TWI593541B - 樹脂模封裝置 - Google Patents

樹脂模封裝置 Download PDF

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Publication number
TWI593541B
TWI593541B TW101140019A TW101140019A TWI593541B TW I593541 B TWI593541 B TW I593541B TW 101140019 A TW101140019 A TW 101140019A TW 101140019 A TW101140019 A TW 101140019A TW I593541 B TWI593541 B TW I593541B
Authority
TW
Taiwan
Prior art keywords
resin
supply
supplied
workpiece
granular
Prior art date
Application number
TW101140019A
Other languages
English (en)
Chinese (zh)
Other versions
TW201318810A (zh
Inventor
藤澤雅彥
大屋秀俊
朝日真一
Original Assignee
山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山田尖端科技股份有限公司 filed Critical 山田尖端科技股份有限公司
Publication of TW201318810A publication Critical patent/TW201318810A/zh
Application granted granted Critical
Publication of TWI593541B publication Critical patent/TWI593541B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
    • B29C2043/5883—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses ensuring cavity filling, e.g. providing overflow means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
TW101140019A 2011-11-08 2012-10-30 樹脂模封裝置 TWI593541B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011244378 2011-11-08

Publications (2)

Publication Number Publication Date
TW201318810A TW201318810A (zh) 2013-05-16
TWI593541B true TWI593541B (zh) 2017-08-01

Family

ID=48289874

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140019A TWI593541B (zh) 2011-11-08 2012-10-30 樹脂模封裝置

Country Status (6)

Country Link
JP (2) JP5731009B2 (ja)
KR (1) KR101950894B1 (ja)
CN (1) CN103930252B (ja)
SG (1) SG11201402077UA (ja)
TW (1) TWI593541B (ja)
WO (1) WO2013069496A1 (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6049597B2 (ja) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP6284764B2 (ja) * 2013-12-24 2018-02-28 Ｔｏｗａ株式会社 樹脂撒布方法、被樹脂封止部品の樹脂封止方法、樹脂撒布装置、被樹脂封止部品の樹脂封止装置、および樹脂封止成形品製造装置
JP6183417B2 (ja) 2015-06-26 2017-08-23 トヨタ自動車株式会社 燃料電池システム
JP6499941B2 (ja) * 2015-07-23 2019-04-10 アピックヤマダ株式会社 樹脂成形方法および樹脂成形装置
JP6499105B2 (ja) * 2016-03-11 2019-04-10 東芝メモリ株式会社 金型
JP6212609B1 (ja) * 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6298871B1 (ja) * 2016-10-21 2018-03-20 Ｔｏｗａ株式会社 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法
JP6284996B1 (ja) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
JP6270969B2 (ja) * 2016-11-22 2018-01-31 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP6774865B2 (ja) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
TWI607207B (zh) * 2016-12-22 2017-12-01 矽品精密工業股份有限公司 模封設備
JP6522817B2 (ja) * 2018-01-29 2019-05-29 Ｔｏｗａ株式会社 樹脂成形品の製造方法、被樹脂封止部品の樹脂封止方法、および樹脂成形装置
JP6989410B2 (ja) * 2018-02-16 2022-01-05 アピックヤマダ株式会社 樹脂モールド装置
JP6936177B2 (ja) * 2018-03-23 2021-09-15 アピックヤマダ株式会社 樹脂モールド装置
JP7284514B2 (ja) 2020-05-11 2023-05-31 アピックヤマダ株式会社 樹脂モールド装置及びクリーニング方法
JP7360364B2 (ja) * 2020-07-03 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7360365B2 (ja) 2020-07-14 2023-10-12 Ｔｏｗａ株式会社 樹脂材料供給装置、樹脂成形装置及び樹脂成形品の製造方法
JP2022061238A (ja) * 2020-10-06 2022-04-18 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7470982B2 (ja) * 2020-11-17 2024-04-19 アピックヤマダ株式会社 樹脂供給装置、樹脂封止装置、及び樹脂封止品の製造方法
JP7468906B2 (ja) 2021-04-26 2024-04-16 アピックヤマダ株式会社 樹脂封止装置
WO2022264374A1 (ja) * 2021-06-17 2022-12-22 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2023176671A (ja) * 2022-05-31 2023-12-13 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003165133A (ja) * 2001-11-30 2003-06-10 Apic Yamada Corp 液材吐出装置及び樹脂封止装置
JP2006156796A (ja) * 2004-11-30 2006-06-15 Towa Corp 半導体チップの樹脂封止成形方法、及び、装置
CN101180170A (zh) * 2005-11-04 2008-05-14 东和株式会社 电子器件的树脂封固成形装置
CN102105282A (zh) * 2008-08-08 2011-06-22 东和株式会社 电子部件的压缩成形方法及模具装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4327985B2 (ja) * 2000-04-21 2009-09-09 アピックヤマダ株式会社 樹脂封止装置
KR100708600B1 (ko) * 2004-04-30 2007-04-18 스미토모 베이클라이트 가부시키가이샤 수지봉지형 반도체 패키지 및 이의 제조 방법 및 장치
JP4741383B2 (ja) * 2006-02-17 2011-08-03 富士通セミコンダクター株式会社 電子部品の樹脂封止方法
JP2007307843A (ja) * 2006-05-20 2007-11-29 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP4917970B2 (ja) * 2007-06-08 2012-04-18 住友重機械工業株式会社 樹脂封止装置
JP4990830B2 (ja) 2008-03-27 2012-08-01 住友重機械工業株式会社 樹脂供給機構
JP2010221430A (ja) * 2009-03-19 2010-10-07 Elpida Memory Inc モールド樹脂及び樹脂モールド方法
JP5320241B2 (ja) * 2009-09-28 2013-10-23 住友重機械工業株式会社 封止装置及び封止方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003165133A (ja) * 2001-11-30 2003-06-10 Apic Yamada Corp 液材吐出装置及び樹脂封止装置
JP2006156796A (ja) * 2004-11-30 2006-06-15 Towa Corp 半導体チップの樹脂封止成形方法、及び、装置
CN101180170A (zh) * 2005-11-04 2008-05-14 东和株式会社 电子器件的树脂封固成形装置
CN102105282A (zh) * 2008-08-08 2011-06-22 东和株式会社 电子部件的压缩成形方法及模具装置

Also Published As

Publication number Publication date
WO2013069496A1 (ja) 2013-05-16
TW201318810A (zh) 2013-05-16
JP5731009B2 (ja) 2015-06-10
SG11201402077UA (en) 2014-09-26
JP5926417B2 (ja) 2016-05-25
KR101950894B1 (ko) 2019-04-22
JP2015128908A (ja) 2015-07-16
KR20140092381A (ko) 2014-07-23
JPWO2013069496A1 (ja) 2015-04-02
CN103930252B (zh) 2016-08-17
CN103930252A (zh) 2014-07-16

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