the top (upper surface) of the wind tunnel portion 20 as viewed from the lower side. 3 is a view of the bottom (bottom surface) of the wind tunnel portion 20 as viewed from the upper side. Furthermore, Fig. 4 is a view of the wind tunnel portion 20 as seen from the A-A cross section of Fig. 1. The wind tunnel portion 20 has a box shape having a rectangular cross section. The wall surface of the wind tunnel portion 20 may be formed of a plate material such as stainless steel (for example, SUS304 or SUS430). In the present embodiment, the wind tunnel portion 20 is configured by assembling an aluminum alloy (Al) aggregate around the roller conveying mechanism 10 and assembling a stainless steel plate material on the aggregate.

The length of the transport direction of the wind tunnel portion 20 can be any value of about several tens of mm to several thousand mm, and can be shorter than the transport direction length of the substrate W. For example, in the first embodiment, the length of the wind tunnel portion 20 in the transport direction is 800 mm, but it is shorter than the length of the glass substrate of the fourth generation (G4) or less. When the length of the conveying direction of the wind tunnel portion 20 is long, the reinforcing rod may be attached to the top or the bottom portion so that the wall surface is not bent. Further, the length of the wind tunnel portion 20 in the width direction may be a value obtained by adding a width of several mm to several tens of mm to the width of the substrate W to be processed. Further, the height of the wind tunnel portion 20 may be any value of about several mm to several tens of mm. In the first embodiment, the interval from the transfer path of the substrate W to the top and bottom of the wind tunnel portion 20 is set to 20 mm. Further, the interval from the transfer path of the substrate W to the top and bottom of the wind tunnel portion 20 can be adjusted.

As shown in FIG. 2, a plurality of (eight in the first embodiment) exhaust ports 71 that communicate with the gas flow path 25 are formed in the top of the wind tunnel portion 20. Eight exhaust ports 71 are formed in the wind tunnel portion 20. The central part of the transport direction. Further, eight exhaust ports 71 are formed in a line in the width direction. Each of the exhaust ports 71 has a long hole shape that is longer in the width direction than the transport direction.

As shown in FIGS. 2 and 4, an exhaust box 70 is provided on each of the eight exhaust ports 71. That is, eight exhaust boxes 70 are provided on the top of the wind tunnel portion 20 corresponding to the eight exhaust ports 71. The eight exhaust boxes 70 are connected to the blower 75 via the exhaust pipe 74. An exhaust valve 72 and a flow rate adjusting valve 73 are inserted into the exhaust pipe 74. The exhaust valve 72 and the flow rate adjusting valve 73 are individually provided on each of the eight exhaust boxes 70. With this configuration, the exhaust valve 72 can be opened while the blower 75 is actuated, and the inside of the exhaust box 70 can be made to be negatively pressurized, and the ambient gas in the gas flow path 25 can be discharged from the exhaust port 71. Further, the flow rate of the exhaust gas from the eight exhaust ports 71 arranged in the width direction can be individually adjusted by individually adjusting the eight flow rate adjusting valves 73.

Further, a plurality of rectifying fans 23 (seven in the first embodiment) are extended in parallel with the conveying direction on the top inner wall surface of the wind tunnel portion 20. The length of the vertical direction (Z direction) of the rectifying fan 23 is about several mm (about 7 mm in the first embodiment). As shown in FIG. 2, in the arrangement of the eight exhaust ports 71 along the width direction, one rectifying fan 23 is formed between the adjacent exhaust ports 71.

On the other hand, as shown in FIG. 3, an opening portion 31 for projecting a part of the upper side of the roller 11 of the roller transport mechanism 10 is provided at the bottom of the wind tunnel portion 20. The size of each of the openings 31 is set to be slightly larger than the size of the roller 11 (the size of the protruding portion) which protrudes upward from the bottom of the wind tunnel portion 20 so as to make the gas flow path 25 and the bottom of the wind tunnel portion 20 The air between the lower spaces is as small as possible.

As shown in FIG. 3, a plurality of openings 31 are formed in a row along the transport direction in the vicinity of both ends in the width direction of the bottom portion of the wind tunnel portion 20. On the other hand, in the inner region excluding the vicinity of both ends in the width direction, a plurality of openings 31 are formed so as to be slightly offset in the width direction of the opening 31 adjacent to each other in the transport direction. The reason why the opening portion 31 is disposed in this manner is that it is considered that the heated substrate W is in direct contact with the roller 11, whereby the contact portion is lowered in temperature due to heat conduction. In other words, in the inner region except for the vicinity of both ends in the width direction of the substrate W, since the positions of the rollers 11 adjacent to each other in the transport direction are shifted in the width direction, the rollers do not contact the same portion of the substrate W, and The influence of the contact with the roller 11 on the uniformity of the in-plane temperature distribution of the substrate W is suppressed to a minimum. On the other hand, in the vicinity of both ends in the width direction of the substrate W, all of the plurality of rollers 11 arranged in a row intermittently contact the same portion of the substrate W, and thus the temperature drop may become remarkable as compared with the other inner regions. However, since the vicinity of both ends in the width direction of the substrate W is not used as a device, it is not necessary to uniformly cool the same as the other inner regions.

Further, a plurality of exhaust ports 71 (six in the first embodiment) that communicate with the gas flow path 25 are also formed at the bottom of the wind tunnel portion 20. The six exhaust ports 71 are formed in the central portion of the wind tunnel portion 20 in the transport direction. Further, similarly to the exhaust port at the top, the six exhaust ports 71 are formed in a line in the width direction, and each of the exhaust ports 71 has a long hole shape that is longer in the width direction than the transport direction.

As shown in FIGS. 3 and 4, an exhaust box 70 is provided below each of the six exhaust ports 71. That is, six exhaust boxes 70 are provided on the lower surface of the bottom portion of the wind tunnel portion 20 corresponding to the six exhaust ports 71. Similarly to the exhaust box 70 provided at the top, the six exhaust boxes 70 are connected to the blower 75 via the exhaust pipe 74. An exhaust valve 72 and a flow rate adjusting valve 73 are inserted into the exhaust pipe 74. The exhaust valve 72 and the flow rate adjusting valve 73 are individually provided on each of the six exhaust boxes 70. Therefore, the exhaust valve 72 can be opened while the blower 75 is actuated, and the inside of the exhaust tank 70 can be made to be negatively pressurized, and the ambient gas in the gas flow path 25 can be discharged from the exhaust port 71. Moreover, the flow rate of the exhaust gas from the six exhaust ports 71 arranged at the bottom of the wind tunnel portion 20 in the width direction can be individually adjusted by individually adjusting the six flow rate adjusting valves 73.

Further, a plurality of rectifying fans 23 (four in the first embodiment) which are the same as the rectifying fan at the top are extended in the inner wall surface of the bottom portion of the wind tunnel portion 20 in parallel with the conveying direction. Further, a rectifying plate is provided so as to surround the periphery of the opening portion 31 so that the air flow of the gas flow path 25 does not flow out from the gap between the roller 11 and the opening portion 31.

Returning to Fig. 1, on the outer wall surface of the bottom portion of the wind tunnel portion 20, a shroud 35 covering the entire lower portion of the roller 11 (i.e., the entire portion excluding the portion protruding from the opening portion 31) is provided. By providing the shroud 35, the inner space of the shroud 35 and the gas flow path 25 are in communication with each other via the opening 31, but the ambient gas in the gas flow path 25 is blocked from the external ambient gas of the substrate cooling device 1. .

A ventilating cylinder 50 is attached to both end portions of the wind tunnel portion 20. The ventilator 50 is disposed at both ends of the wind tunnel portion 20 at both the top and the bottom. At both end portions of the wind tunnel portion 20, a pair of ventilating cylinders 50 disposed above and below the transport path of the substrate W are provided with a reduced diameter portion 55 having the narrowest interval therebetween. From the end of the wind tunnel portion 20 to the reduced diameter portion 55, the interval between the upper and lower pairs of the ventilating cylinders 50 is gradually narrowed. The interval between the pair of ventilating cylinders 50 on the reduced diameter portion 55 becomes the narrowest and is narrower than the interval between the top and the bottom of the wind tunnel portion 20. Further, the opposite side of the end portion of the wind tunnel portion 20 is formed by sandwiching the reduced diameter portion 55 of the pair of the ventilating cylinders 50 into a curved shape (R shape) in which the distance between the two is widened. In other words, the substrate carrying inlet 21 and the substrate carrying port 22 of the gas flow path 25 are formed in a ventilating cylinder structure that expands upward and downward. The curved shape of the ventilating cylinder 50 is convex toward the conveying path side of the substrate W.

Further, an air knife nozzle 80 is provided in the vicinity of the substrate carrying inlet 21 and the substrate carrying port 22. Each of the air knife nozzles 80 is disposed above and below the substrate transfer port 21 and the substrate transfer port 22 above the transfer path of the substrate W. The air knife nozzle 80 is a slit nozzle whose length direction is the X direction, and ejects air toward the substrate carrying port 21 or the substrate carrying port 22 in a curtain shape extending in the width direction. The installation position and the installation angle of the air knife nozzle 80 can be adjusted. Preferably, the air ejection direction from the air knife nozzle 80 is oblique, and the air ejection direction is adjusted to be tangent to the air vent corresponding to the air knife nozzle 80. 50 curved surface.

Next, the cooling processing operation of the substrate cooling device 1 having the above configuration will be described. A heating device that heats the substrate W is provided on the front side of the substrate cooling device 1, and the substrate W heated by the heating device is transferred to the substrate cooling device 1 by a roller conveyor. The temperature of the substrate W after heating is about 100 ° C to 150 ° C.

Before the heated substrate W reaches the substrate transfer inlet 21, an air flow is formed in the gas flow path 25 by the air flow forming mechanism 60. FIG. 5 is a view for explaining the flow of air formed in the gas flow path 25. While the blower 75 is actuated, the exhaust valve 72 is opened, whereby the inside of the exhaust tank 70 becomes a negative pressure, and the ambient gas in the gas flow path 25 is discharged from the exhaust port 71. Both the top and the bottom of the wind tunnel 20 are exhausted by the exhaust box 70. The respective exhaust gas flow rates of the plurality of exhaust boxes 70 (eight at the top of the wind tunnel portion 20 and six at the bottom) can be individually adjusted by the flow rate adjusting valve 73, and can be distributed throughout the gas flow path 25 Adjust in the width direction and exhaust as much as possible.

Air is blown into the substrate transfer port 21 and the substrate transfer port 22 from the air knife nozzle 80 together with the exhaust gas. Air is blown into each of the substrate transfer port 21 and the substrate transfer port 22 from the upper and lower pair of air knife nozzles 80. Since the air knife nozzle 80 ejects air in a curtain shape extending in the width direction, air can be blown into the substrate transfer port 21 and the substrate transfer port 22 at a uniform flow rate in the width direction of the gas flow path 25.

Air is blown from both end portions together with the exhaust from the central portion of the gas flow path 25, whereby an air flow in the transport direction of the substrate W shown in Fig. 5 is formed in the gas flow path 25. In other words, the air that has been blown into the substrate transfer port 21 by the pair of air knife nozzles 80 from the inlet side flows through the reduced diameter portion 55 of the ventilator 50 on the inlet side toward the (+Y) side in the wind tunnel portion 20, and The exhaust port 71 formed in the central portion of the wind tunnel portion 20 is exhausted to the exhaust box 70. On the other hand, the air blown into the substrate transfer port 22 from the upper side of the outlet side of the air knife nozzle 80 flows through the reduced diameter portion 55 of the ventilating cylinder 50 on the outlet side toward the (-Y) side in the wind tunnel portion 20. The exhaust port 71 is exhausted from the exhaust port 71 formed at the central portion of the wind tunnel portion 20. As a result, as shown in FIG. 5, the (-Y) side is oriented (+Y) on the upstream side ((-Y) side) of the gas flow path 25 along the transport direction of the substrate W. The air flow on the side, on the other hand, on the downstream side ((+Y) side) of the central portion, is formed with a flow from the (+Y) side toward the (-Y) side.

The heated substrate W is transferred from the substrate carrying inlet 21 into the wind tunnel portion 20, and is moved from the (-Y) side (+Y) side by the roller transport mechanism 10 along the gas flow path 25 in which the air flow of FIG. 5 is formed. Transfer. When the substrate W is located on the upstream side of the center portion of the wind tunnel portion 20, the air flow flows in the same direction as the direction in which the substrate W is transported. On the other hand, when the substrate W is located on the downstream side of the center portion of the wind tunnel portion 20, the air flow flows in a direction opposite to the direction in which the substrate W is transported. In either case, the air flow may be flowed in parallel with the transport direction of the substrate W.

Therefore, an air flow flows in parallel along the surface of the heated substrate W, and the air flow takes away the heat of the substrate W and is sent out from the exhaust port 71, whereby the substrate W is cooled while being conveyed. Since the air flow parallel to the conveyance direction of the substrate W is formed in the gas flow path 25, the surface of the substrate W is continuously in contact with the air flow in the conveyance direction, whereby the substrate W can be efficiently cooled. Further, since the air flow flows through the gas flow path 25 formed inside the wind tunnel portion 20, the air flow can be prevented from diffusing and continuously acting on the surface of the substrate W. Further, since the air flow is performed at a uniform flow rate in the width direction of the gas flow path 25 by the exhaust box 70 and the air knife nozzle 80, the temperature distribution in the in-plane of the substrate W can be made uniform. The substrate W which has been cooled and lowered in temperature is carried out from the substrate carrying port 22, and is transported to the apparatus of the next step by the roller conveyor on the downstream side.

Further, a gas flow is formed in the gas flow path 25, and the gas flow is discharged from the exhaust port 71 to the outside of the apparatus. Therefore, the step ahead of the heating device on the front side is the coating step of the treatment liquid such as photoresist. At this time, the sublimate or solvent component generated from the heated substrate W can be discharged to the outside of the apparatus together with the gas stream. As a result, the substrate W in the cooling step after heating can be maintained in a clean state.

Further, since the rectifying fan 23 is extended in parallel with the conveying direction on the inner wall surface of the top and bottom of the wind tunnel portion 20, the air flow in the gas flow path 25 can be rectified to linearly flow. Thereby, the air flow can be uniformly supplied to the surface of the substrate W conveyed along the gas flow path 25, whereby the substrate W can be more uniformly cooled.

Further, in the first embodiment, the ventilating cylinder structure of the upper and lower ventilating cylinders 50 is attached to both end portions of the wind tunnel portion 20. Further, an air knife nozzle 80 is provided for each of the pair of ventilating cylinders 50 on the inlet side and the outlet side. The air knife nozzle 80 ejects air in a curtain shape along the curved surface of the corresponding ventilating cylinder 50. More strictly speaking, as shown in Fig. 6, air is ejected so that the air ejection direction AR from the air knife nozzle 80 is tangent to the curved surface of the ventilating cylinder 50. For example, air is ejected in a curtain shape so that the air ejection direction AR from the air knife nozzle 80 provided on the upper side of the inlet side is tangent to the curved surface of the inlet side upper side ventilator 50.

Usually, in the case of injecting a fluid to a curved surface, the flow direction of the fluid is changed along the curved surface due to the Coanda effect. In other words, in the first embodiment, as shown in FIG. 6, the air is ejected from the air knife nozzle 80 in a diagonal direction (inclined upward or obliquely downward), but air is blown along the curved surface of the ventilating cylinder 50. The flow of the air is changed along the curved surface of the ventilator 50 due to the Coanda effect, thereby being smoothly guided to the gas flow path 25. As a result, the air ejected from the air knife nozzle 80 can be efficiently introduced into the gas flow path 25, and the flow velocity of the air flow formed in the gas flow path 25 can be increased to improve the cooling efficiency of the substrate W.

Further, as a result of the high-speed flow of air along the curved surface of the ventilating cylinder 50, the air pressure on the air flow line is lowered by the Bernoulli effect, and the air inflow near the substrate carrying inlet 21 and the substrate carrying opening 22 can be sucked. Road 25. As a result, air having a volume of air or more ejected from the air knife nozzle 80 can flow into the gas flow path 25, and the flow velocity of the air flow formed in the gas flow path 25 can be increased to further improve the cooling efficiency of the substrate W.

Further, the reduced diameter portion 55 in which the interval between the upper and lower pairs of the ventilating cylinders 50 is narrowest is spaced upward and downward, and is narrower than the interval between the top and the bottom of the wind tunnel portion 20. By providing the reduced diameter portion 55 in the ventilating cylinder structure, the inflow velocity of the air from the substrate carrying inlet 21 and the substrate carrying port 22 can be further increased. Thereby, the Bernoulli effect can be obtained more strongly, and the flow velocity of the air flow formed in the gas flow path 25 can be increased to further improve the cooling efficiency of the substrate W.

Further, the decrease in the air pressure generated by the Bernoulli effect generated when the air knife nozzle 80 is blown onto the curved surface of the ventilator 50 also affects the substrate W that is transported along the transport path. When the air pressure on the upper side of the substrate W passing through the substrate carry-in port 21 and the substrate transfer port 22 is lower than the air pressure on the lower side, the substrate W is lifted by the air pressure from the lower side. Therefore, in the first embodiment, as shown in Fig. 6, the distance d ₁ between the reduced diameter portion 55 of the lower ventilator 50 and the transfer path of the substrate W is smaller than that of the upper ventilator 50 on the inlet side and the outlet side. The distance between the reduced diameter portion 55 and the transport path is d ₂ . Therefore, when the substrate W passes through the substrate carry-in port 21 or the substrate carry-out port 22, a stronger Bernoulli effect is generated on the upper side of the substrate W, and the lower side of the substrate W is lower than the upper side. The pressure. As a result, it is possible to prevent the substrate W from floating from the transfer path.

Further, since the shroud 35 covering the entire lower portion 11 of the wind tunnel portion 20 is provided, the air flow from the gap between the opening portion 31 of the bottom portion and the roller 11 through the gas flow path 25 can be performed. The outflow is suppressed to a minimum. Therefore, the air flow formed in the gas flow path 25 can be prevented from being disturbed, and the substrate W can be uniformly cooled.

<Second embodiment>

Next, a second embodiment of the present invention will be described. Fig. 7 is a view showing a substrate cooling device according to a second embodiment; The substrate cooling device according to the second embodiment is also a device that cools the substrate W after heating. In the first embodiment, the air flow forming mechanism 60 is formed by the exhaust box 70 and the air knife nozzle 80. However, in the second embodiment, the air knife nozzle 80 is not provided, and only the air box 70 constitutes the air flow forming mechanism 60. In the other aspects, the substrate cooling device of the second embodiment has the same configuration as that of the first embodiment, and the same elements as those of the first embodiment are denoted by the same reference numerals in FIG.

In the substrate cooling device of the second embodiment, since the air knife nozzle 80 is not provided, the air flow is formed in the gas flow path 25 only by the exhaust gas from the exhaust box 70. That is, the exhaust valve 72 is opened while the blower 75 is actuated, and the inside of the exhaust tank 70 is made a negative pressure, and the ambient gas in the gas flow path 25 is discharged from the exhaust port 71. Similarly to the first embodiment, the exhaust gas flow rate of each of the plurality of exhaust boxes 70 can be individually adjusted by the flow rate adjusting valve 73, and can be adjusted so as to be evenly distributed in the width direction of the gas flow path 25. gas.

Since the atmosphere of the gas flow path 25 is discharged from the exhaust port 71 and the inside of the gas flow path 25 is depressurized, the external atmosphere is sucked from the substrate transfer port 21 and the substrate transfer port 22. As a result, as shown in FIG. 7, an air flow along the transport direction of the substrate W is formed in the gas flow path 25. Since the exhaust box 70 is provided in the central portion of the wind tunnel portion 20, the (-Y) side (+Y) side is formed on the upstream side of the gas flow path 25 along the transport direction of the substrate W. The air flow, on the other hand, forms a gas flow from the (+Y) lateral (-Y) side on the downstream side of the center portion. Therefore, when the substrate W is located on the upstream side of the center portion of the wind tunnel portion 20, the air flow flows in the same direction as the direction in which the substrate W is transported, and the substrate W is located at the center of the wind tunnel portion 20, as in the first embodiment. When the portion is further downstream, the air flow flows in a direction opposite to the direction in which the substrate W is transferred. In either case, the air flow flows in parallel with the transport direction of the substrate W.

Therefore, an air flow flows in parallel along the surface of the heated substrate W, and the air flow takes away the heat of the substrate W and is sent out from the exhaust port 71, whereby the substrate W can be cooled while being transported. Since the air flow is formed in the gas flow path 25 in parallel with the transport direction of the substrate W, the surface of the substrate W is continuously in contact with the air flow in the transport direction, so that the substrate W can be efficiently cooled. Further, since the air flow flows through the gas flow path 25 formed inside the wind tunnel portion 20, the air flow can be prevented from being diffused and continuously applied to the surface of the substrate W. Further, since the air flow is caused to flow in a uniform flow rate in the width direction of the gas flow path 25 by the exhaust box 70, the substrate W can be cooled so that the in-plane temperature distribution of the substrate W becomes uniform.

In the second embodiment, the air flow is formed in the gas flow path 25 only by the exhaust gas from the exhaust box 70. Therefore, it is difficult to cause the particles or the like to adhere to the substrate W accompanying the blowing of the air. In the second embodiment, the ventilating cylinder structure in which the upper and lower ventilating cylinders 50 are attached to both ends of the wind tunnel portion 20 is also provided. In the second embodiment, air is not blown from the air knife nozzle 80. Therefore, the airflow is weaker than that of the first embodiment. However, when the external atmosphere is sucked from the substrate loading port 21 and the substrate carrying port 22, the air can be ventilated. 50 and get the Coanda effect and the Bernoulli effect. As a result, the flow velocity of the air flow formed in the gas flow path 25 can be increased, and the cooling efficiency of the substrate W can be improved. Further, the same effects as those of the configuration of the first embodiment can be obtained.

<Third embodiment>

Next, a third embodiment of the present invention will be described. Fig. 8 is a view showing a substrate cooling device according to a third embodiment; In FIG. 8, the same elements as those in the first embodiment are denoted by the same reference numerals. The substrate cooling device according to the third embodiment is also a device that cools the substrate W after heating.

In the third embodiment, the air flow forming mechanism 60 is configured by the exhaust box 70 and the air knife nozzle 80 as in the first embodiment. However, in the third embodiment, the exhaust port 71 and the exhaust box 70 are provided not in the center portion of the wind tunnel portion 20 but in the vicinity of the outlet side end portion. Further, only one pair of upper and lower ventilating cylinders 50 are attached to the inlet side end portion of the wind tunnel portion 20, and the air knife nozzle 80 is provided only in the vicinity of the ventilating cylinder 50 on the inlet side. In other respects, the substrate cooling device according to the third embodiment has the same configuration as that of the first embodiment.

In the substrate cooling device of the third embodiment, air is blown from the air knife nozzle 80 to the substrate loading port 21, and exhausted from the vicinity of the outlet side end portion of the gas flow path 25 by the exhaust box 70, thereby As shown in FIG. 8, an air flow in the conveying direction of the substrate W is formed in the gas flow path 25. In other words, the air that has been blown into the substrate transfer port 21 by the pair of air knife nozzles 80 from the inlet side flows into the wind tunnel portion 20 through the reduced diameter portion 55 of the ventilator 50 on the inlet side, and is transported along the wind tunnel portion 20 The substantially full length of the direction flows toward the (+Y) side, and the exhaust port 71 formed near the end of the outlet side is exhausted to the exhaust box 70. In addition, when air can flow freely from the substrate carrying port 22, the air flows into the exhaust port 71, and the exhaust effect of the exhaust box 70 cannot be sufficiently obtained, and the opening area of the substrate carrying port 22 is reduced as much as possible to suppress The inflow of air from the substrate discharge port 22. As a result, as shown in FIG. 8, the gas flow is formed from the (-Y) side (+Y) side over the entire length of the gas flow path 25. Thus, in the third embodiment, when the substrate W is transported along the gas flow path 25, the air flow flows in the same direction as the transport direction of the substrate W in the direction parallel to the transport direction of the substrate W.

Therefore, in the same manner as in the first embodiment, the air flow flows in parallel along the surface of the heated substrate W, and the air flow takes away the heat of the substrate W and is sent out from the exhaust port 71, thereby transporting the substrate W. Cool down. Since the air flow is formed in the gas flow path 25 in parallel with the transport direction of the substrate W, the surface of the substrate W is continuously in contact with the air flow along the transport direction, so that the substrate W can be efficiently cooled. Further, since the air flow flows through the gas flow path 25 formed inside the wind tunnel portion 20, the air flow can be prevented from diffusing and continuously acting on the surface of the substrate W. Further, since the air flow is performed at a uniform flow rate in the width direction of the gas flow path 25 by the exhaust box 70 and the air knife nozzle 80, the temperature distribution in the in-plane of the substrate W can be cooled.

Further, in the substrate carrying inlet 21, air is ejected from the air knife nozzle 80 in a curtain shape along the curved surface of the corresponding ventilating cylinder 50, so that the same Coanda effect and Bernoulli effect as in the first embodiment can be obtained. . As a result, the flow velocity of the air flow formed in the gas flow path 25 can be increased, and the cooling efficiency of the substrate W can be further improved. Further, the same effects as those of the configuration of the first embodiment can be obtained.

Further, in the third embodiment, the position of the exhaust box 70 and the position of the air knife nozzle 80 may be reversed. In other words, the exhaust port 71 and the exhaust box 70 may be provided in the vicinity of the inlet side end portion of the wind tunnel portion 20, and only one pair of upper and lower ventilating cylinders 50 may be attached to the outlet side end portion of the wind tunnel portion 20, and only on the outlet side. An air knife nozzle 80 is provided in the vicinity of the ventilating cylinder 50. Even in this case, an air flow in a direction parallel to the conveyance direction of the substrate W and opposite to the direction in which the substrate W is conveyed can be formed in the gas flow path 25. As a result, the same effects as described above can be obtained. In this way, the exhaust port 71 and the exhaust box 70 can be provided at any position along the transport direction of the wind tunnel portion 20.

However, in the case where the exhaust box 70 is not disposed at the center portion of the wind tunnel portion 20 and is disposed at the end portion as in the third embodiment, the configuration in which the air knife nozzle 80 is not provided as in the second embodiment cannot be employed. The reason for this is that when the exhaust box 70 is disposed in the vicinity of the outlet-side end portion of the wind tunnel portion 20 in the third embodiment, the pressure loss from the substrate carrying port 21 to the exhaust port 71 in the gas flow path 25 is caused. The pressure loss from the substrate carry-out port 22 to the exhaust port 71 is significantly larger than the air flow from the substrate transfer port 22 toward the exhaust port 71, and the gas flow path 25 is not formed and transported. Parallel air flow.

<Fourth embodiment>

Next, a fourth embodiment of the present invention will be described. Fig. 9 is a view showing a substrate cooling device according to a fourth embodiment; In FIG. 9, the same elements as those in the first embodiment are denoted by the same reference numerals. The substrate cooling device according to the fourth embodiment is also a device for performing a cooling process while transferring the heated substrate W.

In the fourth embodiment, the exhaust box 70 is not provided, and the air flow forming mechanism 60 is constituted only by the air knife nozzle 80. In other words, in the substrate cooling device of the fourth embodiment, the exhaust port 71 is not provided in the wind tunnel portion 20. Further, only one pair of upper and lower ventilating cylinders 50 are attached to the inlet side end portion of the wind tunnel portion 20, and the air knife nozzle 80 is provided only in the vicinity of the ventilating cylinder 50 on the inlet side. In other respects, the substrate cooling device according to the fourth embodiment has the same configuration as that of the first embodiment.

In the substrate cooling device of the fourth embodiment, air is blown into the substrate transfer port 21 only from the air knife nozzle 80 without being exhausted from the gas flow path 25, and is formed in the gas flow path 25 along as shown in FIG. The air flow in the direction in which the substrate W is shown is shown. In other words, the air that has been blown into the substrate transfer port 21 by the pair of air knife nozzles 80 from the inlet side flows into the wind tunnel portion 20 through the reduced diameter portion 55 of the ventilator 50 on the inlet side, and along the transport direction of the wind tunnel portion 20 The substantially full length flows toward the (+Y) side and is directly discharged from the substrate discharge port 22. As a result, as shown in FIG. 9, a unidirectional airflow from the (-Y) side (+Y) side is formed over substantially the entire length of the gas flow path 25. As a result, in the fourth embodiment, when the substrate W is transported along the gas flow path 25, an air flow is formed in the same direction as the transport direction of the substrate W in the direction parallel to the transport direction of the substrate W.

Therefore, in the same manner as in the first embodiment, the air flow flows in parallel along the surface of the heated substrate W, and the air flow takes away the heat of the substrate W and is sent out from the substrate transfer port 22, thereby carrying the substrate W while transporting the substrate W. cool down. Since the air flow parallel to the conveyance direction of the substrate W is formed in the gas flow path 25, the surface of the substrate W is continuously in contact with the air flow in the conveyance direction, whereby the substrate W can be efficiently cooled. Further, since the air flows through the gas flow path 25 formed inside the wind tunnel portion 20, it is possible to prevent the air flow from diffusing and continuing to act on the surface of the substrate W. Further, since the air flow is performed at a uniform flow rate in the width direction of the gas flow path 25 by the air knife nozzle 80, the temperature distribution in the in-plane of the substrate W can be cooled.

Further, in the substrate carrying inlet 21, air is ejected from the air knife nozzle 80 in a curtain shape along the curved surface of the corresponding ventilating cylinder 50, so that the same Coanda effect and Bernoulli as in the first embodiment can be obtained. effect. As a result, the flow velocity of the air flow formed in the gas flow path 25 can be increased, and the cooling efficiency of the substrate W can be further improved. Further, the same effects as those of the configuration of the first embodiment can be obtained.

Further, in the fourth embodiment, the position of the air knife nozzle 80 may be reversed from the above. That is, only one pair of upper and lower ventilating cylinders 50 are attached to the outlet side end portion of the wind tunnel portion 20, and the air knife nozzle 80 is provided only in the vicinity of the ventilating cylinder 50 on the outlet side. Even in this case, an air flow in a direction parallel to the conveyance direction of the substrate W and opposite to the direction in which the substrate W is conveyed can be formed in the gas flow path 25. As a result, the same effects as described above can be obtained.

However, when the exhaust box 70 is not provided as in the fourth embodiment, the air knife nozzle 80 cannot be provided at both end portions of the wind tunnel portion 20. This is because if the air knife nozzle 80 is provided at both end portions of the wind tunnel portion 20 without providing the exhaust box 70, there is no outlet for the air flow, and the air flow is not formed in the gas flow path 25. Even if the exhaust box 70 is not provided, if the opening portion similar to the exhaust port 71 is formed at any position of the wind tunnel portion 20, the opening portion is opened to the atmosphere, and the both ends of the wind tunnel portion 20 are not provided. The air knife nozzle 80 can also form an air flow in the gas flow path 25, so that the same effects as described above can be obtained.

<Fifth Embodiment>

Next, a fifth embodiment of the present invention will be described. Fig. 10 is a view showing a substrate cooling device according to a fifth embodiment; The substrate cooling device according to the fifth embodiment is also a device that cools the substrate W after heating. In the substrate cooling device of the fifth embodiment, the ionizer 81 is provided in the air knife nozzle 80. In the other aspects, the substrate cooling device of the fifth embodiment has the same configuration as that of the first embodiment. Therefore, the same elements as those of the first embodiment are denoted by the same reference numerals in FIG.

The ionizer 81 generates ions by corona discharge. The ions generated by the ionizer 81 are blown into the substrate transfer port 21 and the substrate transfer port 22 together with the air ejected from the air knife nozzle 80. As a result, an air flow containing ions is formed in the gas flow path 25.

The substrate W is transported by the roller 11 of the roller transport mechanism 10 in the substrate cooling device. Further, the substrate W may be transferred by the roller 19 of the roller conveyor before and after the substrate cooling device. Therefore, the substrate W to be conveyed repeatedly repeats contact with the roller 11 or the roller 19 and peels off, and static electricity due to peeling electrification may occur on the surface of the substrate W. The presence of this static electricity is a hindrance to subsequent substrate processing.

In the substrate cooling device of the fifth embodiment, an ion-containing air flow is supplied to the surface of the substrate W by the ionizer 81. Thereby, the static electricity generated by the peeling electrification is neutralized by the ions, and the surface of the substrate W is neutralized. As a result, it is possible to prevent the hindrance caused by static electricity in the subsequent steps.

The substrate cooling device according to the fifth embodiment is the same as that of the first embodiment except for the fact that the air flow including the ions is formed in the gas flow path 25. Therefore, the same effects as those of the first embodiment can be obtained. That is, since the air flow is formed in parallel along the surface of the heated substrate W, the air flow takes away the heat of the substrate W and is sent out from the exhaust port 71, whereby the substrate W can be cooled while being transported. Since the air flow is formed in the gas flow path 25 in parallel with the transport direction of the substrate W, the surface of the substrate W is continuously in contact with the air flow in the transport direction, whereby the substrate W can be efficiently cooled. Further, since the air flows through the gas flow path 25 formed inside the wind tunnel portion 20, it is possible to prevent the air flow from diffusing and continuing to act on the surface of the substrate W. Further, since the air flow is performed at a uniform flow rate in the width direction of the gas flow path 25 by the exhaust box 70, the substrate W can be cooled so that the in-plane temperature distribution of the substrate W becomes uniform.

<Sixth embodiment>

Next, a sixth embodiment of the present invention will be described. Fig. 11 is a view showing a substrate cooling device according to a sixth embodiment. In FIG. 11, the same elements as those in the first embodiment are denoted by the same reference numerals. The substrate cooling device according to the sixth embodiment is also a device that cools the substrate W after heating.

In the first embodiment to the fifth embodiment, the wind tunnel portion 20 is provided so as to surround the periphery of the transport path of the substrate W, and the gas flow path 25 is formed inside the wind tunnel portion 20. However, in the sixth embodiment, The lid body 120 is disposed above the transfer path of the substrate W, and the lid body 120 covers the surface of the substrate W conveyed by the roll transport mechanism 10, whereby both ends are formed between the surface of the substrate W and the lid body 120. The gas flow path 125.

The lid body 120 is substantially the same as the configuration of the top portion of the wind tunnel portion 20 of the first embodiment. That is, a plurality of exhaust ports are provided at the center of the conveying direction of the lid body 120, and a plurality of exhaust boxes 70 are provided corresponding to the exhaust ports. The ambient gas in the gas flow path 125 can be exhausted from the exhaust port by a plurality of exhaust boxes 70. Further, a plurality of rectifying fans are extended on the inner wall surface of the lid body 120 in parallel with the conveying direction of the substrate W.

A ventilating cylinder 50 is attached to both ends of the cover 120. In the sixth embodiment, one ventilator 50 is provided on each of both end portions of the lid body 120. Further, an air knife nozzle 80 is provided in the vicinity of the ventilator 50. The air knife nozzle 80 is disposed above the transport path of the substrate W at both ends of the cover 120, respectively.

In the sixth embodiment, the heated substrate W is transported from the (-Y) side (+Y) side by the roller transport mechanism 10. Further, when the substrate W that is transported under the lid body 120 is covered, the gas flow path 125 is formed. In this state, the gas is exhausted from the gas flow path 125 by the exhaust box 70, and is blown to the gas flow path 125 by the air knife nozzle 80. Into the air.

The air is exhausted from the central portion of the gas flow path 125, and air is blown from both end portions, and an air flow along the transport direction of the substrate W as shown in FIG. 11 is formed in the gas flow path 125. In other words, the air blown from the air knife nozzles 80 on the inlet side and the outlet side flows toward the (+Y) side and the (-Y) side in the gas flow path 125, and is exhausted from the center portion of the lid body 120. The port exhausts to the exhaust box 70. As a result, as shown in FIG. 11, the air flow from the (-Y) side (+Y) side is formed on the upstream side of the gas flow path 125 along the transport direction of the substrate W, and vice versa. The central portion is further downstream, forming a gas flow from the (+Y) lateral (-Y) side. In either case, the air flow can flow in parallel with the transport direction of the substrate W.

Therefore, an air flow flows in parallel along the surface of the heated substrate W, and the air flow takes away the heat of the substrate W and is sent out from the exhaust port, thereby cooling the substrate W while being transported. Since the air flow parallel to the conveyance direction of the substrate W is formed in the gas flow path 125, the surface of the substrate W is continuously in contact with the air flow in the conveyance direction, whereby the substrate W can be efficiently cooled. Further, since the air flow flows in the gas flow path 125 formed between the lid body 120 and the surface of the substrate W, it is possible to prevent the air flow from diffusing and continuing to act on the surface of the substrate W. Further, since the air flow is performed at a uniform flow rate in the width direction of the gas flow path 125 by the exhaust box 70 and the air knife nozzle 80, the substrate W can be cooled so that the in-plane temperature distribution of the substrate W becomes uniform.

Further, since the rectifying fan 23 is extended in parallel with the conveying direction on the inner wall surface of the lid body 120, the air flow in the gas flow path 125 can be rectified to flow linearly. Thereby, the air flow can be uniformly supplied to the surface of the substrate W conveyed along the gas flow path 125, whereby the substrate W can be more uniformly cooled.

Further, ventilating cylinders 50 are respectively attached to both end portions of the lid body 120, and air knife nozzles 80 are respectively provided corresponding to the ventilating cylinders 50 on both sides. Further, since the air knife nozzle 80 ejects air in a curtain shape along the curved surface of the corresponding ventilating cylinder 50, the same Coanda effect and Bernoulli effect as in the first embodiment can be obtained. As a result, the flow velocity of the air flow formed in the gas flow path 125 can be increased, and the cooling efficiency of the substrate W can be further improved.

<Modification>

The embodiments of the present invention have been described above, but the present invention can be variously modified without departing from the spirit and scope of the invention. For example, in the above-described embodiments, the substrate W is transported in the Y direction by the roller transport mechanism 10, but the transport method of the substrate W is not limited to the roller transport, and may be a mechanism that transports in one direction. For example, a belt transport mechanism that transports the substrate W on a belt for transport can be used, or a float transport mechanism that discharges compressed air from below the substrate W and floats the substrate W while being transported can be used.

Further, in each of the above embodiments, a plurality of exhaust ports 71 and a plurality of exhaust boxes 70 corresponding thereto are provided in the wind tunnel portion 20 (or the lid body 120), and flow rates are individually set in the plurality of exhaust boxes 70. The exhaust valve balance can be adjusted by adjusting the valve 73, but it is also possible to exhaust at a uniform flow rate through the width direction of the gas flow path 25 (125) by other structures. For example, a manifold or a header may be used, or a slit-shaped exhaust port extending in the width direction of the wind tunnel portion 20 (or the lid body 120) may be provided.

Further, instead of the blower 75, a facility exhaust, an ejector, an exhaust pump, or the like of a factory provided with a substrate cooling device may be used.

Further, instead of the rectifying fan 23, another mechanism that can rectify the air flow to linearly flow along the conveying direction can be used. For example, a concave-convex structure in which a concave groove and a convex portion are repeatedly arranged in the transport direction may be used.

Further, the reduced diameter portion which is narrower than the interval between the top and the bottom of the wind tunnel portion 20 may be provided inside the wind tunnel portion 20 other than the ventilating cylinder structure (that is, the region other than the substrate carrying inlet 21 and the substrate carrying port 22). ).

Further, in each of the above embodiments, air is blown into the gas flow path 25 (125) from the air knife nozzle 80 via the ventilator 50, but the lance cylinder 50 may be directly supplied from the air knife nozzle 80 to the gas flow path 25 (125). ) Blow in the air. Of course, the use of the ventilator 50 allows a greater amount of air to be efficiently delivered to the gas flow path 25 (125) by the Coanda effect and the Bernoulli effect.

Moreover, instead of arranging the lid body 120 above the conveyance path of the substrate W in the sixth embodiment, the lid body 120 may be disposed below the conveyance path. In this case, the lid body 120 is substantially the same as the bottom portion of the wind tunnel portion 20 of the first embodiment. In short, as long as the surface (upper or lower surface) of the substrate W transported by the roller transport mechanism 10 is covered by the lid 120, a gas flow path 125 having open ends is formed between the surface of the substrate W and the surface of the substrate W. can.

Further, the substrate cooling device according to the sixth embodiment can be modified in the same manner as the first embodiment to the fifth embodiment. That is, the air flow may be formed in the gas flow path 125 only by the exhaust from the exhaust box 70 or the air from the air knife nozzle 80. Further, the exhaust box 70 may be provided at the outlet side end portion or the inlet side end portion without the center portion of the lid body 120, and the air knife nozzle 80 may be provided on the opposite side. Further, the ionizer 81 may be provided in the air knife nozzle 80, and an air flow containing ions may be formed in the gas flow path 125.

Further, the length of the wind tunnel portion 20 (or the lid body 120) in the transport direction may be set to an arbitrary value depending on the target temperature of the cooling process. However, the substrate cooling device 1 of the present invention may be provided in a plurality of stages as needed. The substrate W is cooled.

In the above-described embodiments, the glass substrate for a liquid crystal display device having a rectangular shape after heating is subjected to a cooling treatment as an example. However, the substrate W to be processed by the substrate cooling device of the present invention is not limited thereto. For example, a glass substrate for a PDP, a semiconductor wafer, a substrate for a recording disk, a substrate for a solar cell, or the like can be used. Further, the technique of the present invention can also be applied to a device for cooling a substrate which is continuously formed into a sheet shape while being conveyed.

1. . . Substrate cooling device

10. . . Roll conveying mechanism

11, 19. . . Roll

20. . . Wind tunnel

twenty one. . . Substrate transfer

twenty two. . . Substrate outlet

twenty three. . . Rectifier fan

25, 125. . . Gas flow path

31. . . Opening

35. . . Enclosure

50. . . Ventilation tube

55. . . Reduced diameter

60. . . Air flow forming mechanism

70. . . Exhaust box

71. . . exhaust vent

72. . . Vent

73. . . Flow regulating valve

74. . . Exhaust piping

75. . . Blower

80. . . Air knife nozzle

81. . . Ionizer

120. . . Cover

W. . . Substrate

AR. . . Air ejection direction

D1. . . The distance between the reduced diameter portion of the lower ventilating cylinder and the transport path of the substrate

D2. . . The distance between the reduced diameter portion of the upper ventilating cylinder and the transport path

1 is a side view showing a configuration of a main part of a substrate cooling device according to a first embodiment of the present invention;

Figure 2 is a view of the top of the wind tunnel from the lower side;

Figure 3 is a view of the bottom of the wind tunnel from the upper side;

Figure 4 is a view of the wind tunnel from the A-A section of Figure 1;

Figure 5 is a view for explaining the flow of air formed in the gas flow path;

Figure 6 is a view showing the periphery of the ventilator and the air knife nozzle;

Figure 7 is a view showing a substrate cooling device according to a second embodiment;

Figure 8 is a view showing a substrate cooling device according to a third embodiment;

Figure 9 is a view showing a substrate cooling device according to a fourth embodiment;

Figure 10 is a view showing a substrate cooling device according to a fifth embodiment; and

Fig. 11 is a view showing a substrate cooling device according to a sixth embodiment.

1. . . Substrate cooling device

10. . . Roll conveying mechanism

11, 19. . . Roll

20. . . Wind tunnel

twenty one. . . Substrate transfer

twenty two. . . Substrate outlet

25. . . Gas flow path

35. . . Enclosure

50. . . Ventilation tube

55. . . Reduced diameter

60. . . Air flow forming mechanism

70. . . Exhaust box

80. . . Air knife nozzle

W. . . Substrate

Claims (12)

A substrate cooling device characterized in that a substrate for cooling a heated substrate includes a transfer mechanism that transports a substrate in a specific direction, and a wind tunnel portion that is formed around a transfer path of the substrate of the transfer mechanism. a gas flow path in which both end portions are open; and an air flow forming mechanism that forms an air flow in the gas flow path along the transport direction of the substrate, wherein the wind tunnel portion is provided with gas guiding to both end portions of the gas flow path a ventilator of at least one of the parties. A substrate cooling device characterized in that a substrate for cooling a heated substrate includes a transfer mechanism that transports a substrate in a specific direction, and a wind tunnel portion that is formed around a transfer path of the substrate of the transfer mechanism. a gas flow path that is open at both ends; and an air flow forming mechanism that forms an air flow in the gas flow path along a transport direction of the substrate, wherein an exhaust port that communicates with the gas flow path is formed in the wind tunnel portion; The mechanism has an exhaust mechanism that discharges the ambient gas in the gas flow path from the exhaust port, and the exhaust port is formed in a central portion of the wind tunnel portion in the transport direction. The substrate cooling device according to claim 2, wherein the airflow forming means includes a gas ejecting mechanism that faces at least one of both end portions of the gas flow path Blow in the gas. The substrate cooling device according to claim 3, wherein the gas ejecting mechanism includes an ionizer that generates ions and blows them together with the gas into at least one of both end portions of the gas flow path. The substrate cooling device according to claim 2 or 3, wherein the wind tunnel portion is provided with a ventilating cylinder that guides gas to at least one of both end portions of the gas flow path. The substrate cooling device of claim 1, wherein the ventilating cylinder is disposed above and below the transport path; and the ventilating cylinder disposed at the upper and lower sides is provided with a narrowed portion having the narrowest interval between the two; and a reduced diameter of the lower ventilating cylinder The interval between the portion and the transport path is smaller than the interval between the reduced diameter portion of the upper ventilator and the transport path. A substrate cooling device characterized in that a substrate for cooling a heated substrate includes a transfer mechanism that transports a substrate in a specific direction, and a wind tunnel portion that is formed around a transfer path of the substrate of the transfer mechanism. a gas flow path that is open at both ends; and an air flow forming mechanism that forms an air flow in the gas flow path along a direction in which the substrate is transported, wherein a rectifying fan extends in parallel with the transport direction on an inner wall surface of the wind tunnel portion . A substrate cooling device characterized in that it cools a heated substrate, including: a transport mechanism that transports the substrate in a specific direction; the wind tunnel portion forms a gas flow path in which both end portions are open around the transfer path of the substrate of the transfer mechanism; and an air flow forming mechanism that is along the gas flow path The conveying mechanism forms an air flow in the conveying direction of the substrate, wherein the conveying mechanism conveys the substrate by a portion of the roller protruding from the opening of the bottom surface of the wind tunnel portion; and the outer wall of the bottom surface of the wind tunnel portion is further provided with a cover for the roller The entire bottom surface of the bottom surface is lower. A substrate cooling device characterized in that a substrate for cooling a heated substrate includes: a transfer mechanism that transports the substrate in a specific direction; and a cover body that covers the substrate transported by the transfer mechanism a gas flow path formed at both ends between the surface and the surface of the substrate; and an air flow forming mechanism for forming an air flow in the gas flow path along a transport direction of the substrate, wherein the gas flow forming mechanism includes a gas a discharge mechanism that blows gas into at least one of both end portions of the gas flow path, and the gas discharge mechanism includes an ionizer that generates ions and blows them together with the gas into both end portions of the gas flow path At least one party. The substrate cooling device of claim 9, wherein the cover body forms an exhaust port communicating with the gas flow path; and the air flow forming mechanism includes an ambient gas in the gas flow path An exhaust mechanism that is discharged from the above exhaust port. A substrate cooling device characterized in that a substrate for cooling a heated substrate includes: a transfer mechanism that transports the substrate in a specific direction; and a cover body that covers the substrate transported by the transfer mechanism a gas flow path formed at both ends between the surface and the surface of the substrate; and an air flow forming mechanism for forming an air flow in the gas flow path along the transport direction of the substrate, wherein the cover body is attached The gas guides the ventilating cylinder to at least one of both end portions of the gas flow path. A substrate cooling device characterized in that a substrate for cooling a heated substrate includes: a transfer mechanism that transports the substrate in a specific direction; and a cover body that covers the substrate transported by the transfer mechanism a gas flow path formed at both ends between the surface and the surface of the substrate; and an air flow forming mechanism for forming an air flow in the gas flow path along the transport direction of the substrate, wherein the gas is inside the cover A rectifying fan is extended on the wall surface in parallel with the above-described conveying direction.