JPH10323631A - Device for self-cleaning cleaning member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a self-cleaning device for cleaning a member in which the self-cleaning device itself can be formed smaller and the whole of the cleaning device can be formed smaller by the arrangement and also a material to be cleaned can be set easily on the central position of the cleaning device. SOLUTION: A self-cleaning plate 30 being brought into contact with the surface of a roll type cleaning member 10 and cleaning the same is set on an arm 20 supporting the roll type cleaning member 10 being in contact with the surface of a semiconductor wafer (material to be cleaned) W and scrub cleaning the same is installed. When the roll type cleaning member 10 is brought into contact with the semiconductor wafer W to carry out the scrub cleaning, a quarts plate 30 is separated from the roll type cleaning member 10. When the roll type cleaning member 10 is separated from the semiconductor wafer W, the quarts plate 31 is brought into contact with the roll type member 10 to carry out the self-cleaning for the roll type cleaning member 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning member used for cleaning a semiconductor wafer, a glass substrate, a liquid crystal panel, or the like in contact with the surface of an object to be cleaned, which requires a high degree of cleanliness. The present invention relates to a self-cleaning device for a cleaning member suitable for cleaning the member itself.

[0002]

2. Description of the Related Art Conventionally, as a device for cleaning the surface of an object to be cleaned, there is a scrub cleaning device for cleaning the surface of the object to be cleaned by rubbing a cleaning member such as a brush or a sponge while supplying pure water to the surface. is there.

In this type of scrub cleaning apparatus, since the cleaning member is brought into direct contact with the contaminated object, the cleaning member itself is contaminated and the cleaning effect is reduced.

In order to clean the cleaning member itself without replacing it even if the cleaning member is contaminated, the cleaning member is rubbed against a cleaning plate such as a quartz plate with cleaning water interposed therebetween to clean the cleaning member itself. A self-cleaning device for cleaning has been developed.

FIG. 6 is a schematic diagram showing the internal structure of a semiconductor wafer cleaning apparatus provided with this type of self-cleaning apparatus. As shown in the figure, a roll-type cleaning member 120 for scrub-cleaning the semiconductor wafer W whose surface has been polished by a polishing apparatus (not shown) is provided in the cleaning apparatus.
And the contaminated roll-type cleaning member 120 used for cleaning.
A self-cleaning device 130 for cleaning itself is provided.

The self-cleaning device 130 is configured by attaching a quartz plate 133 to the bottom of a self-cleaning tank 131 filled with a cleaning liquid. As another example of the self-cleaning device 130, as shown in FIG. 7, instead of filling the self-cleaning bath 131 with the cleaning solution, the cleaning solution is discharged from the cleaning solution jetting device 137 installed near the empty self-cleaning bath 131. You may comprise so that it may jet to the member 120.

While rotating the semiconductor wafer W at a position shown in FIG. 6 by a rotation drive mechanism (not shown), the rotating roll type cleaning member 120 is rubbed against the semiconductor wafer W to perform scrub cleaning.

The contaminated roll-type cleaning member 120 after the scrub cleaning moves into the self-cleaning tank 131,
The roll-type cleaning member 120 is rotated while being pressed against the quartz plate 133 with the cleaning liquid interposed, thereby performing the self-cleaning.

[0009]

However, in the case of the self-cleaning device 130, it must be installed at a position completely different from the position where the semiconductor wafer W is scrubbed. It is bulky because it is necessary to attach a strong foot 135 to press the mold cleaning member 120 with a certain amount of bending.
Not only does the layout of the various other devices installed in the cleaning device be restricted, but it also hinders the miniaturization of the entire cleaning device.

Further, as shown in the figure, since the self-cleaning device 130 is installed beside the portion for cleaning the semiconductor wafer W, the center k of the semiconductor wafer W to be cleaned does not become the center m of the entire width of the cleaning device. As shown in FIG. 8, for example, when two different types of cleaning devices A and B are installed on both sides of the semiconductor wafer transfer robots 140 and 141, the cleaning devices A and B are placed on the left (A-1, B-1).
In consideration of the two installation states, that is, (A-2, B-2) and right placement (A-2, B-2), it is necessary to end up with four different designs, which is complicated.

The present invention has been made in view of the above points, and has as its object to reduce the size of the self-cleaning device itself, thereby reducing the size of the entire cleaning device, and facilitating the object to be cleaned. An object of the present invention is to provide a self-cleaning device for a cleaning member that can be set at a central position of the cleaning device.

[0012]

According to the present invention, there is provided a self-cleaning apparatus for a cleaning member for cleaning by contacting a surface of an object to be cleaned, wherein the self-cleaning device supports the cleaning member. To be mounted on the supporting member. Further, the self-cleaning device is provided with a self-cleaning member for cleaning a predetermined portion by contacting the cleaning member. Further, the self-cleaning device is provided with cleaning liquid jetting means for jetting a cleaning liquid to the cleaning member. According to another aspect of the present invention, there is provided a cleaning apparatus including a cleaning member for cleaning by contacting a surface of a semiconductor wafer and a self-cleaning device for cleaning the cleaning member, wherein the self-cleaning device is attached to a support member supporting the cleaning member. I decided that.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIG. 1 is a schematic side view showing a self-cleaning device according to a first embodiment of the present invention. This self-cleaning device is a self-cleaning device for a roll-type cleaning member, and includes self-cleaning plates (self-cleaning members) 30, 3 attached to arms (support members) 20, 20, as shown in FIG.
0 and beams 40, 40 for regulating the movement of the self-cleaning plates 30, 30. FIG. 2 shows the roll type cleaning members 10 and 10 and the arm 2
FIG. 2 is a perspective view of a main part showing an example of an actual configuration of 0, 20 and self-cleaning plates 30, 30; Hereinafter, each component will be described.

As shown in FIG. 2, the arms 20 support both ends of the rotating shaft of the roll-type cleaning member 10. The arms 20, 20 are integrated with the roll-type cleaning members 10, 10, as shown in FIG.
7 (which may be a driving mechanism having another structure) makes it movable vertically.

The roll-type cleaning member 10 is formed of a columnar roll sponge (for example, made of foamed polyurethane), and as shown in FIG. 2, drive motors 25, 25 ( (A driving device having another structure may be used).

Next, the self-cleaning plate 30
As shown in FIG. 2, it is a substantially rectangular shape, and its length in the longitudinal direction is slightly longer than the length of the roll-type cleaning member 10. Both ends are swingably attached to the arm 20, and a quartz plate 31 (see FIG. 1) is attached to the lower end of the arm 20 over its entire length. The surface of the quartz plate 31 is made rough by providing fine lattice-like irregularities or the like.

The two self-cleaning plates 30,
Numeral 30 is urged in the direction of arrow C by urging means such as a spring or a balance weight (not shown), and is configured to stop at a position shown in FIG.

Next, the beam 40 is fixed to a stationary member (not shown), and a contact surface 41 is provided at the tip thereof.

Next, the operation of the self-cleaning device will be described. First, as shown in FIG. 1 (a), the semiconductor wafer W is sandwiched between the two roll-type cleaning members 10, 10 by driving the lifting / lowering air cylinders 27, 27 to bring the arms 20, 20 closer to each other. At the same time, the drive motor 25,
25 (see FIG. 2), the two roll-type cleaning members 10, 1
0 is rotationally driven.

At this time, since the semiconductor wafer W is rotated by the driving device (not shown), the upper and lower surfaces thereof are scrub-cleaned evenly.

After the scrub cleaning, the arms 20 and 20 and the roll-type cleaning members 10 and 10 are moved away from each other by the lifting and lowering air cylinders 27 to release the semiconductor wafer W from being clamped. The plate 30, 30 is brought into contact with the contact surface 41 of the beam 40 and is swung against the urging means.
As shown in (b), both self-cleaning plates 3
The 0, 30 quartz plates 31, 31 are pressed against the surfaces of the rotating roll-type cleaning members 10, 10. At this time, a cleaning liquid is supplied to the roll-type cleaning members 10 and 10 from a cleaning liquid supply unit (not shown).

Since the self-cleaning plate 30 is configured to be slightly longer than the length of the roll-type cleaning member 10 as described above, the entire circumference can be self-cleaned by the rotation of the roll-type cleaning member 10. . The length of the self-cleaning plate 30 is made shorter than the length of the roll-type cleaning member 10, and the self-cleaning plate 30 with the quartz plate 31 pressed against the roll-type cleaning member 10 is rotated while rotating the roll-type cleaning member 10. The entire surface of the roll-type cleaning member 10 may be self-cleaned by reciprocating in the direction of the rotation axis.

Thus, the roll type cleaning members 10, 10
The contaminants attached near the surface of the quartz plates 31 and 3
The surface is scraped off by the fine irregularities on one surface, thereby effectively removing contaminants and draining to the outside together with the cleaning liquid.

When the self-cleaning is completed, the semiconductor wafer W to be cleaned next is cleaned with both roll-type cleaning members 10 and 1.
0, the arms 20 and 20 and the roll-type cleaning members 10 and 10 are brought close to each other as shown in FIG. 1A to sandwich the semiconductor wafer W, and the cleaning of the semiconductor wafer W is started.

At this time, the self-cleaning plate 30,
The 30 quartz plates 31, 31 are separated from the surfaces of the roll-type cleaning members 10, 10 by urging means (not shown).

[Second Embodiment] FIG. 3 is a schematic side view showing a self-cleaning device according to a second embodiment of the present invention. In this self-cleaning apparatus, FIG.
The difference from the embodiment shown in FIG. 13 is that the shapes of the self-cleaning plates 30 ', 30' and the beams 40 ', 40' are different.
Is the only shape.

That is, the self-cleaning plate 3
In the case of 0 ', the self-cleaning plate 3 shown in FIG.
Unlike FIG. 0, a claw 35 is provided in the vicinity of a portion swingably attached to the arm 20, and a cleaning liquid supply nozzle 37 is attached at a predetermined position.

In addition, both self-cleaning plates 3
0 'and 30' are urged in the direction of arrow D by urging means such as a spring or a balance weight (not shown).

On the other hand, the contact surface 41 'of the beam 40' is provided at a position facing the claw 35.

The operation of the self-cleaning device will be described. First, as shown in FIG. 3A, the arms 20, 20 and the roll-type cleaning members 10, 10 are brought close to each other by the air cylinders 27, 27 for lifting. The rotating semiconductor wafer W is sandwiched, and at the same time, both roll type cleaning members 10 and 1 are held.
The semiconductor wafer W is scrub-cleaned by rotating 0.

After the cleaning is completed, the clamping is released by separating the arms 20, 20 and the roll-type cleaning members 10, 10 from the semiconductor wafer W. At this time, the engagement between the claws 35 and the contact surfaces 41 'is released. The two self-cleaning plates 30 ', 30' are respectively rotated in the direction of arrow D by the urging means, whereby the quartz plates 31, 30 'of the two self-cleaning plates 30', 30 'are rotated as shown in FIG. Roll type cleaning members 10 and 10 on which 31 rotates
, Whereby the roll-type cleaning members 10 and 10 are self-cleaned.

At this time, a cleaning liquid is supplied to the roll-type cleaning members 10, 10 from a cleaning liquid supply nozzle 37 attached to both self-cleaning plates 30 ', 30'.

When the self-cleaning is completed, the state returns to the state shown in FIG. 3A, and the cleaning of the next semiconductor wafer W is started.

[Third Embodiment] FIG. 4 is a view showing a self-cleaning device according to a third embodiment of the present invention.
5A and 5B are schematic side views, and FIG. 5C is a view of the self-cleaning plate 70 as seen from the direction of arrows EE. The self-cleaning device is a self-cleaning device for a pencil-type cleaning member. The self-cleaning device includes a self-cleaning plate (self-cleaning member) 70 attached to an arm (support member) 60, and a beam 80 for regulating the movement of the self-cleaning plate 70. It is constituted by. Hereinafter, each component will be described.

The arm 60 has a rotating head 5 at its lower end.
1 and a pencil-type cleaning member 53 made of sponge. That is, independently of the arm 60, the head 51 and the pencil type cleaning member 53 are driven to rotate integrally in the direction of arrow H. The arm 60 is movable vertically and horizontally by a drive mechanism (not shown).

Next, one end of the self-cleaning plate 70 is swingably attached to the arm 60.
A cleaning projection 71 protruding in the lateral direction is provided near the other end, and a hole 73 and a tapered surface 72 are provided in the cleaning projection 71. Note that a quartz plate is attached to the tapered surface 72.

The beam 80 has a contact surface 81 on its upper surface.

Next, the operation of the self-cleaning device will be described. First, as shown in FIG. 4A, the arm 60 is lowered, and the pencil-type cleaning member 53 rotating in the direction of the arrow H contacts the surface of the rotating semiconductor wafer W to scrub the surface. Wash.

After the completion of the cleaning, the arm 60 is raised to release the contact with the semiconductor wafer W. At this time, the self-cleaning plate 70 (attached to the arm 60 and rotating integrally with the cleaning member 53). The surface of the pencil-type cleaning member 53 whose own weight (or a biasing means such as a spring (not shown) attached to the self-cleaning plate 70) swings downward, and the tapered surface 72 of the cleaning protrusion 71 rotates. , The self-cleaning is performed over the entire surface of the pencil-type cleaning member 53. At this time, a cleaning liquid is supplied to the pencil-type cleaning member 53 from a cleaning liquid supply unit (not shown).

As a result, the contaminants adhering to the surface of the pencil type cleaning member 53 are scraped off and drained to the outside together with the cleaning liquid. At this time, the self-cleaning plate 70 may be swung in the direction of arrow AA 'shown in FIG. 4B by a mechanism (not shown) to enhance the cleaning effect of the central portion of the sponge which is difficult to clean.

When the self-cleaning is completed, the semiconductor wafer W to be cleaned next is placed under the pencil-type cleaning member 53, and the operation shown in FIG. 4A is performed again. Beam 8 at the end
The cleaning projection 71 is lifted by contacting the contact surface 81 of the pencil-type cleaning member 53 and is separated from the surface of the pencil-type cleaning member 53.

The structure of the cleaning projection 71 of the self-cleaning plate 70 can be variously modified. For example, as shown in FIGS. 5A and 5B, the upper surface of the cleaning projection 71 is formed by a pencil-type cleaning member. A plurality of discharge holes 75 may be formed on the surface 74 so as to abut in parallel with the surface of the surface 53, and at the same time, penetrate the surface 74. With this configuration, by pressing the surface 74 in parallel with the surface of the pencil-type cleaning member 53, the pressing amount can be made uniform, and the surface of the pencil-type cleaning member 53 can be uniformly self-cleaned. The holes 75 allow the cleaning foreign substances and waste liquid to be effectively discharged.

Further, as shown in FIGS. 5C and 5D, a plurality of grooves 77 are provided on the upper surface 74 of the cleaning projection 71, and the grooves 77 are used for self-cleaning the surface of the pencil-type cleaning member 53. The cleaning foreign matter and the waste liquid may be discharged.

It goes without saying that the structure of the cleaning projection 71 may be various other structures other than the above embodiments.

It goes without saying that the present invention can be applied not only to a cleaning member for a semiconductor wafer but also to a cleaning member for other objects to be cleaned such as a glass substrate and a liquid crystal panel.

The cleaning member is not limited to a sponge member, but may be, for example, a member having a brush or a polishing cloth attached to the surface.

The self-cleaning member may be a plate of another material instead of the quartz plate.
A polishing cloth may be used.

[0048]

As described above in detail, according to the present invention, since the self-cleaning device, particularly the self-cleaning member (self-cleaning plate) is attached to the cleaning member, the self-cleaning device itself can be reduced in size. This makes it possible to reduce the size of the entire cleaning device, and to easily set the position of the object to be cleaned in the cleaning device at the center position of the cleaning device. There is an excellent effect that it is not necessary to consider two installation states.

[Brief description of the drawings]

FIG. 1 is a schematic side view of a self-cleaning device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of an essential part showing an example of an actual configuration of a roll-type cleaning member 10, arms 20, 20, and self-cleaning plates 30, 30;

FIG. 3 is a schematic side view of a self-cleaning device according to a second embodiment of the present invention.

FIG. 4 is a schematic side view of a self-cleaning device according to a third embodiment of the present invention.

FIG. 5 is a view showing a cleaning projection 71 according to another structure, and FIGS. 5 (a) and 5 (c) are side views of relevant parts, respectively, and FIG.
FIGS. 5B and 5D respectively show K− in FIGS. 5A and 5C.
It is a K, LL arrow line view.

FIG. 6 is a schematic view showing the internal structure of a semiconductor wafer cleaning device provided with a self-cleaning device.

FIG. 7 is a diagram showing another conventional self-cleaning device 130.

FIG. 8 shows four cleaning apparatuses A-1, A-2, B-1, and B-
FIG. 3 is a diagram showing an example of installation of the second embodiment.

[Explanation of symbols]

W Semiconductor wafer (object to be cleaned) 10 Roll-type cleaning member 20 Arm (supporting member) 30 Self-cleaning plate (Self-cleaning member) 40 Beam 30 'Self-cleaning plate (Self-cleaning member) 40' Beam 53 Pencil-type cleaning member 60 Arm (Supporting member) 70 Self-cleaning plate (Self-cleaning member) 80 Beam

Claims (4)

[Claims] 1. A self-cleaning device for a cleaning member that abuts on a surface of an object to be cleaned and cleans the cleaning member, wherein the self-cleaning device is attached to a support member that supports the cleaning member. Cleaning device. 2. The self-cleaning device according to claim 1, wherein the self-cleaning device has a self-cleaning member that cleans a predetermined portion by contacting the cleaning member. 3. The self-cleaning device according to claim 1, wherein the self-cleaning device includes a cleaning liquid jetting unit that jets a cleaning liquid to the cleaning member. 4. A cleaning apparatus comprising: a cleaning member that contacts and cleans a surface of a semiconductor wafer; and a self-cleaning device that cleans the cleaning member, wherein the self-cleaning device is attached to a support member that supports the cleaning member. A cleaning device characterized in that it is capable of being cleaned.