US8458843B2 - Apparatus and methods for brush and pad conditioning - Google Patents

Apparatus and methods for brush and pad conditioning Download PDF

Info

Publication number
US8458843B2
US8458843B2 US12/603,771 US60377109A US8458843B2 US 8458843 B2 US8458843 B2 US 8458843B2 US 60377109 A US60377109 A US 60377109A US 8458843 B2 US8458843 B2 US 8458843B2
Authority
US
United States
Prior art keywords
conditioner
cylindrical rollers
rollers
cylindrical
interior volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US12/603,771
Other versions
US20110094537A1 (en
Inventor
Sen-Hou Ko
Lakshmanan Karuppiah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KARUPPIAH, LAKSHMANAN, KO, SEN-HOU
Priority to US12/603,771 priority Critical patent/US8458843B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to PCT/US2010/046599 priority patent/WO2011049671A1/en
Priority to JP2012535203A priority patent/JP5916617B2/en
Priority to TW099129282A priority patent/TWI535529B/en
Publication of US20110094537A1 publication Critical patent/US20110094537A1/en
Priority to US13/897,008 priority patent/US8813293B2/en
Publication of US8458843B2 publication Critical patent/US8458843B2/en
Application granted granted Critical
Priority to US14/469,188 priority patent/US20140360976A1/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12Brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/50Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/50Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/50Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/54Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • B08B15/04Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/041Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B13/00Brushes with driven brush bodies or carriers
    • A46B13/001Cylindrical or annular brush bodies
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B2200/00Brushes characterized by their functions, uses or applications
    • A46B2200/30Brushes for cleaning or polishing
    • A46B2200/3093Brush with abrasive properties, e.g. wire bristles

Definitions

  • Embodiments of the invention relate to electronic device manufacturing.
  • embodiments relate to a scrubber box for cleaning and/or polishing thin discs such as semiconductor substrates, wafers, compact discs, glass substrates and the like.
  • Brush cleaning apparatus sometimes referred to as scrubbers or scrubber boxes, are often utilized to polish and/or clean semiconductor substrates at one or more stages of an electronic device manufacturing process.
  • a cleaning device using cylindrical rollers having a pad material or a brush body disposed thereon may be caused to contact at least one major surface of a substrate to remove material from the major surface of the substrate.
  • a cylindrical roller having a pad material disposed thereon is caused to rotate and urged against a rotating substrate to polish the substrate using a chemical mechanical polishing (CMP) process.
  • CMP chemical mechanical polishing
  • a cylindrical roller having a brush body disposed thereon is caused to rotate and urged against a rotating substrate to clean the substrate after a CMP process.
  • the processing surface of the pad material or brush body disposed on the cylindrical rollers in these devices tend to wear over time, which decreases removal rate or cleaning efficiency.
  • the pad material or brush bodies may need to be replaced frequently in order to achieve desirable polishing or cleaning results. Replacement of the pad material or brush bodies is costly and causes downtime, which results in higher cost of ownership and lower throughput.
  • What is needed is an apparatus and method for refreshing the processing surface of the pad material or the brush body disposed on the cylindrical rollers to obviate wear of the surface, remove agglomerated materials from the surface, as well as extend the useful lifetime of the pad material or the brush body.
  • Embodiments described herein relate to a method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box that is part of a substrate polishing system or a substrate cleaning system.
  • a brush box is described.
  • the brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity to each other and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.
  • a brush box in another embodiment, includes a tank having an interior volume and a pair of cylindrical rollers disposed in the interior volume, each of the rollers being rotatable about a respective first axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective roller between a first position where the rollers are in proximity to each other and a second position where the rollers are spaced away from each other, a conditioning device for each of the rollers, each conditioning device including a conditioner disposed in the interior volume, each conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, and each conditioner being rotatable about a second axis that is different than the first axis.
  • a method for processing a substrate includes transferring a substrate to a tank, positioning the substrate between two cylindrical rollers disposed in the tank, moving each of the two cylindrical rollers into a first position where a processing surface of each of the cylindrical rollers contacts major surfaces of the substrate, processing the substrate by providing relative motion between at least one of the two cylindrical rollers and the substrate, moving each of the two cylindrical rollers to a second position that is spaced apart from the major surfaces of the substrate, the second position including contacting the processing surface with a conditioning device, and transferring the substrate out of the tank while conditioning the processing surface.
  • FIG. 1 is an isometric view of a scrubber box.
  • FIG. 2A is a top view of the scrubber box of FIG. 1 showing the cylindrical rollers in a substrate processing position.
  • FIG. 2B is a top cross-sectional view of the scrubber box of FIG. 2A showing the cylindrical rollers in a substrate transfer position.
  • FIG. 3A is a top view of one embodiment a conditioning device.
  • FIG. 3B is a side cross-sectional view of the cylindrical roller and the conditioner of FIG. 3A .
  • FIG. 3C is a side cross-sectional view of another embodiment of a conditioning device.
  • FIG. 4A is a top view of another embodiment a conditioning device.
  • FIG. 4B is a cross-sectional view of the cylindrical roller and the conditioner of FIG. 3A .
  • FIG. 5A is a top view of another embodiment a conditioning device.
  • FIG. 5B is a cross-sectional view of the cylindrical roller and the conditioner of FIG. 5A .
  • FIG. 6 is a flowchart showing one embodiment of a conditioning method.
  • FIG. 7 is a flowchart showing one embodiment of a substrate processing method.
  • Embodiments described herein generally provide an apparatus and method for conditioning or refreshing a processing surface of a pad material or a brush body disposed on a cylindrical roller in a brush-type cleaning system that is utilized in a scrubber box.
  • Embodiments of a scrubber box that may be adapted to benefit from the invention include a cleaning module that is part of a SYCAMORETM polishing system and a DESICA® cleaner, both available from Applied Materials, Inc., located in Santa Clara, Calif.
  • Embodiments described herein may also be utilized on brush-type cleaning and polishing systems available from other manufacturers.
  • the embodiments of scrubber boxes are described to process a substrate in a vertical orientation, some embodiments may be utilized in scrubber boxes configured to process a substrate in a horizontal orientation.
  • FIG. 1 is an isometric view of a scrubber box 100 that may be utilized in a cleaning module as described above.
  • the scrubber box 100 includes a tank 105 that is at least partially encased in a first support 125 and a second support 130 .
  • Each of the supports 125 , 130 are coupled to a linkage 110 that is external to (i.e., outside of) the tank 105 of the scrubber box 100 .
  • Each of the supports 125 , 130 are adapted to support an actuator 135 .
  • Each actuator 135 is coupled to a cylindrical roller 115 , 120 (shown in FIG. 2A ) located inside the tank 105 .
  • the actuators 135 provide rotational movement of the respective cylindrical rollers 115 , 120 about axes A′ and A′′.
  • Each of the actuators 135 may be drive motors, such as direct drive servo motors adapted to rotate the respective cylindrical rollers 115 , 120 about axes A′ and A′′. Each of the actuators 135 are coupled to a controller adapted to control the rotational speed of the cylindrical rollers 115 , 120 .
  • the linkage 110 is coupled to each of the supports 125 , 130 , a base 140 , and an actuator 145 .
  • the linkage 110 is utilized for convenient and accurate actuation/movement of the cylindrical rollers 115 , 120 located inside the tank 105 relative to the major surfaces of a substrate 101 (shown in FIG. 2A ). Additionally, clearance holes (not shown) may be formed in the tank 105 to achieve rotational coupling between the brushes 115 , 120 , actuators 135 and the supports 125 , 130 .
  • a compliant coupling element 150 such as a flexible washer, a seal or a bellows, may be disposed around each hole and mounted between the tank 105 and the supports 125 , 130 .
  • Such an arrangement (1) permits relative motion of the cylindrical rollers 115 , 120 relative to the walls of the tank 105 ; (2) protects the substrate 101 against particulate contamination that might otherwise pass into the interior of the tank 105 through the holes in the tank walls; and/or (3) permits a fluid level in the tank 105 to reach or exceed the level of the holes while preventing fluid from draining therethrough.
  • the actuator 145 is coupled to the controller to control the movement of the linkage 110 .
  • Each of the first and second supports 125 , 130 are coupled to the base 140 by a pivot point 112 to which the first and second supports 125 , 130 may be adapted to pivot (upward and inward toward one another, and/or downward and outward away from one another).
  • the first and second supports 125 , 130 may be moved simultaneously through respective arcs 146 1 , 146 2 , as shown in FIG. 1 , relative to the base 140 .
  • Such movement may cause the first and second cylindrical rollers 115 , 120 to close against the substrate 101 as shown in FIG. 2A , or to cause the first and second cylindrical rollers 115 , 120 to be spaced apart (shown in FIG. 2B ) to allow insertion and/or removal of the substrate 101 from the scrubber box 100 .
  • FIG. 2A is a top view of the scrubber box 100 of FIG. 1 showing the cylindrical rollers 115 , 120 in a processing position where the cylindrical rollers 115 , 120 are closed or pressed against major surfaces of the substrate 101 .
  • FIG. 2B is a top view of the scrubber box 100 of FIG. 2A in a transfer position where the cylindrical rollers 115 , 120 are spaced apart to facilitate transfer of the substrate.
  • the scrubber box 100 also includes one or more drive motors 144 and a rotational device 147 . Each of the drive motors 144 and rotational device 147 are coupled to a roller assembly configured to support and/or engage the substrate 101 and facilitate rotation of the substrate 101 .
  • Each of the cylindrical rollers 115 , 120 include a tubular cover 128 disposed thereon.
  • the tubular cover 128 may be a removable sleeve made of a pad material utilized to polish the substrate 101 or a brush body adapted to clean the substrate 101 .
  • Examples of the pad material that may be utilized as the tubular cover 128 include polymeric pad materials typically utilized in chemical mechanical polishing (CMP) processes.
  • the polymeric material may be a polyurethane, a polycarbonate, fluoropolymers, PTFE, PTFA, polyphenylene sulfide (PPS), or combinations thereof.
  • the pad material may further comprise open or closed cell foamed polymers, elastomers, felt, impregnated felt, plastics, and like materials compatible with the processing chemistries.
  • the pad material is a felt material impregnated with a porous coating.
  • tubular cover 128 examples include polymeric materials, such as foams (e.g., polyvinyl alcohol (PVA), polyurethane) as well as thermoplastic materials or polyamide materials, such as nylon.
  • the tubular cover 128 may further include a plurality of raised features, nodules or bristles (not shown) utilized to abrade the substrate 101 and effect cleaning of the substrate 101 .
  • cleaning and/or polishing effectiveness of the processing surface of the tubular cover 128 is generally dependent on a suitable porosity and average pore size.
  • the porosity of the processing surface of the tubular cover 128 may be greater than about 85%.
  • Other characteristics of the tubular cover 128 include a desirable average pore size or opening.
  • the pore size opening in some embodiments range from about 10 microns to about 200 microns.
  • the pore structures effect cleaning or material removal from the feature side of the substrate. Attributes such as polishing compound retention, polishing or removal activity, and material and fluid transportation also affect removal rate.
  • these microscopic pores In order to facilitate optimal removal of material from the substrate, these microscopic pores must be fully and evenly open to provide a relatively high and stable removal rate and/or a maximized cleaning efficiency.
  • These pore structures when open, facilitate material removal by enhancing processing surface wetability, maintaining processing surface roughness, and dispersing polishing compounds, such as, for example, abrasive particles supplied from a polishing compound.
  • the processing surface of the tubular cover 128 becomes worn and removed materials, chemicals, and other by products become attached to the processing surface of the tubular cover 128 .
  • the tubular cover 128 may be replaced, which is costly and time consuming.
  • the processing surface of the tubular cover 128 may be periodically conditioned or refreshed to enhance the processing surface of the tubular cover 128
  • FIGS. 2A and 2B depict one embodiment of a conditioning device 200 that may be utilized to condition and/or refresh the processing surface of the tubular cover 128 disposed on each of the cylindrical rollers 115 , 120 .
  • a dedicated conditioning device 200 is provided for each of the cylindrical rollers 115 , 120 .
  • the conditioning device 200 is mounted adjacent a sidewall 205 of the tank 105 by one or more support members 210 .
  • the conditioning device 200 is positioned away from the center of the tank 105 so the conditioning device 200 does not interfere with substrate transfer and/or substrate polishing or cleaning processes.
  • the conditioning device 200 is positioned to contact each of the cylindrical rollers 115 , 120 when the first and second supports 125 , 130 are actuated downward and outward away from one another.
  • the movement of the first and second supports 125 , 130 brings the cylindrical rollers 115 , 120 into contact with a respective conditioning device 200 .
  • the processing surface of the tubular cover 128 disposed on each of the cylindrical rollers 115 , 120 may be conditioned by causing relative movement between the cylindrical rollers 115 , 120 and the conditioning device 200 .
  • the cylindrical rollers 115 , 120 rotate about respective first axes A′ and A′′ relative to the conditioning device 200 .
  • the rotational direction of axes A′ and A′′ may be the same or different.
  • the rotational direction of a first axis A′ and a second axis A′′ may both be clockwise or counterclockwise.
  • the rotational direction of the first axis A′ may be clockwise and the rotational direction of the second axis A′′ may be counterclockwise, or vice versa.
  • the conditioning device 200 may be caused to rotate relative to each of the cylindrical rollers 115 , 120 based on movement or axial rotation of the cylindrical rollers 115 , 120 .
  • both of the conditioning device 200 and the cylindrical rollers 115 , 120 may be rotated independently.
  • the conditioning device 200 is an article configured to clean, abrade or enhance the processing surface of the tubular cover 128 by mechanical contact with the tubular cover 128 .
  • the conditioning device 200 is an abrasive article made of an abrasive material and/or includes abrasive particles such as a diamond or ceramic material.
  • the conditioning device 200 may be made from a material that is harder than the hardness of the processing surface of the tubular cover 128 . Examples include glass, silicon materials, thermoplastics, process compatible metals, such as aluminum or tungsten, among other materials.
  • the outer surface of the conditioning device 200 may be roughened to enhance abrasion of the processing surface of the tubular cover 128 .
  • each conditioning device 200 is an elongated cylindrical or tubular member. In other embodiments, each conditioning device 200 may be configured as a flat or cylindrical brush having bristles or a disk-shaped member.
  • FIG. 3A is a top view of one embodiment a conditioning device 200 having a conditioner 300 in contact with a processing surface 301 of a tubular cover 128 disposed on a cylindrical roller 115 .
  • the conditioner 300 is in the form of a cylindrical rod or tube 302 .
  • the conditioner 300 includes a roughened outer surface 303 adapted to abrade the processing surface 301 of the tubular cover 128 .
  • the outer surface 303 of the conditioner 300 includes a plurality of abrasive particles 305 .
  • the conditioner 300 is adapted to rotate relative to the cylindrical roller 115 .
  • the conditioner 300 is coupled to support members 210 on each end by a spindle 312 .
  • the spindles 312 allow rotation of the conditioner 300 relative to the support members 210 and the cylindrical roller 115 .
  • the conditioner 300 may be adapted to rotate based on the rotation of the cylindrical roller 115 or the conditioner 300 may be caused rotate independent of the cylindrical roller 115 .
  • the conditioner 300 is coupled to an actuator 315 that rotates the conditioner 300 about an axis B, which may be referred to as a third axis B.
  • the conditioner 300 may be rotated while the cylindrical roller 115 is stationary.
  • the conditioner 300 may be rotated about axis B while the cylindrical roller 115 is rotated about axis A′′.
  • the rotational axes A′′ and B are substantially parallel.
  • the rotational direction of axes A′ and A′′ may both be clockwise or counterclockwise.
  • the rotational direction of axis A′ may be clockwise and the rotational direction of axis A′′ may be counterclockwise, or vice versa.
  • the rotational direction of axis B may be clockwise or counterclockwise and the rotational movement may be independent of the rotation of the cylindrical rollers 115 , 120 .
  • rotational force to any or all of the cylindrical rollers 115 , 120 and the conditioner 300 may be pulsed on and off, varied to change the rotational speed, and/or intermittently reversed.
  • FIG. 3B is a cross-sectional view of the cylindrical roller 115 and the conditioner 300 of FIG. 3A .
  • the conditioner 300 includes a core 320 , which may be a shaft disposed on the longitudinal axis of the conditioner 300 .
  • the core 320 may be coupled to the spindles 312 ( FIG. 3A ).
  • the cylindrical roller 115 includes a mandrel assembly 316 that includes tubular core 317 on the longitudinal axis of the cylindrical roller 115 .
  • the tubular core 317 is in communication with a plurality of radial conduits 318 extending from the tubular core 317 to a periphery of the cylindrical roller 115 .
  • the tubular core 317 is coupled to a fluid source 319 that provides a cleaning or polishing fluid to the tubular cover 128 through the radial conduits 318 during processing of a substrate.
  • the fluid source 319 provides a fluid to the tubular cover 128 during conditioning to enhance cleaning of the processing surface 301 .
  • the fluid source 319 provides a liquid or a gas to the tubular cover 128 through the radial conduits 318 .
  • the fluid may be deionized water (DIW), inert gases such as argon, nitrogen, helium, among other fluids that may facilitate removal of material from the processing surface 301 .
  • DIW deionized water
  • inert gases such as argon, nitrogen, helium
  • FIG. 3C is a side cross-sectional view of another embodiment of a conditioning device 200 having a housing 325 that encloses or surrounds at least a portion of the conditioner 300 .
  • the housing 325 includes wipers 328 that are adapted to contact the processing surface 301 of the tubular cover 128 .
  • the wipers 328 include bristles and/or abrasives (not shown) that are utilized to abrade the processing surface 301 .
  • the wipers 328 may be utilized with or without the conditioner 300 .
  • the wipers 328 may be utilized as a conditioning device without the need for the conditioner 300 .
  • the wipers 328 are utilized with the conditioner 300 to contain any materials produced by the conditioning process.
  • the wipers 328 are made of a flexible or compliant material adapted to conform to the topography of the processing surface 301 of the tubular cover 128 .
  • materials for the wipers 328 include rigid materials such as ceramics, glass, thermoplastics as well as more compliant materials, such as polymers, plastics, silicon, elastomers and rubber.
  • the housing 325 encloses a negative pressure region 335 .
  • the housing 325 is in fluid communication with a vacuum pump 330 adapted to generate or maintain negative pressure in the region 335 .
  • the wipers 328 are configured as compliant seals to contain negative pressure within the housing 325 . Cleaning of the processing surface 301 may be enhanced by suction from the vacuum pump 330 . Material removed from the processing surface 301 of the tubular cover 128 as well as any fluids may be removed from the interior of the housing 325 and routed to a waste or abatement system.
  • FIG. 4A is a top view of another embodiment a conditioning device 200 having a conditioner 400 in contact with a processing surface 301 of a tubular cover 128 disposed on a cylindrical roller 115 .
  • the conditioner 400 is configured as a brush or comb having a bar-shaped structural member 402 that spans the length of the cylindrical roller 115 .
  • Each end of the structural member 402 is coupled to a support member 210 .
  • one or both of the support members 210 are coupled to a linear actuator 415 adapted to provide pressure to one or both ends of the structural member 402 .
  • a pressure or force between the conditioner 400 and the processing surface 301 of the tubular cover 128 may be varied.
  • the cylindrical roller 115 is rotated about axis A′′ while the conditioner 400 is controllably urged against the processing surface 301 of the tubular cover 128 .
  • FIG. 4B is a cross-sectional view of the cylindrical roller 115 and the conditioner 400 of FIG. 3A .
  • the conditioner 400 includes a plurality of raised features 405 that may be bristles, abrasive particles, structural protrusions, or combinations thereof. While not shown, the conditioner 400 may be enclosed by a housing that is in communication with a vacuum pump as shown in FIG. 3C .
  • FIG. 5A is a top view of another embodiment a conditioning device 200 having a conditioner 500 in contact with a processing surface 301 of a tubular cover 128 disposed on a cylindrical roller 115 .
  • the conditioner 500 includes a disk-shaped body 502 coupled to a support member 510 at a geometric center of the body 502 .
  • the support member 510 is adapted as an axle that is coupled to an actuator 515 utilized to rotate the body 502 about axis C.
  • the tank 105 may be provided with a lid (not shown) to allow the interior volume of the tank 105 to contain negative pressure provided by a vacuum pump 330 .
  • the removed materials, as well as any fluids may be removed from the interior of the tank 105 and routed to a waste or abatement system.
  • FIG. 5B is a cross-sectional view of the cylindrical roller 115 and the conditioner 500 of FIG. 5A .
  • the conditioner 500 includes an outer surface 503 that may be roughened in order to abrade the processing surface 301 of the tubular cover 128 .
  • the outer surface 503 includes a plurality of raised features 505 that may be bristles, abrasive particles, structural protrusions, or combinations thereof.
  • the conditioner 500 is adapted to rotate relative to the cylindrical roller 115 .
  • the conditioner 500 is coupled to the support member 510 to facilitate rotation of the body 502 relative to the cylindrical roller 115 .
  • the conditioner 500 may be adapted to rotate based on the rotation of the cylindrical roller 115 or the conditioner 500 may be caused rotate independent of the cylindrical roller 115 .
  • the conditioner 500 is coupled to the actuator 515 that rotates the body 502 about axis C, which may be referred to as a fourth axis C.
  • the body 502 may be rotated while the cylindrical roller 115 is stationary.
  • the body 502 may be rotated about axis C while the cylindrical roller 115 is rotated about axis A′′.
  • the rotational axis A′′ is substantially normal to the rotational axis C.
  • FIG. 6 is a flowchart showing one embodiment of a conditioning method 600 using the conditioning device 200 as described herein.
  • a conditioner such as the conditioner 300 , 400 or 500 as described herein.
  • relative motion is provided between the processing surface 301 and the conditioner. The relative motion may be provided by rotating the cylindrical roller 115 , 120 relative to the conditioner, rotating the conditioner relative to the cylindrical roller 115 , 120 , or a combination thereof.
  • FIG. 7 is a flowchart showing one embodiment of a substrate processing method 700 using the scrubber box 100 as described herein.
  • a substrate is transferred to a tank 105 to a position between two cylindrical rollers 115 , 120 .
  • each of the two cylindrical rollers 115 , 120 are urged toward the substrate into a first position that facilitates contact between a processing surface 301 of the cylindrical rollers 115 , 120 and major surfaces of the substrate.
  • the cylindrical rollers 115 , 120 and the substrate may be caused to rotate relative in order to perform a cleaning or polishing process.
  • the cylindrical rollers 115 , 120 are moved to a second position that spaces the cylindrical rollers 115 , 120 away from the substrate to facilitate transfer of the substrate.
  • the second position also includes contacting the processing surface of each of the cylindrical rollers 115 , 120 with a conditioning device, which may be the conditioner 300 , 400 , or 500 as described herein.
  • a conditioning method as described in FIG. 6 may be performed while the substrate is transferred out of the tank 105 .
  • the conditioning method may continue until another substrate is transferred into the tank 105 and the method may repeat beginning at step 710 .
  • Embodiments of the conditioning device 200 as described herein extends the lifetime of the processing surface 301 of a tubular cover 128 utilized on the cylindrical rollers 115 , 120 of a scrubber box 100 .
  • the use of the conditioning device 200 provides in-situ conditioning of the processing surface 301 of the cylindrical rollers 115 , 120 such that the cylindrical rollers 115 , 120 do not need to be removed from the tank 105 .
  • the processing surface 301 of new or unused tubular covers 128 may be conditioned in a break-in process that is performed in the scrubber box 100 . Using the conditioning device 200 in a break-in process minimizes or eliminates the need for dummy wafers and saves time.
  • the conditioning of the processing surface 301 of the cylindrical rollers 115 , 120 during substrate transfer processes does not affect throughput of the scrubber box 100 .
  • the conditioning device 200 as described herein also maintains an optimal processing surface 301 of the tubular cover 128 by opening pores and removing agglomerated and/or excess material from the processing surface 301 .
  • the optimal processing surface 301 increases removal rate or cleaning efficiency and minimizes replacement frequency of the tubular cover 128 . Thus, cost of ownership is minimized while throughput is maximized.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
Embodiments of the invention relate to electronic device manufacturing. In particular, embodiments relate to a scrubber box for cleaning and/or polishing thin discs such as semiconductor substrates, wafers, compact discs, glass substrates and the like.
2. Description of the Related Art
Brush cleaning apparatus, sometimes referred to as scrubbers or scrubber boxes, are often utilized to polish and/or clean semiconductor substrates at one or more stages of an electronic device manufacturing process. For example, a cleaning device using cylindrical rollers having a pad material or a brush body disposed thereon may be caused to contact at least one major surface of a substrate to remove material from the major surface of the substrate. In one typical process, a cylindrical roller having a pad material disposed thereon is caused to rotate and urged against a rotating substrate to polish the substrate using a chemical mechanical polishing (CMP) process. In another typical process, a cylindrical roller having a brush body disposed thereon is caused to rotate and urged against a rotating substrate to clean the substrate after a CMP process.
The processing surface of the pad material or brush body disposed on the cylindrical rollers in these devices tend to wear over time, which decreases removal rate or cleaning efficiency. Thus, the pad material or brush bodies may need to be replaced frequently in order to achieve desirable polishing or cleaning results. Replacement of the pad material or brush bodies is costly and causes downtime, which results in higher cost of ownership and lower throughput.
As the demand for integrated circuits continue to rise, chip manufactures have demanded semiconductor process tooling have increased throughput and more robust processing equipment. To meet such demands, apparatus and methods are being developed to maximize throughput, increase the service life of tool components, and decrease the cost of ownership.
What is needed is an apparatus and method for refreshing the processing surface of the pad material or the brush body disposed on the cylindrical rollers to obviate wear of the surface, remove agglomerated materials from the surface, as well as extend the useful lifetime of the pad material or the brush body.
SUMMARY OF THE INVENTION
Embodiments described herein relate to a method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box that is part of a substrate polishing system or a substrate cleaning system. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity to each other and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.
In another embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers disposed in the interior volume, each of the rollers being rotatable about a respective first axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective roller between a first position where the rollers are in proximity to each other and a second position where the rollers are spaced away from each other, a conditioning device for each of the rollers, each conditioning device including a conditioner disposed in the interior volume, each conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, and each conditioner being rotatable about a second axis that is different than the first axis.
In another embodiment, a method for processing a substrate is described. The method includes transferring a substrate to a tank, positioning the substrate between two cylindrical rollers disposed in the tank, moving each of the two cylindrical rollers into a first position where a processing surface of each of the cylindrical rollers contacts major surfaces of the substrate, processing the substrate by providing relative motion between at least one of the two cylindrical rollers and the substrate, moving each of the two cylindrical rollers to a second position that is spaced apart from the major surfaces of the substrate, the second position including contacting the processing surface with a conditioning device, and transferring the substrate out of the tank while conditioning the processing surface.
BRIEF DESCRIPTION OF THE DRAWINGS
So that the manner in which the above-recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
FIG. 1 is an isometric view of a scrubber box.
FIG. 2A is a top view of the scrubber box of FIG. 1 showing the cylindrical rollers in a substrate processing position.
FIG. 2B is a top cross-sectional view of the scrubber box of FIG. 2A showing the cylindrical rollers in a substrate transfer position.
FIG. 3A is a top view of one embodiment a conditioning device.
FIG. 3B is a side cross-sectional view of the cylindrical roller and the conditioner of FIG. 3A.
FIG. 3C is a side cross-sectional view of another embodiment of a conditioning device.
FIG. 4A is a top view of another embodiment a conditioning device.
FIG. 4B is a cross-sectional view of the cylindrical roller and the conditioner of FIG. 3A.
FIG. 5A is a top view of another embodiment a conditioning device.
FIG. 5B is a cross-sectional view of the cylindrical roller and the conditioner of FIG. 5A.
FIG. 6 is a flowchart showing one embodiment of a conditioning method.
FIG. 7 is a flowchart showing one embodiment of a substrate processing method.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.
DETAILED DESCRIPTION
Embodiments described herein generally provide an apparatus and method for conditioning or refreshing a processing surface of a pad material or a brush body disposed on a cylindrical roller in a brush-type cleaning system that is utilized in a scrubber box. Embodiments of a scrubber box that may be adapted to benefit from the invention include a cleaning module that is part of a SYCAMORE™ polishing system and a DESICA® cleaner, both available from Applied Materials, Inc., located in Santa Clara, Calif. Embodiments described herein may also be utilized on brush-type cleaning and polishing systems available from other manufacturers. Additionally, while the embodiments of scrubber boxes are described to process a substrate in a vertical orientation, some embodiments may be utilized in scrubber boxes configured to process a substrate in a horizontal orientation.
FIG. 1 is an isometric view of a scrubber box 100 that may be utilized in a cleaning module as described above. The scrubber box 100 includes a tank 105 that is at least partially encased in a first support 125 and a second support 130. Each of the supports 125, 130 are coupled to a linkage 110 that is external to (i.e., outside of) the tank 105 of the scrubber box 100. Each of the supports 125, 130 are adapted to support an actuator 135. Each actuator 135 is coupled to a cylindrical roller 115, 120 (shown in FIG. 2A) located inside the tank 105. The actuators 135 provide rotational movement of the respective cylindrical rollers 115, 120 about axes A′ and A″. Each of the actuators 135 may be drive motors, such as direct drive servo motors adapted to rotate the respective cylindrical rollers 115, 120 about axes A′ and A″. Each of the actuators 135 are coupled to a controller adapted to control the rotational speed of the cylindrical rollers 115, 120.
The linkage 110 is coupled to each of the supports 125, 130, a base 140, and an actuator 145. The linkage 110 is utilized for convenient and accurate actuation/movement of the cylindrical rollers 115, 120 located inside the tank 105 relative to the major surfaces of a substrate 101 (shown in FIG. 2A). Additionally, clearance holes (not shown) may be formed in the tank 105 to achieve rotational coupling between the brushes 115, 120, actuators 135 and the supports 125, 130. A compliant coupling element 150, such as a flexible washer, a seal or a bellows, may be disposed around each hole and mounted between the tank 105 and the supports 125, 130. Such an arrangement (1) permits relative motion of the cylindrical rollers 115, 120 relative to the walls of the tank 105; (2) protects the substrate 101 against particulate contamination that might otherwise pass into the interior of the tank 105 through the holes in the tank walls; and/or (3) permits a fluid level in the tank 105 to reach or exceed the level of the holes while preventing fluid from draining therethrough. The actuator 145 is coupled to the controller to control the movement of the linkage 110.
Each of the first and second supports 125, 130 are coupled to the base 140 by a pivot point 112 to which the first and second supports 125, 130 may be adapted to pivot (upward and inward toward one another, and/or downward and outward away from one another). In operation, the first and second supports 125, 130 may be moved simultaneously through respective arcs 146 1, 146 2, as shown in FIG. 1, relative to the base 140. Such movement may cause the first and second cylindrical rollers 115, 120 to close against the substrate 101 as shown in FIG. 2A, or to cause the first and second cylindrical rollers 115, 120 to be spaced apart (shown in FIG. 2B) to allow insertion and/or removal of the substrate 101 from the scrubber box 100.
FIG. 2A is a top view of the scrubber box 100 of FIG. 1 showing the cylindrical rollers 115, 120 in a processing position where the cylindrical rollers 115, 120 are closed or pressed against major surfaces of the substrate 101. FIG. 2B is a top view of the scrubber box 100 of FIG. 2A in a transfer position where the cylindrical rollers 115, 120 are spaced apart to facilitate transfer of the substrate. The scrubber box 100 also includes one or more drive motors 144 and a rotational device 147. Each of the drive motors 144 and rotational device 147 are coupled to a roller assembly configured to support and/or engage the substrate 101 and facilitate rotation of the substrate 101.
Each of the cylindrical rollers 115, 120 include a tubular cover 128 disposed thereon. The tubular cover 128 may be a removable sleeve made of a pad material utilized to polish the substrate 101 or a brush body adapted to clean the substrate 101.
Examples of the pad material that may be utilized as the tubular cover 128 include polymeric pad materials typically utilized in chemical mechanical polishing (CMP) processes. The polymeric material may be a polyurethane, a polycarbonate, fluoropolymers, PTFE, PTFA, polyphenylene sulfide (PPS), or combinations thereof. The pad material may further comprise open or closed cell foamed polymers, elastomers, felt, impregnated felt, plastics, and like materials compatible with the processing chemistries. In another embodiment, the pad material is a felt material impregnated with a porous coating.
Examples of a brush body that may be utilized as the tubular cover 128 include polymeric materials, such as foams (e.g., polyvinyl alcohol (PVA), polyurethane) as well as thermoplastic materials or polyamide materials, such as nylon. The tubular cover 128 may further include a plurality of raised features, nodules or bristles (not shown) utilized to abrade the substrate 101 and effect cleaning of the substrate 101.
Depending on the specific material of the tubular cover 128, cleaning and/or polishing effectiveness of the processing surface of the tubular cover 128 is generally dependent on a suitable porosity and average pore size. In some embodiments, the porosity of the processing surface of the tubular cover 128 may be greater than about 85%. Other characteristics of the tubular cover 128 include a desirable average pore size or opening. The pore size opening in some embodiments range from about 10 microns to about 200 microns. The pore structures effect cleaning or material removal from the feature side of the substrate. Attributes such as polishing compound retention, polishing or removal activity, and material and fluid transportation also affect removal rate.
In order to facilitate optimal removal of material from the substrate, these microscopic pores must be fully and evenly open to provide a relatively high and stable removal rate and/or a maximized cleaning efficiency. These pore structures, when open, facilitate material removal by enhancing processing surface wetability, maintaining processing surface roughness, and dispersing polishing compounds, such as, for example, abrasive particles supplied from a polishing compound.
In the process of removing materials from the substrate in the polishing or cleaning process, the processing surface of the tubular cover 128 becomes worn and removed materials, chemicals, and other by products become attached to the processing surface of the tubular cover 128. In order to maintain the cleaning and/or polishing efficiency of the tubular cover 128, the tubular cover 128 may be replaced, which is costly and time consuming. Alternatively, the processing surface of the tubular cover 128 may be periodically conditioned or refreshed to enhance the processing surface of the tubular cover 128
FIGS. 2A and 2B depict one embodiment of a conditioning device 200 that may be utilized to condition and/or refresh the processing surface of the tubular cover 128 disposed on each of the cylindrical rollers 115, 120. In this embodiment, a dedicated conditioning device 200 is provided for each of the cylindrical rollers 115, 120. The conditioning device 200 is mounted adjacent a sidewall 205 of the tank 105 by one or more support members 210. The conditioning device 200 is positioned away from the center of the tank 105 so the conditioning device 200 does not interfere with substrate transfer and/or substrate polishing or cleaning processes. However, the conditioning device 200 is positioned to contact each of the cylindrical rollers 115, 120 when the first and second supports 125, 130 are actuated downward and outward away from one another. In one embodiment, the movement of the first and second supports 125, 130 brings the cylindrical rollers 115, 120 into contact with a respective conditioning device 200. When the cylindrical rollers 115, 120 are in this position, the processing surface of the tubular cover 128 disposed on each of the cylindrical rollers 115, 120 may be conditioned by causing relative movement between the cylindrical rollers 115, 120 and the conditioning device 200.
In one embodiment, the cylindrical rollers 115, 120 rotate about respective first axes A′ and A″ relative to the conditioning device 200. The rotational direction of axes A′ and A″ may be the same or different. For example, the rotational direction of a first axis A′ and a second axis A″ may both be clockwise or counterclockwise. Alternatively, the rotational direction of the first axis A′ may be clockwise and the rotational direction of the second axis A″ may be counterclockwise, or vice versa. In another embodiment, the conditioning device 200 may be caused to rotate relative to each of the cylindrical rollers 115, 120 based on movement or axial rotation of the cylindrical rollers 115, 120. In another embodiment, both of the conditioning device 200 and the cylindrical rollers 115, 120 may be rotated independently.
The conditioning device 200 is an article configured to clean, abrade or enhance the processing surface of the tubular cover 128 by mechanical contact with the tubular cover 128. In one embodiment, the conditioning device 200 is an abrasive article made of an abrasive material and/or includes abrasive particles such as a diamond or ceramic material. Alternatively, the conditioning device 200 may be made from a material that is harder than the hardness of the processing surface of the tubular cover 128. Examples include glass, silicon materials, thermoplastics, process compatible metals, such as aluminum or tungsten, among other materials. The outer surface of the conditioning device 200 may be roughened to enhance abrasion of the processing surface of the tubular cover 128. In this embodiment, each conditioning device 200 is an elongated cylindrical or tubular member. In other embodiments, each conditioning device 200 may be configured as a flat or cylindrical brush having bristles or a disk-shaped member.
FIG. 3A is a top view of one embodiment a conditioning device 200 having a conditioner 300 in contact with a processing surface 301 of a tubular cover 128 disposed on a cylindrical roller 115. In this embodiment, the conditioner 300 is in the form of a cylindrical rod or tube 302. In one embodiment, the conditioner 300 includes a roughened outer surface 303 adapted to abrade the processing surface 301 of the tubular cover 128. In one embodiment, the outer surface 303 of the conditioner 300 includes a plurality of abrasive particles 305.
In this embodiment, the conditioner 300 is adapted to rotate relative to the cylindrical roller 115. The conditioner 300 is coupled to support members 210 on each end by a spindle 312. The spindles 312 allow rotation of the conditioner 300 relative to the support members 210 and the cylindrical roller 115. The conditioner 300 may be adapted to rotate based on the rotation of the cylindrical roller 115 or the conditioner 300 may be caused rotate independent of the cylindrical roller 115. In one embodiment, the conditioner 300 is coupled to an actuator 315 that rotates the conditioner 300 about an axis B, which may be referred to as a third axis B. In one embodiment, the conditioner 300 may be rotated while the cylindrical roller 115 is stationary. In another embodiment, the conditioner 300 may be rotated about axis B while the cylindrical roller 115 is rotated about axis A″. In one aspect, the rotational axes A″ and B are substantially parallel. In one embodiment, the rotational direction of axes A′ and A″ may both be clockwise or counterclockwise. Alternatively, the rotational direction of axis A′ may be clockwise and the rotational direction of axis A″ may be counterclockwise, or vice versa. In another embodiment, the rotational direction of axis B may be clockwise or counterclockwise and the rotational movement may be independent of the rotation of the cylindrical rollers 115, 120. In yet another embodiment, rotational force to any or all of the cylindrical rollers 115, 120 and the conditioner 300 may be pulsed on and off, varied to change the rotational speed, and/or intermittently reversed.
FIG. 3B is a cross-sectional view of the cylindrical roller 115 and the conditioner 300 of FIG. 3A. The conditioner 300 includes a core 320, which may be a shaft disposed on the longitudinal axis of the conditioner 300. The core 320 may be coupled to the spindles 312 (FIG. 3A). The cylindrical roller 115 includes a mandrel assembly 316 that includes tubular core 317 on the longitudinal axis of the cylindrical roller 115. The tubular core 317 is in communication with a plurality of radial conduits 318 extending from the tubular core 317 to a periphery of the cylindrical roller 115. In one embodiment, the tubular core 317 is coupled to a fluid source 319 that provides a cleaning or polishing fluid to the tubular cover 128 through the radial conduits 318 during processing of a substrate. In another embodiment, the fluid source 319 provides a fluid to the tubular cover 128 during conditioning to enhance cleaning of the processing surface 301. In this embodiment, the fluid source 319 provides a liquid or a gas to the tubular cover 128 through the radial conduits 318. In one embodiment, the fluid may be deionized water (DIW), inert gases such as argon, nitrogen, helium, among other fluids that may facilitate removal of material from the processing surface 301.
FIG. 3C is a side cross-sectional view of another embodiment of a conditioning device 200 having a housing 325 that encloses or surrounds at least a portion of the conditioner 300. The housing 325 includes wipers 328 that are adapted to contact the processing surface 301 of the tubular cover 128. In one embodiment, the wipers 328 include bristles and/or abrasives (not shown) that are utilized to abrade the processing surface 301. In this embodiment, the wipers 328 may be utilized with or without the conditioner 300. For example, in one embodiment, the wipers 328 may be utilized as a conditioning device without the need for the conditioner 300. In another embodiment, the wipers 328 are utilized with the conditioner 300 to contain any materials produced by the conditioning process. In this embodiment, the wipers 328 are made of a flexible or compliant material adapted to conform to the topography of the processing surface 301 of the tubular cover 128. Depending on the use of the wipers 328 with or without the conditioner 300, materials for the wipers 328 include rigid materials such as ceramics, glass, thermoplastics as well as more compliant materials, such as polymers, plastics, silicon, elastomers and rubber.
In one embodiment, the housing 325 encloses a negative pressure region 335. In this embodiment, the housing 325 is in fluid communication with a vacuum pump 330 adapted to generate or maintain negative pressure in the region 335. In this embodiment, the wipers 328 are configured as compliant seals to contain negative pressure within the housing 325. Cleaning of the processing surface 301 may be enhanced by suction from the vacuum pump 330. Material removed from the processing surface 301 of the tubular cover 128 as well as any fluids may be removed from the interior of the housing 325 and routed to a waste or abatement system.
FIG. 4A is a top view of another embodiment a conditioning device 200 having a conditioner 400 in contact with a processing surface 301 of a tubular cover 128 disposed on a cylindrical roller 115. In this embodiment, the conditioner 400 is configured as a brush or comb having a bar-shaped structural member 402 that spans the length of the cylindrical roller 115. Each end of the structural member 402 is coupled to a support member 210. In this embodiment, one or both of the support members 210 are coupled to a linear actuator 415 adapted to provide pressure to one or both ends of the structural member 402. In this manner, a pressure or force between the conditioner 400 and the processing surface 301 of the tubular cover 128 may be varied. In operation, the cylindrical roller 115 is rotated about axis A″ while the conditioner 400 is controllably urged against the processing surface 301 of the tubular cover 128.
FIG. 4B is a cross-sectional view of the cylindrical roller 115 and the conditioner 400 of FIG. 3A. In one embodiment, the conditioner 400 includes a plurality of raised features 405 that may be bristles, abrasive particles, structural protrusions, or combinations thereof. While not shown, the conditioner 400 may be enclosed by a housing that is in communication with a vacuum pump as shown in FIG. 3C.
FIG. 5A is a top view of another embodiment a conditioning device 200 having a conditioner 500 in contact with a processing surface 301 of a tubular cover 128 disposed on a cylindrical roller 115. In this embodiment, the conditioner 500 includes a disk-shaped body 502 coupled to a support member 510 at a geometric center of the body 502. In this embodiment, the support member 510 is adapted as an axle that is coupled to an actuator 515 utilized to rotate the body 502 about axis C. In this embodiment, the tank 105 may be provided with a lid (not shown) to allow the interior volume of the tank 105 to contain negative pressure provided by a vacuum pump 330. As the material is removed from the processing surface 301 of the tubular cover 128, the removed materials, as well as any fluids, may be removed from the interior of the tank 105 and routed to a waste or abatement system.
FIG. 5B is a cross-sectional view of the cylindrical roller 115 and the conditioner 500 of FIG. 5A. The conditioner 500 includes an outer surface 503 that may be roughened in order to abrade the processing surface 301 of the tubular cover 128. In one embodiment, the outer surface 503 includes a plurality of raised features 505 that may be bristles, abrasive particles, structural protrusions, or combinations thereof.
In this embodiment, the conditioner 500 is adapted to rotate relative to the cylindrical roller 115. The conditioner 500 is coupled to the support member 510 to facilitate rotation of the body 502 relative to the cylindrical roller 115. The conditioner 500 may be adapted to rotate based on the rotation of the cylindrical roller 115 or the conditioner 500 may be caused rotate independent of the cylindrical roller 115. In one embodiment, the conditioner 500 is coupled to the actuator 515 that rotates the body 502 about axis C, which may be referred to as a fourth axis C. In one embodiment, the body 502 may be rotated while the cylindrical roller 115 is stationary. In another embodiment, the body 502 may be rotated about axis C while the cylindrical roller 115 is rotated about axis A″. In one aspect, the rotational axis A″ is substantially normal to the rotational axis C.
FIG. 6 is a flowchart showing one embodiment of a conditioning method 600 using the conditioning device 200 as described herein. At 610, one or both of the cylindrical rollers 115, 120 having a processing surface 301 are positioned to contact a conditioner, such as the conditioner 300, 400 or 500 as described herein. At 620, relative motion is provided between the processing surface 301 and the conditioner. The relative motion may be provided by rotating the cylindrical roller 115, 120 relative to the conditioner, rotating the conditioner relative to the cylindrical roller 115, 120, or a combination thereof.
FIG. 7 is a flowchart showing one embodiment of a substrate processing method 700 using the scrubber box 100 as described herein. At 710, a substrate is transferred to a tank 105 to a position between two cylindrical rollers 115, 120. At 720, each of the two cylindrical rollers 115, 120 are urged toward the substrate into a first position that facilitates contact between a processing surface 301 of the cylindrical rollers 115, 120 and major surfaces of the substrate. During step 720, the cylindrical rollers 115, 120 and the substrate may be caused to rotate relative in order to perform a cleaning or polishing process.
At 730, the cylindrical rollers 115, 120 are moved to a second position that spaces the cylindrical rollers 115, 120 away from the substrate to facilitate transfer of the substrate. The second position also includes contacting the processing surface of each of the cylindrical rollers 115, 120 with a conditioning device, which may be the conditioner 300, 400, or 500 as described herein. A conditioning method as described in FIG. 6 may be performed while the substrate is transferred out of the tank 105. The conditioning method may continue until another substrate is transferred into the tank 105 and the method may repeat beginning at step 710.
Embodiments of the conditioning device 200 as described herein extends the lifetime of the processing surface 301 of a tubular cover 128 utilized on the cylindrical rollers 115, 120 of a scrubber box 100. The use of the conditioning device 200 provides in-situ conditioning of the processing surface 301 of the cylindrical rollers 115, 120 such that the cylindrical rollers 115, 120 do not need to be removed from the tank 105. In one embodiment, the processing surface 301 of new or unused tubular covers 128 may be conditioned in a break-in process that is performed in the scrubber box 100. Using the conditioning device 200 in a break-in process minimizes or eliminates the need for dummy wafers and saves time. Additionally, the conditioning of the processing surface 301 of the cylindrical rollers 115, 120 during substrate transfer processes does not affect throughput of the scrubber box 100. The conditioning device 200 as described herein also maintains an optimal processing surface 301 of the tubular cover 128 by opening pores and removing agglomerated and/or excess material from the processing surface 301. The optimal processing surface 301 increases removal rate or cleaning efficiency and minimizes replacement frequency of the tubular cover 128. Thus, cost of ownership is minimized while throughput is maximized.
While the foregoing is directed to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof.

Claims (15)

What is claimed is:
1. A brush box, comprising:
a tank having an interior volume;
a pair of cylindrical rollers coupled at each end thereof to a respective support member disposed outside the interior volume, each of the cylindrical rollers disposed at least partially in the interior volume and being rotatable about a respective axis;
an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity to each other and a second position where the cylindrical rollers are spaced away from each other; and
a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, wherein:
the conditioner is rotatably coupled to a sidewall of the tank by one or more support members,
the one or more support members are coupled to an actuator,
the cylindrical rollers are rotatable about a first axis and a second axis, the first axis being different than and parallel to the second axis, and
the actuator rotates the conditioner about a third axis that is substantially normal to the first or the second axis.
2. A brush box, comprising:
a tank having an interior volume;
a pair of cylindrical rollers coupled at each end thereof to a respective support member disposed outside the interior volume, each of the cylindrical rollers disposed at least partially in the interior volume and being rotatable about a respective axis;
an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity to each other and a second position where the cylindrical rollers are spaced away from each other; and
a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, wherein the conditioner comprises a cylindrical tube.
3. A brush box, comprising:
a tank having an interior volume;
a pair of cylindrical rollers coupled at each end thereof to a respective support member disposed outside the interior volume, each of the cylindrical rollers disposed at least partially in the interior volume and being rotatable about a respective axis;
an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity to each other and a second position where the cylindrical rollers are spaced away from each other; and
a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, wherein the conditioner comprises a disk.
4. A brush box, comprising:
a tank having an interior volume;
a pair of cylindrical rollers coupled at each end thereof to a respective support member disposed outside the interior volume, each of the cylindrical rollers disposed at least partially in the interior volume and being rotatable about a respective axis;
an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity to each other and a second position where the cylindrical rollers are spaced away from each other;
a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position; and
a housing disposed around the conditioner.
5. The brush box of claim 4, wherein the housing is coupled to a vacuum pump.
6. The brush box of claim 4, wherein the housing includes at least one wiper adapted to contact the outer surface of the cylindrical roller in the second position.
7. A brush box, comprising:
a tank having an interior volume;
a pair of cylindrical rollers coupled at each end thereof to a respective support member movably disposed outside the interior volume, each of the cylindrical rollers disposed at least partially in the interior volume and being rotatable about a respective first axis;
an actuator assembly coupled to each of the cylindrical rollers to move the respective roller between a first position where the rollers are in proximity to each other and a second position where the rollers are spaced away from each other; and
a conditioning device for each of the rollers, each conditioning device including a conditioner disposed in the interior volume, each conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, and each conditioner being rotatable about a second axis that is different than the first axis, wherein each conditioner is rotatably coupled to a sidewall of the tank by one or more support members, and the one or more support members are coupled to an actuator that rotates the conditioner about the second axis, the second axis being substantially normal to the first axis.
8. A brush box, comprising:
a tank having an interior volume;
a pair of cylindrical rollers coupled at each end thereof to a respective support member movably disposed outside the interior volume, each of the cylindrical rollers disposed at least partially in the interior volume and being rotatable about a respective first axis;
an actuator assembly coupled to each of the cylindrical rollers to move the respective roller between a first position where the rollers are in proximity to each other and a second position where the rollers are spaced away from each other;
a conditioning device for each of the rollers, each conditioning device including a conditioner disposed in the interior volume, each conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, and each conditioner being rotatable about a second axis that is different than the first axis; and
a housing disposed around the conditioner.
9. The brush box of claim 8, wherein the housing is coupled to a vacuum pump.
10. The brush box of claim 8, wherein the housing includes at least one wiper adapted to contact the outer surface of the cylindrical roller in the second position.
11. A brush box, comprising:
a tank having an interior volume;
a pair of cylindrical rollers coupled to a respective support member movably disposed outside the interior volume, each of the cylindrical rollers disposed at least partially in the interior volume and being rotatable about a respective first axis;
an actuator assembly coupled to each of the cylindrical rollers to move the respective roller between a first position where the rollers are in proximity to each other and a second position where the rollers are spaced away from each other; and
a conditioning device for each of the rollers, each conditioning device including a conditioner disposed in the interior volume, each conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position, and each conditioner being rotatable about a second axis that is different than the first axis, wherein each conditioner is rotatably coupled to a sidewall of the tank by one or more support members that are coupled to an actuator, and wherein the actuator rotates the conditioner about the second axis, the second axis being substantially normal to the first axis.
12. The brush box of claim 11, wherein each conditioner comprises a cylindrical tube.
13. The brush box of claim 11, wherein the conditioner comprises a bar.
14. The brush box of claim 11, wherein the conditioner comprises a disk.
15. The brush box of claim 11, wherein the conditioning device further comprises a housing disposed around the conditioner.
US12/603,771 2009-10-22 2009-10-22 Apparatus and methods for brush and pad conditioning Active 2031-09-05 US8458843B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/603,771 US8458843B2 (en) 2009-10-22 2009-10-22 Apparatus and methods for brush and pad conditioning
PCT/US2010/046599 WO2011049671A1 (en) 2009-10-22 2010-08-25 Apparatus and methods for brush and pad conditioning
JP2012535203A JP5916617B2 (en) 2009-10-22 2010-08-25 Apparatus and method for brush conditioning and pad conditioning
TW099129282A TWI535529B (en) 2009-10-22 2010-08-31 Apparatus and methods for brush and pad conditioning
US13/897,008 US8813293B2 (en) 2009-10-22 2013-05-17 Apparatus and methods for brush and pad conditioning
US14/469,188 US20140360976A1 (en) 2009-10-22 2014-08-26 Apparatus and methods for brush and pad conditioning

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/603,771 US8458843B2 (en) 2009-10-22 2009-10-22 Apparatus and methods for brush and pad conditioning

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/897,008 Continuation US8813293B2 (en) 2009-10-22 2013-05-17 Apparatus and methods for brush and pad conditioning

Publications (2)

Publication Number Publication Date
US20110094537A1 US20110094537A1 (en) 2011-04-28
US8458843B2 true US8458843B2 (en) 2013-06-11

Family

ID=43897340

Family Applications (3)

Application Number Title Priority Date Filing Date
US12/603,771 Active 2031-09-05 US8458843B2 (en) 2009-10-22 2009-10-22 Apparatus and methods for brush and pad conditioning
US13/897,008 Active US8813293B2 (en) 2009-10-22 2013-05-17 Apparatus and methods for brush and pad conditioning
US14/469,188 Abandoned US20140360976A1 (en) 2009-10-22 2014-08-26 Apparatus and methods for brush and pad conditioning

Family Applications After (2)

Application Number Title Priority Date Filing Date
US13/897,008 Active US8813293B2 (en) 2009-10-22 2013-05-17 Apparatus and methods for brush and pad conditioning
US14/469,188 Abandoned US20140360976A1 (en) 2009-10-22 2014-08-26 Apparatus and methods for brush and pad conditioning

Country Status (4)

Country Link
US (3) US8458843B2 (en)
JP (1) JP5916617B2 (en)
TW (1) TWI535529B (en)
WO (1) WO2011049671A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140360976A1 (en) * 2009-10-22 2014-12-11 Applied Materials, Inc. Apparatus and methods for brush and pad conditioning
US10170343B1 (en) * 2017-06-30 2019-01-01 Taiwan Semiconductor Manufacturing Co., Ltd. Post-CMP cleaning apparatus and method with brush self-cleaning function
US10751738B2 (en) 2016-12-30 2020-08-25 Applied Materials, Inc. Spray bar design for uniform liquid flow distribution on a substrate

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9646859B2 (en) * 2010-04-30 2017-05-09 Applied Materials, Inc. Disk-brush cleaner module with fluid jet
US20130196572A1 (en) * 2012-01-27 2013-08-01 Sen-Hou Ko Conditioning a pad in a cleaning module
CN102601736A (en) * 2012-03-22 2012-07-25 珠海镇东有限公司 Back pressure roller, leveling brush system and leveling brush method for plate polishing machine
CN107377510B (en) * 2014-09-30 2019-11-08 宁波新芝生物科技股份有限公司 The working method of brush formula spinning spindle supersonic wave cleaning machine
US10410936B2 (en) 2017-05-19 2019-09-10 Illinois Tool Works Inc. Methods and apparatuses for effluent monitoring for brush conditioning
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US10149135B1 (en) * 2017-05-30 2018-12-04 Illinois Tool Works Inc. Methods and apparatuses for wireless communication with a brush
CN107377441B (en) * 2017-07-31 2021-01-22 京东方科技集团股份有限公司 Cleaning device, cleaning equipment and cleaning method
CN108940939A (en) * 2018-06-14 2018-12-07 东莞市光纳光电科技有限公司 A kind of fingerprint recognition screen having self-cleaning ability
US11839907B2 (en) * 2018-08-17 2023-12-12 Taiwan Semiconductor Manufacturing Company, Ltd. Breaking-in and cleaning method and apparatus for wafer-cleaning brush
NL2022059B1 (en) * 2018-11-23 2020-06-09 Gerald Jg Belemans Cleaning device for a pair of spectacles having bar-shaped cleaning elements.
JP7161418B2 (en) 2019-01-30 2022-10-26 株式会社荏原製作所 SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SELF-CLEANING METHOD OF CLEANING MEMBER
JP7274883B2 (en) * 2019-02-19 2023-05-17 株式会社荏原製作所 Cleaning equipment for cleaning members and substrate processing equipment
JP7284514B2 (en) * 2020-05-11 2023-05-31 アピックヤマダ株式会社 RESIN MOLDING DEVICE AND CLEANING METHOD
US20240332037A1 (en) * 2023-04-03 2024-10-03 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639311A (en) 1995-06-07 1997-06-17 International Business Machines Corporation Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations
US5745945A (en) * 1996-06-28 1998-05-05 International Business Machines Corporation Brush conditioner for a semiconductor cleaning brush
US6158448A (en) 1998-03-27 2000-12-12 Rippey Corporation System for cleaning sponge or porous polymeric products
US6328640B1 (en) 2000-03-31 2001-12-11 Lam Research Corporation Wafer preparation apparatus including rotatable wafer preparation assemblies
US20020006767A1 (en) * 1999-12-22 2002-01-17 Applied Materials, Inc. Ion exchange pad or brush and method of regenerating the same
JP2007509749A (en) 2003-10-28 2007-04-19 アプライド マテリアルズ インコーポレイテッド Scrubber box and how to use it
KR20070119823A (en) 2006-06-16 2007-12-21 삼성전자주식회사 Apparatus for cleaning semiconductor wafer
KR20080024579A (en) 2006-09-14 2008-03-19 삼성전자주식회사 Pad conditioning apparatus in semiconductor device fabricating equipment
US20090075567A1 (en) 2007-09-19 2009-03-19 Powerchip Semiconductor Corp. Polishing pad conditioner and method for conditioning polishing pad

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4514156Y1 (en) * 1965-12-29 1970-06-15
US5775983A (en) * 1995-05-01 1998-07-07 Applied Materials, Inc. Apparatus and method for conditioning a chemical mechanical polishing pad
JPH10323631A (en) * 1997-05-23 1998-12-08 Ebara Corp Device for self-cleaning cleaning member
WO1999049995A1 (en) * 1998-03-27 1999-10-07 Rippey Corporation A microcleaning process for sponge or porous polymeric products
JP2001054765A (en) * 1999-08-19 2001-02-27 Dainippon Screen Mfg Co Ltd Substrate cleaning device
EP1269522B1 (en) * 2000-03-31 2007-01-24 Lam Research Corporation Wafer preparation apparatus
US20020115283A1 (en) * 2001-02-20 2002-08-22 Chartered Semiconductor Manufacturing Ltd. Planarization by selective electro-dissolution
US6620029B2 (en) * 2002-01-30 2003-09-16 International Business Machines Corporation Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces
JP2003311536A (en) * 2002-04-23 2003-11-05 Sony Corp Polishing apparatus and method for polishing
JP4934644B2 (en) * 2007-06-25 2012-05-16 株式会社日立ハイテクノロジーズ Disc cleaning mechanism and disc cleaning device
WO2009158507A2 (en) * 2008-06-26 2009-12-30 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and method of forming
US8458843B2 (en) * 2009-10-22 2013-06-11 Applied Materials, Inc. Apparatus and methods for brush and pad conditioning
US20130196572A1 (en) * 2012-01-27 2013-08-01 Sen-Hou Ko Conditioning a pad in a cleaning module

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639311A (en) 1995-06-07 1997-06-17 International Business Machines Corporation Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations
US5745945A (en) * 1996-06-28 1998-05-05 International Business Machines Corporation Brush conditioner for a semiconductor cleaning brush
US6158448A (en) 1998-03-27 2000-12-12 Rippey Corporation System for cleaning sponge or porous polymeric products
US20020006767A1 (en) * 1999-12-22 2002-01-17 Applied Materials, Inc. Ion exchange pad or brush and method of regenerating the same
US6328640B1 (en) 2000-03-31 2001-12-11 Lam Research Corporation Wafer preparation apparatus including rotatable wafer preparation assemblies
JP2007509749A (en) 2003-10-28 2007-04-19 アプライド マテリアルズ インコーポレイテッド Scrubber box and how to use it
KR20070119823A (en) 2006-06-16 2007-12-21 삼성전자주식회사 Apparatus for cleaning semiconductor wafer
KR20080024579A (en) 2006-09-14 2008-03-19 삼성전자주식회사 Pad conditioning apparatus in semiconductor device fabricating equipment
US20090075567A1 (en) 2007-09-19 2009-03-19 Powerchip Semiconductor Corp. Polishing pad conditioner and method for conditioning polishing pad

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PCT International Search Report for Application No. PCT/US2010/046599, mailed Mar. 28, 2011.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140360976A1 (en) * 2009-10-22 2014-12-11 Applied Materials, Inc. Apparatus and methods for brush and pad conditioning
US10751738B2 (en) 2016-12-30 2020-08-25 Applied Materials, Inc. Spray bar design for uniform liquid flow distribution on a substrate
US10170343B1 (en) * 2017-06-30 2019-01-01 Taiwan Semiconductor Manufacturing Co., Ltd. Post-CMP cleaning apparatus and method with brush self-cleaning function

Also Published As

Publication number Publication date
US20130247314A1 (en) 2013-09-26
WO2011049671A4 (en) 2011-07-07
JP2013508969A (en) 2013-03-07
US20140360976A1 (en) 2014-12-11
JP5916617B2 (en) 2016-05-11
TW201114548A (en) 2011-05-01
US20110094537A1 (en) 2011-04-28
US8813293B2 (en) 2014-08-26
WO2011049671A1 (en) 2011-04-28
TWI535529B (en) 2016-06-01

Similar Documents

Publication Publication Date Title
US8813293B2 (en) Apparatus and methods for brush and pad conditioning
JP5279463B2 (en) Single substrate processing apparatus and method
US9751189B2 (en) Compliant polishing pad and polishing module
KR102211533B1 (en) Polishing system with local area rate control
US20070151867A1 (en) Apparatus and a method for electrochemical mechanical processing with fluid flow assist elements
TWI582844B (en) Conditioning a pad in a cleaning module
JP6375166B2 (en) Double-sided buff module for post-CMP cleaning
KR20160024797A (en) Buffing apparatus, and substrate processing apparatus
US10256120B2 (en) Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
KR20160013461A (en) Carrier head and chemical mechanical polishing apparatus
CN114005770A (en) Cleaning brush subassembly and wafer belt cleaning device
US20090061743A1 (en) Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate
US10434623B2 (en) Local area polishing system and polishing pad assemblies for a polishing system
US20090217953A1 (en) Drive roller for a cleaning system
JP5675626B2 (en) Stretching of polishing pad edge
US8181302B2 (en) Brush alignment control mechanism
US20240082982A1 (en) Processing system, pad transporting apparatus, liquid-receiving apparatus, and polishing apparatus
CN116435220A (en) Wafer cleaning device
KR20220048507A (en) Wafer cleaning device and wafer polishing equipment
JP2000254856A (en) Polishing device and polishing method
WO2007111729A2 (en) An apparatus and a method for electrochemical mechanical processing with fluid flow assist elements

Legal Events

Date Code Title Description
AS Assignment

Owner name: APPLIED MATERIALS, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KO, SEN-HOU;KARUPPIAH, LAKSHMANAN;REEL/FRAME:023408/0391

Effective date: 20091021

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8