JP2004283803A - Substrate treating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus capable of securely drying a substrate when drying the substrate after the substrate is treated with chemicals and pure water. <P>SOLUTION: The substrate treating apparatus is constituted of having a chemical treating section 10 in which the substrate W is treated by using the chemicals, a pure water and dry treating section 12 in which the substrate W after being treated with the chemicals is treated by using pure water and also the substrate W after being treated with pure water is treated with first drying, a dry treating section 14 in which the substrate W after being treated in the pure water and in dry treating section 12 is treated with secondary drying, and a substrate transfer apparatus 98 with which the substrate W is transferred from the chemical treating section 10 to the pure water and dry treating section 12 and also the substrate W is transferred from the pure water and dry treating section 12 to the dry treating section 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, an electronic component, and a printed circuit board with a chemical solution, cleaning the substrate with pure water, and then drying the substrate.
[0002]
[Prior art]
For example, in a semiconductor device manufacturing process, before heat treatment such as oxidation treatment or CVD treatment is performed on a substrate such as a silicon wafer, particles, organic substances, metal contaminants, etc. attached to the surface of the substrate are removed from the substrate surface. Next, the substrate is subjected to a cleaning process. The cleaning process includes a chemical cleaning step of cleaning the substrate using a chemical, a water cleaning step of cleaning the substrate after the chemical cleaning using pure water, and a drying step of drying the substrate after the water cleaning.
[0003]
The substrate processing apparatus that performs each of the above-described processes includes, for example, one or more chemical cleaning tanks that perform a predetermined cleaning process on a substrate by storing a predetermined cleaning chemical and immersing the substrate in the chemical. One or more pure water cleaning tanks containing pure water, immersing the substrate in the pure water and washing the substrate with pure water, a final rinse tank for finally rinsing the substrate using pure water, A drying section for drying the surface of the substrate that has been finally rinsed, a loader for holding a cassette that is adjacent to the first chemical solution cleaning tank and contains a plurality of substrates before cleaning and that has been carried in, and a drying process. Unloader, loader, chemical solution washing tank, pure water washing tank, final rinsing tank, final rinsing tank, drying section, and unloader, which are placed adjacent to the section and accommodate the cassette containing the substrate after the cleaning and drying processing, and carrying out the cassette. Group between each Substrate conveying robot for conveying the, and a like cassette tracks for transferring the empty cassettes from the loader to the unloader. In each of the chemical cleaning tanks, for example, a mixed solution of ammonia water and hydrogen peroxide solution, a mixed solution of hydrofluoric acid, hydrochloric acid and hydrogen peroxide solution, and the like are stored. In addition, as a substrate drying processing apparatus installed in the drying processing unit, a spin dryer that shakes off pure water from the surface of the substrate by centrifugal force to dry the substrate, or an organic solvent such as isopropyl alcohol that removes the pure water attached to the substrate surface. For example, an organic solvent vapor drying device for drying by replacing with steam is used (see, for example, Patent Document 1).
[0004]
[Patent Document 1]
JP-A-8-203858 (page 2, FIG. 7)
[0005]
[Problems to be solved by the invention]
As described above, the substrate that has been subjected to the cleaning with the chemical solution and the cleaning and rinsing processing with the pure water is dried in the drying processing unit, and then transported to the substrate processing unit such as the heat treatment unit. . However, there is a case where it is not possible to sufficiently dry even an extremely fine portion of the substrate by the conventional drying processing unit. In addition, drying may be insufficient even when a hygroscopic film is formed on the surface of the substrate. If the substrate is subjected to a treatment such as a heat treatment while the drying is insufficient, the treatment quality may be affected.
[0006]
The present invention has been made in view of the above circumstances, and after a substrate is treated with a chemical solution and treated with pure water, when the substrate is dried, complete drying of the substrate can be realized. It is an object to provide a substrate processing apparatus.
[0007]
[Means for Solving the Problems]
The invention according to claim 1 is a substrate processing apparatus for performing a predetermined process on a substrate, wherein a chemical solution processing unit that processes the substrate using a chemical solution, and a substrate that has been processed in the chemical solution processing unit using pure water. A pure water / drying treatment unit for primary drying the substrate after treatment with pure water, a drying treatment unit for secondary drying the treated substrate in the pure water / drying treatment unit, and the chemical treatment unit And a transport unit that transports the substrate from the pure water / dry processing unit to the dry processing unit while transporting the substrate from the pure water / dry processing unit to the pure water / dry processing unit.
[0008]
According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the drying processing unit includes a process chamber capable of housing a substrate, a heating unit configured to heat the inside of the processing chamber, and the processing unit. And a pressure reducing means for reducing the pressure in the chamber.
[0009]
According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the chemical processing section includes a chemical processing tank for storing a chemical, and the pure water / dry processing section includes pure water. A pure water treatment tank for storing the organic solvent, and an organic solvent supply means for supplying an organic solvent to the substrate, wherein the transport means includes a first elevating means for elevating the substrate between the inside and the outside of the chemical solution treatment tank A second elevating means for elevating and lowering the substrate between the inside and the outside of the pure water treatment tank, wherein in the pure water / drying processing section, the second elevating means moves the pure water in the pure water treatment tank. The method is characterized in that the substrate is pulled up from the inside, an organic solvent is supplied from the organic solvent supply means to the substrate after the treatment with pure water, and the substrate is primarily dried.
[0010]
The invention according to claim 4 is a substrate processing apparatus for performing a predetermined process on a substrate, wherein a chemical solution processing unit for processing the substrate using a chemical solution, and a substrate after the processing in the chemical solution processing unit using pure water. Water treatment unit, a first drying treatment unit for temporarily drying the substrate after the treatment in the pure water treatment unit, and a second drying treatment for secondary drying the substrate after the treatment in the first drying treatment unit And a transport unit for transporting the substrate between each of the chemical processing unit, the pure water processing unit, the first drying processing unit, and the second drying processing unit.
[0011]
According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the second drying section includes a process chamber capable of housing a substrate, and a heating unit configured to heat the inside of the process chamber; And a pressure reducing means for reducing the pressure in the processing chamber.
[0012]
According to a sixth aspect of the present invention, in the substrate processing apparatus according to the fourth or fifth aspect, the chemical processing section includes a chemical processing tank for storing a chemical, and the pure water processing section stores the pure water. A first pure water treatment tank, wherein the first drying section includes a support means for supporting the substrate, and a rotation drive means for rotating the support means at a high speed, and the transfer means includes an inside of the chemical solution treatment tank. And a second elevating means for elevating the substrate between the inside and the outside of the pure water treatment tank.
[0013]
In the substrate processing apparatus according to the first aspect of the present invention, the substrate is processed with the chemical in the chemical processing section, the substrate is processed with the pure water in the pure water / drying processing section, and the primary drying of the substrate is performed. After that, the substrate is subjected to a secondary drying process in the drying processing unit. As described above, the substrate is completely dried after being subjected to the primary drying and then the secondary drying.
[0014]
In the substrate processing apparatus according to the second aspect of the present invention, in the drying processing section, the inside of the processing chamber in which the substrate is accommodated is heated by the heating means, and the inside of the processing chamber is depressurized by the decompression means. These heating and depressurization ensure that the substrate is completely dried.
[0015]
In the substrate processing apparatus according to the third aspect of the present invention, in the chemical processing section, the substrate is immersed in the chemical stored in the chemical processing tank to perform the chemical processing of the substrate, and in the pure water / drying processing section. By washing the substrate with water by immersing the substrate in pure water stored in a pure water treatment tank, the organic solvent vapor and mist are supplied to the substrate from the organic solvent supply means. Then, the pure water attached to the surface of the substrate is replaced with the organic solvent, and the substrate is dried. At this time, the substrate is lifted from the pure water in the pure water treatment tank by the second lifting / lowering means, and an organic solvent is supplied to the substrate during or after the lifting to perform primary drying of the substrate. Is
[0016]
In the substrate processing apparatus according to the fourth aspect of the present invention, the processing of the substrate with the chemical is performed in the chemical processing section, the processing of the substrate with the pure water is performed in the pure water processing section, and the primary processing of the substrate is performed in the first drying processing section. After the drying process is performed, a second drying process is performed on the substrate in the second drying processing unit. As described above, the substrate is completely dried after being subjected to the primary drying and then the secondary drying.
[0017]
In the substrate processing apparatus according to a fifth aspect of the present invention, in the second drying section, the inside of the processing chamber in which the substrate is accommodated is heated by the heating means, and the inside of the processing chamber is depressurized by the pressure reducing means. These heating and depressurization ensure that the substrate is completely dried.
[0018]
In the substrate processing apparatus of the invention according to claim 6, in the chemical processing section, the substrate is immersed in the chemical stored in the chemical processing tank to perform the chemical processing of the substrate. The substrate is immersed in pure water stored in the water treatment tank, so that the substrate is washed with water. In the first drying unit, the supporting unit is rotated at high speed by the rotation driving unit. Pure water is shaken off by centrifugal force from the surface of the substrate supported by the means to perform a primary drying process on the substrate.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0020]
FIG. 1 is a schematic configuration diagram of a substrate processing apparatus showing an example of an embodiment of the present invention. The substrate processing apparatus includes a chemical processing section 10, a pure water / dry processing section 12, and a drying processing section 14.
[0021]
The chemical processing section 10 includes two one-bath type chemical processing tanks 16 (hereinafter, referred to as “one bath processing tank 16”) and two heated chemical processing tanks 18 (hereinafter, referred to as “chemical processing tank 18”). The tank 16 and the chemical treatment tank 18 are alternately connected.
[0022]
As shown in FIG. 2, the one-bath processing tank 16 has a liquid supply port 20 formed at the lower part thereof, and an overflow liquid receiving part 22 into which the liquid overflowing from the upper part is provided. I have. A liquid supply pipe 24 is connected to and connected to the liquid supply port 20 at the lower part of the one bath processing tank 16, and the liquid supply pipe 24 is connected to a liquid outlet of a mixing valve 26. The mixing valve 26 is connected to a pure water supply pipe 28 connected to a pure water supply source, and chemical liquid supply pipes 30a to 30e respectively connected to chemical liquid supply tanks (not shown) of the chemical liquids A to E. ing. Open / close control valves 32 and 34 are provided on the pure water supply pipe 28 and the chemical liquid supply pipes 30a to 30e, respectively, and a flow control valve 36 is further provided on the pure water supply pipe 28. Have been. When all of the opening / closing control valves 34 interposed in the respective chemical liquid supply pipes 30a to 30e are closed with the opening / closing control valve 32 opened, the one-bath processing tank 16 passes through the liquid supply pipe 24 from the liquid outlet of the mixing valve 26. Pure water is supplied inside. When two or more of the open / close control valves 34 inserted into the respective chemical supply pipes 30a to 30e are opened with the open / close control valve 32 kept open, the mixing valve 26 converts the chemical into pure water. A mixed solution prepared by mixing two or more of the chemical liquids A to E to a constant concentration is supplied from the liquid outlet of the mixing valve 26 to the one bath processing tank 16 through the liquid supply pipe 24. I have.
[0023]
On the other hand, a liquid supply port 38 is formed in the lower part of the chemical solution treatment tank 18, and an overflow liquid receiving part 40 into which the liquid overflowing from the upper part flows is provided. The inside of the chemical treatment tank 18 is always filled with a chemical, for example, caloic acid at a temperature of 80 ° C. to 150 ° C. One end of a chemical liquid circulating pipe 42 is connected to and connected to the bottom of the overflow liquid receiving part 40, and the other end of the chemical liquid circulating pipe 42 is connected to a liquid supply port 38 of the chemical liquid processing tank 18. It is connected. The chemical liquid circulation pipe 42 is provided with a circulation pump 44, a heater 46, and a filter 48, respectively. The chemical liquid flowing out of the overflow liquid receiving portion 40 is heated to a predetermined temperature by the heater 46 when flowing through the chemical liquid circulation pipe 42, and the chemical liquid always heated to the predetermined temperature is supplied from the chemical liquid circulation pipe 42. It is configured to flow into the chemical treatment tank 18 through the port 38.
[0024]
The chemical processing section 10 includes a lifter 50 having a plurality of guides formed at a lower end thereof for supporting a plurality of substrates W side by side in an upright posture. The lifter 50 is moved up and down by a drive mechanism (not shown) between the inside of the one-bath processing tank 16 and a position immediately above the same, and between the inside of the chemical solution processing tank 18 and a position directly above the same. It can be reciprocated between the position directly above 16 and the position directly above the chemical treatment tank 18.
[0025]
The pure water / drying processing unit 12 includes a one-bath processing tank 52 (hereinafter, referred to as “processing tank 52”). The processing tank 52 is housed in a processing chamber 54 that can carry in and carry out the substrate W by opening and closing the lid 56 and that can be sealed. A lifter 58 for receiving the substrate W carried into the processing chamber 54, inserting it into the processing tank 52, and taking out the processed substrate W from the processing tank 52 is provided inside the processing chamber 54. Have been. A gas-liquid outlet 60 is formed at the bottom of the processing chamber 54. Although not shown, a gas-liquid discharge pipe is connected to and connected to the gas-liquid discharge port 60. The gas-liquid discharge pipe has a drain pipe with an open / close control valve interposed, and an open / close control valve. Exhaust pipes interposed and connected to the vacuum pump communicate with each other. The pressure inside the processing chamber 52 is reduced by driving a vacuum pump.
[0026]
The processing tank 52 has a liquid supply port 62 formed at the lower part thereof, and an overflow liquid receiving part 64 into which the liquid overflowing from the upper part flows. A liquid supply pipe 66 is connected to and connected to a liquid supply port 62 at a lower portion of the processing tank 52, and the liquid supply pipe 66 is connected to a liquid outlet of a mixing valve 68. The mixing valve 68 is connected to a pure water supply pipe 70 connected to a pure water supply source, and chemical liquid supply pipes 72a and 72b respectively connected to chemical liquid supply tanks (not shown) for the chemical liquid A and the chemical liquid B. ing. Open / close control valves 74 and 76 are provided in the pure water supply pipe 70 and the chemical liquid supply pipes 72a and 72b, respectively, and a flow rate adjustment valve 78 is further provided in the pure water supply pipe 70. Have been. When the open / close control valve 74 inserted in the chemical supply pipes 72a and 72b is closed with the open / close control valve 74 opened, the pure liquid enters the processing tank 52 through the liquid supply pipe 66 from the liquid outlet of the mixing valve 68. Water is supplied. When the opening / closing control valve 76 inserted in each of the chemical supply pipes 72a and 72b is opened with the opening / closing control valve 74 kept open, the chemical A and the chemical B are mixed with the pure water by the mixing valve 26. The mixed solution adjusted to a constant concentration is supplied from the liquid outlet of the mixing valve 68 into the processing tank 52 through the liquid supply pipe 66.
[0027]
Further, inside the processing chamber 54, a steam supply nozzle 80 is provided, and a steam supply pipe 82 is connected to the steam supply nozzle 80 in communication therewith. The steam supply pipe 82 is connected to an organic solvent vapor, for example, isopropyl. The flow path is connected to a vapor supply source of alcohol (IPA). Then, IPA vapor is supplied from the vapor supply nozzle 80 into the processing chamber 54. In addition, a two-fluid nozzle is installed in place of the vapor supply nozzle 80, and the two-fluid nozzle has a liquid supply pipe connected to an IPA supply source and a gas supply pipe connected to a supply source of an inert gas such as nitrogen gas. The tubes may be connected to each other, and a droplet (mist) of IPA may be supplied into the processing chamber 54 from the two-fluid nozzle.
[0028]
The drying processing section 14 includes a drying processing chamber 84 that can carry in and carry out the substrate W by opening and closing the lid 86 and that can seal the substrate W. Inside the drying processing chamber 84, a holder 88 for holding the substrate W is provided. Further, the drying processing chamber 84 is provided with a heater 90 for heating the inside thereof to increase the temperature of the substrate W. Further, an exhaust port 92 is provided in the drying processing chamber 84, and an exhaust pipe 94 communicates with the exhaust port 92. A vacuum pump 96 is connected to the exhaust pipe 94, and the inside of the drying processing chamber 84 can be depressurized by driving the vacuum pump 96.
[0029]
Although the detailed mechanism of the substrate processing apparatus is omitted in the drawing, one set of one bath processing tank 16 and one set of one bath processing tank 16 and another set of one Between the tank 18, between the chemical processing section 10 and the pure water / drying section 12, between the pure water / drying section 12 and the drying section 14, and in the pure water / drying section 12. Between the outside and inside of the processing chamber 54, and between the outside and inside of the drying processing chamber 84 in the drying processing unit 14, a substrate transfer device 98 (FIG. 1 shows a chemical processing unit). Only the substrate transport device 98 that transports the substrate W between the substrate 10 and the pure water / drying processing unit 12 is shown).
[0030]
In the substrate processing apparatus having the above configuration, a series of processing on the substrate is performed as follows. When a substrate is transferred by a substrate transfer robot from a substrate processing apparatus (not shown) at a preceding stage, first, a chemical solution processing unit 10 performs a process using a chemical solution on the substrate W transferred to the lifter 50. That is, the substrate W is cleaned by being immersed in a mixed solution of the respective chemicals stored in the one bath processing tank 16, and is immersed in the heating chemical stored in the chemical bath 18. The cleaning process is performed. Further, the substrate W is rinsed by being immersed in pure water stored in the one bath processing tank 16. Then, the substrate W that has been finally washed is transferred from the lifter 50 to the substrate transport device, and transported from the chemical solution processing unit 10 to the pure water / dry processing unit 12 by the substrate transport device.
[0031]
In the pure water / drying processing unit 12, the substrate W is carried into the processing chamber 54 by the substrate transfer device 98 and transferred to the lifter 58, and the processing of the substrate W is performed in a state where the processing chamber 54 is sealed. That is, if necessary, the substrate W is washed by being immersed in a mixed solution of the chemicals stored in the processing tank 52, and the substrate W is immersed in pure water stored in the processing tank 52. It is washed with water. Then, finally, the substrate W is immersed in pure water stored in the processing tank 52, and the substrate W is subjected to a rinsing process. When the final rinsing process is completed, the substrate W is pulled up from the pure water stored in the processing tank 52. At this time, IPA vapor is ejected from the vapor supply nozzle 80 into the processing chamber 54, and the IPA vapor is supplied to the substrate W during or after being lifted from the pure water in the processing bath 52. When the IPA vapor is supplied to the substrate W, the pure water attached to the surface of the substrate W is replaced by the IPA. When the withdrawal of the substrate W from the pure water in the processing tank 52 is completed and the surface of the substrate W is completely replaced by the IPA, the inside of the processing chamber 54 is evacuated, and the pressure in the processing chamber 54 is reduced. Is done. Thus, the IPA condensed on the surface of the substrate W is quickly evaporated and removed from the substrate W, and the substrate W is dried. The substrate W that has been subjected to the primary drying process in this way is carried out of the processing chamber 54, and is transported by the substrate transport device 98 from the pure water / drying processing unit 12 to the drying processing unit 14.
[0032]
In the drying processing section 14, the substrate W is carried into the drying processing chamber 84 by the substrate transfer device 98 and transferred to the holder 88, and thereafter the drying processing chamber 84 is sealed. Then, electric power is supplied to the heater 90, and the inside of the drying processing chamber 84 is heated by the heater 90, and the vacuum pump 96 is driven to evacuate the inside of the drying processing chamber 84. The pressure is reduced. The substrate W is subjected to a secondary drying process by these heating and pressure reduction. As described above, in this substrate processing apparatus, the substrate W is subjected to the primary drying process in the pure water / drying processing unit 12 and then the secondary drying process in the drying processing unit 14. Therefore, the substrate W is completely dried.
[0033]
Next, FIG. 3 is a schematic configuration diagram of a substrate processing apparatus showing an example of another embodiment of the present invention. The substrate processing apparatus includes a chemical processing section 100, a pure water processing section 102, a first drying processing section 104, and a second drying processing section 106.
[0034]
The chemical processing section 100 includes a chemical processing tank 108 for storing a cleaning chemical. The substrate W is cleaned by being immersed in the chemical stored in the chemical processing tank 108. Further, the pure water treatment section 102 includes a pure water treatment tank 110 for storing pure water. The substrate W is washed by being immersed in pure water stored in the pure water treatment tank 110. The configurations of the chemical solution treatment tank 108 and the pure water treatment tank 110 are similar to those of the one bath treatment tank 16 in the substrate processing apparatus shown in FIGS. 1 and 2, and a detailed description thereof will be omitted. In addition, the chemical processing unit 100 and the pure water processing unit 102 include lifters 112 and 114 each having a plurality of guides formed at a lower end thereof for supporting a plurality of substrates W in parallel and in an upright posture. I have. The lifters 112 and 114 are moved up and down by a drive mechanism (not shown) between the inside of the chemical solution treatment tank 108 and a position directly above the same, and between the inside of the pure water treatment tank 110 and a position directly above the same.
[0035]
The first drying unit 104 includes a chamber 116. Inside the chamber 116, a spin dryer provided with a support 118 for supporting a plurality of substrates W in parallel and in a vertical posture, and a rotation drive mechanism 120 for rotating the support 118 at high speed around a horizontal axis. Is provided. By driving the spin dryer, the substrate W supported by the support 118 is rotated at high speed. Pure water is shaken off from the surface of the substrate W by the centrifugal force at that time, and the substrate W is dried.
[0036]
The second drying unit 106 can carry in and carry out the substrate W by opening and closing the lid 124 as well as the drying unit 14 in the substrate processing apparatus shown in FIG. A certain drying processing chamber 122 is provided. Inside the drying processing chamber 122, a holder 126 for holding the substrate W is provided, and a heater 128 is provided. Further, an exhaust port 130 is provided in the drying processing chamber 122, an exhaust pipe 132 communicates with the exhaust port 130, and a vacuum pump 134 is connected to the exhaust pipe 132. Then, electric power is supplied to the heater 128, and the inside of the drying processing chamber 122 is heated by the heater 128, and the vacuum pump 134 is driven to evacuate the inside of the drying processing chamber 122 to reduce the pressure inside the drying processing chamber 122. It can be in a state. The substrate W is dried by these heating and pressure reduction.
[0037]
Further, although detailed illustration of the mechanism is omitted in this substrate processing apparatus, the substrate processing apparatus includes a section between the chemical processing section 100 and the pure water processing section 102, a section between the pure water processing section 102 and the first drying processing section 104, And, between the first drying processing unit 104 and the second drying processing unit 106, between the outside and the inside of the chamber 116 in the first drying processing unit 104, and in the drying processing chamber in the second drying processing unit 106 Between the outside and the inside of the substrate 122, a substrate transfer device 136 (in FIG. 3, between the chemical solution treatment unit 100 and the pure water treatment unit 102, and between the pure water treatment unit 102 and the first water treatment unit 102). (Only the substrate transport device 136 that transports the substrate W to and from the drying processing unit 104 is shown).
[0038]
The substrate transfer device 136 includes a pair of chucks 138, 138. The chuck 138 is formed of an elongated plate-like body extending in a direction perpendicular to the paper surface, and is supported in a cantilever manner via a horizontal support shaft 140 along the longitudinal direction. The pair of chucks 138 and 138 rotate symmetrically with each other by rotating the horizontal support shaft 140 by a rotation drive mechanism (not shown) connected to the horizontal support shaft 140. The chuck 138 has a plurality of substrate alignment holding grooves 142a and 142b each having a groove bottom formed in an arc shape along the peripheral shape of the substrate W on one of the one surface and the other one surface, and the plurality of substrate alignment holding grooves 142a and 142b are parallel to each other at a constant pitch. It is formed in parallel in the direction. The substrate alignment / holding groove 142a on one side and the substrate alignment / holding groove 142b on the other side are formed at diagonal positions. The pair of chucks 138 and 138 are moved between the chemical processing unit 100 and the pure water processing unit 102 by a horizontal moving mechanism (not shown) that holds a rotary drive mechanism connected to the horizontal support shaft 140, and The water treatment unit 102 and the first drying treatment unit 104 can be reciprocated in the horizontal direction.
[0039]
In the substrate transfer apparatus 136 including the pair of chucks 138 and 138 having the above-described configuration, when transferring the substrate W after the cleaning with the chemical in the chemical processing section 100 from the chemical processing section 100 to the pure water processing section 102, The substrate W is transferred from the lifter 112 to the chuck 138 by rotating the pair of chucks 138 and 138 to close the lower half from the open state. At this time, the chuck 138 holds the substrate W in the substrate alignment holding groove 142a on one side. Then, the substrate W is transferred from the chuck 138 to the lifter 114 by moving the chuck 138 to the pure water processing unit 102 and rotating the pair of chucks 138 and 138 to expand the lower half. When transporting the substrate W, which has been washed in the pure water processing unit 102, from the pure water processing unit 102 to the first dry pure water processing unit 104, the pair of chucks 138, 138 are rotated to lower each of them. By closing the half from the open state, the substrate W is transferred from the lifter 114 to the chuck 138. At this time, the chuck 138 holds the substrate W in the substrate alignment holding groove 142b on the other one side, and moves to the first drying processing unit 104. As described above, the substrate W after the chemical treatment and the substrate W after the rinsing process are held by the separate substrate alignment holding grooves 142a and 142b, so that the chemical solution adheres to the substrate W after the rinsing process via the chuck 138. Can be eliminated.
[0040]
In the substrate processing apparatus having the configuration shown in FIG. 3 as well, the substrate W washed with a chemical in the chemical processing section 100 and washed with water in the pure water processing section 102 is subjected to primary drying processing in the first drying processing section 104. Thereafter, the second drying processing unit 106 further performs a secondary drying processing. Therefore, the substrate W is completely dried.
[0041]
FIG. 4 is a partial schematic configuration diagram showing a modification of the substrate processing apparatus shown in FIG. In FIG. 4, the illustration of the chemical solution treatment section and the pure water treatment section is omitted. Further, the configuration of the first drying processing unit 104 is the same as that of the apparatus shown in FIG. 3, and the same reference numerals as in FIG.
[0042]
The second drying section 136 of the substrate processing apparatus is configured by adding a front chamber 146 to a drying chamber 144. The front chamber 146 can carry in and carry out the substrate W by opening and closing the lid 148, and can be sealed. Inside the front chamber 146, a holder 150 for holding the substrate W is provided. An exhaust port 152 is provided in the front chamber 146, an exhaust pipe 154 communicates with the exhaust port 152, and a vacuum pump 156 is connected to the exhaust pipe 154. Then, the vacuum pump 156 is driven to evacuate the inside of the front chamber 146 to reduce the pressure inside the front chamber 146.
[0043]
The front chamber 146 and the drying processing chamber 144 communicate with each other through a communication path having a shutter 158, and the opening and closing of the shutter 158 allows the substrate W to be taken in and out between the front chamber 146 and the drying processing chamber 144. Can be performed. Further, by closing the shutter 158, the drying processing chamber 144 can be sealed. Inside the drying processing chamber 144, a holder 160 for holding the substrate W is provided, and a heater 162 is installed, similarly to the drying processing chamber 122 of the substrate processing apparatus shown in FIG. . Further, an exhaust port 164 is provided in the drying processing chamber 144, an exhaust pipe 166 communicates with the exhaust port 164, and a vacuum pump 168 is connected to the exhaust pipe 166. Then, power is supplied to the heater 162, and the inside of the drying chamber 144 is heated by the heater 162, and the vacuum pump 168 is driven to evacuate the inside of the drying chamber 144 to reduce the pressure inside the drying chamber 144. It can be in a state. The substrate W is dried by these heating and pressure reduction.
[0044]
In the apparatus having the configuration shown in FIG. 4, the shutter 158 is always closed when the cover 148 of the front chamber 146 is opened, and the inside of the front chamber 146 is always kept in a reduced pressure state when the shutter 158 is opened. The inside of the processing chamber 144 is always kept under reduced pressure. That is, the substrate W after the primary drying processing in the first drying processing unit 104 is carried into the front chamber 146 by opening the lid 148 of the front chamber 146 with the shutter 158 closed. When the substrate W is accommodated in the front chamber 146, the lid 148 is closed to close the front chamber 146, and then the vacuum pump 156 is driven to reduce the pressure in the front chamber 146. After that, the shutter 158 is opened, and the substrate W is transferred from the front chamber 146 to the drying processing chamber 144. Then, the shutter 158 is closed, and the substrate W accommodated in the drying processing chamber 144 is subjected to secondary drying processing. When the secondary drying of the substrate W is completed, the shutter 158 is opened, and the substrate W is transferred from the drying chamber 144 to the front chamber 146. Then, after the shutter 158 is closed, the lid 148 is opened, and the substrate W after the secondary drying process is carried out from the front chamber 146. By doing so, the inside of the drying processing chamber 144 is always kept under reduced pressure.
[0045]
The specific configuration of the chemical processing section, the pure water / drying processing section, the pure water processing section, and the like is not limited to the above-described embodiment.
[0046]
【The invention's effect】
When the substrate processing apparatus according to the first and fourth aspects of the present invention is used, it is possible to completely dry the substrate when drying the substrate after processing the substrate with the chemical solution and the pure water. it can.
[0047]
In the substrate processing apparatus according to the second and fifth aspects of the present invention, the substrate can be completely dried without fail.
[0048]
In the substrate processing apparatus according to each of the third and sixth aspects of the present invention, the substrate can be reliably and primarily dried.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a substrate processing apparatus showing an example of an embodiment of the present invention.
FIG. 2 is a diagram illustrating a schematic configuration of a chemical processing section of the substrate processing apparatus illustrated in FIG. 1;
FIG. 3 is a schematic configuration diagram of a substrate processing apparatus showing an example of another embodiment of the present invention.
4 is a partial schematic configuration diagram showing a modification of the substrate processing apparatus shown in FIG.
[Explanation of symbols]
W substrate
10,100 Chemical treatment section
12 Pure water / drying section
14 Drying section
16 One bath type chemical treatment tank
18 Heated chemical treatment tank
24 Liquid supply pipe
26, 68 Mixing valve
28, 70 Pure water supply pipe
30a-30e, 72a, 72b Chemical supply pipe
32, 34, 74, 76 open / close control valve
42 Chemical liquid circulation piping
50, 58, 112, 114 Lifter
52 One-bath processing tank
54 Processing Chamber
56 Processing Chamber Lid
60 Gas-liquid outlet
66 Liquid supply pipe
80 Steam supply nozzle
82 steam supply pipe
84, 122, 144 drying processing chamber
86, 124 Drying process chamber lid
88, 126, 150, 160 Substrate Holder
90, 128, 162 heater
92, 130, 164 Exhaust port of drying processing chamber
94, 132, 154, 166 Exhaust pipe
96, 134, 156, 168 Vacuum pump
98, 136 Substrate transfer device
102 Pure water treatment section
104 first drying section
106, 136 Second drying section
108 Chemical treatment tank
110 Pure water treatment tank
116 chambers
118 Substrate support
120 rotation drive mechanism
138 chuck
146 Front room of drying processing chamber
148 Front room lid
152 Exhaust vent in front room
158 shutter

Claims (6)

In a substrate processing apparatus that performs predetermined processing on a substrate,
A chemical processing section for processing the substrate using the chemical,
While processing the substrate after processing in the chemical solution processing section using pure water, a pure water / drying processing section for primary drying the substrate after processing with pure water,
A drying processing unit for secondary drying the substrate after processing in the pure water / dry processing unit, and transporting the substrate from the chemical liquid processing unit to the pure water / dry processing unit, and from the pure water / dry processing unit to the Transport means for transporting the substrate to the drying processing unit,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the drying processing unit includes a sealable processing chamber for accommodating a substrate, heating means for heating the inside of the processing chamber, and decompression means for decompressing the inside of the processing chamber. . In the substrate processing apparatus according to claim 1 or 2,
The chemical processing unit includes a chemical processing tank that stores a chemical,
The pure water / drying processing unit includes a pure water treatment tank that stores pure water, and an organic solvent supply unit that supplies an organic solvent to the substrate.
The transporting means includes a first elevating means for elevating and lowering the substrate between the inside and the outside of the chemical solution processing tank, and a second elevating means for elevating and lowering the substrate between the inside and the outside of the pure water processing tank. Prepare
In the pure water / drying processing unit, the substrate is pulled up from the pure water in the pure water treatment tank by the second elevating unit, and the organic solvent is supplied from the organic solvent supply unit to the substrate after the treatment with the pure water. A substrate processing apparatus, wherein a substrate is primarily dried. In a substrate processing apparatus that performs predetermined processing on a substrate,
A chemical processing section for processing the substrate using the chemical,
A pure water processing unit that processes the substrate after processing in the chemical solution processing unit using pure water,
A first drying processing unit for temporarily drying the substrate after the processing in the pure water processing unit,
A second drying section for secondary drying the substrate after the processing in the first drying section;
Transport means for transporting the substrate between each of the chemical processing section, the pure water processing section, the first drying processing section and the second drying processing section,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 4,
The second drying processing unit includes a process chamber capable of holding a substrate, a heating unit that heats the inside of the processing chamber, and a decompression unit that decompresses the inside of the processing chamber. Processing equipment. In the substrate processing apparatus according to claim 4 or 5,
The chemical processing unit includes a chemical processing tank that stores a chemical,
The pure water treatment unit includes a pure water treatment tank that stores pure water,
The first drying unit includes a support unit that supports the substrate, and a rotation driving unit that rotates the support unit at a high speed,
The transporting means includes a first elevating means for elevating and lowering the substrate between the inside and the outside of the chemical solution processing tank, and a second elevating means for elevating and lowering the substrate between the inside and the outside of the pure water processing tank. A substrate processing apparatus, comprising:

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