TWI577526B - Resin encapsulation method and resin encapsulation device - Google Patents
Resin encapsulation method and resin encapsulation device Download PDFInfo
- Publication number
- TWI577526B TWI577526B TW103138288A TW103138288A TWI577526B TW I577526 B TWI577526 B TW I577526B TW 103138288 A TW103138288 A TW 103138288A TW 103138288 A TW103138288 A TW 103138288A TW I577526 B TWI577526 B TW I577526B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- sheet
- cavity portion
- mold
- cavity
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims description 568
- 229920005989 resin Polymers 0.000 title claims description 568
- 238000005538 encapsulation Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 36
- 239000000463 material Substances 0.000 claims description 97
- 239000000758 substrate Substances 0.000 claims description 66
- 230000002093 peripheral effect Effects 0.000 claims description 54
- 230000007246 mechanism Effects 0.000 claims description 49
- 238000007789 sealing Methods 0.000 claims description 38
- 230000014759 maintenance of location Effects 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 claims description 27
- 238000000465 moulding Methods 0.000 claims description 24
- 238000000748 compression moulding Methods 0.000 claims description 23
- 238000004891 communication Methods 0.000 claims description 20
- 239000002313 adhesive film Substances 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims description 17
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 13
- 230000002265 prevention Effects 0.000 claims description 13
- 230000006835 compression Effects 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 2
- 239000004519 grease Substances 0.000 claims 1
- 230000009471 action Effects 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 8
- 239000011800 void material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000004804 winding Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013270106A JP6143665B2 (ja) | 2013-12-26 | 2013-12-26 | 半導体封止方法及び半導体封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201532776A TW201532776A (zh) | 2015-09-01 |
| TWI577526B true TWI577526B (zh) | 2017-04-11 |
Family
ID=53536629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103138288A TWI577526B (zh) | 2013-12-26 | 2014-11-05 | Resin encapsulation method and resin encapsulation device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6143665B2 (ko) |
| KR (1) | KR101667854B1 (ko) |
| CN (1) | CN104752238B (ko) |
| TW (1) | TWI577526B (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6430143B2 (ja) * | 2014-04-30 | 2018-11-28 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法並びに成形製品の製造方法 |
| JP6506717B2 (ja) * | 2016-03-30 | 2019-04-24 | Ｔｏｗａ株式会社 | 樹脂成形装置、樹脂成形方法、フィルム搬送用ローラ及び樹脂成形装置用フィルム供給装置 |
| CN113286687B (zh) * | 2018-12-21 | 2022-05-03 | 爱沛股份有限公司 | 树脂封装方法，树脂封装金属模具及树脂封装装置 |
| JP7291663B2 (ja) * | 2020-04-24 | 2023-06-15 | Ｔｏｗａ株式会社 | 位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法 |
| JP7453683B2 (ja) * | 2020-09-11 | 2024-03-21 | アピックヤマダ株式会社 | 樹脂封止装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI235703B (en) * | 2002-09-06 | 2005-07-11 | Towa Corp | Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor |
| TWI253724B (en) * | 2004-03-12 | 2006-04-21 | Towa Corp | Resin sealing apparatus and resin sealing method |
| TW200639982A (en) * | 2005-03-23 | 2006-11-16 | Renesas Tech Corp | Method of manufacturing semiconductor device and compression molding device |
| TW201132483A (en) * | 2010-02-03 | 2011-10-01 | Dai Ichi Seiko Co Ltd | Mold apparatus for resin encapsulation |
| TW201339238A (zh) * | 2012-01-20 | 2013-10-01 | Nitto Denko Corp | 電子零件封裝用樹脂組成物薄片及使用其之電子零件裝置之製法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0699448A (ja) * | 1991-04-12 | 1994-04-12 | Hosokawa Seisakusho:Kk | 合成樹脂加圧成形品の低圧製造方法 |
| JPH1041694A (ja) * | 1996-07-25 | 1998-02-13 | Sharp Corp | 半導体素子の基板実装構造及びその実装方法 |
| JP4326786B2 (ja) * | 2002-11-26 | 2009-09-09 | Ｔｏｗａ株式会社 | 樹脂封止装置 |
| JP2007307843A (ja) * | 2006-05-20 | 2007-11-29 | Apic Yamada Corp | 樹脂モールド方法および樹脂モールド装置 |
| JP5144634B2 (ja) * | 2009-12-22 | 2013-02-13 | 日東電工株式会社 | 基板レス半導体パッケージ製造用耐熱性粘着シート、及びその粘着シートを用いる基板レス半導体パッケージ製造方法 |
| JP5658108B2 (ja) | 2011-08-23 | 2015-01-21 | Ｔｏｗａ株式会社 | 反射体付基板の製造方法及び製造装置 |
| JP5627619B2 (ja) * | 2012-02-28 | 2014-11-19 | Ｔｏｗａ株式会社 | 樹脂封止装置及び樹脂封止体の製造方法 |
| WO2013129307A1 (ja) * | 2012-03-01 | 2013-09-06 | 株式会社村田製作所 | 封止用樹脂シートの製造方法 |
-
2013
- 2013-12-26 JP JP2013270106A patent/JP6143665B2/ja active Active
-
2014
- 2014-11-05 TW TW103138288A patent/TWI577526B/zh active
- 2014-11-06 CN CN201410636569.7A patent/CN104752238B/zh active Active
- 2014-11-25 KR KR1020140165469A patent/KR101667854B1/ko active IP Right Grant
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI235703B (en) * | 2002-09-06 | 2005-07-11 | Towa Corp | Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor |
| TWI253724B (en) * | 2004-03-12 | 2006-04-21 | Towa Corp | Resin sealing apparatus and resin sealing method |
| TW200639982A (en) * | 2005-03-23 | 2006-11-16 | Renesas Tech Corp | Method of manufacturing semiconductor device and compression molding device |
| TW201132483A (en) * | 2010-02-03 | 2011-10-01 | Dai Ichi Seiko Co Ltd | Mold apparatus for resin encapsulation |
| TW201339238A (zh) * | 2012-01-20 | 2013-10-01 | Nitto Denko Corp | 電子零件封裝用樹脂組成物薄片及使用其之電子零件裝置之製法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6143665B2 (ja) | 2017-06-07 |
| CN104752238B (zh) | 2017-11-24 |
| CN104752238A (zh) | 2015-07-01 |
| JP2015126125A (ja) | 2015-07-06 |
| KR20150076075A (ko) | 2015-07-06 |
| TW201532776A (zh) | 2015-09-01 |
| KR101667854B1 (ko) | 2016-10-19 |
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