JPH08203858A - Substrate treating device - Google Patents

Abstract

PURPOSE: To provide a substrate treating device for consistently performing heat treatment from washing/drying of a substrate to heat treatment without being affected by the atmosphere. CONSTITUTION: A mechanical interface 2 receives a substrate carried in from another process and retains it. A pressure-reducing chamber 4 forms a closed space, the lower portion is constituted as a washing chamber part 41, and the upper portion is constituted as a film-forming chamber part 41 by a transfer machine 3. In the washing chamber part 51, washing treatment by a chemical liquid, water-washing treatment by pure water, and drying treatment are performed. After washing/drying treatment is completed, the substrate is housed in the film-forming chamber part 42 by a boat elevator. The substrate is heated by an oven body in the film-forming chamber part 42.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus,
More specifically, in a semiconductor device manufacturing process, a liquid crystal display manufacturing process, an electronic component-related manufacturing process, etc., a predetermined treatment (cleaning / drying treatment and heat treatment) for various substrates such as silicon wafers, glass substrates, and electronic components. Relating to a device for applying.

[0002]

2. Description of the Related Art When a substrate such as a silicon wafer is subjected to heat treatment such as oxide film treatment or LPCVD treatment, the substrate is washed before the heat treatment. Conventionally, a substrate cleaning apparatus is configured as a completely different apparatus from the substrate heat treatment apparatus, and is installed in another area in the factory. Substrates that have been treated with various chemicals in the cleaning device and finally cleaned with pure water are dried and then taken out from the cleaning device and transferred from the cleaning area to the heat treatment area by a robot, transfer device, or operator in the atmosphere. Transported in
It had been carried into the heat treatment equipment.

FIG. 7 is a plan layout diagram showing an example of the configuration of a conventional substrate processing system. In FIG. 7, the substrate processing system includes a cleaning device A provided in a cleaning area and a heat treatment device B provided in a heat treatment area different from the cleaning area.

The cleaning apparatus A includes one or a plurality of chemical cleaning tanks (three in the figure, as an example, for carrying out a predetermined cleaning process on a substrate by containing a required cleaning chemical and immersing the substrate in the chemical. Case) and one or more deionized water cleaning tanks (in the figure, 3 as an example, in which deionized water is contained, the substrate is immersed in the deionized water, and the substrate is washed with deionized water.
Two cases are shown), a final rinse bath for finally rinsing the substrate with pure water, a drying processing section for drying the surface of the substrate after the final rinse treatment, and a chemical cleaning bath 1
Adjacent to the loader for accommodating a plurality of pre-cleaned substrates and carrying in the loaded cassette, and a cassette for accommodating cleaned and dried substrates adjacent to the drying processing unit An unloader that carries out cassettes, a substrate transfer robot that transfers substrates between the loader, a chemical cleaning tank, a pure water cleaning tank, a final rinse tank, a drying processing section, and an unloader, and an empty cassette from the loader to the unloader. And a cassette truck for transfer. Each chemical cleaning tank contains a predetermined chemical depending on its purpose. For example, the chemical cleaning tank 1 stores a mixed solution of ammonia water and hydrogen peroxide water, the chemical cleaning tank 2 stores hydrofluoric acid, and the chemical cleaning tank 3 stores a mixed solution of hydrochloric acid and hydrogen peroxide water. . Further, as a substrate drying apparatus installed in the drying processing unit, a spin dryer for shaking off pure water from the surface of the substrate by centrifugal force to dry it, or an organic solvent such as isopropyl alcohol for deionized water attached to the surface of the substrate An organic solvent vapor dryer is used which dries by substituting the vapor of A stocker is provided adjacent to the unloader. This stocker is a cassette that contains cleaned substrates that have been unloaded from the unloader.
It acts as a buffer for temporary accommodation.

On the other hand, in the heat treatment apparatus B, in order to prevent the influence of mixing of atmospheric components into the interior of the furnace body where the substrate is heat-treated and the influence of oxidation by the atmospheric components during the transfer of the substrate, the inlet and outlet of the furnace body A load lock chamber is connected to. In addition, a loader for loading and unloading substrates
A stocker is provided adjacent to the unloader. This stocker can temporarily store the cassette containing the substrate, which has been transported from the cleaning apparatus A. Then, the transportation of the substrate from the cleaning apparatus A to the heat treatment apparatus B is performed in the atmosphere.

Further, conventionally, as a special example, as shown in the plan layout diagram of FIG. 8, the cleaning apparatus section C and the heat treatment apparatus section D are in-lined by the interface robot E, and the cleaning process and the heat treatment are in the same area. There was also an integrated substrate processing system that could be done in-house.

[0007]

In the system in which the cleaning device A and the heat treatment device B are installed in different areas as shown in FIG. 7, the cleaning device A has completed the cleaning / drying process and is housed in the cassette. The substrate is unloaded from the cleaning apparatus A, is accommodated in the stocker of the heat treatment apparatus B by the inter-process transfer, and waits for the order of heat treatment there. The substrate is exposed to the atmosphere during the transportation between the steps and during the waiting for the heat treatment. Also in the cleaning apparatus A, the substrate was affected by the atmosphere while being transported between the tanks and during the drying process in the drying processing section. Therefore, adhesion of particles and adsorption of gas occur on the surface of the substrate, causing contamination by carbon, heavy metals, and the like, and undesired growth of an oxide film. As a result, the properties of the film formed on the surface of the substrate in the oxidation process and the LPCVD process deteriorate, and the yield of the final product decreases.

On the other hand, as shown in FIG. 8, in the system in which the cleaning device section C and the heat treatment apparatus section D are in-line,
Since the substrate transfer between the cleaning / drying process and the heat treatment process and the process waiting until the heat treatment can be omitted, it is less affected by the atmosphere as compared with the system shown in FIG. However, the substrate is still in contact with the atmosphere during the transfer between the tanks in the cleaning device section C. The substrate is exposed to the atmosphere until it enters the load lock chamber from the unloader of the cleaning device section C through the interface robot E and the loader / unloader of the heat treatment device section D. Therefore, even the system shown in FIG. 8 cannot completely eliminate the problems that occur in the system shown in FIG. Further, the system of FIG. 8 has another problem that the configuration is huge and complicated.

Therefore, an object of the present invention is to perform substrate cleaning / drying to heat treatment in a single apparatus without being affected by the atmosphere at all, and further, the substrate processing is simple and inexpensive. It is to provide a device.

[0010]

The invention according to claim 1 is
A substrate processing apparatus that centrally performs cleaning / drying processing and heat treatment of a substrate in a sealed space, and forms a sealed space and a substrate receiving portion that receives and holds a substrate carried in from another process. A decompression chamber and a transfer machine for transferring the substrate between the substrate receiving section and the decompression chamber are provided, and the decompression chamber accommodates the substrate transferred from the substrate receiving section by the transfer machine and cleans with a chemical solution. Processing, a washing treatment with pure water, and a drying treatment; a film forming chamber portion having a furnace body provided above the washing chamber for heating the substrate; and a washing chamber portion. An opening / closing mechanism for opening and closing a communication port with the film chamber section is further provided, and an elevating means for elevating the substrate between the cleaning chamber section and the film forming chamber section is further provided.

According to a second aspect of the present invention, in the first aspect of the present invention, one or more are provided upright in the cleaning chamber section, and the chemical liquid and / or pure water supplied from the outside of the decompression chamber are jetted into the cleaning chamber section. The nozzle column is characterized in that the nozzle column itself rotates and revolves around the substrate contained in the cleaning chamber section.

The invention according to claim 3 is the invention according to claim 1 or 2.
In the invention described above, there is further provided a substrate accommodating portion which is provided in the cleaning chamber portion and accommodates a substrate, and the substrate accommodating portion is rotated by itself.

[0013]

In the invention according to claim 1, the substrate carried in from another process is accommodated in the cleaning chamber portion provided in the decompression chamber, and the cleaning process with the chemical solution and the cleaning process with pure water are performed.
And a drying process. When these processes are completed in the cleaning chamber part, the substrate is transferred to the film forming chamber part also provided in the decompression chamber and heated by the furnace body. In this way, the cleaning / drying process and heat treatment of the substrate are performed centrally in a closed decompression chamber, so there is no influence of the atmosphere during substrate processing, and the substrate processing quality is greatly improved. To do. Further, since the cleaning process with a plurality of chemicals and the cleaning process with pure water are performed in one cleaning chamber, the configuration of the device is simple and compact, and the cost is low.

According to the second aspect of the present invention, the nozzle column for jetting the chemical liquid and / or the pure water, which is erected in the cleaning chamber section, rotates and revolves around the substrate housed in the cleaning chamber section. As a result, the substrates housed in the cleaning chamber section are uniformly cleaned, and the cleaning efficiency can be improved. Further, after the cleaning of the substrate is completed, the inside of the cleaning chamber portion can be cleaned, and particles and reaction products attached to the inner wall and the like can be washed away.

According to the third aspect of the present invention, the substrate housing portion for housing the substrate provided in the cleaning chamber portion rotates.
As a result, the substrate can always come into contact with new chemical liquid / pure water without the chemical liquid / pure water remaining on the substrate, and the cleaning efficiency can be improved.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a schematic structure of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the substrate processing apparatus according to the embodiment of the present invention. First, the configuration of an embodiment of the present invention will be schematically described with reference to FIGS. 1 and 2.

The substrate processing apparatus 1 includes a mechanical interface 2 for receiving and holding a substrate carried in from another process (not shown), a decompression chamber 4 which can be sealed against the outside air, a mechanical interface 2 and a decompression. A transfer machine 3 for transferring the substrate between the chambers 4 is provided. The decompression chamber 4 includes a cleaning chamber section 41,
The film forming chamber unit 42 is included. The substrate is cleaned and dried in the cleaning chamber section 41, and the film forming chamber section 42 is
The substrate is heat-treated therein. The mechanical interface 2, the transfer machine 3 and the decompression chamber 4 are housed in a single housing 7, whereby a single device environment is realized as a whole. Doors 71 and 72 that can be opened and closed are provided at one end of the housing 7.

FIG. 3 is a perspective view showing a more detailed structure of the mechanical interface 2 and the transfer machine 3 shown in FIGS. In FIG. 3, the mechanical interface 2 includes a plurality of cassette stages 2 on which a plurality of substrates 8 which have not been cleaned and which have been carried in can be placed.
1, connecting rods 22 to 24 for connecting the cassette stages 21 in the vertical direction with a predetermined gap therebetween, and a motor (not shown) for rotating each cassette stage. In this embodiment, two sets of vertically connected cassette stages are provided as shown in FIG. 2 in order to increase the substrate storage capacity. The transfer machine 3 includes a lifting device 31, a lifting member 32, a rotation motor 33, and link members 34 and 35.
And an actuator 36 and a substrate hand 37.
One end of the link member 34 is connected to the rotation shaft of the rotation motor 33. A motor is built in near the other end of the link member 34, and the rotation shaft of this motor is connected to one end of the link member 35. A motor is built in near the other end of the link member 35, and the rotating shaft of this motor is connected to one end of an actuator 36. Therefore, the tip of the actuator 36 moves with extremely high degree of freedom by combining the joint movements of the three axes. The board hand 37 includes a plurality of tongue pieces for holding the board 8 therebetween. The actuator 36 has a built-in drive mechanism for driving the substrate hand 37. This drive mechanism includes a first drive mechanism for adjusting the distance of the board hand 37 protruding from the actuator 36 and a second drive mechanism for adjusting the distance between the tongues of the board hand 37. . One end of the elevating member 32 is connected to the elevating device 31, and the other end is connected to the rotation motor 33. When the lifting / lowering member 32 is lifted / lowered by the lifting / lowering device 31, the rotary motor 33, the link members 34, 35, the actuator 3 are integrated with the lifting / lowering device 31.
6 and the substrate hand 37 are moved up and down.

FIG. 4 is a perspective view showing the internal structure of the decompression chamber 4 shown in FIGS. 1 and 2. In FIG. 4, the lower half of the decompression chamber 4 is configured as the cleaning chamber section 41, and the upper half is configured as the film formation chamber section 42. The cleaning chamber unit 41 and the film forming chamber unit 42 communicate with each other inside, and the communicating portion (that is, the furnace opening of the film forming chamber unit 42) is opened and closed by the furnace opening gate valve 5. The furnace gate valve 5 has an opening / closing plate 51.
And a drive unit 52 for moving the opening / closing plate 51 in and out in the horizontal direction. The opening / closing plate 51 is pushed out by the driving unit 52, so that the furnace opening of the film forming chamber unit 42 is closed. Further, the opening / closing plate 51 is pulled into the inside by the driving unit 52, so that the furnace opening of the film forming chamber unit 42 is opened.

An inlet gate valve 401 which can be opened and closed by a door is provided in a portion of the cleaning chamber section 41 adjacent to the transfer machine 3. A turntable 403 rotatably supported by a motor 402 is provided at the center of the inside of the cleaning chamber portion 41. A heat insulating cylinder 404 and a substrate boat 405 are mounted on the turntable 403 so as to rotate integrally with the turntable 403. The substrate boat 405 stores a plurality of substrates 8 transferred from each cassette 9 by the transfer device 3. Further, inside the cleaning chamber portion 41, nozzles 406 and 407 are provided upright around the substrate boat 405. These nozzles 406 and 407 have a plurality of nozzle holes, and pure water, a chemical solution, and nitrogen gas (N
₂ ), vapor of IPA (isopropyl alcohol) is ejected. In addition, preferably, each nozzle 40
Reference numerals 6 and 407 are configured to revolve around the substrate boat 405 and to rotate themselves. Each nozzle 40
Discharge ports 408 for discharging unnecessary liquid or gas are provided in the lower portions of 6, 407.

A boat elevator 6 is provided adjacent to the cleaning chamber section 41. This boat elevator 6
Moves the lifting member 61 up and down in the vertical direction. The elevating member 61 penetrates the outer wall of the cleaning chamber section 41,
It extends inside and supports the motor 402, the turntable 403, the heat insulating cylinder 404, and the substrate boat 405. Therefore, the motor 402, the turntable 403, the heat insulating cylinder 404, and the substrate boat 405.
Will be moved up and down by the boat elevator 6. Although the cleaning chamber 41 is provided with a slide groove for moving up and down the lifting member 61,
The slide groove has a bellows-shaped flexible member 410.
Is provided. As a result, the slide groove is shielded and particles from the boat elevator 6 are prevented from entering.

A furnace body 421 containing a heater and the like is provided in the film forming chamber section 42. A furnace core tube 422 is provided inside the furnace body 421. When the substrate boat 405 is lifted by the boat elevator 6, the furnace core tube 422 receives the substrate boat 405. Furnace body 42
1 heats each substrate 8 stored in the furnace core tube 422 to a high temperature. As a result, a film is formed on the substrate 8. Further, the furnace body 421 is provided with an exhaust port 423 communicating with the core tube 422, and a pump (not shown) exhausts gas in the core tube 422 from the exhaust port 423.

FIG. 5 is a diagram schematically showing a liquid / gas supply / discharge system for the decompression chamber 4. In FIG. 5, the nozzle 406 includes solenoid valves 101 and 102.
Nitrogen gas N ₂ and pure water are respectively supplied via the. Further, the nozzle 407 has solenoid valves 103 and 1
Nitrogen gas N ₂ and IPA vapor are supplied via 04, respectively. Further, pure water or a mixed liquid of pure water and a chemical liquid is supplied to the nozzle 407 via the electromagnetic valve 105 and the mixing valve 106. Pure water is supplied to the mixing valve 106 via the electromagnetic valve 107, and different chemicals are supplied via the electromagnetic valves 108 to 111. Pure water and a chemical solution are mixed in the mixing valve 106. Further, by closing the solenoid valves 108 to 111 and opening the solenoid valve 107, only pure water is discharged from the nozzle 40.
7 is supplied.

FIG. 6 is a flow chart for explaining the operation of the above embodiment. Hereinafter, referring to FIG. 6,
The operation of this embodiment will be described. First, the cassette 9 accommodating a plurality of unwashed substrates 8 is carried in from another process (not shown) and placed on the cassette stage 21 (step S1). At this time, the doors 71 and 72 of the housing 7 and the inlet gate valve 401 of the decompression chamber 4 are opened, and the furnace port gate valve 5 is closed. When the loading of the cassette 21 is completed, the doors 71 and 72 are closed, and the substrates 8 stored in the cassettes 9 are transferred by the transfer device 3 to the substrate boat 405 in the cleaning chamber section 41 (step S2). . At this time, the transfer machine 3 simultaneously grips the plurality of substrates 8 with the substrate hand 37, and the substrate boat 4
Store in 05. Next, the inlet gate valve 401 of the cleaning chamber section 41 is closed (step S3). As a result, the decompression chamber 4 is in a closed state. Next, the solenoid valves 101 and 103 of FIG. 5 are opened, and the other solenoid valves are closed, so that the nozzles 406 and 40 are closed.
Nitrogen gas is introduced into the cleaning chamber section 41 from 7 (step S4). Accordingly, the cleaning chamber unit 41
The air remaining inside is exhausted through the outlet 408 and replaced with nitrogen gas. Since nitrogen gas is inert, an undesired chemical reaction does not occur during various subsequent treatments.

Next, a cleaning process with a chemical solution and a cleaning process with pure water are alternately performed (step S5). The cleaning process is performed by opening any of the solenoid valves 105 and 108-111 and closing the other solenoid valves. As a result, the chemical liquid is supplied to the nozzle 407, and the chemical liquid is ejected from the nozzle 407 into the cleaning chamber portion 41. Further, the solenoid valve 107 is also opened if necessary. As a result, the chemical liquid diluted with pure water is ejected from the nozzle 407 into the cleaning chamber portion 41. The washing process is performed by opening the solenoid valves 102, 105 and 107 and closing the other solenoid valves. As a result, pure water is ejected from the nozzles 406 and 407 into the cleaning chamber section 41. It should be noted that the substrate boat 405 that accommodates the substrate 8
Since it rotates integrally with the turntable 404, the chemical liquid / pure water does not remain on the substrate, and the substrate 8 can always come into contact with a new chemical liquid / pure water, so that the cleaning efficiency can be improved. Further, at this time, the chemical liquid / pure water is discharged from the nozzle 407, and the nitrogen gas (N
_By jetting ₂ ) respectively, the substrate 8 can always come into contact with a new chemical liquid / pure water, and the cleaning efficiency can be further improved. During the cleaning process and the water cleaning process, the nozzles 406 and 407 are connected to the substrate boat 405.
Orbit around. As a result, each substrate 8 is thoroughly cleaned and cleaning efficiency can be improved.

When the final rinsing process of each substrate 8 is completed, the rinsing process of the cleaning chamber section 41 itself is performed (step S6). This is because undesired particles and reaction products may adhere to the inner wall of the cleaning chamber 41 during the cleaning process with the chemical solution, which may adversely affect the substrate 8. The washing process of the washing chamber section 41 is performed by the solenoid valves 102, 10
This is done by opening 5 and 107 and closing the other solenoid valves. At this time, the nozzles 406 and 40
7 revolves around the substrate boat 405, and also rotates itself. As a result, the cleaning chamber section 41 can be efficiently cleaned.

Next, by opening the solenoid valve 104 and closing the other solenoid valves, the vapor of IPA is introduced from the nozzle 407 into the cleaning chamber section 41 (step S).
7). Further, at this time, the substrate boat 405 is connected to the motor 40.
Rotated by 3. On the surface of each substrate 8, water droplets are replaced with the vapor of IPA. That is, IPA
Since the surface tension of the water droplet attached to the substrate surface is reduced, the water droplet is easily shaken off from the substrate surface by the centrifugal force. Next, the inside of the cleaning chamber 41 is evacuated and decompressed by an exhaust device (not shown) connected to the discharge port 408 (step S8). As a result, the boiling point of the IPA vapor in the cleaning chamber section 41 is lowered, the IPA replaced with pure water on the substrate surface is quickly evaporated, and the substrate surface is dried in a short time. In addition, if it is water-soluble and has the property of reducing the surface tension of water droplets remaining on the substrate,
Instead of IPA vapor, vapor of other organic solvent may be used. Instead of such an organic solvent vapor, heated water vapor may be sprayed to dry the substrate surface.

When the substrate 8 is dried, the solenoid valves 101 and 103 of FIG. 5 are opened and the other solenoid valves are closed, so that nitrogen gas is introduced from the nozzles 406 and 407 into the cleaning chamber section 41. (Step S
9). As a result, the IPA vapor remaining in the cleaning chamber section 41 is quickly exhausted and replaced with nitrogen gas. Next, the interior of the cleaning chamber 41 is decompressed again by an exhaust device (not shown) (step S10). Next, the furnace gate valve 5 is opened to communicate with the depressurized film forming chamber section 42 (step S11).

Next, the substrate boat 405 is raised by the boat elevator 6 (step S12). As a result, the substrate boat 405 accommodating the substrate 8 is accommodated in the furnace core tube 422 of the film forming chamber section 42. Further, the inlet (furnace port) of the film forming chamber portion 42 is closed by the heat insulating cylinder 503 that rises together with the substrate boat 405. This prevents the high temperature atmosphere in the film forming chamber section 42 from falling into the cleaning chamber section 41. Next, the furnace body 42
The inside of the furnace core tube 422 is heated by 1 so that a film is formed on the surface of the substrate 8 (step S13).
When the film formation on the substrate is completed, the substrate boat 405 is lowered by the boat elevator 6 (step S1).
4). Next, the furnace gate valve 5 is closed (step S15).

Next, the solenoid valves 101 and 103 are opened and the other solenoid valves are closed, so that the nozzle 4 is closed.
Nitrogen gas is introduced into the decompression chamber 4 from 06 and 407, and the inside of the cleaning chamber portion 41 is returned to the atmospheric pressure (step S16). Next, the inlet gate valve 401 of the cleaning chamber section 41 is opened (step S17). next,
The transfer device 3 transfers each substrate 8 stored in the substrate boat 405 to the cassette 9 on the cassette stage 22 (step S18). Next, the doors 71 and 72 of the housing 7 are opened, and the cassette 9 is carried out (step S
19).

As described above, in the above-described embodiment, since the cleaning and drying of the substrate to the heat treatment are performed in the closed space (pressure reducing chamber 4) in the apparatus,
It is not affected by the atmosphere during processing. Therefore, the processing quality of the substrate can be significantly improved.
Therefore, the yield of products can be improved and the manufacturing cost can be reduced. Further, since the cleaning chamber section and the film forming chamber section are integrally configured, and the cleaning processing with a plurality of chemicals and the cleaning processing with pure water are performed in the cleaning chamber section, the in-line type of FIG. The configuration of the device is simpler and cheaper than that of.

[0032]

According to the invention of claim 1, cleaning of the substrate
Since the drying process and the heat treatment are centrally performed in a closed decompression chamber, there is no influence of the atmosphere during the processing of the substrate, and the processing quality of the substrate can be significantly improved. Further, since the cleaning process with a plurality of chemicals and the cleaning process with pure water are performed in one cleaning chamber section,
The configuration of the device can be simplified and downsized, and the cost can be reduced.

According to the second aspect of the present invention, the nozzle column for jetting the chemical liquid and / or pure water, which is erected in the cleaning chamber section, is rotated and revolves around the substrate housed in the cleaning chamber section. Since this is done, the substrates housed in the cleaning chamber section can be thoroughly cleaned and the cleaning efficiency can be improved. Moreover, since the inside of the cleaning chamber can be cleaned after the completion of cleaning of the substrate, it is possible to prevent particles and reaction products adhering to the inner wall of the cleaning chamber from being washed away and adversely affecting the substrate.

According to the third aspect of the present invention, the substrate housing portion for housing the substrate provided in the cleaning chamber portion rotates.
As a result, the substrate can always come into contact with new chemical liquid / pure water without the chemical liquid / pure water remaining on the substrate, and the cleaning efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention.

3 is a perspective view showing a more detailed structure of the mechanical interface 2 and the transfer machine 3 shown in FIGS. 1 and 2. FIG.

FIG. 4 is a perspective view showing an internal configuration of the decompression chamber 4 shown in FIGS. 1 and 2.

5 is a diagram schematically showing a liquid / gas supply / discharge system for the decompression chamber 4. FIG.

FIG. 6 is a flowchart for explaining the operation of the embodiment shown in FIGS.

FIG. 7 is a plan layout diagram showing an example of a configuration of a conventional substrate processing system.

FIG. 8 is a plan layout diagram showing another example of the configuration of the conventional substrate processing system.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus 2 ... Mechanical interface 3 ... Transfer machine 4 ... Decompression chamber 41 ... Cleaning chamber part 42 ... Deposition chamber part 5 ... Furnace gate valve 6 ... Boat elevator 7 ... Housing 8 ... Substrate 9 ... Cassette 21 ... cassette stage 401 ... inlet gate valve 406, 407 ... nozzle 421 ... furnace body

Claims (3)

[Claims] 1. A substrate processing apparatus which performs a cleaning / drying process and a heat treatment of a substrate in a sealed space, wherein the substrate receiving unit receives and holds a substrate loaded from another process, said sealing. A decompression chamber that forms a defined space, and a transfer machine that transfers the substrate between the substrate receiving section and the decompression chamber, wherein the decompression chamber is transferred from the substrate receiving section by the transfer machine. A cleaning chamber portion for accommodating the mounted substrate and performing a cleaning treatment with a chemical solution, a rinsing treatment with pure water, and a drying treatment, and the cleaning chamber portion are provided above the cleaning chamber and heat the substrate therein. A film forming chamber part having a furnace body; and an opening / closing mechanism for opening and closing a communication port between the cleaning chamber part and the film forming chamber part. Further comprising elevating means for elevating said substrate between parts, the substrate processing apparatus. 2. The cleaning chamber further comprises one or more nozzle columns that stand upright in the cleaning chamber part and eject the chemical liquid and / or pure water supplied from the outside of the decompression chamber into the cleaning chamber part. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus rotates on its own axis and revolves around the substrate housed in the cleaning chamber section. 3. The substrate accommodating portion for accommodating the substrate, the substrate accommodating portion being provided in the cleaning chamber portion, wherein the substrate accommodating portion rotates by itself. Substrate processing equipment.