CN100466216C - Carrying processing device - Google Patents
Carrying processing device Download PDFInfo
- Publication number
- CN100466216C CN100466216C CNB2006101498503A CN200610149850A CN100466216C CN 100466216 C CN100466216 C CN 100466216C CN B2006101498503 A CNB2006101498503 A CN B2006101498503A CN 200610149850 A CN200610149850 A CN 200610149850A CN 100466216 C CN100466216 C CN 100466216C
- Authority
- CN
- China
- Prior art keywords
- substrate
- unit
- decompression chamber
- mouth
- sending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
The present invention provides a conveying processing apparatus capable of avoiding liquid from a wet unit. An outlet (23) of a decompression chamber (20) has a vertical size set within a range avoiding contact of its top edge with the liquid (developing solution) supplied on the surface of a substrate (W). Therefore, because the clearance between the top face of the substrate (W) and the top edge of the outlet (23) becomes small when the substrate (W) passes through the outlet (23) and the interior of the decompression chamber (20) has a negative pressure, atmosphere rushes into the decompression chamber (20) along the top surface of the substrate (W) so that the flow of the atmosphere causes the developing solution put on the surface of the substrate (W) to flow and fall from the long side of the substrate (W). The developing solution thus caused to flow and fall is collected through a collection port (24).
Description
Technical field
The present invention relates to the limit and transport the processing unit that transports that various processing are carried out on substrate limits such as glass substrate by roller etc.
Background technology
In the past, shown in patent documentation 1, known had a following processing unit that transports, that is, in order to improve treatment effeciency, along substrate transport the various processing unit of line configuring, the limit transports by roller etc. that glass substrate is equilateral to carry out various processing.
Such along substrate the transporting in the processing unit of various processing unit of having transported line configuring, sometimes for example also at the downstream of UV irradiation unit (drying unit) configuration cleaning device (moistening unit), after substrate being sent into the UV irradiation unit and being removed the organic substance that is attached to the surface, clean the surface of glass substrate with cleaning device.
2004-No. 281991 communiques of [patent documentation 1] TOHKEMY
But, as mentioned above, transporting in the processing unit of the structure with UV irradiation unit and cleaning device adjacency, in the time of for example on substrate has been parked in across the position of UV irradiation unit and cleaning device for a certain reason, will occur in the cleaning fluid that produces in the clean problem on substrate surface from cleaning device side direction UV irradiation unit side flow.
At this moment, can adhere to developer solution on the lamp of UV irradiation unit 50 (not shown), thereby occur breaking down and the situation of decreased performance.
Summary of the invention
In order to solve above-mentioned problem, the present invention transports the substrate limit this substrate is carried out transporting in the processing unit of various processing on the limit, adopted following structure, promptly, moistening unit to this substrate surface providing chemical liquid is installed, be provided with decompression chamber, make and moistening unit adjacency or encirclement moistening unit; Be formed with sending into mouth and sending mouth of substrate in the decompression chamber, the above-mentioned rising wood of sending mouthful is set lowlyer than the above-mentioned rising wood of sending into mouthful, and the lower end of the rising wood that this is sent mouthful is than more than the high 3mm of substrate surface, in addition, be formed with the recovery mouth of the treatment fluid that falls from substrate in the bottom of decompression chamber.
According to the processing unit that transports of the present invention, because the moistening unit to this substrate surface providing chemical liquid is installed, and with moistening unit in abutting connection with or be provided with decompression chamber with surrounding moistening unit, decompression chamber is formed with sending into mouth and sending mouth of substrate, send into mouthful and send in the mouth at least one rising wood not with the contacted scope of the treatment fluid that is fed to substrate surface in, set lowlyer, in addition, be formed with the recovery mouth of the treatment fluid that falls from substrate in the bottom of decompression chamber, so, when substrate when sending into mouthful or sending mouthful, extraneous air enters in the decompression chamber, the unnecessary treatment fluid of substrate surface so the time air-flow and fall from substrate surface.Its result can not be admitted to next processing unit under substrate surface adheres to the state of unnecessary treatment fluid.
As above-mentioned moistening unit, the feeding unit or the cleaning unit of developer solution for example arranged.In addition, for example also have the etching unit, peel off the unit.
According to the processing unit that transports of the present invention, between the device of adjacency, can prevent to bring treatment fluid into another device from a device, so can avoid because of for example bringing the fault and the decreased performance of the device that treatment fluid causes into.In addition, also can remove treatment fluid unnecessary on the substrate, improve for example utilance again of treatment fluid.
Therefore, can realize that reliability is high and not reduce the processing unit that transports of treatment effeciency.
Description of drawings
Fig. 1 is the expression summary construction diagram (part) that transports an execution mode of processing unit of the present invention.
Fig. 2 is the partial longitudinal section figure of decompression chamber.
Fig. 3 is the expression summary construction diagram (part) that transports other execution mode of processing unit of the present invention.
Fig. 4 is the expression summary construction diagram (part) that transports another other execution mode of processing unit of the present invention.
Symbol description among the figure
1 transports processing unit; 2 transport and use roller; 10 developing apparatus; 12 send into mouth; 13 send mouth; 14 developer solution supply nozzles; 20 decompression chamber; 21 discharge ducts; 22 send into mouth; 23 send mouth; The recovery mouth of 24 developer solutions; 30 rinsing devices; 31 first rinsing chambers; 32 second rinsing chambers; 33 the 3rd rinsing chambers; 34 the 4th rinsing chambers; 35 cascade tanks; First Room of 35a cascade tank; Second Room of 35b cascade tank; 36 cascade tanks; 37 send mouth; 38 reclaim mouth; 40 cleaning devices; 41 cleaning fluid supply nozzles; 42 clean brush; The 50UV irradiation unit; 60 decompression chamber; 61 send mouth; 62 send into mouth; 63 exhaust outlets; 64 reclaim mouth
Embodiment
Below, with reference to the accompanying drawings embodiments of the present invention are described.
Fig. 1 is the summary construction diagram (part) that an execution mode of processing unit is transported in expression, and Fig. 2 is the partial longitudinal section figure of decompression chamber.
In transporting processing unit 1, as shown in Figure 1, with as the developing apparatus 10 of moistening unit in abutting connection with dispose decompression chamber 20.Glass substrate W is by transporting with roller 2 ... in these developing apparatus 10 and decompression chamber 20, pass through.
In addition, prime and the back level in developing apparatus 10 and decompression chamber 20 also disposes not shown various processing unit.
In developing apparatus 10, on the shell that is the case shape, be formed with sending into mouth 12 and sending mouth 13 of substrate, in shell, dispose developer feeding nozzle 14.In addition, be connected with at the top of decompression chamber 20 and be used to make the discharge duct 21 that becomes negative pressure in the decompression chamber 20, what be formed with substrate on the side of front and back sends into mouthfuls 22 and send mouthfuls 23.
In the present embodiment, particularly, with the size of sending mouthfuls 23 above-below direction of decompression chamber 20 rising wood not with set lowlyer in the scope that the liquid that is fed to substrate W surface (developer solution) contacts.In addition, be provided with the recovery mouth 24 of developer solution in the bottom of decompression chamber 20.
Thus, at substrate W by sending mouthfuls 23 o'clock, as shown in Figure 2, because substrate W upper surface is less with the gap of sending between mouth 23 the upper limb, and in the decompression chamber 20 is negative pressure, so extraneous air is delivered to substrate W upper surface and enters strong in the decompression chamber 20, the unnecessary developer solution of saving bit by bit on substrate W surface flows down from the long limit of substrate W because of air-flow.
In addition, the developer solution that flows down reclaims by the recovery mouth 24 that is provided with in decompression chamber 20, therefore also for example can improve utilance again.
Particularly, the cleaning fluid on substrate W surface locates to become halted state pressure line of demarcation (send mouthful 23 near), has only substrate W to be transported.This moment, developer solution was benchmark with the line of demarcation, surpassed capillary unnecessary developer solution and wandered outside the substrate W.
In addition, enter strong in the decompression chamber 20 though mention air,, as long as the pressure differential of existence and adjacent unit, then minimum pressure differential is also passable.
Though the rising wood of sending mouth 23 is in the degree that does not hinder substrate W to pass through, tried one's best forms narrowly, according to size and the apparatus structure of substrate W, also has air displacement etc., and it is highly had nothing in common with each other.Because the surface tension of developer solution is 3mm, therefore be preferably more than the 3mm.
In addition, the situation of setting lowlyer to the rising wood that only will send mouthful 23 1 sides is illustrated, but, from taking into account above-mentioned substrate W size and apparatus structure, also having the angle of air displacement etc., also can all set the rising wood of both sides (send into mouth 22 and send mouth 23) lower, and not only set the rising wood of a side lower.
At this moment, different by the height of a side (send mouthful 23) and the height of opposite side (sending into mouth 22) are made as, can obtain effect same as described above.For example, the rising wood that will send mouthfuls 23 set during more close substrate W surface, though send into mouthfuls 22 rising wood less than the degree of sending mouthfuls 23 rising wood, also near substrate W surface.
Fig. 3 is the figure that transports processing unit (part) that other execution mode of the present invention relates to, and in this embodiment, applies the present invention to rinsing (rinse) device.In addition, dispose not shown various devices in the front and back of rinsing device 30.
In rinsing device 30, from upstream side downstream side have along transporting line configuring: the first rinsing chamber 31, the second rinsing chamber 32, the 3rd rinsing chamber 33 and the 4th rinsing chamber 34.Supply new liquid (rinsing liquid) in the 4th rinsing chamber 34, the 4th rinsing chamber 34 employed rinsing liquids are returned in the first Room 35a of cascade tank 35, and the rinsing liquid of the first Room 35a is provided for the 3rd rinsing chamber 33.In addition, rinsing liquid also turns back to the first Room 35a from the 3rd rinsing chamber 33.
Overflow and the rinsing liquid that enters the second Room 35b is sent to the second rinsing chamber 32 from the first Room 35a of cascade tank 35, the second rinsing chamber, 32 used rinsing liquids turn back to other cascade tank 36, and the rinsing liquid (the dirtiest rinsing liquid) in this cascade tank 36 is offered the first rinsing chamber 31.In addition, a part of rinsing liquid flows to another cascade tank 36 from the first Room 35a of a cascade tank 35.
In the present embodiment, make in the second rinsing chamber 32 to having the structure of decompression chamber concurrently, the same with the situation of above-mentioned execution mode, with the size of sending mouthfuls 37 above-below direction of the second rinsing chamber 32 not with the contacted scope of the liquid that supplies to substrate W surface (rinsing liquid) in, set lowlyer.
Thus, when glass substrate W by when the second rinsing chamber 32 is transplanted on the 3rd rinsing chamber 33, in case glass substrate W is by sending mouth 37, then produce the air-flow that sucks to inside on the surface of glass substrate W, the rinsing liquid on glass substrate W surface is dashed by air-flow, and the recovery mouth 38 of the bottom by the second rinsing chamber 32 turns back to cascade tank 36.Thus, the dirtiest rinsing liquid can not be brought in the 3rd rinsing chamber 33, can improve the utilance again of rinsing liquid.
Fig. 4 is the figure that transports processing unit (part) that expression another other execution mode of the present invention relates to, and in the present embodiment, applies the present invention to cleaning device.
Transporting in the processing unit of present embodiment, along the carriage direction of substrate W, dispose UV irradiation unit 50 at upstream side, dispose cleaning device 40 in the downstream.In addition, prime and the back level at UV irradiation unit 50 and cleaning device 40 disposes not shown various processing unit.
Dispose cleaning fluid supply nozzle 41 and clean brush 42 in cleaning device 40, cleaning device 40 integral body are incorporated in the decompression chamber 60.Be formed with sending into mouth 62 and sending mouth 61 of glass substrate W in this decompression chamber 60, in addition, exhaust outlet 63 is at lateral opening, and recovery mouth 64 is set at the bottom surface.
In addition, mouthfuls 23 the same with sending of above-mentioned execution mode in the present embodiment, with send into mouth 62 above-below direction size not with the contacted scope of the liquid that supplies to substrate W surface (cleaning fluid) in, set lowlyer.
Even as mentioned above, in the time of on for example substrate has been parked in across the position of UV irradiation unit 50 and cleaning device 40 for a certain reason, also can be because of the effect identical with above-mentioned execution mode, and avoid the cleaning fluid that in clean, produces on substrate surface from cleaning device 40 effluents to UV irradiation unit 50 sides.
Thus, the lamp (not shown) that can not produce UV irradiation unit 50 is gone up the adhesion developer solution, and the problem of generating means fault and decreased performance etc.
In addition, the present invention is not limited to above-mentioned execution mode, as long as in not breaking away from aim scope of the present invention, can adopt other various structures.
Claims (3)
1. one kind is transported processing unit, and the limit is transported the substrate limit this substrate is carried out various processing, and this transports processing unit and is characterised in that,
Moistening unit to this substrate surface providing chemical liquid is installed, with above-mentioned moistening unit in abutting connection with or be provided with decompression chamber with surrounding above-mentioned moistening unit;
In above-mentioned decompression chamber, be formed with sending into mouth and sending mouth of aforesaid substrate, the above-mentioned rising wood of sending mouthful is set lowlyer than the above-mentioned rising wood of sending into mouthful, and the lower end of the rising wood that this is sent mouthful is than more than the high 3mm of substrate surface, in addition, be formed with the recovery mouth of the treatment fluid that falls from aforesaid substrate in the bottom of above-mentioned decompression chamber.
2. the processing unit that transports as claimed in claim 1 is characterized in that above-mentioned moistening unit is the feeding unit of developer solution.
3. the processing unit that transports as claimed in claim 1 is characterized in that above-mentioned moistening unit is a cleaning unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005316881 | 2005-10-31 | ||
| JP2005316881A JP4817802B2 (en) | 2005-10-31 | 2005-10-31 | Transport processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1959951A CN1959951A (en) | 2007-05-09 |
| CN100466216C true CN100466216C (en) | 2009-03-04 |
Family
ID=38071554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101498503A Expired - Fee Related CN100466216C (en) | 2005-10-31 | 2006-10-27 | Carrying processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4817802B2 (en) |
| KR (1) | KR100834702B1 (en) |
| CN (1) | CN100466216C (en) |
| TW (1) | TW200746251A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI407270B (en) * | 2009-12-30 | 2013-09-01 | Au Optronics Corp | Developing equipment |
| CN101718963B (en) * | 2010-01-14 | 2011-10-05 | 友达光电股份有限公司 | Developing outfit |
| JP5641989B2 (en) * | 2011-03-17 | 2014-12-17 | 三菱電機ビルテクノサービス株式会社 | Filter cleaning device |
| CN204544839U (en) * | 2012-11-05 | 2015-08-12 | 日本电气硝子株式会社 | Flat glass cleaning device |
| US20150118012A1 (en) * | 2013-10-31 | 2015-04-30 | Lam Research Corporation | Wafer entry port with gas concentration attenuators |
| CN104538332B (en) * | 2014-12-12 | 2017-06-27 | 深圳市华星光电技术有限公司 | A kind of chamber structure of wet process board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203858A (en) * | 1995-01-31 | 1996-08-09 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| JP2001135702A (en) * | 1999-11-04 | 2001-05-18 | Canon Inc | Substrate transfer apparatus, substrate treatment apparatus, method of manufacturing device |
| US20020020496A1 (en) * | 2000-03-22 | 2002-02-21 | Hisato Shinohara | Substrate treatment apparatus |
| CN1503758A (en) * | 2002-02-04 | 2004-06-09 | 住友精密工业株式会社 | Substrate processing apparatus of transfer type |
| JP2004299850A (en) * | 2003-03-31 | 2004-10-28 | Dainippon Printing Co Ltd | Processing method and processing device |
| JP2005005587A (en) * | 2003-06-13 | 2005-01-06 | Sumitomo Precision Prod Co Ltd | Resist stripping apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11334870A (en) * | 1998-05-26 | 1999-12-07 | Dainippon Screen Mfg Co Ltd | Board processing device |
| JP4056858B2 (en) * | 2001-11-12 | 2008-03-05 | 東京エレクトロン株式会社 | Substrate processing equipment |
| KR100904278B1 (en) * | 2001-11-12 | 2009-06-25 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus |
-
2005
- 2005-10-31 JP JP2005316881A patent/JP4817802B2/en active Active
-
2006
- 2006-09-14 TW TW095134057A patent/TW200746251A/en not_active IP Right Cessation
- 2006-10-27 KR KR1020060104941A patent/KR100834702B1/en active IP Right Grant
- 2006-10-27 CN CNB2006101498503A patent/CN100466216C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203858A (en) * | 1995-01-31 | 1996-08-09 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| JP2001135702A (en) * | 1999-11-04 | 2001-05-18 | Canon Inc | Substrate transfer apparatus, substrate treatment apparatus, method of manufacturing device |
| US20020020496A1 (en) * | 2000-03-22 | 2002-02-21 | Hisato Shinohara | Substrate treatment apparatus |
| CN1503758A (en) * | 2002-02-04 | 2004-06-09 | 住友精密工业株式会社 | Substrate processing apparatus of transfer type |
| JP2004299850A (en) * | 2003-03-31 | 2004-10-28 | Dainippon Printing Co Ltd | Processing method and processing device |
| JP2005005587A (en) * | 2003-06-13 | 2005-01-06 | Sumitomo Precision Prod Co Ltd | Resist stripping apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4817802B2 (en) | 2011-11-16 |
| KR100834702B1 (en) | 2008-06-02 |
| TW200746251A (en) | 2007-12-16 |
| TWI306272B (en) | 2009-02-11 |
| JP2007117953A (en) | 2007-05-17 |
| KR20070046727A (en) | 2007-05-03 |
| CN1959951A (en) | 2007-05-09 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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Granted publication date: 20090304 Termination date: 20171027 |