TW200746251A - Conveying/processing apparatus - Google Patents

Conveying/processing apparatus

Info

Publication number
TW200746251A
TW200746251A TW095134057A TW95134057A TW200746251A TW 200746251 A TW200746251 A TW 200746251A TW 095134057 A TW095134057 A TW 095134057A TW 95134057 A TW95134057 A TW 95134057A TW 200746251 A TW200746251 A TW 200746251A
Authority
TW
Taiwan
Prior art keywords
substrate
outlet
flow
developing solution
decompression chamber
Prior art date
Application number
TW095134057A
Other languages
Chinese (zh)
Other versions
TWI306272B (en
Inventor
Futoshi Shimai
Shigeru Kawata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200746251A publication Critical patent/TW200746251A/en
Application granted granted Critical
Publication of TWI306272B publication Critical patent/TWI306272B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Abstract

To provide a conveying/processing apparatus capable of avoiding a liquid from a wet unit. An outlet 23 of a decompression chamber 20 has a vertical size set within a range avoiding contact of its top edge with the liquid (developing solution) supplied on the surface of a substrate W. Therefore, because the clearance between the top face of the substrate W and the top edge of the outlet 23 becomes small when the substrate W passes through the outlet 23 and the interior of the decompression chamber 20 has a negative pressure, atmosphere rushes into the decompression chamber 20 along the top surface of the substrate W so that the flow of the atmosphere causes the developing solution put on the surface of the substrate W to flow and fall from the long side of the substrate W. The developing solution thus caused to flow and fall is collected through a collection port 24.
TW095134057A 2005-10-31 2006-09-14 Conveying/processing apparatus TW200746251A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005316881A JP4817802B2 (en) 2005-10-31 2005-10-31 Transport processing device

Publications (2)

Publication Number Publication Date
TW200746251A true TW200746251A (en) 2007-12-16
TWI306272B TWI306272B (en) 2009-02-11

Family

ID=38071554

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134057A TW200746251A (en) 2005-10-31 2006-09-14 Conveying/processing apparatus

Country Status (4)

Country Link
JP (1) JP4817802B2 (en)
KR (1) KR100834702B1 (en)
CN (1) CN100466216C (en)
TW (1) TW200746251A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407270B (en) * 2009-12-30 2013-09-01 Au Optronics Corp Developing equipment

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101718963B (en) * 2010-01-14 2011-10-05 友达光电股份有限公司 Developing outfit
JP5641989B2 (en) * 2011-03-17 2014-12-17 三菱電機ビルテクノサービス株式会社 Filter cleaning device
JPWO2014069577A1 (en) * 2012-11-05 2016-09-08 日本電気硝子株式会社 Sheet glass cleaning apparatus and sheet glass cleaning method
US20150118012A1 (en) * 2013-10-31 2015-04-30 Lam Research Corporation Wafer entry port with gas concentration attenuators
CN104538332B (en) * 2014-12-12 2017-06-27 深圳市华星光电技术有限公司 A kind of chamber structure of wet process board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08203858A (en) * 1995-01-31 1996-08-09 Dainippon Screen Mfg Co Ltd Substrate treating device
JPH11334870A (en) * 1998-05-26 1999-12-07 Dainippon Screen Mfg Co Ltd Board processing device
JP2001135702A (en) * 1999-11-04 2001-05-18 Canon Inc Substrate transfer apparatus, substrate treatment apparatus, method of manufacturing device
JP4316767B2 (en) * 2000-03-22 2009-08-19 株式会社半導体エネルギー研究所 Substrate processing equipment
JP4056858B2 (en) * 2001-11-12 2008-03-05 東京エレクトロン株式会社 Substrate processing equipment
KR100904278B1 (en) * 2001-11-12 2009-06-25 도쿄엘렉트론가부시키가이샤 Substrate processing apparatus
JP4044047B2 (en) * 2002-02-04 2008-02-06 住友精密工業株式会社 Transport type substrate processing equipment
JP2004299850A (en) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd Processing method and processing device
JP4346967B2 (en) * 2003-06-13 2009-10-21 住友精密工業株式会社 Resist stripping device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407270B (en) * 2009-12-30 2013-09-01 Au Optronics Corp Developing equipment

Also Published As

Publication number Publication date
JP4817802B2 (en) 2011-11-16
CN1959951A (en) 2007-05-09
KR100834702B1 (en) 2008-06-02
TWI306272B (en) 2009-02-11
JP2007117953A (en) 2007-05-17
KR20070046727A (en) 2007-05-03
CN100466216C (en) 2009-03-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees