TWI562322B - Semiconductor device packages - Google Patents
Semiconductor device packagesInfo
- Publication number
- TWI562322B TWI562322B TW104134721A TW104134721A TWI562322B TW I562322 B TWI562322 B TW I562322B TW 104134721 A TW104134721 A TW 104134721A TW 104134721 A TW104134721 A TW 104134721A TW I562322 B TWI562322 B TW I562322B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- device packages
- packages
- semiconductor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
- H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/85005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate being a temporary or sacrificial substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/521,342 US9269673B1 (en) | 2014-10-22 | 2014-10-22 | Semiconductor device packages |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201616632A TW201616632A (zh) | 2016-05-01 |
TWI562322B true TWI562322B (en) | 2016-12-11 |
Family
ID=55314744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104134721A TWI562322B (en) | 2014-10-22 | 2015-10-22 | Semiconductor device packages |
Country Status (3)
Country | Link |
---|---|
US (1) | US9269673B1 (zh) |
CN (2) | CN108807304B (zh) |
TW (1) | TWI562322B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107535078B (zh) * | 2015-05-20 | 2020-03-31 | 株式会社村田制作所 | 高频模块 |
US9461001B1 (en) | 2015-07-22 | 2016-10-04 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same |
JP6418605B2 (ja) * | 2015-07-31 | 2018-11-07 | 東芝メモリ株式会社 | 半導体装置および半導体装置の製造方法 |
US10535611B2 (en) | 2015-11-20 | 2020-01-14 | Apple Inc. | Substrate-less integrated components |
US10147685B2 (en) * | 2016-03-10 | 2018-12-04 | Apple Inc. | System-in-package devices with magnetic shielding |
JP6407186B2 (ja) * | 2016-03-23 | 2018-10-17 | Tdk株式会社 | 電子回路パッケージ |
US10225964B2 (en) * | 2016-03-31 | 2019-03-05 | Apple Inc. | Component shielding structures with magnetic shielding |
US10242954B2 (en) * | 2016-12-01 | 2019-03-26 | Tdk Corporation | Electronic circuit package having high composite shielding effect |
US20190035744A1 (en) * | 2016-03-31 | 2019-01-31 | Tdk Corporation | Electronic circuit package using composite magnetic sealing material |
US10373916B2 (en) * | 2016-07-28 | 2019-08-06 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Semiconductor device packages |
US9711442B1 (en) | 2016-08-24 | 2017-07-18 | Nanya Technology Corporation | Semiconductor structure |
US10854556B2 (en) * | 2016-10-12 | 2020-12-01 | Advanced Semiconductor Engineering Korea, Inc. | Semiconductor package device and method of manufacturing the same |
TWI668821B (zh) * | 2016-10-25 | 2019-08-11 | 日商Tdk股份有限公司 | 電子零件模組及其製造方法 |
KR101896435B1 (ko) | 2016-11-09 | 2018-09-07 | 엔트리움 주식회사 | 전자파차폐용 전자부품 패키지 및 그의 제조방법 |
JP2018088629A (ja) | 2016-11-29 | 2018-06-07 | ソニーセミコンダクタソリューションズ株式会社 | 高周波モジュール、および通信装置 |
US10553542B2 (en) * | 2017-01-12 | 2020-02-04 | Amkor Technology, Inc. | Semiconductor package with EMI shield and fabricating method thereof |
US10622318B2 (en) * | 2017-04-26 | 2020-04-14 | Advanced Semiconductor Engineering Korea, Inc. | Semiconductor package device and method of manufacturing the same |
CN107172549A (zh) * | 2017-06-06 | 2017-09-15 | 广东欧珀移动通信有限公司 | 电声组件及电子设备 |
TWI647796B (zh) * | 2018-04-09 | 2019-01-11 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
US10438901B1 (en) * | 2018-08-21 | 2019-10-08 | Qualcomm Incorporated | Integrated circuit package comprising an enhanced electromagnetic shield |
US11557489B2 (en) * | 2018-08-27 | 2023-01-17 | Intel Corporation | Cavity structures in integrated circuit package supports |
US10937741B2 (en) | 2018-11-16 | 2021-03-02 | STATS ChipPAC Pte. Ltd. | Molded laser package with electromagnetic interference shield and method of making |
TWI766164B (zh) * | 2019-05-28 | 2022-06-01 | 力成科技股份有限公司 | 封裝結構 |
CN110534502B (zh) * | 2019-07-26 | 2021-12-10 | 南通通富微电子有限公司 | 封装结构 |
US20220270982A1 (en) * | 2019-07-26 | 2022-08-25 | Tongfu Microelectronics Co., Ltd. | Packaging structure and fabrication method thereof |
JP2021125525A (ja) * | 2020-02-04 | 2021-08-30 | キオクシア株式会社 | 半導体パッケージおよびその製造方法 |
CN114078823A (zh) * | 2020-08-17 | 2022-02-22 | 江苏长电科技股份有限公司 | 扇出型封装结构及其制造方法 |
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US6350951B1 (en) * | 1997-12-29 | 2002-02-26 | Intel Corporation | Electric shielding of on-board devices |
US8686543B2 (en) * | 2011-10-28 | 2014-04-01 | Maxim Integrated Products, Inc. | 3D chip package with shielded structures |
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KR101855294B1 (ko) | 2010-06-10 | 2018-05-08 | 삼성전자주식회사 | 반도체 패키지 |
KR101678055B1 (ko) * | 2010-06-15 | 2016-11-22 | 삼성전자 주식회사 | 전자파 간섭 제거 장치 및 이를 포함하는 반도체 패키지 |
US8836449B2 (en) * | 2010-08-27 | 2014-09-16 | Wei Pang | Vertically integrated module in a wafer level package |
CN102110674B (zh) * | 2010-12-31 | 2012-07-04 | 日月光半导体制造股份有限公司 | 半导体封装件 |
JP2012151326A (ja) | 2011-01-20 | 2012-08-09 | Toshiba Corp | 半導体装置の製造方法、半導体装置及び電子部品のシールド方法 |
US8268677B1 (en) | 2011-03-08 | 2012-09-18 | Stats Chippac, Ltd. | Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer |
TWI460843B (zh) | 2011-03-23 | 2014-11-11 | Universal Scient Ind Shanghai | 電磁屏蔽結構及其製作方法 |
CN103022011B (zh) * | 2011-09-23 | 2015-10-07 | 讯芯电子科技(中山)有限公司 | 半导体封装结构及其制造方法 |
JP5829562B2 (ja) * | 2012-03-28 | 2015-12-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR102161173B1 (ko) * | 2013-08-29 | 2020-09-29 | 삼성전자주식회사 | 패키지 온 패키지 장치 및 이의 제조 방법 |
TW201519400A (zh) * | 2013-11-06 | 2015-05-16 | 矽品精密工業股份有限公司 | 半導體封裝件 |
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2014
- 2014-10-22 US US14/521,342 patent/US9269673B1/en active Active
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2015
- 2015-10-22 TW TW104134721A patent/TWI562322B/zh active
- 2015-10-22 CN CN201810661914.0A patent/CN108807304B/zh active Active
- 2015-10-22 CN CN201510690564.7A patent/CN105552061B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6350951B1 (en) * | 1997-12-29 | 2002-02-26 | Intel Corporation | Electric shielding of on-board devices |
US8686543B2 (en) * | 2011-10-28 | 2014-04-01 | Maxim Integrated Products, Inc. | 3D chip package with shielded structures |
Also Published As
Publication number | Publication date |
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CN108807304B (zh) | 2021-02-12 |
CN108807304A (zh) | 2018-11-13 |
TW201616632A (zh) | 2016-05-01 |
CN105552061A (zh) | 2016-05-04 |
US9269673B1 (en) | 2016-02-23 |
CN105552061B (zh) | 2018-07-20 |
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