TWI275141B - Substrate processor - Google Patents

Abstract

The substrate processing device 10 specifically processes a substrate B carried at a nearly horizontal attitude along a conveyance path 171. The device disposes in series a liquid collection type nozzle device 20 constituted to collect a supplied processing liquid from the substrate B as a processing liquid supply device supplying the specified processing liquid to the carrying substrate B, and an air knife 30 constituted to blow the remaining processing liquid on the substrate B with an air current as a processing removing device removing the processing liquid left on the substrate B, after the processing liquid is supplied are arranged in series along the conveyance path 171 to make a substrate processing device more compact.

Description

[Technical Field] The present invention relates to a substrate processing apparatus for manufacturing various substrates including a substrate, in which a substrate such as a liquid crystal or various electronic devices is mounted. [Prior Art]

It is used in the liquid day, Japanese, and the like. For each towel, in the manufacturing process, the substrate is sequentially loaded into a plurality of processing tanks for the parent-type processing liquid. In each of the treatment tanks, the treatment liquid of the crucible is supplied, and thus various treatments are performed. Set the connection u-, +, + 粕扪 迗 , , , , , , , , , , , , , , , 对 对 对 对 对 对 对 对 对 对 对 对 对 u u u u u u u u u u u u u u u u 'The substrate passes through the conveyor slot. < Weiyi-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The treatment brought to the downstream side: this, two; this, the distance between the treatment tanks must be sufficiently ensured. :, := The increase in space occupied by the processing leads to an unfavorable situation in the manufacturing space. In order to solve such problems, people have come up with various solutions. The ratio of the delivery path to the substrate is from the clearing of the spirit, the nighttime atmosphere, and the spray on the substrate during transport. ^,, ^ ^ b From the mouth, the treatment liquid can be spread over the entire substrate. _Substrate immersion in comparison, the processing time is shortened, and the more versatile sub-cracking method can be used to manage and control the treatment liquid usage 2〇l4-7191-PF; Ahddub 6 1275141. However, even in such a treatment liquid spray method, a large amount of the treatment liquid remains on the treated substrate. Therefore, in order to reliably remove the residual treatment liquid, it is necessary to separate the spray position from the next treatment liquid. A considerable distance is opened to allow the residual treatment liquid to drip from the substrate, and the liquid removal treatment must be performed at the end by the liquid removal member. In addition, in recent years, it has been proposed to use a liquid recovery type nozzle device in which a processing liquid is supplied to a substrate on the downstream side in the substrate transport direction, and the processing liquid is recovered from the substrate on the upstream side (for example, JP-A-2002-280340) . Since the liquid recovery type nozzle is disposed to immediately collect the supplied processing liquid, it is desirable to use such a device, and it is not necessary to provide a substrate transfer space for removing the liquid to remove the liquid. However, in actuality, if a liquid recovery type nozzle device is used and substrate processing is performed, the following problems are caused. 1 Even if a liquid nozzle type device is used, the treatment liquid cannot be completely recovered inside the liquid recovery type nozzle device, and a part of the treatment liquid remains on the substrate. 2 Thus, a dry unevenness in which the substrate is partially dried is generated. As a result, the particles partially adhere to the surface of the substrate, and the components of the treatment liquid form crystals, which are precipitated, that is, so-called water marks. The mark is a phenomenon which occurs in the known treatment liquid spray method for spraying the treatment liquid from the nozzle, and is a new technical problem arising from the use of the liquid recovery type nozzle device. Therefore, the advantages of the violet nozzle device (4) are new technical means for exerting the above problems in liquid recovery. SUMMARY OF THE INVENTION 2014~7191~PF/Ahddub 7 1275141 The purpose of the present invention is to provide a substrate processing apparatus that solves the above problems. Another object of the present invention is to provide a substrate processing apparatus which makes the substrate processing work more compact and ensures more efficient substrate processing while ensuring effective use of the processing liquid. Further, another object of the present invention is to provide a substrate processing apparatus which does not generate water marks and exhibits characteristics of a liquid recovery type nozzle device. The substrate processing apparatus according to the present invention is characterized in that the substrate is subjected to a predetermined process including: a transport path for transporting the substrate; and a liquid recovery type 117 which is transported along the transport path to supply and supply the treatment liquid. The f-substrate processing 'and the processing liquid after the processing is recovered from the substrate; and the liquid-removing portion is disposed on the downstream side of the liquid-type nozzle portion in the transport path, and the liquid-collecting nozzle portion is spaced apart by a distance Liquid removal. According to the above-described scheme, the substrate sent to the inside of the substrate processing apparatus is transported. On the other hand, first, the processing liquid is supplied from the liquid recovery type injection, and a large amount of the processing liquid is recovered. * The substrate after the external treatment is sent to the liquid removing portion, and the remaining liquid is subjected to the liquid removal treatment through the liquid removing portion. Since, even in the case where the liquid-removing portion is provided at the position on the downstream side of the liquid recovery type nozzle mounting =, it is possible to make sure that the liquid-repellent portion can be minimized as it is wetted. The amount of the treatment liquid on the downstream side can be shortened to the front and rear length of the substrate processing apparatus to a large extent as compared with the past. It can transport 2相对14-7l9l~PF to the substrate; Ahddub 8 1275141::, the liquid recovery type nozzle part is densely arranged, and the operation is: v: The processing unit is compacted, and the running cost is reduced, and the liquid recovery type is adopted.

The following disadvantages of the known technique, i.e., the distance to the next step in order to prevent the situation of the second and second steps = the tight setting of the plate processing apparatus, resulting in a decrease in the promotion base. Between the seated cost and the running cost, the other is: set = 'the liquid recovery type nozzle portion and the liquid-removing portion 5 are further provided with a liquid supply portion, which holds the wet state to at least at A柘, s, , ^ 彳 /, ^ to make the substrate liquid. The process of transporting the board to the liquid removing unit is carried out according to the above-described scheme, and is sent to the substrate of the substrate processing apparatus (4), and the other side is firstly treated by the liquid from the liquid. 01口口|5 is available for you. The liquid supply unit continuously supplies the liquid to the liquid removal unit and reaches the liquid removal unit. The liquid removal unit prevents the liquid recovery type nozzle from being supplied only to the nozzle. The treatment liquid, therefore, the substrate arrives at the (four) particles locally fixed in the AL ^ ^ heart month j also, ^, " 'or the treatment of the liquid tissue of the composition of the n-day precipitation of the unfavorable situation. Therefore, in order to make the second: and reduce the running cost, the liquid back is used: = the recovery type nozzle is placed in the A "brothers to maximize the liquid soil" π 5 and placed on the substrate The advantages in the device. Further, it is preferable that the holding liquid supply portion is disposed closer to the liquid recovery than the liquid returning to the middle of the liquid returning portion of the third liquid jetting portion and the liquid removing portion of Ahdub 9 1275141; . According to this configuration, the holding liquid supply unit is disposed at a position offset from the liquid recovery type nozzle unit at an intermediate position in the substrate transport direction between the liquid recovery type nozzle unit and the liquid removal unit, thereby securing the holding liquid supply unit. In order to prevent the drying of the substrate processed by the liquid recovery type nozzle portion as much as possible. In addition, it is preferable to use a washing liquid for washing the substrate to maintain the wet state. According to the scheme 'because the treatment liquid is used to clean the substrate, the monthly washing water' can use the substrate processing device as the cleaning device i, and the particles such as particles attached to the substrate can be washed away by the cleaning water. The substrate is cleaned.逖 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , a partitioning passage is formed in the inside of the casing; the liquid meter recovery type nozzle portion is disposed between the substrate feeding inlet and the partition wall; and the liquid removing portion is disposed on the partition wall and The door of the substrate delivery port. According to this aspect, the human body is transported through the substrate, and the substrate (4) is transported to the liquid π, the liquid removing portion, and the holding liquid supply portion which are disposed inside the casing along the transport path, and the predetermined processing is performed by the nozzle portions. It is then discharged from the substrate delivery outlet to the outside of the system. * The partition wall 'on the upstream side is said to be free from the holding liquid supply part, and the knife liquid part is placed next to the lower part. Therefore, even if the liquid supply unit is provided in the holding liquid supply unit, the liquid separation can be prevented by the partition wall. First, the granules are moved to the setting of 2014-7191-PF; Ahddub 10 1275141 to remove the space of the liquid section (age, original ^ & this two) morning, so you can keep the dry space clean w, j main clothes In the above-mentioned liquid recovery type nozzle portion and the liquid removal portion, the substrate processing portion of the unit is formed, and the substrate processing portions of the plurality of units are arranged in series along the upper = path, and the substrate processing portion of each unit is provided. According to this scheme, the substrate is transported along the transport path. Therefore, it is possible to process a plurality of types of processing liquids by passing through the respective substrate processing units. Night = Compared with the past The amount of processing of the substrate processing unit on the upstream side can be reduced to the amount of the substrate processing unit on the downstream side, so that the distance between the substrate processing units can be shortened as much as possible in the past. Separate shape The τ, the processing of the substrate can contribute to the reduction of the device cost and the running cost of the substrate processing device that processes the substrate. The substrate can also be disposed as the substrate from the upstream side of the transport. In the upper insect cutting portion, the cleaning portion, and the drying portion, in the upper portion, the processing liquid is etched with a money engraving liquid, and the substrate is treated with the liquid (4) pure water in the cleaning portion, and the substrate is cleaned. The drying unit may use the above-mentioned liquid removing unit as a drying unit. According to the solution, the substrate that is being transported along the lining of the g-passage is first processed at the etch y' for the money engraving, and then, In the cleaning unit, the pure water supplied is purged, and finally, in the drying section, the airflow supplied from the liquid removing unit is dried, and then discharged to the next step. The base surface of the opposite wall of the body forms a base 2014-7191-PF; the Ahddub 11 1275141 port is provided at the substrate inlet and the liquid recovery type spray may be provided with a plate for purifying air and discharging the inside of the casing. The substrate is formed on the other side of the inlet, and the substrate is fed out to the substrate to be transported into the casing, and the liquid-removing portion is disposed in the casing, and the air introduction mechanism is also introduced into the casing, and the air is exhausted. According to this aspect, the substrate that is transported from the substrate along the transport path and transported to the substrate is transported to the liquid recovery type spray portion and the liquid removal portion provided in the casing, and is in a state of interest. , ▲. 卩 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃The mechanism continuously discharges the sample, and even if there is a treatment liquid droplet or floating particles in the inside of the casing, it can be exhausted and discharged to the outside of the system. n # ^ ^ can be kept, and the ground is kept clean. Because &, it is possible to reliably prevent the contamination of the substrate due to the contaminated environment inside the casing. Further, it is preferable that the liquid-removing portion extends in the width direction of the transport path and is disposed in a direction obliquely intersecting with the transport direction. According to this aspect, since the liquid-repellent portion is provided on the surface parallel to the substrate transport surface in a direction intersecting with the substrate traveling direction at a predetermined angle, the air ejected from the liquid-removing portion is pressed toward the substrate width. The component force applied to the processing liquid adhered to the substrate can effectively remove the processing liquid adhered to the substrate as compared with the case where the liquid removing portion is perpendicular to the substrate transporting direction. [Embodiment] 2014 -7191-PF; Ahddub 12 1275141 The substrate processing apparatus 1 of one embodiment of the present invention shown in FIG. 1 is an etching processing apparatus for etching a substrate, as shown in the first drawing, in a rectangular parallelepiped shell. The inside of the body has a surname portion 1 2 for etching the substrate Β, a cleaning portion 13 for cleaning the substrate 送 sent from the nick portion i 2 , and a substrate β sent from the cleaning portion 13 The dried portion 14 of the treatment. On the upstream side wall ηι of the casing 11 (to the right of the i-th view), the door holds the substrate feed port 15, and on the downstream side wall 112, a substrate is opened at a position opposite to the above-mentioned port:送 16. In addition, between the substrate delivery population 15 and the substrate conveyance "16, in the direction of the left direction (in the first figure, the leftward direction) is pressed by the threshold Η 连 运 , 17 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Γ': : A plurality of transport rollers 171. Each transport (4) is driven by the counterclockwise direction of the motion diagram by means of the second diagram: Therefore, from the outside of the system, the substrate β in the substrate is fed through the substrate, and the substrate is passed through the substrate.

The driving of the Mu b 17 is rotated, the transport path m is transported to the downstream side, the etching portion 12 is reversed, the passage 171 13 is cleaned, and finally, the drying process is performed, and then the cleaning portion is sent to the system through the substrate delivery port 16 / 仃 drying treatment, the cleaning unit 13 is configured by the first cleaning unit washing unit 130 on the upstream side (the (10), and the downstream side, and the right side of the R ^ drawing). In the second cleaning, the second cleaning is set to 130, and the ordinary cleaning is performed: 2 pairs of _ (4) sent base β, and a higher-level fine cleaning washing unit 130 is performed again, and the substrate is 2014-7191-PF; Ahddub 13 1275141 A first hopper 121 is provided below the etching portion 12 in the casing 11, and a second material + m' is provided below the second cleaning portion 130' at a position below the first cleaning portion 130. At the position, the third hopper 132' is provided at a position below the drying portion 14, and the fourth hopper (4) is provided. The processing liquid dripping on the substrate B that is transported along the transport path 171 is made of the first to fourth hoppers m and m. (132) (4) Receiving, and then, the opening from the bottom is appropriately discharged by the gas-liquid separator 181 which will be described later. Further, the upper portion of the transport path 171 of the _ portion 12 and the cleaning portion 13 is ': '/ The partition wall, but at the boundary position ' of the second cleaning portion 1 d ϋ and the drying portion 1 4, is provided with a top partition wall 114 from the top plate 113 of the casing 11 at a position directly above the conveyance 71. Passing through the partition wall 114 to prevent water droplets in the button portion 12 and the cleaning portion 13 The case where the inside of the drying unit 14 is moved to the inside of the drying unit 14. * The length of the substrate in the direction in which the cleaning unit 13 is at the outer portion, the length of the washing unit 13 is the length of the cleaning unit 1 3 〇, and the size of the length of the cleaning unit 1 3 Μ is in the position τ 4 97 size 5 is further reduced. The space between the target plates and the h's is configured to be used for the base-person after the final cleaning process, and the liquid holding nozzle to be described later is used for the treatment of the liquid holding nozzle. The scribing unit 12 performs an etching treatment on the feeding chamber u, and the soil plate is subjected to a fine cleaning treatment in the second cleaning unit 130 in the second cleaning unit 130. ^The 基板 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼 冼

Ahddub 2〇14~7l91-pp; 14 1275141 1 3 0 and 2nd Qingji Qiu]qn, 冼邛130, sigh according to the way of clamping the transport path at the top and bottom respectively - 罟义日斜 a aA 171 (7) A pair of opposite liquid recovery type recovery type nozzles 邱. ^ 1 % 政 ((. w 9n ^ α π Washing part 130 Sighing sputum is the positive downstream side of the device 20, according to the way of the passage Π1, 八 罢 μ π 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹In the second cleaning department! 3〇', in liquid recovery"

The downstream side is provided in a state in which the conveyance path 171 is housed, and the holding nozzle device 40 is placed. The liquid holding nozzle is disposed in the second cleaning unit 130. The air knife 3 is used by the drying unit 14. Since the main drying is performed, it is possible to prevent the substrate Β which is subjected to the most cleaning treatment by the liquid recovery type nozzle device 2 from being naturally dried before reaching the drying portion 14, and the particles are fixed to the particles. A problem of water marks is generated on the inner and outer surfaces of the substrate crucible, thereby further performing the final cleaning process. By the ultra-pure water being ejected from the inside and the outside of the substrate 从 from the liquid holding nozzle device 40, the drying process of the drying unit 14 prevents drying of particles or water marks on the substrate. Further, in the vicinity of the substrate processing apparatus 10, a processing liquid supply source 50 for supplying a processing liquid to the liquid recovery type nozzle device 20 and the liquid holding nozzle device 40 is provided. The processing liquid supply source 50 constitutes a money engraving liquid supply source 51, and supplies a liquid engraving liquid containing hydrofluoric acid as a main component to the liquid recovery type nozzle of the remaining portion 1 2; The cleaning water supply source $2 supplies the clear water to the liquid recovery type nozzle device 2 of the first cleaning unit 1130, and the second cleaning water supply source 5 3' to the liquid of the second cleaning unit 130. 2014-7191-PF; Ahddub 15 • 1275141 Recycling nozzle unit 2. Supply ultrapure water. The "= portion 14" is disposed obliquely to the side of the transport path 171 in accordance with the manner in which the transport path is sandwiched. In the way of wearing the second, the air supply device for supplying the pressurized air to the air knife, ^ / Yin + is supplied to the upstream 30, and the ventilating device is supplied from the air. 60. The pressurized air from the 6 6 6 is also supplied to the etched portion 12 and the nip 1 of the cleaning port 13 . The substrate 运 carried into the drying unit 14 is first passed through the upstream 30, and is subjected to the removal, & _, the knives of the work example: the liquid removal treatment, and then the drying by the downstream air knife 3 deal with. The pain is exhausted and the knives 3 extend in the width direction of the transport path 171. The air knife 30 is transported along with Gu Shen. Guangyou A #, the direction is obliquely placed in the direction of the direction, effectively performing liquid removal and drying. Completion The substrate β substrate which defines the drying process of the dried crucible 14 is discharged to the next step, except for the first, the first, the second, and the first. In addition, the air knife 3' at the 14th place of the money (4) can be used to explain the liquid recovery type nozzle device 20, if the upper and lower sides of the upstream side can be sufficiently dried, the downstream side gas can be omitted. The air knife 3n and the liquid holding squeegee have a three-dimensional view of the squirting 40, which indicates that the liquid recovery type 嗔〃/night body holding nozzle 40 40 is provided in the second cleaning unit, and the lacquer blade 30 is disposed in the drying section. The state of 14. As shown in Fig. 3, the liquid recovery type nozzle is provided by the top nozzle device 20 1 disposed on the upper side of the transport path 177, and is placed on the lower side and the top. The nozzle device 2〇 is configured to face the bottom nozzle device 2〇2 provided. 20l4>7l91-PF; Ahddub 16 1275141 Night body recovery type nozzle device 2, as shown in Fig. 4, includes a pair of upper and lower nozzle bodies 21, and a substrate visibility direction perpendicular to the substrate transport direction (with the fourth The paper surface of the figure is sag == body; the guide tube 22 is connected to the end of the _ body 21 in the base=direction downstream side; the outlet tube Μ is connected to the upstream side end in the guiding direction; The liquid guide ..., the mouth and the body introduction port 24, the shape of the L π., t, 7 is formed in the upper and lower pairs of the nozzle body 21, /, the introduction tube 22 is connected, and is comparable; , 军,,, t A Ϋ ^ ^ 社,, the direction of the substrate is perpendicular to the substrate in the direction of the visibility is a long-shaped thin guide Μ > elongated, liquid outlet 25, the liquid is derived 25 and the above The outlet pipe 23 is connected to the lower side of the liquid guide 24, and is connected to the liquid guide 24 in the second cleaning water. On the other hand, on the downstream side of the second cleaning water supply η ^ ^ ^ and the source 53 As shown in Fig. 3, it is provided that the ultrapure water of the first brother d is reversed &,, and the mountain Ζ π 冼 water supply source is provided. 531. The delivery pump 531 盥 卜 卜 々憎 々憎 々憎 一 一 一 一 一 一 一 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引 吸引The pumping 531 of the pump 531 sends the ultra-pure water from the second 冼Μ, and the source 53 is introduced to each of the inlet tubes to introduce 9 U. The ultrapure water is supplied to the liquid introduction port 24, and is supplied to the pump. The cause of the dislocation between the front and back of the substrate B sandwiched between the upper and lower sides, the ub, the 4, 2 01, and 2 0 2, and the opposite faces of the bird body 21, , Tian Guan phenomenon, from the substrate 喷 and the leakage to the outside, and the gap between the eh road & body, the body 21, the leakage 屮〇% universal movement. In addition, the ultra-pure water reaching the liquid outlet 25 passes through the suction And the drive of the 9 Q AA τ> is discharged outside the system by the attraction of the guide 23, and the other is provided at the bottom of the nozzle body 21 π top side, and the support substrate 2〇14-7l91-PF is provided. a plurality of support rollers 26 of Ahddub 17 1275141 B, on which the substrate B is supported, whereby the substrate A passage for passing ultrapure water is formed between B and the upper surface of the nozzle body 21 at the bottom. By using such a liquid recovery type nozzle device 2, the minimum required ultrapure water is supplied to the substrate B, thereby A reliable cleaning process is achieved, which contributes to a reduction in the running cost of the substrate cleaning process using expensive ultrapure water. As shown in FIG. 3, the air knife 30 has a pentagonal shape as seen from the side. A long-sized air knife body 3 in the width direction of the substrate; a nozzle portion 32 formed on the tip end side of the air knife body 31; and an air guiding tube 33 connected to the root end side of the air knife body 31 . At the tip end of the nozzle portion, a long-sized blow slit 32 沿 in the width direction of the substrate is provided. Then, the pressurized air sent by the driving of the air supply device 60 is sent to the inside of the air knife main body 31 through the air introduction pipe 33, and then blown from the air blowing slit 32 to the substrate B' by the above-described program. The air stream blows off the ultrapure water adhering to the front and back surfaces of the substrate B. The air knife 30 is provided in an inclined state with respect to the conveyance direction of the substrate B. In this way, the blown gas jetted from the blow slit 321 is applied to the cleaning water adhering to the substrate B by the component of the pressure in the width direction of the substrate, so that the blow slit 321 is perpendicular to the substrate transport direction. In comparison, the washing water attached to the substrate B can be effectively removed. As shown in FIG. 3, the liquid holding nozzle assembly 40 is disposed between the liquid recovery type nozzle device 20 and the air knife 30 so as to sandwich the transport path i7i, and includes a cylindrical crucible. The mouth tube guide 18 20l4-7191-PF; Ahddub 1275141 Lu 42 is connected to one end of the nozzle body 41, and the ultra pure water from the second washing water supply source ^ is sent to the ^ 42 by the drive of the delivery pump 531 The plurality of nozzle holes 43 are formed at equal intervals on the surface facing the base in the longitudinal direction of each of the plurality of nozzle holes 43. The liquid provided in the upper and lower pairs by holding the transport path 171 is held by the (four) hole 43 of the nozzle device 40, and the ultrapure water is sprayed onto the front and back surfaces of the substrate 6 to prevent the liquid recovery type nozzle device 20 from being carried out. The substrate Β in the cleaning place is dried before reaching the air knife 3G, and passes through the body holding nozzle device 4. Further, the spray water is further subjected to the cleaning treatment in the final stage, whereby the drying of the substrate B of the air knife 3G is performed, and the unevenness of the particles adhering to the front and back surfaces of the substrate B can be reliably prevented.

Further, in the present embodiment, the liquid holding nozzle device 4 is disposed closer to the liquid recovery type nozzle device 2〇 with respect to the intermediate position between the liquid recovery type nozzle device 2〇 and the air knife 3〇. And as close as possible to the position of the liquid recovery type nozzle device 2〇. In the above case, in the liquid recovery type nozzle device 2, only the minimum necessary ultrapure water is brought into contact with the substrate B, so that the amount of adhered water is small, so that the cleaned portion of the substrate b is from the liquid. The recovery nozzle device 2 starts at the moment of separation, and the natural drying progresses rapidly. Therefore, the liquid holding nozzle device 40 is disposed as close as possible to the liquid recovery type nozzle device 2 to avoid the above. On the other hand, in the bottom of the 2014-7191-PF of the i-th to fourth hoppers m, 131, 132, and i4i, and the bottom of the Ahddub 19 1275141, as shown in Fig. 1, the gas-liquid delivery guide in the casing u is provided. Guide tube 〗 8, 8, D. The bottom end of each guide tube 18 is open and faces the bottom 邛 ' of the housing 11 and in the middle of the guide tube 18, the exhaust pipe 19 forms a branch position of the branch in the guide g 18 relative to the exhaust pipe 丨9, The predetermined air-liquid separator m' is disposed in the guide pipe 18, and the cleaning air and the treatment liquid are separated by the gas-liquid separator 181, and then the treatment liquid is opened from the bottom end of the guide tube 18 to the casing η. At the bottom, on the other hand, the used air passing through the scribe 12, the cleaning unit 13 and the drying unit 14 is sent to the exhaust pipe 19. The downstream end of each of the above-mentioned rows of the milk tubes 19 is connected to a concentrated exhaust pipe (drainage mechanism) 7.4 provided in the vicinity of the substrate processing apparatus i 用于 for absorbing the exhaust gas of each position in the jigsaw plant. The used air in the exhaust gas 19 separated by the sputum separator 181 in the early morning, the sputum, and the sputum 181 is concentrated in the sputum discharge official 74, and the dust collection is omitted by the illustration provided in the factory. , , and discharged outside the system. #仃 both...dust treatment, and then, inside the respective exhaust pipe 丨9, the & knives (7) 5 are again provided for adjusting the damper 191 for attracting the wind. In the etched portion 12, the first cleaning unit 130, and the drying unit 14, in the case where the main and the nipples 30 are injected with the pressurized air and the non-injection, the adjustment nipple 1 91 is adjusted. Thus, the dust force within the body 11 is continuously in a predetermined negative environment. π That is, when the pressurized air is injected from the air knife 30 - from a, wind, the situation is detected by the sensing of the | §, the detection ^, σ~ is input to the control omitted from the figure, by In this case, the Q1 door from the controller is output to the damper 1 91 'the opening degree of the wind L door 19 调节 is adjusted based on the control signal, and is transmitted to 2014-7191-PF/Ahddub 2〇 1275141 The amount of suction of the used air of the damper 191 is increased. On the other hand, if the name of the squeezing from the air knives 30 is stopped, the discharge of the squeezing work milk is stopped, the situation can pass the established feeling. The detector detects that the degree of opening of the damper 191 is reduced by the control signal of the controller based on the detection signal, and the amount of suction of the used air is reduced. By the above-described degree of opening control of the damper 191, the pressurized air from the air knife 30 is stopped regardless of the injection or ejection, and the pressure in the (four) 3312, the cleaning unit Η and the drying unit 14 is maintained constant. As described above, the substrate processing apparatus 1 of the present invention is a device that performs a predetermined process on the substrate β that is being transported in a substantially horizontal posture along the operational path m, and the liquid recovery type nozzle device 2 () is disposed in series with the air knife 3〇 along the transport path 171, wherein the liquid recovery type nozzle device 20 is a processing liquid supply device that supplies a predetermined processing liquid to the substrate β in the transport, and the sputum substrate β is recovered. The treatment liquid is supplied in the form of a treatment liquid, and the air knives and the sputum are the treatment liquid removal means for removing the treatment liquid remaining on the substrate raft after the treatment liquid is supplied, and the residual effluent on the substrate 吹 is blown off by the air flow. In this way, the substrate is transported to the inside of the substrate processing apparatus J, and the processing liquid which is supplied by the liquid recovery type spray 2G is first processed, and then the liquid is wetted to the ' At 30, the liquid knife 30 is used to perform the liquid removal treatment, so that the remaining ports 2 1 and the cleaning unit 1 30 are adjacent to each other and different types of liquid are used. , As this minimizes / door substrate Β amount of the treatment liquid to the downstream side. In addition, in order to make the substrate processing apparatus compact, and to reduce the operating cost of 20l4-7l91-pF; Ahddub 21 1275141, the liquid recovery type nozzle device 2〇 is used, but it is also possible to prevent the treatment liquid from being removed. The existing disadvantages of having to extend the distance to the next step are to the τ-step, which can promote the reduction of the device cost and the running cost due to the compactness of the substrate processing apparatus. In addition, the substrate processing unit (in the present embodiment, the etching unit 12 and the first cleaning unit 130) of one unit is formed by the liquid recovery type nozzle device 20 and the air knife 30. The substrate processing unit of the plurality of units is along the transport path. 171 is connected in series (in this embodiment, (4)] the portion 12 and the cleaning unit 13 are arranged in series), and 1' uses different types of processing liquids in the substrate processing unit of each unit: in the present embodiment, in the case of the last name 124, the treatment liquid is a surname engraving liquid, and the treatment liquid is washed water by the first cleaning unit 130. Therefore, the substrate is transported along the transport path 171, and the substrate processing unit % etching unit 12 and the first cleaning unit of each unit are used. Part 13)), can handle a variety of treatment liquids. In addition, since the liquid recovery type nozzle device 2 is used as the processing liquid supply device, the amount of the processing liquid in the upstream substrate processing unit can be reduced to the amount of the substrate processing unit on the downstream side of the substrate processing portion. Compared with the past, the distance between the substrate processing units can be minimized, and the device cost and the running cost of the substrate processing apparatus that processes the substrate 采用 can be promoted by using various processing liquids. In the present embodiment, as the respective substrate processing portions, the etching portion 12, the cleaning portion, and the drying portion 14 are provided from the upstream side of the transport path 171, and in the etching portion 12, the processing liquid is subjected to etching treatment on the substrate β. In the cleaning unit 13, the treatment liquid is made of pure water for cleaning the substrate ' in the drying section 14, and the air knife 30 is used for drying; therefore, it is being transported 2014-7191-PF; Ahddub 22 ^ 275141 The substrate β conveyed by the road 171 is first subjected to an etching process for supplying a liquid in the engraving #12, and then, in the cleaning unit 13, the cleaning process is performed by the supply of pure water, and finally, the drying unit 14 passes the drying process. It is supplied from the air knife 3: "Oxygen flow, drying treatment. Therefore, the substrate is passed through each processing portion (the second portion 12, the cleaning portion 13 and the drying portion (4), whereby the substrate β can be included Cleaning and drying - series of engraving treatments. In addition, the 'liquid recovery type nozzle device 2' and the air knife 3' have the opposite sides (4) respectively on the upstream side wall (1) and the downstream side wall ι2 on the substrate k inlet 15 and the substrate Delivery outlet 16, and the liquid is recovered Nozzle means provided in the 3G = air knife is formed out of the inner housing n conveyance passage 171 \ between the substrate 15 and the substrate feed population, therefore, along the transport

The substrate B of the inside of the substrate 15 is fed to the liquid recovery type nozzle device 2A and the air knife 30 provided in the crotch portion of the casing 11, and the nozzles are set. After the autumn, the two substrate delivery outlets 16' are discharged outside the system. In addition, in the two parts of the casing U, there is a blower for purifying air for supplying clean air, and a concentrated exhaust pipe 74 for exhausting air in the two bodies 11, so that the flat air is introduced through the air blower. At the same time as the inside of the casing u, the air in the casing n is continuously discharged through the concentrated exhaust pipe 74. Therefore, even if there are fly beads or floating particles of the treatment liquid in the inner part of the shell =, the sputum 1 will be maintained, so that the environment in the casing 11 can be maintained, r, and 叮 can be reliably prevented. The disadvantage of contamination of the substrate B due to the contaminated environment inside the casing 11. Further, between the liquid recovery type nozzle device 2〇 and the air knife 3〇, Lu is 2014-7191-PF; Ahddub 23^75141 is placed on the substrate B, and the acknowledgment & ～5 The liquid holding nozzle for the cleaning water for prevention is transported according to the square slaughter, #, and the substrate B inside the square substrate processing apparatus is supplied with the cleaning water surface. The nozzle device 2 is used to hold the main body by the nozzle. Wide cleaning water, in the state where the liquid is wet, reaches the air knife. 'With the air knife 30, the cleaning nozzle device 2〇n(4)μ丨U body is recovered and repaired to prevent the cleaning water of 4 degrees. Therefore, the soil can be cleaned. The sheet is fixed to the substrate crucible when it reaches the nozzle for liquid removal. "...", so that, in order to achieve a reduction in the compactness of the substrate processing apparatus, the liquid recovery type* is converted into a particle-free particle or the like, and the substrate B is prevented from increasing the failure rate of I ασ. In the home floor treatment device 10, the advantages of the nozzle device 20 can be maximized. "Body recovery type" In addition, since the liquid holding nozzles are placed, the nozzles 20 and the air knife 30 are relatively The liquid back ρ „ between the neutral direction of the substrate transport direction' is more sinful than the liquid recovery type nozzle in the Panyu, can be ~ ..., set the position of 20, so can do this to suppress the liquid recovery type nozzle

Dry. He's set the substrate B to be cleaned by 2°, and the air inside the chamber housing u can be set in the factory by setting the air to the inside of the processing chamber housing. The concentrated exhaust pipe 74 is discharged inside, so that the purified air from the clean air blower 61 can be continuously introduced into the processing chamber 24 2014-7191-PF; Ahddub 1275141 is inside the casing 11 while simultaneously processing the chamber casing u The air is continuously discharged outward through the concentrated exhaust pipe 74. Therefore, even if there are floating particles in the process chamber casing u, they can be discharged to the outside of the system along with the exhaust gas, so that the environment in the process chamber casing n can be kept clean and can be surely prevented. Due to the contaminated environment within the housing η, the particles cause contamination of the substrate B.

Further, since the cleaning water used in the third cleaning chamber 14 uses ultrapure water, the base can be completely cleaned in the final stage of the cleaning process. The present invention is not limited to the above embodiment, and includes the following contents. (1) In the above embodiment, an example of a device for performing (four) processing on the substrate B as a substrate processing apparatus is exemplified. However, the present invention is not limited to a device in which the substrate is placed at a level of 1 G, and the substrate may be used. The entire processing device 10 serves as a device for performing a cleaning process. At this time, the button engraving supply source 51 is replaced by the washing water treatment source. That is, the cleaning liquid is supplied from the liquid supply source 5 to the liquid recovery type nozzle device 2 of the etching unit 12. The etching portion u can be referred to as the first ? The cleaning unit i 3 can be used as the second cleaning unit. *Other 'this time' can also be in the first! In the cleaning unit 12, the second cleaning unit 13A and the above are provided with a liquid holding nozzle device 4'. At this time, the washing water from the first washing water supply source 51 is supplied to the holding nozzle provided on the first cleaning unit 〇, and the water supply from the second cleaning water supply source 52 The liquid holding nozzle device 40 is provided in the second cleaning chamber 13. With the above configuration, since the β-washing treatment in the i-th and second cleaning units 0 is formed as a two-stage process of the liquid recovery type nozzle device Μ and the liquid holding nozzle device 40, the ratio can be achieved! And the second clear 2〇14-7l91^pF/Ahddub 25 1275141 Washing part 1 2, 1 3 0 stage more effective cleaning process. (2) In the above embodiment, the liquid holding nozzle device 4A is not provided in the etching portion 12 and the second cleaning portion 13A, but the present invention is not limited to the rice portion 12 and the first cleaning portion 13 The liquid holding nozzle device 40 is not provided, and the liquid holding nozzle device 4A may be provided in the substrate processing unit in accordance with the type and condition of the substrate processing. With the above configuration, since the processing in the etching portion 12 and the "clearing portion 13" is formed into a two-stage process of the liquid recovery type nozzle device 20 and the liquid holding nozzle device 4, the substrate can be more efficiently realized. deal with. (3) In the above-described embodiment, the cleaning process of the substrate B using the ultrapure water of the liquid recovery type nozzle device 2 in the second cleaning unit 13A is performed from the liquid recovery type nozzle device 2 The pure water after the cleaning treatment is discharged to the outside of the system. However, instead of such a method, the ultra-pure water after the cleaning treatment may be returned to the i-th cleaning unit 13A for reuse. (4) In the above embodiment, the circular nozzle hole 43 for jetting the washing water in the liquid holding nozzle device 40 is bored on the nozzle tube 41, i, the present invention is not limited to the jet washing water. Partially rounded nozzles:: 43, can also be square holes, polygonal holes, or star-shaped holes, etc., and can be used instead of holes, but with slits, installed on a given nozzle part. (5) In the above embodiment, the liquid holding nozzle I of the second cleaning r is set to 4, and is disposed closer to the liquid recovery type than the substantially intermediate position between the liquid recovery type nozzle 妒2〇 and the air knife 30. The nozzle 2 is on the side, but the present invention is not limited to the liquid holding nozzle device, and is disposed at the above-described position, depending on the type of the substrate B, the running bar: 2〇14-7191-pF; Ahddub 26 1275141, etc. Various conditions related to substrate processing are set to appropriately set the position. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal cross-sectional view showing a general configuration of a substrate processing apparatus according to an embodiment of the present invention; Fig. 2 is a transverse cross-sectional view of the substrate processing apparatus shown in Fig. 1; The positional relationship between the liquid recovery type nozzle device, the air knife, and the liquid holding nozzle is set to be the first view. 3 shows the longitudinal section of the liquid recovery type nozzle through the main component symbol description] 11 ~ housing; 112 ~ downstream side wall; 114 ~ partition wall; 1 21 ~ 1st hopper; 1 3 0 ~ 1st cleaning section; 131~2nd hopper; 14~drying section; 15~substrate give σ · 1 7~ transport pro; 18~ guide tube; 1 9~ exhaust pipe; I 0~substrate processing device ·, 111~upstream sidewall; II 3~ top plate; 1 2~single part; 1 3~cleaning part; 130'~2nd cleaning part 1 3 2~3rd hopper; 141~4th hopper; 16~substrate delivery port; 171~transportation path; ~ gas-liquid separator ·, 2014-7191-PF; Ahddub 27 1275141 1 91~ adjusting damper; 201~ top nozzle device 21~ nozzle body; 23~ outlet tube; 25~ liquid outlet; 31~ air knife body; ~ blowing slit; 41 ~ nozzle tube; • 42 ~ introduction tube; 5 0 ~ treatment liquid supply source 5 31 ~ delivery pump; 532 ~ suction pump; 60 ~ air supply device 74 ~ concentrated exhaust pipe; Recycling nozzle section; 202~ bottom nozzle device; 22~ introduction tube; 24~ liquid introduction port; 3 0~ air knife; 32 to nozzle portion; 33 to air introduction tube; 40 to liquid holding nozzle device; 43 to nozzle hole; 51 to etching liquid supply source; 52 to first cleaning water supply source; 53 to second cleaning water supply source; ~ Purify the air with a hair dryer; B ~ substrate. 2014-7191-PF; Ahddub 28

Claims (1)

1275141 X. Patent application: The earth plate processing device performs a predetermined process on the substrate, and is characterized by: ^ a transport path for transporting the substrate; and a liquid recovery type nozzle portion for supplying the substrate to the transport path along the transport path The liquid material is subjected to the substrate treatment, and the treatment liquid after the treatment is recovered from the substrate; and the liquid removal hopper is disposed at a predetermined distance from the liquid recovery type nozzle portion on the downstream side of the liquid recovery type nozzle portion in the transport path. And remove the treatment liquid on the substrate. The substrate processing apparatus according to claim 2, wherein a holding liquid supply unit is provided between the liquid recovery type nozzle unit and the liquid removal unit, and the holding liquid supply unit supplies the substrate to be wet. The state is at least the processing liquid that has been transported to the above-described liquid removing portion. The substrate processing apparatus according to the second aspect of the invention, wherein the holding liquid supply unit is disposed at a position intermediate to the liquid recovery type nozzle unit and the liquid removal unit, and is further biased toward the liquid recovery type nozzle unit side. . 4. The substrate processing apparatus according to claim 2, wherein the processing liquid that is kept in a wet state is cleaning water for cleaning the substrate. The substrate processing apparatus according to any one of the items 2 to 4, wherein the substrate processing apparatus further includes a housing having a wall surface, and a substrate feeding inlet is formed on one wall surface of the opposite wall surface of the housing, in another A substrate delivery port is formed on one wall surface, and the transport path is formed between the substrate feed inlet and the substrate delivery port, and a partition wall is provided inside the casing, and the 2014-7191-PF; Ahddub 29 1275141 liquid recovery The nozzle portion is disposed on the substrate feed inlet and the ea upper partition wall 4, and the liquid removal portion is disposed on the partition wall and the substrate transfer mechanism as described in any one of claims 1 to 4 of the patent application scope. a substrate processing unit in which the liquid recovery type nozzle portion and the liquid removal unit are connected to each other, and a substrate processing m transportation path of a plurality of units is provided in series in the base of the unit. Treatment fluid. In the substrate processing apparatus according to the sixth aspect of the invention, the basin is provided with an etchback from the upstream side of the transport path. The 卩 and the drying unit are used as the processing unit for each of the substrates, wherein the etchant is used as a processing liquid for processing the substrate, and the cleaning unit is made of pure water as a processing liquid for cleaning the substrate; The drying section uses the above liquid removing section as a drying. The substrate processing apparatus according to any one of claims 1 to 4, further comprising a substrate having a wall surface J^ forming a substrate inlet on a wall surface of the opposite wall surface of the installation body Forming a substrate delivery opening on the other wall surface; forming the transport path between the substrate delivery outlets on the substrate feeding inlet tray; the liquid recovery type nozzle portion and the liquid removal portion are disposed in the housing; An empty milk introduction mechanism for introducing the clean air into the casing, and an exhausting mechanism for discharging the air in the casing. The substrate processing apparatus according to any one of the preceding claims, wherein The liquid removing portion extends in the width direction of the above-described conveying path and is disposed in the direction in which the (four) conveying direction is inclined at a predetermined angle. 2014-7191-PF; Ahddub 30