SG11201402077UA - Resin molding apparatus - Google Patents
Resin molding apparatusInfo
- Publication number
- SG11201402077UA SG11201402077UA SG11201402077UA SG11201402077UA SG11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA
- Authority
- SG
- Singapore
- Prior art keywords
- molding apparatus
- resin molding
- resin
- molding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
- B29C2043/5883—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses ensuring cavity filling, e.g. providing overflow means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011244378 | 2011-11-08 | ||
PCT/JP2012/077907 WO2013069496A1 (ja) | 2011-11-08 | 2012-10-29 | 樹脂封止装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201402077UA true SG11201402077UA (en) | 2014-09-26 |
Family
ID=48289874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201402077UA SG11201402077UA (en) | 2011-11-08 | 2012-10-29 | Resin molding apparatus |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP5731009B2 (ja) |
KR (1) | KR101950894B1 (ja) |
CN (1) | CN103930252B (ja) |
SG (1) | SG11201402077UA (ja) |
TW (1) | TWI593541B (ja) |
WO (1) | WO2013069496A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6049597B2 (ja) * | 2013-11-28 | 2016-12-21 | Towa株式会社 | 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置 |
JP6284764B2 (ja) * | 2013-12-24 | 2018-02-28 | Towa株式会社 | 樹脂撒布方法、被樹脂封止部品の樹脂封止方法、樹脂撒布装置、被樹脂封止部品の樹脂封止装置、および樹脂封止成形品製造装置 |
JP6183417B2 (ja) | 2015-06-26 | 2017-08-23 | トヨタ自動車株式会社 | 燃料電池システム |
JP6499941B2 (ja) * | 2015-07-23 | 2019-04-10 | アピックヤマダ株式会社 | 樹脂成形方法および樹脂成形装置 |
JP6499105B2 (ja) * | 2016-03-11 | 2019-04-10 | 東芝メモリ株式会社 | 金型 |
JP6212609B1 (ja) * | 2016-08-19 | 2017-10-11 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
JP6298871B1 (ja) * | 2016-10-21 | 2018-03-20 | Towa株式会社 | 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法 |
JP6284996B1 (ja) * | 2016-11-04 | 2018-02-28 | Towa株式会社 | 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法 |
JP6270969B2 (ja) * | 2016-11-22 | 2018-01-31 | Towa株式会社 | 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置 |
JP6774865B2 (ja) * | 2016-12-13 | 2020-10-28 | アピックヤマダ株式会社 | 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法 |
TWI607207B (zh) * | 2016-12-22 | 2017-12-01 | 矽品精密工業股份有限公司 | 模封設備 |
JP6522817B2 (ja) * | 2018-01-29 | 2019-05-29 | Towa株式会社 | 樹脂成形品の製造方法、被樹脂封止部品の樹脂封止方法、および樹脂成形装置 |
JP6989410B2 (ja) * | 2018-02-16 | 2022-01-05 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP6936177B2 (ja) * | 2018-03-23 | 2021-09-15 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7284514B2 (ja) | 2020-05-11 | 2023-05-31 | アピックヤマダ株式会社 | 樹脂モールド装置及びクリーニング方法 |
JP7360364B2 (ja) * | 2020-07-03 | 2023-10-12 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP7360365B2 (ja) | 2020-07-14 | 2023-10-12 | Towa株式会社 | 樹脂材料供給装置、樹脂成形装置及び樹脂成形品の製造方法 |
JP2022061238A (ja) * | 2020-10-06 | 2022-04-18 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP7470982B2 (ja) * | 2020-11-17 | 2024-04-19 | アピックヤマダ株式会社 | 樹脂供給装置、樹脂封止装置、及び樹脂封止品の製造方法 |
JP7468906B2 (ja) | 2021-04-26 | 2024-04-16 | アピックヤマダ株式会社 | 樹脂封止装置 |
WO2022264374A1 (ja) * | 2021-06-17 | 2022-12-22 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP2023176671A (ja) * | 2022-05-31 | 2023-12-13 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4327985B2 (ja) * | 2000-04-21 | 2009-09-09 | アピックヤマダ株式会社 | 樹脂封止装置 |
JP3984824B2 (ja) * | 2001-11-30 | 2007-10-03 | アピックヤマダ株式会社 | 液材吐出装置及び樹脂封止装置 |
KR100708600B1 (ko) * | 2004-04-30 | 2007-04-18 | 스미토모 베이클라이트 가부시키가이샤 | 수지봉지형 반도체 패키지 및 이의 제조 방법 및 장치 |
JP2006156796A (ja) * | 2004-11-30 | 2006-06-15 | Towa Corp | 半導体チップの樹脂封止成形方法、及び、装置 |
JP4953619B2 (ja) * | 2005-11-04 | 2012-06-13 | Towa株式会社 | 電子部品の樹脂封止成形装置 |
JP4741383B2 (ja) * | 2006-02-17 | 2011-08-03 | 富士通セミコンダクター株式会社 | 電子部品の樹脂封止方法 |
JP2007307843A (ja) * | 2006-05-20 | 2007-11-29 | Apic Yamada Corp | 樹脂モールド方法および樹脂モールド装置 |
JP4917970B2 (ja) * | 2007-06-08 | 2012-04-18 | 住友重機械工業株式会社 | 樹脂封止装置 |
JP4990830B2 (ja) | 2008-03-27 | 2012-08-01 | 住友重機械工業株式会社 | 樹脂供給機構 |
JP5153509B2 (ja) * | 2008-08-08 | 2013-02-27 | Towa株式会社 | 電子部品の圧縮成形方法及び金型装置 |
JP2010221430A (ja) * | 2009-03-19 | 2010-10-07 | Elpida Memory Inc | モールド樹脂及び樹脂モールド方法 |
JP5320241B2 (ja) * | 2009-09-28 | 2013-10-23 | 住友重機械工業株式会社 | 封止装置及び封止方法 |
-
2012
- 2012-10-29 JP JP2013542931A patent/JP5731009B2/ja active Active
- 2012-10-29 KR KR1020147015227A patent/KR101950894B1/ko active IP Right Grant
- 2012-10-29 SG SG11201402077UA patent/SG11201402077UA/en unknown
- 2012-10-29 CN CN201280054945.0A patent/CN103930252B/zh active Active
- 2012-10-29 WO PCT/JP2012/077907 patent/WO2013069496A1/ja active Application Filing
- 2012-10-30 TW TW101140019A patent/TWI593541B/zh active
-
2015
- 2015-04-07 JP JP2015078311A patent/JP5926417B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2013069496A1 (ja) | 2013-05-16 |
TW201318810A (zh) | 2013-05-16 |
JP5731009B2 (ja) | 2015-06-10 |
JP5926417B2 (ja) | 2016-05-25 |
KR101950894B1 (ko) | 2019-04-22 |
JP2015128908A (ja) | 2015-07-16 |
TWI593541B (zh) | 2017-08-01 |
KR20140092381A (ko) | 2014-07-23 |
JPWO2013069496A1 (ja) | 2015-04-02 |
CN103930252B (zh) | 2016-08-17 |
CN103930252A (zh) | 2014-07-16 |
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