JP7284514B2 - 樹脂モールド装置及びクリーニング方法 - Google Patents
樹脂モールド装置及びクリーニング方法 Download PDFInfo
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- JP7284514B2 JP7284514B2 JP2020083368A JP2020083368A JP7284514B2 JP 7284514 B2 JP7284514 B2 JP 7284514B2 JP 2020083368 A JP2020083368 A JP 2020083368A JP 2020083368 A JP2020083368 A JP 2020083368A JP 7284514 B2 JP7284514 B2 JP 7284514B2
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
以下、図面を参照して、本発明の実施形態について詳しく説明する。図1は、本発明の実施形態に係る樹脂モールド装置1の構成例を示す概略図である。なお、各実施形態を説明するための全図において、同一の機能を有する部材には同一の符号を付し、その繰り返しの説明は省略する場合がある。
本実施形態に係る電子部品WbがキャリアWaに搭載されたワークWのクリーニング方法は、ワークWの搬送経路と重なる位置にワークWに当接するクリーニング装置8が設けられており、ワークWとクリーニング装置8とを相対移動させてワークWの電子部品Wbが搭載されていないワーク裏面をクリーニングする方法である。本実施形態では、ワークWの対象面の全領域とクリーニング装置8とが重なるように移動させて、ワークWの対象面の全領域のクリーニングを行うことができる。このとき、少なくともワークWとクリーニング装置8との何れか一方を移動させればよい。仮にワークWを移動させる場合、ワーク搬送を利用することができ、機構の簡素化及び製造コストの低下を実現できる。なお、前記クリーニング装置8に、適宜ブラシ毛48a及び吸引部46を設ければよい。
2 ワーク搬送部
4 ローダ
5 ホルダープレート
6 ディスペンサ
8、8a、8b クリーニング装置
9 プリヒート部
10 プリヒータ
11 プレス部
12 モールド金型
13 フィルム搬送機構
22 枠体
32 チャック
42 クリーニングヘッド本体
44 アクチュエータ
46 吸引部
48、48b、48c、48d ブラシ本体
50 移動装置
A ワーク供給ユニット
B 樹脂供給ユニット
C ワーク受渡しユニット
D プレスユニット
E 冷却ユニット
F リリースフィルム
R モールド樹脂
W ワーク
Claims (6)
- 電子部品がキャリアに搭載されたワーク及びモールド樹脂がモールド金型に搬入される樹脂モールド装置であって、
前記ワーク及び前記モールド樹脂をクランプして樹脂封止する前記モールド金型を有するプレス部と、
前記ワークのプリヒートを行うプリヒート部と、
前記プレス部へ搬送される前記ワークの前記電子部品が搭載されていないワーク裏面をクリーニングするクリーニング装置と、を備え、
前記クリーニング装置は、
前記プレス部より前記ワークの搬送経路の上流側で重なる位置であって、
前記プリヒート部の直前、及び、前記プリヒート部と前記プレス部との間、の何れか一方又は両方の位置に設けられ、
前記クリーニング装置は、前記ワーク裏面にブラシ毛が当接するブラシ本体と、塵埃を吸引する吸引部と、を有するクリーニングヘッド本体を備えていること
を特徴とする樹脂モールド装置。 - 前記クリーニングヘッド本体は、前記ワーク裏面に前記ブラシ毛の当接及び離間駆動を行うアクチュエータを備えていること
を特徴とする請求項1記載の樹脂モールド装置。 - 前記ブラシ本体は、前記ワークの搬送方向に対して直角方向に複数に分割されており、
分割された各ブラシ本体に個別に連結されて、前記各ブラシ本体を個々上下駆動させる駆動装置を備えていること
を特徴とする請求項1又は請求項2記載の樹脂モールド装置。 - 電子部品がキャリアに搭載されたワーク及びモールド樹脂がモールド金型に搬入される樹脂モールド装置であって、
前記ワーク及び前記モールド樹脂をクランプして樹脂封止する前記モールド金型を有するプレス部と、
前記ワークのプリヒートを行うプリヒート部と、
前記プレス部へ搬送される前記ワークの前記電子部品が搭載されているワーク表面を吸引するクリーニング装置と、を備え、
前記クリーニング装置は、前記プレス部より前記ワークの搬送経路の上流側で重なる位置であって、前記プリヒート部より前に設けられていること
を特徴とする樹脂モールド装置。 - 前記クリーニング装置は、前記ワークに前記モールド樹脂が供給された後の位置に設けられて、塵埃を吸引する吸引部を有すること
を特徴とする請求項4記載の樹脂モールド装置。 - 電子部品がキャリアに搭載されたワーク及びモールド樹脂がモールド金型に搬入される樹脂モールド装置における該ワークのクリーニング方法であって、
前記ワーク及び前記モールド樹脂をクランプして樹脂封止する前記モールド金型を有するプレス部より前記ワークの搬送経路の上流側で重なる位置であって、
前記ワークのプリヒートを行うプリヒート部の直前、及び、前記プリヒート部と前記プレス部との間、の何れか一方又は両方の位置に、前記ワークに当接するクリーニング装置を設け、
前記クリーニング装置にブラシ毛及び吸引部を設け、
前記ワークと前記クリーニング装置とを相対移動させて前記ワークの前記電子部品が搭載されていないワーク裏面をクリーニングすること
を特徴とするクリーニング方法。
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